CN205987541U - 一种铜浆孔化的印刷线路板 - Google Patents
一种铜浆孔化的印刷线路板 Download PDFInfo
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- CN205987541U CN205987541U CN201620202466.4U CN201620202466U CN205987541U CN 205987541 U CN205987541 U CN 205987541U CN 201620202466 U CN201620202466 U CN 201620202466U CN 205987541 U CN205987541 U CN 205987541U
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CN201620202466.4U CN205987541U (zh) | 2016-03-16 | 2016-03-16 | 一种铜浆孔化的印刷线路板 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP02 | Change in the address of a patent holder |
Address after: 310006 No. 99 Shuangma Road, Jinbei Street, Linan District, Hangzhou City, Zhejiang Province Patentee after: Hangzhou Baolin Printed Circuits Co.,Ltd. Address before: 311300 No. 38 Weixi South Road, Jincheng Street, Linan City, Hangzhou City, Zhejiang Province Patentee before: Hangzhou Baolin Printed Circuits Co.,Ltd. |
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CP02 | Change in the address of a patent holder | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A Copper Paste Porous Printed Circuit Board Effective date of registration: 20230520 Granted publication date: 20170222 Pledgee: Pudong Development Bank, Shanghai, Shanghai, Hangzhou Ling'an branch Pledgor: Hangzhou Baolin Printed Circuits Co.,Ltd. Registration number: Y2023980041273 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |