CN206005002U - Printed circuit board (PCB) - Google Patents
Printed circuit board (PCB) Download PDFInfo
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- CN206005002U CN206005002U CN201621055349.6U CN201621055349U CN206005002U CN 206005002 U CN206005002 U CN 206005002U CN 201621055349 U CN201621055349 U CN 201621055349U CN 206005002 U CN206005002 U CN 206005002U
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Abstract
This utility model is related to a kind of printed circuit board (PCB), including components and parts layer, routing layer and holding wire, described components and parts layer and described routing layer are provided with two difference through holes, described holding wire is worn to described routing layer from described components and parts layer by described difference through hole, described two difference through holes are surrounded by a metal level, the distance between described two difference through holes are 20～50mil, and/or, the minimum range of described metal level to described difference through hole is 10～35mil.The printed circuit board (PCB) that this utility model provides, by expanding the distance between two difference through holes, and/or expand metal level to the distance of difference through hole, impedance continuity and the signal integrity of holding wire can be kept, improve signal transmission quality, ensure high speed transmission of signals, this utility model PCB design is reasonable, structure is simple, it is easy to accomplish.
Description
Technical field
This utility model is related to field of circuit technology, particularly to a kind of printed circuit board (PCB).
Background technology
With the raising of the signal density on printed circuit board (PCB), need more signal transmitting layer, then pass through via real
Existing interlayer signal transmission is inevitable.With the development in high speed epoch, the transmission speed of signal is more and more faster, integrated chip
Degree more and more higher, this is huge challenge for high speed signal wiring and signal integrity.
Printed circuit board (PCB) at least includes components and parts layer and routing layer, and routing layer includes holding wire.Current cabling mode is
Directly holding wire being drawn by via it is difficult to ensure the impedance concordance of holding wire, thus causing impedance fluctuations, affecting signal
Transmission quality.Especially flourishing along with 4G, 5G high-speed communication network, during high speed transmission of signals, to link
Impedance coherence request more and more higher, maintains high-quality high speed transmission of signals quality palpus controlling transmission channel impedance very steady
Fixed.Traditional printed circuit board (PCB) cabling mode will be unable to meet high speed signaling quality demand.
Utility model content
The purpose of this utility model is to provide a kind of printed circuit board (PCB), complete to improve high-speed line impedance continuity and signal
Whole property.
In order to realize above-mentioned utility model purpose, this utility model embodiment provides technical scheme below：
A kind of printed circuit board (PCB), including components and parts layer, routing layer and holding wire, described components and parts layer and described routing layer are equal
It is provided with two difference through holes, described holding wire is worn to described routing layer, institute from described components and parts layer by described difference through hole
State two difference through holes to be surrounded by a metal level, the distance between described two difference through holes are 20～50mil, and/or, described
Metal level is 10～35mil to the minimum range of described difference through hole.
It is preferred that in above-mentioned printed circuit board (PCB), the distance between described two difference through holes are 30～40mil.
It is preferred that in above-mentioned printed circuit board (PCB), the minimum range of described metal level to described difference through hole is 15～
27.5mil.
Further, above-mentioned printed circuit board (PCB) also includes the first ground plane and the second ground plane, and described routing layer is located at institute
State between the first ground plane and the second ground plane, described difference through hole pass through described first ground plane connect described components and parts layer and
Described routing layer.Routing layer passes through two ground plane shieldings, and so setting can eliminate interference, improves signal transmission matter further
Amount.
Further, in above-mentioned printed circuit board (PCB), the inner surface setting of described difference through hole has a weld-ring, described weld-ring interior
Footpath is 0.3～0.6 with the ratio of external diameter.It is further preferred that the internal diameter of described weld-ring is 0.4～0.5 with the ratio of external diameter.
More preferably, described metal level is copper sheet layer.
The printed circuit board (PCB) that this utility model embodiment provides, by expanding the distance between two difference through holes, and/or
Expand metal level to the distance of difference through hole, impedance continuity and the signal integrity of holding wire can be kept, improve signal and pass
Transmission quality, ensures high speed transmission of signals, and rationally, structure is simple for this utility model PCB design, it is easy to accomplish.
Brief description
In order to be illustrated more clearly that the technical scheme of this utility model embodiment, below will be to use required in embodiment
Accompanying drawing be briefly described it will be appreciated that the following drawings illustrate only some embodiments of the present utility model, therefore should
It is counted as the restriction to scope, for those of ordinary skill in the art, on the premise of not paying creative work, also
Other related accompanying drawings can be obtained according to these accompanying drawings.
The structural representation of the printed circuit board (PCB) that Fig. 1 provides for this utility model embodiment.
Fig. 2 be in this utility model embodiment difference through hole and copper sheet layer apart from schematic diagram.
Fig. 3 is the analogous diagram of the impedance-time domain in embodiment 1.
Fig. 4 is the analogous diagram of the impedance-time domain in embodiment 3.
