CN206022886U - The chip adsorbing mechanism of the full-automatic eutectic chip mounter of Laser Devices - Google Patents
The chip adsorbing mechanism of the full-automatic eutectic chip mounter of Laser Devices Download PDFInfo
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- CN206022886U CN206022886U CN201620918939.0U CN201620918939U CN206022886U CN 206022886 U CN206022886 U CN 206022886U CN 201620918939 U CN201620918939 U CN 201620918939U CN 206022886 U CN206022886 U CN 206022886U
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- suction nozzle
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Abstract
The utility model discloses a kind of chip adsorbing mechanism of the full-automatic eutectic chip mounter of Laser Devices, solve the problems, such as that chip absorption breakage rate is high and absorption low precision.It is included in lower skateboard（7）Right flank on be fixedly installed YZ plane risers（8）, in YZ plane risers（8）Right flank on be provided with YZ planar arc grooves, be movably set with YZ orientation angle adjustable plates in YZ planar arc grooves（9）, in YZ orientation angle adjustable plates（9）Right flank on be fixedly installed XZ plane risers（10）, XZ planar arc grooves are provided with the leading flank of XZ plane risers, in XZ planar arc grooves are movably set with XZ orientation angle adjustable plates（11）, suction nozzle mounting seat is fixedly connected with the right-hand member of XZ orientation angle adjustable plates（15）, suction nozzle clamping frame plate is provided with suction nozzle mounting seat（16）, frame plate is clamped in suction nozzle（16）On be provided with chip inhale Zi, one of the lunar mansions（20）.The absorption precision of micro chip is improve, absorption breakage rate is reduced.
Description
Technical field
The present invention relates to a kind of chip adsorbent equipment of the full-automatic eutectic chip mounter of Laser Devices, more particularly to a kind of application
In full-automatic eutectic chip mounter from the adsorbing mechanism of precision pick chip on blue membranous disc.
Background technology
In optical communication field, optical signal is transmitted by optical fiber, in the transmittance process of optical signal, due to launching work(
Rate is limited, is provided with several light transmitting-receiving moulds for playing relaying action being made up of generating laser and receptor on transmission line
Block.Prior art, in the production process of generating laser, is to first pass through artificial pickup chip（LD chips）, then by naked eyes
Positioning chip welding base under the microscope（TO type bases）On, chip attachment is completed by eutectic technology.This pickup
There is chip pickup difficulty with localization method, positioning precision is poor, the problem of low production efficiency.Also there are some chips in prior art
Pickup and the automatic mechanism of positioning, but as LD chip sizes are little, material is crisp, thickness of thin, the absorption of these automatic mechanisms
Head is being rigid with downward contact pressure in chip contact process, easily causes the breakage of LD chips, increased the useless of chip
Product rate；Meanwhile, often there is adsorption head center vertical line with chip surface not in assembling process in the adsorption head of these automatic mechanisms
Vertical problem, causes adsorption plane gas leakage, causes absorption failure.
Content of the invention
The invention provides a kind of chip adsorbing mechanism of the full-automatic eutectic chip mounter of Laser Devices, solves chip absorption
Breakage rate technical problem that is high and adsorbing low precision.
The present invention is to solve above technical problem by the following technical programs：
A kind of chip adsorbing mechanism of the full-automatic eutectic chip mounter of Laser Devices, including mounting body, in mounting body
The X axis guide rail of left and right directions is provided with top surface, left and right slide plate is provided with the X axis guide rail of left and right directions, is being installed
Differential screw regulator is provided with pedestal, the output shaft of differential screw regulator is linked together with left and right slide plate, in left and right
The Y-axis substrate of fore-and-aft direction is provided with the right flank of slide plate, is provided with the right flank of the Y-axis substrate of fore-and-aft direction
The Z axis direction guiding rail of above-below direction, is provided with lower skateboard, on the Z axis direction guiding rail of above-below direction in the right flank of upper lower skateboard
On be fixedly installed YZ plane risers, be provided with YZ planar arc grooves on the right flank of YZ plane risers, in YZ planar arcs
YZ orientation angle adjustable plates are movably set with groove, between YZ orientation angles adjustable plate and YZ plane risers are provided with YZ directions
Angle adjustment plate fixes jackscrew, is fixedly installed XZ plane risers, in XZ planes on the right flank of YZ orientation angle adjustable plates
XZ planar arc grooves are provided with the leading flank of riser, in XZ planar arc grooves are movably set with XZ orientation angle adjustable plates,
XZ orientation angles adjustable plate is provided between XZ orientation angles adjustable plate and YZ plane risers and fixes jackscrew, in XZ orientation angles
The right-hand member of adjustable plate is fixedly connected with suction nozzle mounting seat, is provided with suction nozzle clamping frame plate, clamps in suction nozzle in suction nozzle mounting seat
Chip is provided with frame plate inhales Zi, one of the lunar mansions.
Suction nozzle Z-direction sports limiting groove is provided with suction nozzle clamping frame plate, in suction nozzle Z-direction sports limiting groove, is provided with suction
Mouth Z-direction motion guide wheel pair, chip are inhaled Zi, one of the lunar mansions and are movably arranged on suction nozzle Z-direction motion guide wheel centering, and the lower end for inhaling Zi, one of the lunar mansions in chip is provided with
Spring lower draw-bar, the upper end for clamping frame plate in suction nozzle are provided with spring and link up with, between linking up with spring lower draw-bar and spring
It is provided with spring.
Inventive structure is simple, realizes easily, improve the absorption precision of micro chip, reducing absorption breakage rate.
Description of the drawings
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the structural representation of the suction nozzle mounting seat 15 of the present invention；
Fig. 3 is structural representation of the suction nozzle mounting seat 15 of the present invention in side-looking direction.
Specific embodiment
The present invention is described in detail below in conjunction with the accompanying drawings：
A kind of chip adsorbing mechanism of the full-automatic eutectic chip mounter of Laser Devices, including mounting body 1, in mounting body 1
Top surface on be provided with the X axis guide rail 2 of left and right directions, be provided with left and right slide plate 3 on the X axis guide rail 2 of left and right directions,
Differential screw regulator 4 is provided with mounting body 1, and the output shaft of differential screw regulator 4 is connected to one with left and right slide plate 3
Rise, the Y-axis substrate 5 of fore-and-aft direction is provided with the right flank of left and right slide plate 3, on the right side of the Y-axis substrate 5 of fore-and-aft direction
The Z axis direction guiding rail 6 of above-below direction is provided with side, is provided with lower skateboard 7, upper on the Z axis direction guiding rail 6 of above-below direction
YZ planes riser 8 is fixedly installed on the right flank of lower skateboard 7, is provided with YZ plane arcs on the right flank of YZ planes riser 8
Shape groove, is movably set with YZ orientation angles adjustable plate 9 in YZ planar arc grooves, in YZ orientation angles adjustable plate 9 and YZ planes
YZ orientation angles adjustable plate being provided between riser 8 and fixing jackscrew 13, fixation on the right flank of YZ orientation angles adjustable plate 9 sets
XZ planes riser 10 is equipped with, XZ planar arc grooves are provided with the leading flank of XZ planes riser 10, in XZ planar arc grooves
XZ orientation angles adjustable plate 11 is movably set with, between XZ orientation angles adjustable plate 11 and YZ planes riser 8, is provided with XZ side
Jackscrew 14 is fixed to angle adjustment plate, suction nozzle mounting seat 15 is fixedly connected with the right-hand member of XZ orientation angles adjustable plate 11, inhaling
Suction nozzle clamping frame plate 16 is provided with mouth mounting seat 15, is clamped in suction nozzle and is provided with chip suction Zi, one of the lunar mansions 20 on frame plate 16.
Clamp in suction nozzle and suction nozzle Z-direction sports limiting groove 12 is provided with frame plate 16, set in suction nozzle Z-direction sports limiting groove 12
Suction nozzle Z-direction motion guide wheel is equipped with to 21, and chip is inhaled Zi, one of the lunar mansions 20 and is movably arranged on suction nozzle Z-direction motion guide wheel in 21, Zi, one of the lunar mansions being inhaled in chip
20 lower end is provided with spring lower draw-bar 19, and the upper end for clamping frame plate 16 in suction nozzle is provided with spring links up with 18, under spring
Spring 17 is provided between hook 18 on hook 19 and spring.
The present invention manually rotates differential screw regulator 4 and drives left and right slide plate 3, so as to adjust in chip mechanism for picking
Microscopic motion amount of the suction nozzle in X-direction.The suction nozzle mounting seat 15 of the present invention is on upper lower skateboard 7, it is possible to achieve chip is picked up
Take linear motion of the suction nozzle in Z-direction in mechanism.The fine setting of YZ orientation angles adjustable plate 9 and XZ orientation angles adjustable plate 11 is realized
The fine setting of suction nozzle mounting seat 15.Suction nozzle upper port in the component suction nozzle of the present invention accesses flexible pipe all the way, by one group of electromagnetic valve
Control vacuum and nitrogen two-way gas.In the case where electromagnetic valve must be controlled, when vacuum is accessed in flexible pipe, realize that suction nozzle is inhaled from blue membranous disc
Attached pickup chip；When accessing nitrogen in flexible pipe, nitrogen pressure can blow the impurity adsorbed at suction nozzle tip off（Dust, damaged
Chip residue etc.）, prevent suction nozzle from blocking.
Claims (2)
1. the chip adsorbing mechanism of the full-automatic eutectic chip mounter of a kind of Laser Devices, including mounting body（1）, in mounting body
（1）Top surface on be provided with the X axis guide rail of left and right directions（2）, in the X axis guide rail of left and right directions（2）On be provided with left and right
Slide plate（3）, in mounting body（1）On be provided with differential screw regulator（4）, differential screw regulator（4）Output shaft with left
Right slide plate（3）Link together, in left and right slide plate（3）Right flank on be provided with the Y-axis substrate of fore-and-aft direction（5）, front
The Y-axis substrate of rear direction（5）Right flank on be provided with the Z axis direction guiding rail of above-below direction（6）, above-below direction Z axis to
Guide rail（6）On be provided with lower skateboard（7）, it is characterised in that in upper lower skateboard（7）Right flank on be fixedly installed YZ planes
Riser（8）, in YZ plane risers（8）Right flank on be provided with YZ planar arc grooves, activity in the YZ planar arc grooves is arranged
There are YZ orientation angle adjustable plates（9）, in YZ orientation angle adjustable plates（9）With YZ plane risers（8）Between be provided with YZ deflections
Degree adjustable plate fixes jackscrew（13）, in YZ orientation angle adjustable plates（9）Right flank on be fixedly installed XZ plane risers（10）,
In XZ plane risers（10）Leading flank on be provided with XZ planar arc grooves, be movably set with XZ directions in XZ planar arc grooves
Angle adjustment plate（11）, in XZ orientation angle adjustable plates（11）With YZ plane risers（8）Between be provided with XZ orientation angles regulation
Jackscrew fixed by plate（14）, in XZ orientation angle adjustable plates（11）Right-hand member be fixedly connected with suction nozzle mounting seat（15）, pacify in suction nozzle
Dress seat（15）On be provided with suction nozzle clamping frame plate（16）, frame plate is clamped in suction nozzle（16）On be provided with chip inhale Zi, one of the lunar mansions（20）.
2. the chip adsorbing mechanism of the full-automatic eutectic chip mounter of a kind of Laser Devices according to claim 1, its feature exist
In in suction nozzle clamping frame plate（16）On be provided with suction nozzle Z-direction sports limiting groove（12）, in suction nozzle Z-direction sports limiting groove（12）Interior
It is provided with suction nozzle Z-direction motion guide wheel pair（21）, chip suction Zi, one of the lunar mansions（20）It is movably arranged on suction nozzle Z-direction motion guide wheel pair（21）In,
Chip inhales Zi, one of the lunar mansions（20）Lower end be provided with spring lower draw-bar（19）, frame plate is clamped in suction nozzle（16）Upper end be provided with spring hang
Hook（18）, in spring lower draw-bar（19）Link up with spring（18）Between be provided with spring（17）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620918939.0U CN206022886U (en) | 2016-08-23 | 2016-08-23 | The chip adsorbing mechanism of the full-automatic eutectic chip mounter of Laser Devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620918939.0U CN206022886U (en) | 2016-08-23 | 2016-08-23 | The chip adsorbing mechanism of the full-automatic eutectic chip mounter of Laser Devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206022886U true CN206022886U (en) | 2017-03-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620918939.0U Active CN206022886U (en) | 2016-08-23 | 2016-08-23 | The chip adsorbing mechanism of the full-automatic eutectic chip mounter of Laser Devices |
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| CN (1) | CN206022886U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106253049A (en) * | 2016-08-23 | 2016-12-21 | 中国电子科技集团公司第二研究所 | The chip adsorbing mechanism of Laser Devices full-automatic eutectic chip mounter |
| CN114325300A (en) * | 2021-11-09 | 2022-04-12 | 苏州联讯仪器有限公司 | Chip test equipment for optical communication |
| CN115172231A (en) * | 2022-09-08 | 2022-10-11 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Rapid heating and cooling eutectic heating table with atmosphere protection |
-
2016
- 2016-08-23 CN CN201620918939.0U patent/CN206022886U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106253049A (en) * | 2016-08-23 | 2016-12-21 | 中国电子科技集团公司第二研究所 | The chip adsorbing mechanism of Laser Devices full-automatic eutectic chip mounter |
| CN114325300A (en) * | 2021-11-09 | 2022-04-12 | 苏州联讯仪器有限公司 | Chip test equipment for optical communication |
| CN114325300B (en) * | 2021-11-09 | 2023-08-08 | 苏州联讯仪器股份有限公司 | Chip test equipment for optical communication |
| CN115172231A (en) * | 2022-09-08 | 2022-10-11 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Rapid heating and cooling eutectic heating table with atmosphere protection |
| CN115172231B (en) * | 2022-09-08 | 2022-11-25 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Rapid heating and cooling eutectic heating table with atmosphere protection |
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