CN208556251U - A kind of flexible jig - Google Patents
A kind of flexible jig Download PDFInfo
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- CN208556251U CN208556251U CN201820610087.8U CN201820610087U CN208556251U CN 208556251 U CN208556251 U CN 208556251U CN 201820610087 U CN201820610087 U CN 201820610087U CN 208556251 U CN208556251 U CN 208556251U
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- flexible jig
- semiconductor chip
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- servo
- heating
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Abstract
The utility model relates to micro semiconductor chip bonding equipment field more particularly to a kind of flexible jigs.A kind of flexible jig is provided, including the adsorbent support mechanism for fixing semiconductor chip, the heating mechanism for semiconductor chip heating below adsorbent support mechanism is set, and the elevating mechanism below heating mechanism for driving adsorbent support mechanism to move up and down is set.By the way that an adsorbent support mechanism is arranged in heating mechanism, under the premise of meeting bonding wire processing temperature, it can effectively prevent the tail portion of welding caused by loosening because of semiconductor chip not of uniform size, improve welding precision, welding quality and production efficiency, reduce scrappage, easy to operate；The height for being used to adjust adsorbent support mechanism by increasing an elevating mechanism again, semiconductor chip that can be different to a variety of height carry out bonding wire, improve the versatility of fixture.
Description
Technical field
The utility model relates to micro semiconductor chip bonding equipment field more particularly to a kind of flexible jigs.
Background technique
It is mostly currently on the market to be completed under artificial operation to the bonding wire of micro semiconductor chip.Specific operation process is more
Micro semiconductor chip manually to be placed corresponding position and carries out bonding wire under automanual machine.The effect of such bonding wire is simultaneously
Undesirable, can generate following problems: the tail portion of welding is not of uniform size, and welding precision is poor, and welding quality is bad, and production efficiency is low,
Scrappage is high and higher to the technical requirements of operator.
Utility model content
The technical problem to be solved by the present invention is in view of the above drawbacks of the prior art, provide a kind of adjustable clamp
Tool, overcome the tail portion of existing welding not of uniform size, welding precision is poor, and welding quality is bad, and production efficiency is low, scrappage height with
And to the technical requirements of operator it is higher the problems such as.
The technical scheme adopted by the utility model to solve the technical problem is as follows: providing a kind of flexible jig, including it is used for
The heating for semiconductor chip heating below adsorbent support mechanism is arranged in the adsorbent support mechanism of fixed semiconductor chip
Mechanism, and the elevating mechanism below heating mechanism for driving adsorbent support mechanism to move up and down is set.
The still more preferably scheme of the utility model is: the elevating mechanism includes pedestal, leading of being set on the base
To plate, the servo-actuated riser being slidably arranged on guide plate, transporting for driving servo-actuated riser to do lifting for guide plate side is set
Dynamic screw mechanism, the servo-actuated riser are connected with heating mechanism.
The still more preferably scheme of the utility model is: the flexible jig further includes the bottom being arranged in below pedestal
Plate, threaded hole is provided on the bottom plate and the X for adjusting the displacement of flexible jig X-direction is displaced adjustment structure, the pedestal
On be provided with threaded hole cooperation for adjust flexible jig Y-direction displacement Y be displaced adjustment structure.
The still more preferably scheme of the utility model is: the elevating mechanism further includes one that guide plate two sides are arranged in
End connects the extension spring of servo-actuated riser other end connection pedestal.
The still more preferably scheme of the utility model is: the heating mechanism includes the heat dissipation bottom to connect with servo-actuated riser
Plate and the heat block for semiconductor chip heating being arranged on radiating bottom plate.
The still more preferably scheme of the utility model is: the flexible jig further includes being arranged in servo-actuated riser and heat dissipation
The connecting plate equipped with heat release hole between bottom plate is provided with heat dissipation air vent connector and the heat dissipation equipped with perforation on the connecting plate
Piece, the heat dissipation air vent connector are connected by perforation with the heat release hole on connecting plate.