Main element symbol description
Components and parts layer 100；First ground plane 200；Routing layer 300；Second ground plane 400；Weld-ring 500, difference through hole
600；Copper sheet layer 700.
Specific embodiment
Below in conjunction with accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out clearly
Chu, it is fully described by it is clear that described embodiment is only a part of embodiment of this utility model, rather than whole realities
Apply example.The assembly of this utility model embodiment generally described and illustrated in accompanying drawing herein can be come with various different configurations
Arrangement and design.Therefore, below the detailed description of the embodiment of the present utility model providing in the accompanying drawings is not intended to limit
Claimed scope of the present utility model, but it is merely representative of selected embodiment of the present utility model.Based on this utility model
Embodiment, the every other embodiment that those skilled in the art are obtained on the premise of not making creative work, all
Belong to the scope of this utility model protection.
Embodiment 1
Refer to Fig. 1（A difference through hole 600 is illustrate only in Fig. 1）, the printed circuit board (PCB) bag of offer in the present embodiment
Include components and parts layer 100, routing layer 300 and two ground planes, two ground planes are respectively the first ground plane 200 and the second ground plane
400, components and parts layer 100, the first ground plane 200, routing layer 300, the second ground plane 400 are sequentially arranged, i.e. components and parts layer 100
Shielded by the first ground plane 200 and routing layer 300 between, routing layer 300 is located at the first ground plane 200 and the second ground plane
Between 400, play shielding action.Components and parts layer 100, the first ground plane 200, routing layer 300 are provided with two difference through holes
600, two difference through holes 600 penetrate the first ground plane 200 from components and parts layer 100, until routing layer 300.Outside difference through hole 600
It is provided with metal level, that is, two difference through holes 600 are all surrounded ground connection by this metal level, surround ground connection by metal level, can disappear
Except interference, improve signal transmission quality.Usually, metal level is copper sheet layer 700, low cost and performance is good.
Printed circuit board (PCB) also includes the holding wire drawn from components and parts layer 100, and holding wire passes through difference through hole 600 from first device
Part layer 100 cabling is to routing layer 300.Specifically, the inner surface setting of difference through hole 600 has weld-ring 500, and holding wire passes through weld-ring
500 from components and parts layer 100 cabling to routing layer 300.
As shown in Fig. 2 defining the distance between two difference through holes 600 is x1, in the present embodiment, x1=30mil.
The printed circuit board (PCB) that the present embodiment provides, routing layer 300 is arranged in the first ground plane 200 and and the second ground plane
Between 400, good shielding action can be played；By expanding the distance between two difference through holes 600, weld-ring can be compensated
The TDR impedance that 500 cause reduces, and eliminates the first ground plane 200, the stub of the second ground plane 400, improves conventional print-circuit board
The poor defect of impedance continuity, preferably keeps seriality and the signal integrity of signal line impedance.As shown in figure 3, Fig. 3 shows
Go out x1 and take impedance-sequential relationship during different value, it can be seen that about impedance is maintained for unanimously after 70ms.
It should be noted that expand the distance between two difference through holes 600 can keep impedance concordance, but distance
The more big size that correspondingly can lead to circuit board is bigger, and is not linear reduction with the change of the increase impedance of distance
（In figure can be seen that, after 40ms, x1 takes impedance during different value to differ very little）, therefore, conforming comprehensive based on size and impedance
Close and consider, preferably x1=20～50mil, such as 20mil, 30mil, 35mil, 40mil, 45mil, with x1=30～40mil be especially
Good.
Embodiment 2
Refer to Fig. 1, the printed circuit board (PCB) providing in the present embodiment includes components and parts layer 100, routing layer 300, first connects
Stratum 200 and the second ground plane 400, components and parts layer 100, the first ground plane 200, routing layer 300, the second ground plane 400 are successively
Arrangement, components and parts layer 100, the first ground plane 200, routing layer 300 are provided with two difference through holes 600, two difference through holes
600 penetrate the first ground plane 200 from components and parts layer 100, until routing layer 300, are provided with copper sheet layer 700 outside difference through hole 600,
The inner surface setting of difference through hole 600 has weld-ring 500, and holding wire passes through weld-ring 500 from components and parts layer 100 cabling to routing layer
300.
As shown in Fig. 2 in the present embodiment, defining copper sheet layer 700 and arrive difference through hole 600（The center of difference through hole 600）'s
Minimum range is r1, and the radius of difference through hole 600 is R1, and the distance of the center of difference through hole 600 internal diameter to weld-ring 500 is R2
（The difference of R1 and R2 is the width of weld-ring 500）, in the present embodiment, r1=25mil.
The printed circuit board (PCB) that the present embodiment provides, arrives the distance of difference through hole 600, Ke Yibao by expanding copper sheet layer 700
Barrier impedance continuity.
