CN205979236U - Lamp device and lighting device - Google Patents
Lamp device and lighting device Download PDFInfo
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- CN205979236U CN205979236U CN201621040236.9U CN201621040236U CN205979236U CN 205979236 U CN205979236 U CN 205979236U CN 201621040236 U CN201621040236 U CN 201621040236U CN 205979236 U CN205979236 U CN 205979236U
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- main part
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- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims description 114
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 14
- 239000002184 metal Substances 0.000 abstract description 14
- 125000004122 cyclic group Chemical group 0.000 abstract 3
- 238000009434 installation Methods 0.000 description 17
- 230000002093 peripheral effect Effects 0.000 description 14
- 238000005476 soldering Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000000411 inducer Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model provides a can guarantee the power supply circuit of base plate insulating nature, can guarantee light emitting component's thermal diffusivity and can reduce the lamp device and the lighting device of the use amount of heat conduction parts. The lamp device possesses light emitting module, framework and heat conduction parts. The light emitting module has the base plate, installs regional light emitting component and the power supply circuit of setting in the neighboring area of base plate in the central authorities of base plate. The framework has main part, lamp holder and base plate and sets the portion, the main part has the metal sheet and sets up in the resin portion on the surface of metal sheet, the lamp holder sets up distolateral at the main part, the base plate portion of setting sets up distolateral and supply the base plate to set at another of main part. The base plate set the portion and the central region of base plate and neighboring area between corresponding position be provided with and outstanding and form to annular cyclic annular teat from resin portion, the metal sheet exposes in the inboard of cyclic annular teat. The heat conduction parts are packed and are contacted in the inboard of cyclic annular teat and with base plate and metal sheet.
Description
Technical field
Embodiment of the present utility model is related to a kind of employ the lamp device of light-emitting component and employ this lamp device
Illuminator.
Background technology
In the past, for example had and employed the flat types of lamp holder such as GX53 type lamp holder, GH76p type lamp holder and GH69h type lamp holder
Lamp device.
This lamp device possesses：Substrate is provided with light-emitting component light emitting module, to light emitting module supply power supply electricity
Source circuit, accommodate framework of these light emitting modules and power circuit etc..The substrate of light emitting module is disposed in frame via conducting-heat elements
Body, thus produced heat during light-emitting component lighting is discharged to framework side effectively.In order to effectively discharge from luminous unit
The heat that part passes over, framework is sometimes using metal parts.
And, have and a kind of power circuit and light-emitting component are provided integrally at the light emitting module on substrate.Luminous at this
In module, in order that the heat transfer of the light-emitting component on substrate is to framework side it is necessary to be arranged to be close to substrate with framework, but
It is so, arrange and be difficult between power circuit on the substrate and the metal parts of framework keep insulation distance, lead to
It is difficult to ensure that the insulating properties of power circuit.
And, because the price comparison of conducting-heat elements is expensive, thus preferably reduce its usage amount, but, so
It is difficult to ensure that based on conducting-heat elements from substrate to the thermal diffusivity of framework side.
Patent documentation 1：Japanese Unexamined Patent Publication 2015-5524 publication
Content of the invention
Problem to be solved in the utility model be to provide a kind of insulating properties of the power circuit being able to ensure that substrate, can
The lamp device of the thermal diffusivity guaranteeing light-emitting component and the usage amount that conducting-heat elements can be reduced and illuminator.
The lamp device of embodiment possesses light emitting module, framework and conducting-heat elements.Light emitting module has substrate, is installed on
The light-emitting component of the middle section of substrate and be arranged on substrate neighboring area power circuit.Framework has main part, lamp
Head and substrate disposed portion, described main part has metallic plate and is arranged at the resin portion on the surface of metallic plate, described lamp holder
It is arranged on a side of main part, described substrate disposed portion is arranged on the another side of main part and substrate arranges.In substrate
Between the middle section with substrate of disposed portion and neighboring area corresponding position be provided with from resin portion project and be formed as
The ring-type teat of ring-type, metallic plate exposes in the inner side of ring-type teat.Conducting-heat elements are filled in inner side and and the base of ring-type teat
Plate and metallic plate contact.
According to this utility model, the insulating properties guaranteeing the power circuit of substrate, the radiating guaranteeing light-emitting component can be expected
Property and reduce the usage amount of conducting-heat elements.
Brief description
Fig. 1 is a kind of sectional view of the lamp device representing embodiment.
Fig. 2 is the exploded perspective view of above-mentioned lamp device.
Fig. 3 is the light emitting module of above-mentioned lamp device and the front view of framework.
Fig. 4 is the use of the axonometric chart of the illuminator of above-mentioned lamp device.
In figure：10- lamp device, 11- framework, 12- light emitting module, 20- main part, 22- lamp holder, 23- substrate disposed portion,
29- metallic plate, 30- resin portion, 31- ring-type teat, 33- arranges face, 34- groove portion, 35- conducting-heat elements, 50- substrate, and 51- lights
Element, 52- power circuit, 59- window portion, 90- illuminator, 92- lamp socket.
Specific embodiment
Hereinafter, referring to figs. 1 to Fig. 4, a kind of embodiment of the present utility model is illustrated.
The lamp device 10 of flat type shown in Fig. 1 and Fig. 2.In addition, in the following description, by the front face side of lamp device 10
(another side) i.e. light irradiation direction is set to downside, and the rear side (side) in opposite direction with light irradiation is set to lamp holder side
Upside.
Lamp device 10 has：Framework 11, the light emitting module 12 being disposed in this framework 11 and reflector 13, it is installed on frame
The diffuser 14 of the bottom of body 11.
And, framework 11 possesses main part 20.It is provided with the lamp with a pair of electrodes pin 21 in the upside of this main part 20
22, the downside of main part 20 is provided with the substrate disposed portion 23 that the substrate for light emitting module 12 arranges.Lamp holder 22 is, for example,
GX53 type lamp holder.
Main part 20 possesses：Annulus 24, the peripheral part of the cylindrical shape projecting downward from the periphery of this annulus 24
25th, the substrate disposed portion 23 projecting downward via end difference 26 from the inner circumferential of annulus 19.And, from annulus 24
The inner circumferential projecting protuberance 27 having the cylindrical shape constituting lamp holder 22 upward.And, the downside in annulus 24, outside
It is formed with the spatial portion 28 of ring-type between all portions 25 and substrate disposed portion 23 (end difference 26).
Framework 11 is formed as one by the insert moulding with resin portion 30 covered metal plate 29 and a pair of electrodes pin 21
Body.
For metallic plate 29, for example, extrusion molding is carried out to metal plates such as aluminum and be formed as throughout substrate disposed portion
23rd, the shape of annulus 24 and peripheral part 25.That is, metallic plate 29 possesses：It is disposed in the flat metal of substrate disposed portion 23
Plate portion 29a, the sheet metal part 29b of the tubular bending between substrate disposed portion 23 and annulus 24 and being disposed in end difference 26,
The sheet metal part 29c being disposed in the ring-type of annulus 24 is, the sheet metal part 29d being disposed in peripheral part 25.Shape on metallic plate 29
Become to have multiple holes, and resin portion 30 enters in this hole, thus metallic plate 29 and resin portion 30 is combined as a whole.And,
It is formed with resin portion 30 in the sheet metal part 29a of metallic plate 29 and is introduced into and multiple hole portions 29e towards open lower side, in gold
The position that the insert locations with electrode pin 21 of genus plate portion 29c are corresponding is formed with a pair of hole portion 29f.
For resin portion 30, substrate disposed portion 23, annulus 24, peripheral part are formed by the resin material with insulating properties
25 and protuberance 27.
And, substrate disposed portion 23 projects downwards than annulus 24.Periphery setting in this substrate disposed portion 23
Have from resin portion 30 downward project and be formed as the ring-type teat 31 of ring-type.It is formed with circle in the inner side of ring-type teat 31
Peristome 32, metallic plate 29 exposes from this peristome 32.It is provided with for arranging luminous mould in the front end face of ring-type teat 31
The substantially a ring-shaped arranging face 33 of the substrate of block 12, being provided with the part in this arranging face 33 makes the inner side of ring-type teat 31
And the groove portion 34 of outside connection.In the present embodiment, it is provided with a pair of groove portion 34, this pair of groove portion 34 is disposed relative to ring
On centrosymmetric two positions of shape teat 31, but groove portion 34 can also be arranged at least one position.
It is filled with the conducting-heat elements such as such as silicone resin 35 in the inner side of ring-type teat 31.This conducting-heat elements 35 be disposed in
The substrate of light emitting module 12 of substrate disposed portion 23 and metallic plate 29 contact, therefore, it is possible to make heat from the base of light emitting module 12
Plate is delivered to metallic plate 29.Hole portion 29e being partly into metallic plate 29 of conducting-heat elements 35 but also enter into ring-type dash forward
The groove portion 34 in portion 31.
In annulus 24 with respect on the centrosymmetric position of lamp holder 22, projecting downward from resin portion 30
There is a pair of lobe 36, and be fixed with electrode pin 21 in this lobe 36.Lobe 36 is prominent to spatial portion 28, lobe
36 lower end projects downwards than substrate disposed portion 23 (ring-type teat 31).And, a pair of lobe 36 and a pair of groove portion 34
Centrally directed identical radial alignment shape configuration from framework 11.And, it is formed with resin portion 30 in the lower surface of annulus 24
Made multiple holes 37 that metallic plate 29 exposes by opening.Hole 37 is formed as elongated hole-shape along the circumference of annulus 24.
In the projecting multiple location divisions 38 having a substrate for positioning luminous module 12 in the inner side of peripheral part 25 and
For positioning multiple location divisions 39 of reflector 13, and it is also formed with for installing diffuser 14 in the inner side of peripheral part 25
Multiple installation portions 40.And, it is outer that the outer circumferential side being also formed with the substrate for light emitting module 12 in the inner side of peripheral part 25 arranges
The week side of boss arranges face 41.Outer circumferential side arranges face 41 and is formed as the face parallel with the arranging face 33 of ring-type teat 31.
In the centrosymmetric position with respect to lamp holder 22 of the outer peripheral face of protuberance 27 and be configured with a pair of electrodes pin
On the position staggered in 21 position, it is formed with the keyway 42 (with reference to Fig. 4) of a pair of L-shaped.It is formed with the inner side of protuberance 27
The open space 43 opening upward, substrate disposed portion 23 is arranged at the bottom of this open space 43.
And, electrode pin 21 is made up of the metal material with electric conductivity.Electrode pin 21 has：It is fixed on lobe 36
Base portion 44, the pin portion 45 projecting from the upper end of this base portion 44.There is the fixed part being fixed on lobe 36 base portion 44 is projecting
46, and it is formed with the screwed hole 47 of opening downward in base portion 44.It is formed with large-diameter portion 48 on the top in pin portion 45.And
And, the lower end of electrode pin 21 projects downwards than the lower end of lobe 36, or the lower end of electrode pin 21 and lobe 36
Lower end arranges at grade.
Then, light emitting module 12 possesses：Substrate 50, a surface being arranged on this substrate 50 are on front surface (lower surface)
Multiple light-emitting components 51, be arranged on the power circuit 52 of substrate 50 and multiple circuit blocks 53 of this power circuit 52, be electrically connected
Connect and be fixed on a pair of connecting portion part 54 (with reference to Fig. 3) of substrate 50.
Substrate 50 is discoideus printed wiring board, is to be the two of the back side (upper surface) in front surface and another surface
Individual surface is respectively formed on the double sided mounting substrate of Wiring pattern.The size of substrate 50 is close with the external diameter of framework 11 big
Little, and substrate 50 is inserted in the inner side of peripheral part 25 of framework 11 and is disposed in arranging face 33 and the periphery of ring-type teat 31
Side arranging face 41.It is formed with multiple groove portions 55 in the surrounding edge of substrate 50, these groove portions 55 are outer respectively to be embedded in determining of framework 11
Position portion 38, so that substrate 50 is positioned in framework 11.
It is formed with the light-emitting component installation region 56 installing light-emitting component 51 in the middle section of substrate 50, in substrate 50
Neighboring area is formed with setting power circuit 54 and installs the circuit block installation region 57 of circuit block 53.In substrate 50
Between centre region and neighboring area, that is, between light-emitting component installation region 56 and circuit block installation region 57, it is formed with and joins
The arranging region 58 arranging on face 33 located at ring-type teat 31.It is formed with ring-type teat 31 in this arranging region 58
The opposed window portion of groove portion 34 59.Window portion 59 is circular port and the groove more staggering to outside diameter with the inner circumferential position than ring-type teat 31
The center in portion 34 is opposed.It is formed with the periphery of substrate 50 and be configured at the outer circumferential side arranging region 60 that outer circumferential side arranges face 41.
In the neighboring area of substrate 50, in the centrosymmetric position with respect to substrate 50 and with a pair of lobe 36 and
On the position corresponding to electrode pin 21, it is provided with a pair of the hole portion 61 for arranging connection member 54.Hole portion 61 is rounded, and
There is the aperture that lobe 36 can run through.
And, in the light-emitting component installation region 56 of the front surface of substrate 50, multiple light-emitting components 51 and shape are installed
Become and have the Wiring pattern that the multiple light-emitting components 51 installed are connected in series or are connected in parallel.Front surface and the back side in substrate 50
Circuit block installation region 57, be formed with and constitute power circuit 52 and the Wiring pattern of multiple circuit blocks 53 is installed.Send out
The Wiring pattern of the Wiring pattern of optical element installation region 56 and circuit block installation region 57 passes through to be formed at arranging region 58
Wiring pattern and electrically connect.
And, light-emitting component 51 is for example using surface mounting LED.Multiple light-emitting components 51 pass through soldering connection in setting
On the Wiring pattern of the light-emitting component installation region 56 of the front surface of substrate 50.In addition, light-emitting component 51 is not limited solely to LED,
Other light-emitting components such as organic EL element can also be used.
And, power circuit 52 possesses the alternating electromotive force inputting from a pair of electrodes pin 21 is carried out with the whole of rectification and smoothing
Current circuit, the output of this rectification circuit is converted into by DC source by the switch motion of switch element and is supplied to light-emitting component
Control unit of 51 transducer and controlling switch element etc..
The circuit block 53 of power circuit 52 possesses multiple surface mounting assemblies and multiple lead member.Surface mount
Part for example has transistor, resistance, capacitor and IC etc., and it passes through soldering connection at the back side of substrate 50 and installs in circuit block
The Wiring pattern in region 57.Lead member for example has electrolysis condenser and inducer etc., and lead member main body configures in substrate 50
Front surface circuit block installation region 57, from lead member main body project lead run through substrate 50 and in substrate 50
Soldering connection is passed through in the Wiring pattern of circuit block installation region 57 in the back side.
And, connection member 54 is made up of the terminal being referred to as lug plate.One side of connection member 54 is in hole portion 61
Sidepiece is fixed on the front-surface side of substrate 50, and another side configures in hole portion 61.It is provided with a side of connection member 54
Run through substrate 50 and the back side of substrate 50 pass through soldering connection many on the Wiring pattern of circuit block installation region 57
Individual connection sheet.A pair of connecting portion part 54 is electrically connected to the input unit of the input AC electric power of power circuit 52.