The still more preferably scheme of the utility model is: the adsorbent support mechanism includes the top being connected on heat block
Plate, be arranged on top plate for fixing the bulk cargo jig of semiconductor chip and being arranged in the vacuum pipe of heat block side,
The first vacuum stomata is offered on the top plate, the vacuum pipe is connected with the first vacuum stomata.
The still more preferably scheme of the utility model is: the adsorbent support mechanism further includes being arranged on connecting plate
Preceding vertical block and afterwards vertical block are arranged in preceding vertical block and the rear thermal insulation board stood on block, are arranged on thermal insulation board and determine for bulk cargo jig
The limit plate component of position.
The still more preferably scheme of the utility model is: the flexible jig further include setting heat block and top plate it
Between elastic hold-down mechanism.
The still more preferably scheme of utility model is: the elastic hold-down mechanism includes the light being arranged on heat block
Axis, the clamping jaw being rotatably arranged on optical axis, the compressed spring being arranged between clamping jaw and heat block, the clamping jaw is far from compression bullet
One end of spring sticks on top plate.
The utility model has the beneficial effects that: being met by the way that an adsorbent support mechanism is arranged in heating mechanism
Under the premise of bonding wire processing temperature, it can effectively prevent the tail portion of welding caused by loosening because of semiconductor chip not of uniform size, mention
High welding precision, welding quality and production efficiency reduce scrappage, easy to operate；It is used again by increasing an elevating mechanism
In the height of adjustment adsorbent support mechanism, semiconductor chip that can be different to a variety of height carries out bonding wire, improves the logical of fixture
The property used.
Detailed description of the invention
Utility model is described further below in conjunction with accompanying drawings and embodiments, in attached drawing:
Fig. 1 is the flexible jig structural schematic diagram of the utility model embodiment；
Fig. 2 is the structural schematic diagram of the elevating mechanism of the utility model embodiment；
Fig. 3 is the structural schematic diagram of the heating mechanism of the utility model embodiment；
Fig. 4 is the structural schematic diagram of the adsorbent support mechanism of the utility model embodiment.
Specific embodiment
Now in conjunction with attached drawing, elaborate to the preferred embodiment of the utility model.
As shown in Figure 1, a kind of flexible jig of the present embodiment, including the adsorbent support mechanism for fixing semiconductor chip
1, the heating mechanism 2 for semiconductor chip heating below adsorbent support mechanism 1 is set, and is arranged in heating mechanism 2
The elevating mechanism 3 that lower section is used to that adsorbent support mechanism 1 to be driven to move up and down.By the way that an absorption is arranged in heating mechanism 2
Supporting mechanism 1 can effectively prevent welding caused by loosening because of semiconductor chip under the premise of meeting bonding wire processing temperature
Tail portion is not of uniform size, improves welding precision, welding quality and production efficiency, reduces scrappage, easy to operate；Pass through increasing again
Add an elevating mechanism 3 for adjusting the height of adsorbent support mechanism 1, semiconductor chip that can be different to a variety of height carries out
Bonding wire improves the versatility of fixture.
As shown in Figure 1, 2, the elevating mechanism 3 include pedestal 31, be set on the base guide plate 32, be slidably arranged in
Servo-actuated riser 33 on guide plate 32, the lead screw for driving servo-actuated perpendicular 33 plates to move up and down that 32 side of guide plate is set
Mechanism 34, the servo-actuated riser 33 are connected with heating mechanism 2.The screw mechanism 34 includes that one end is rotatably arranged on pedestal 31
On T-type lead screw 341, the feed screw nut 342 that is socketed on T-type screw rod 341.By by heating mechanism 2 and servo-actuated 33 phase of riser
Connection, then servo-actuated riser 33 is connected with feed screw nut 342, then by turning T-type screw rod 341, can realize feed screw nut 342
Lifting, while adsorbent support mechanism 1 on elevating mechanism 3 can be driven to complete elevating movement.Certainly screw mechanism herein can
To be replaced by cylinder, the elevating movement of supporting mechanism 1 is realized by cylinder.Described 341 one end of T-type screw rod is additionally provided with knob,
It can be used for reversing T-type screw rod 341 manually, structure is simple, convenient to use.Certainly may be otherwise use is driven by electricity T-type screw rod
341 rotations, it is more convenient.The T-type screw rod 341 is provided with bearing with 31 junction of pedestal, reduces the friction of the two, mentions
The efficiency of high flexible jig.The T-type screw rod 341 is additionally provided with anchor ear close to one end of pedestal 31, can online welder when making, hold tightly
T-type screw rod 341 prevents T-type screw rod 341 from rotating, and improves fixture stability.The guide plate 32, which is equipped with, intersects ball slide rail,
The servo-actuated riser 33, which is mounted on, to intersect on ball slide rail.Intersect ball slide rail by increasing, can effectively reduce servo-actuated perpendicular
Friction between plate 33 and guide plate 32, lifting system efficiency.
The flexible jig further includes the bottom plate 4 being arranged in below pedestal 31, is provided with threaded hole and use on the bottom plate 4
It is displaced adjustment structure 41 in the X of adjustment flexible jig X-direction displacement, is provided on the pedestal 31 with threaded hole cooperation for adjusting
The Y of whole flexible jig Y-direction displacement is displaced adjustment structure 311.By increasing the position X for adjusting the displacement of flexible jig X-direction
Transposition section structure 41, and Y displacement adjustment structure 311 for adjusting the displacement of flexible jig Y-direction is, it can be achieved that flexible jig
The fine tuning of X-direction and Y-direction position, the position that can adjust flexible jig at any time adapt to processing, improve processing effect.The X
Displacement adjustment structure 41 is strip hole, and the Y displacement adjustment structure 311 is strip hole.
The elevating mechanism 3 further includes one end connection servo-actuated 33 other end of riser connection bottom that 32 two sides of guide plate are arranged in
The extension spring of seat 31.By increase an extension spring, can to servo-actuated riser 33 apply a pretightning force, can effectively prevent with
Dynamic riser 33 processes mistake caused by sliding, and improves fixture stability.
As shown in Figure 1-3, the heating mechanism 2 includes that the radiating bottom plate 21 to connect with servo-actuated riser 33 and setting exist
The heat block 22 for semiconductor chip heating on radiating bottom plate 21.Semiconductor chip can be added by heat block 22
Heat, the temperature requirements before meeting semiconductor chip wire bonding；One radiating bottom plate 21 is set below heat block 22, heat block can be prevented
22 temperature are excessively high, damage to the elevating mechanism 3 of lower section.
As shown in Figure 1-3, the flexible jig further includes that being equipped between servo-actuated riser 33 and radiating bottom plate 21 is arranged in
The connecting plate 6 of heat release hole is provided with heat dissipation air vent connector 61 and the cooling fin 62 equipped with perforation on the connecting plate 6, described
Heat dissipation air vent connector 61 is connected by perforation with the heat release hole on connecting plate.By between servo-actuated riser 33 and radiating bottom plate 21
Increase a connecting plate 6, the heat release hole being connected to heat dissipation air vent connector 61 is offered on the connecting plate 6, can effectively be dropped
Influence of the low heat block 22 to elevating mechanism 3, can increase the service life of fixture.
As shown in Fig. 1,3,4, the adsorbent support mechanism 1 includes the top plate 11 being connected on heat block 22, is arranged and is pushing up
On plate 11 for fixing the bulk cargo jig 12 of semiconductor chip and being arranged in the vacuum pipe 13 of 22 side of heat block, institute
It states and offers the first vacuum stomata 111 on top plate 11, the vacuum pipe 13 is connected with the first vacuum stomata 111.It is logical
It crosses and the vacuum pipe 13 is connected with the first vacuum stomata 111, vacuum pipe 13 is connected with vacuum air valve, just
The first vacuum stomata 111 can be led to bulk cargo jig 12 is absorbed and fixed on top plate 11.The bulk cargo jig 12 be equipped with it is multiple with
The through-hole that vacuum pipe 13 is connected to, for adsorbing semiconductor chip of the fixed placement on bulk cargo jig 12.In the present embodiment
Bulk cargo jig 12 is detachable installation, and different bulk cargo jigs can be replaced according to different semiconductor chips, improves adjustable clamp
The versatility of tool.Vacuum pipe 13 in this implementation is vacuum copper pipe, and copper pipe has the performances such as non-leakage, not combustion-supporting, corrosion-resistant, can
Increase the service life of fixture.It is offered on the heat block 22 and the second vacuum stomata, the second vacuum stomata and vacuum
Pipeline 13, state the first vacuum stomata 111 be interconnected.By by the second vacuum stomata and vacuum pipe 13, state the first vacuum gas
Hole 111 is interconnected, and can promote the heating effect of 12 semiconductor-on-insulator chip of bulk cargo jig.
As shown in Figs 1-4, the adsorbent support mechanism 1 further includes that block 14 and afterwards vertical block are found before being arranged on connecting plate 6
15, preceding vertical block 14 and the rear thermal insulation board 16 stood on block 15 are set, positioning on thermal insulation board 16 for bulk cargo jig 12 is set
Limit plate component 17.The limit plate component 17 includes L-type limit plate 171 and front limit plate 172, passes through two limit plates
Cooperate it is achievable to bulk cargo jig 12 position, guarantee wire bonding work is normally carried out.Limit can be effectively protected in thermal insulation board 16
Board group part 17 does not receive the influence of heat, improves the service life of fixture.
As shown in figure 3, the flexible jig further includes the elastic hold-down mechanism being arranged between heat block 22 and top plate 11
5.The elastic hold-down mechanism 5 includes the optical axis 51 being arranged on heat block 22, the clamping jaw 52 being rotatably arranged on optical axis 51, sets
The compressed spring 53 between clamping jaw 52 and heat block 22 is set, the clamping jaw 52 sticks on top plate far from one end of compressed spring 53
On 11.By the way that optical axis 51 is arranged in heat block 22, clamping jaw 52 can turn an angle along optical axis 52, then by 52 one end of clamping jaw
Increase a compressed spring 53 between heat block 22, the other end of clamping jaw 52 can be made to compress the top plate being connected on heat block 2
11。
It should be understood that above embodiments are only to illustrate the technical solution of the utility model, it is rather than its limitations, right
For those skilled in the art, it can modify to technical solution illustrated in the above embodiments, or to part of skill
Art feature is equivalently replaced；And all such modifications and replacement, it all should belong to the protection of the appended claims for the utility model
Range.
Claims (9)
1. a kind of flexible jig, it is characterised in that: including the adsorbent support mechanism for fixing semiconductor chip, setting is being adsorbed
The heating mechanism for semiconductor chip heating below supporting mechanism, and be arranged below heating mechanism for driving absorption
The elevating mechanism that supporting mechanism moves up and down；
The elevating mechanism includes pedestal, is set on the base guide plate, is set the servo-actuated riser being slidably arranged on guide plate
Set the screw mechanism for driving servo-actuated riser to move up and down in guide plate side, the servo-actuated riser and heating mechanism phase
Connection.
2. flexible jig according to claim 1, it is characterised in that: the flexible jig further includes being arranged below pedestal
Bottom plate, threaded hole is provided on the bottom plate and the X for adjusting the displacement of flexible jig X-direction is displaced adjustment structure, it is described
It is provided on pedestal and is displaced adjustment structure with the Y for adjusting the displacement of flexible jig Y-direction of threaded hole cooperation.
3. flexible jig according to claim 2, it is characterised in that: the elevating mechanism further includes being arranged in guide plate two
One end of side connects the extension spring of servo-actuated riser other end connection pedestal.
4. flexible jig according to claim 1, it is characterised in that: the heating mechanism includes connecting with servo-actuated riser
Radiating bottom plate and the heat block for semiconductor chip heating being arranged on radiating bottom plate.
5. flexible jig according to claim 4, it is characterised in that: the flexible jig further includes being arranged in servo-actuated riser
The connecting plate equipped with heat release hole between radiating bottom plate is provided with heat dissipation air vent connector on the connecting plate and is equipped with perforation
Cooling fin, the heat dissipation air vent connector by perforation is connected with the heat release hole on connecting plate.
6. flexible jig according to claim 5, it is characterised in that: the adsorbent support mechanism includes being connected to heat block
On top plate, be arranged on top plate for fix semiconductor chip bulk cargo jig and the true of heat block side is set
Vacant duct offers the first vacuum stomata on the top plate, and the vacuum pipe is connected with the first vacuum stomata.
7. flexible jig according to claim 6, it is characterised in that: the adsorbent support mechanism further includes that setting is connecting
Preceding vertical block on plate and rear vertical block, preceding vertical block and thermal insulation board on rear vertical block are set, be arranged on thermal insulation board for bulk cargo
The limit plate component of jig positioning.
8. flexible jig according to claim 6, it is characterised in that: the flexible jig further include setting in heat block and
Elastic hold-down mechanism between top plate.
9. flexible jig according to claim 8, it is characterised in that: the elastic hold-down mechanism includes being arranged in heat block
On optical axis, the clamping jaw being rotatably arranged on optical axis, the compressed spring that is arranged between clamping jaw and heat block, the clamping jaw is separate
One end of compressed spring sticks on top plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820610087.8U CN208556251U (en) | 2018-04-26 | 2018-04-26 | A kind of flexible jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820610087.8U CN208556251U (en) | 2018-04-26 | 2018-04-26 | A kind of flexible jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208556251U true CN208556251U (en) | 2019-03-01 |
Family
ID=65481408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820610087.8U Active CN208556251U (en) | 2018-04-26 | 2018-04-26 | A kind of flexible jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208556251U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110877240A (en) * | 2019-12-25 | 2020-03-13 | 无锡新柯工具制造有限公司 | Automatic clamping jaw of wood chisel |
| CN115283926A (en) * | 2022-09-29 | 2022-11-04 | 江苏时代新能源科技有限公司 | Welding jig and welding equipment |
| CN117564594A (en) * | 2024-01-15 | 2024-02-20 | 宁波尚进自动化科技有限公司 | Manual welding table |
-
2018
- 2018-04-26 CN CN201820610087.8U patent/CN208556251U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110877240A (en) * | 2019-12-25 | 2020-03-13 | 无锡新柯工具制造有限公司 | Automatic clamping jaw of wood chisel |
| CN115283926A (en) * | 2022-09-29 | 2022-11-04 | 江苏时代新能源科技有限公司 | Welding jig and welding equipment |
| CN115283926B (en) * | 2022-09-29 | 2023-01-06 | 江苏时代新能源科技有限公司 | Welding jig and welding equipment |
| CN117564594A (en) * | 2024-01-15 | 2024-02-20 | 宁波尚进自动化科技有限公司 | Manual welding table |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 No. 9988 Shennan Road, Nanshan District, Shenzhen, Guangdong Patentee after: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. Patentee after: Shenzhen Dazu Photoelectric Equipment Co.,Ltd. Address before: 518000 No. 9988 Shennan Road, Nanshan District, Shenzhen, Guangdong Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. Patentee before: SHENZHEN HAN'S PHOTOELECTRIC EQUIPMENT Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220311 Address after: 518000 floor 6, building 5, Han's laser Industrial Park, No. 128, Chongqing Road, Fuyong street, Bao'an District, Shenzhen, Guangdong Province Patentee after: Shenzhen Dazu Photoelectric Equipment Co.,Ltd. Address before: 518000 No. 9988 Shennan Road, Nanshan District, Shenzhen, Guangdong Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. Patentee before: Shenzhen Dazu Photoelectric Equipment Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 floor 6, building 5, Han's laser Industrial Park, No. 128, Chongqing Road, Fuyong street, Bao'an District, Shenzhen, Guangdong Province Patentee after: Shenzhen Han family sealing and Testing Technology Co.,Ltd. Address before: 518000 floor 6, building 5, Han's laser Industrial Park, No. 128, Chongqing Road, Fuyong street, Bao'an District, Shenzhen, Guangdong Province Patentee before: Shenzhen Dazu Photoelectric Equipment Co.,Ltd. |