It should be noted that the distance expanding copper sheet layer 700 to difference through hole 600 can keep impedance concordance, but
The more big size that correspondingly can lead to circuit board of distance is bigger, and the change with the increase impedance of distance is not linearly to subtract
Little, therefore, consider based on size and impedance are conforming, preferably r1=10～35mil, such as 10mil, 15mil, 20mil,
25mil, 35mil, are especially preferred with r1=15～27.5mil.
Embodiment 3
As shown in Fig. 2 in the present embodiment, the radius defining difference through hole 600 is R1（A diameter of 2R1, i.e. the external diameter of weld-ring
For 2R1）, the inner circle radius of weld-ring 500 are R2（The internal diameter of weld-ring is 2R2）（The difference of R1 and R2 is the width of weld-ring 500）.
Compared with Example 2, the printed circuit board (PCB) providing in the present embodiment, difference is：Define two difference through holes 600
The distance between be x1, x1=38mil, R2/R1=0.4.
It should be noted that through emulation detection, R2/R1=0.3～0.6 is all reasonable selection, such as 0.3,0.4,
0.46th, 0.55,0.6, especially it is preferred with R2/R1=0.4～0.5.
Detect by analysis, the ratio that the width of weld-ring accounts for difference through hole aperture also has slight shadow to impedance concordance
Ring, the printed circuit board (PCB) that the present embodiment provides, both expanded the distance between two difference through holes 600, and expanded copper sheet layer again
700 distances arriving difference through hole 600, also limit the ratio of R1 and R2, further increase the holding conforming effect of impedance,
As shown in Figure 4.
The above, specific embodiment only of the present utility model, but protection domain of the present utility model does not limit to
In this, any those familiar with the art, in the technical scope that this utility model discloses, can readily occur in change
Or replace, all should cover within protection domain of the present utility model.Therefore, protection domain of the present utility model should described to weigh
The protection domain that profit requires is defined.
Claims (7)
1. a kind of printed circuit board (PCB) is it is characterised in that include components and parts layer, routing layer and holding wire, described components and parts layer and institute
State routing layer and be provided with two difference through holes, described holding wire is worn to described from described components and parts layer by described difference through hole
Routing layer, described two difference through holes are surrounded by a metal level, and the distance between described two difference through holes are 20～50mil,
And/or, the minimum range of described metal level to described difference through hole is 10～35mil.
2. printed circuit board (PCB) according to claim 1 is it is characterised in that the distance between described two difference through hole is 30
～40mil.
3. printed circuit board (PCB) according to claim 1 it is characterised in that described metal level to described difference through hole minimum
Distance is 15～27.5mil.
4. the printed circuit board (PCB) according to any one of claim 1-3 is it is characterised in that also include the first ground plane and second
Ground plane, described routing layer is located between described first ground plane and the second ground plane, and described difference through hole passes through described first
Ground plane connects described components and parts layer and described routing layer.
5. printed circuit board (PCB) according to claim 4 is it is characterised in that the inner surface setting of described difference through hole has weldering
Ring, the internal diameter of described weld-ring and the ratio of external diameter are 0.3～0.6.
6. printed circuit board (PCB) according to claim 5 is it is characterised in that the internal diameter of described weld-ring with the ratio of external diameter is
0.4～0.5.
7. printed circuit board (PCB) according to claim 4 is it is characterised in that described metal level is copper sheet layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621055349.6U CN206005002U (en) | 2016-09-14 | 2016-09-14 | Printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621055349.6U CN206005002U (en) | 2016-09-14 | 2016-09-14 | Printed circuit board (PCB) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206005002U true CN206005002U (en) | 2017-03-08 |
Family
ID=58194079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621055349.6U Active CN206005002U (en) | 2016-09-14 | 2016-09-14 | Printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206005002U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI640230B (en) * | 2017-05-16 | 2018-11-01 | 中華精測科技股份有限公司 | Load board with high speed transmitting structure |
| WO2021000173A1 (en) * | 2019-06-30 | 2021-01-07 | 瑞声声学科技(深圳)有限公司 | Transmission line |
| CN114492291A (en) * | 2022-04-06 | 2022-05-13 | 飞腾信息技术有限公司 | Design method and device of high-speed serial link, electronic equipment and storage medium |
-
2016
- 2016-09-14 CN CN201621055349.6U patent/CN206005002U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI640230B (en) * | 2017-05-16 | 2018-11-01 | 中華精測科技股份有限公司 | Load board with high speed transmitting structure |
| WO2021000173A1 (en) * | 2019-06-30 | 2021-01-07 | 瑞声声学科技(深圳)有限公司 | Transmission line |
| CN114492291A (en) * | 2022-04-06 | 2022-05-13 | 飞腾信息技术有限公司 | Design method and device of high-speed serial link, electronic equipment and storage medium |
| CN114492291B (en) * | 2022-04-06 | 2022-07-15 | 飞腾信息技术有限公司 | Method and device for designing high-speed serial link, electronic equipment and storage medium |
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|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |