CN2909527Y - Point electroplating lead frame - Google Patents
Point electroplating lead frame Download PDFInfo
- Publication number
- CN2909527Y CN2909527Y CN 200620102751 CN200620102751U CN2909527Y CN 2909527 Y CN2909527 Y CN 2909527Y CN 200620102751 CN200620102751 CN 200620102751 CN 200620102751 U CN200620102751 U CN 200620102751U CN 2909527 Y CN2909527 Y CN 2909527Y
- Authority
- CN
- China
- Prior art keywords
- lead frame
- electroplated
- point
- molding compounds
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Lead Frames For Integrated Circuits (AREA)
Abstract
A point electroplated lead frame includes chip parts, small solder joints, middle pins, a main body composed of side pins and electroplated coatings covered on the main body. The electroplated coatings are of point distribution on the lead frame. Because the lead frame still needs to be electroplated with non-ferromagnetic metals and be packaged with molding compounds, and the lead frame, electroplated coatings and molding compounds are made of various materials, the thermophysical properties and thermal expansion coefficients of which are different, in particular that the bonding power between the electroplated coatings and the molding compounds is not ideal, the point electroplated lead frame is adopted now and is only made a point electroplating between packaging chips and connection wires, which meets the packaging requirements, reduces the consumption of metal electroplated coating materials in a large area, the production cost and the emission pollution from hazardous substances in the electroplating, and enhances the combination and seal strength between the lead frame and the molding compounds.
Description
Technical field
The utility model relates to a kind of lead frame, the point type electroplate lead wire framework that particularly a kind of triode is used.
Background technology
Lead frame is to make the basic element of character of producing semiconductor element, also needs most of local non-ferromagnetic metal level of electroplating on its surface, utilizes resin plastic-sealed chip to be fixed into holistic semiconductor element again.
Existing TO-126 lead frame as shown in Figure 2, according to cartridge chip be welded to connect the needs of line, its plating area covered chip section 1 and little solder joint 2 ' entire area, the electroplating cost height.
Summary of the invention
Technical problem to be solved in the utility model is, a kind of point type electroplate lead wire framework is provided, can when satisfying original encapsulation requirement, strengthen adhesion and sealing intensity between lead frame and plastic packaging material again, and reduce electroplating cost and reduce when electroplating discharging pollution environment.
The technical scheme in the invention for solving the above technical problem is: point type electroplate lead wire framework comprises that main body that is made of chip section, little solder joint, interim pins, side pipe pin and the electrodeposited coating that covers on the main body form, and described electrodeposited coating is for being spot distribution on lead frame.
Compared with prior art, advantage of the present utility model is, because of also electroplating non-ferromagnetic metal level on the lead frame and encapsulating with plastic packaging material, and lead frame, electrodeposited coating, plastic packaging material is respectively by different material, the thermophysical property of each material, thermal coefficient of expansion is all inequality, especially the adhesion of electrodeposited coating and plastic packaging material is undesirable, with its clear-cut like this scope of dwindling the plating area, relatively just strengthened combining and sealing intensity of lead frame and plastic packaging material, so adopt point type electroplate lead wire framework, only carry out the point-like plating at packaged chip and connecting line place, not only satisfied encapsulation requires but also large tracts of land has reduced electrodeposited coating, reduce the consumption of coat of metal material, reduced production cost and reduced the discharge of poisonous waste pollution that brings when electroplating again.
Description of drawings
Fig. 1, the utility model structure and point type are electroplated schematic diagram.
Fig. 2, prior art structure and electrodeposited coating cover schematic diagram (L between electroplating region).
Embodiment
Below in conjunction with accompanying drawing embodiment of the present utility model is further described.
Main body is by the chip section 1 of band through hole, is linked to be whole interim pins 4 and two with little solder joint 2 ' and form with the side pipe pin 3 that interim pins 4 links together with chip section 1.
Electroplate non-ferromagnetic metal level, square plating point 5 is electroplated in the position that is distributed in chip section 1 lower end intermediate demand packaged chip, and the length of side is in 1.8～2.2mm zone.
In the little solder joint 2 ' Zone Full in both sides pin 3 upper ends, electroplate, electroplate point 2 and little solder joint 2 ' shape and be complementary.
Claims (3)
1, a kind of point type electroplate lead wire framework, comprise by chip section (1), little solder joint (2 '), side pipe pin (3), the main body of interim pins (4) formation and the electrodeposited coating that covers on the main body and forming, it is characterized in that described electrodeposited coating is for being spot distribution on lead frame.
2, point type electroplate lead wire framework according to claim 1 is characterized in that needing the packaged chip place on chip section (1), and square plating point (5) is arranged, and the length of side is in 1.8～2.2mm zone.
3, point type electroplate lead wire framework according to claim 1 is characterized in that going up Zone Full at the little solder joint (2 ') of both sides pin (3) upper end electroplates, and electroplates point (2) and is complementary with little solder joint (2 ') shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620102751 CN2909527Y (en) | 2006-04-14 | 2006-04-14 | Point electroplating lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620102751 CN2909527Y (en) | 2006-04-14 | 2006-04-14 | Point electroplating lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2909527Y true CN2909527Y (en) | 2007-06-06 |
Family
ID=38128744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620102751 Expired - Lifetime CN2909527Y (en) | 2006-04-14 | 2006-04-14 | Point electroplating lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2909527Y (en) |
-
2006
- 2006-04-14 CN CN 200620102751 patent/CN2909527Y/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20070606 |
|
| EXPY | Termination of patent right or utility model |