And, insert connection member 54 and be screwed on by will be equipped with the screw 64 of plate washer 62 and spring washer 63
In the screwed hole 47 of electrode pin 21, so that connection member 54 is crimped on electrode pin 21 and electrically connect with electrode pin 21, and make substrate
50 states pressing on substrate disposed portion 23 with the back side of substrate 50 are fixed on framework 11.
Then, for reflector 13, it is formed with the peristome 70 opposed with light-emitting component 51 in central authorities, and is formed with
The reflection face 71 expanding downward from the surrounding of this peristome 70, and from the lower end of this reflection face 71 towards external diameter side
To being formed with cover portion 72.Cover portion 72 covers circuit block 53 together with framework 11.It is formed with the periphery of reflector 13 and be clipped in
The flange part 73 being kept between framework 11 and diffuser 14, is formed with groove portion 74 in this flange part 73, this groove portion 74 is outer
Location division 39 in framework 11.
Then, diffuser 14 is formed as discoid by the synthetic resin with light transmission and light diffusing.In diffuser 14
The projecting embedded division 80 having the inner side of peripheral part 25 being embedded in framework 11 of periphery.Multiple positions in embedded division 80
Upper projecting have claw 81, this claw 81 is respectively arranged in the installation portion 40 of the peripheral part 25 of framework 11 thus by diffuser 14
It is fixed in framework 11.
Then, the assembling to lamp device 10 illustrates.
Make the lamp holder 22 of framework 11 down and make the inner side of framework 11 upward in the state of, to the ring-type teat of framework 11
The conducting-heat elements 35 such as the such as silicone resin of the state with mobility of ormal weight are injected in 31 inner side.
Now, conducting-heat elements 35 flow on the metallic plate 29 of ring-type teat 31 inner side and extend on metallic plate 29, but
It is that this extension can be stopped by the internal perisporium of ring-type teat 31, thus not expanding to the outside of ring-type teat 31.
The injection rate of conducting-heat elements 35 is set to the amounts slightly more than the volume of the inner space of ring-type teat 31.In conducting-heat elements
In the case that 35 mobility is higher, conducting-heat elements 35 are extended in the way of eliminating space in the whole inner side of ring-type teat 31,
And pass through surface tension, conducting-heat elements 35 become the state of protuberance higher than ring-type teat 31.And, in conducting-heat elements 35
In the case that mobility is relatively low, conducting-heat elements 35 will not expand to the whole inner side of ring-type teat 31 sometimes, but conducting-heat elements
35 states that can become protuberance higher than ring-type teat 31.
Then, light emitting module 12 is inserted in the inner side of framework 11, makes to be embedded in determining of framework 11 outside the groove portion 55 of substrate 50
Make lobe 36 pass through the hole portion 61 of substrate 50 while position portion 38, then substrate 50 is pressed on framework 11 side.
Now, the back side of substrate 50 is contacted with the conducting-heat elements 35 of protuberance higher than ring-type teat 31, with the back of the body of substrate 50
Conducting-heat elements 35 are pressed on framework 11 side by face.Whole in ring-type teat 31 by the conducting-heat elements 35 of the back side pressing of substrate 50
Inner side extends the conducting-heat elements 35 so that amount having more than the volume of the inner space of ring-type teat 31 in the way of eliminating space
Flow out towards the outside of ring-type teat 31 from low a pair of the groove portion 34 in face 33 that arrange than ring-type teat 31 front end.Due to substrate 50
The arranging face 33 of the back side and ring-type teat 31 and outer circumferential side arrange face 41 and contact, thus substrate 50 is to the pressing of framework 11 side
It is inhibited.
Due to the window portion 59 opposed with a groove portion 34 being provided with substrate 50, thus can confirm to flow out from window portion 59
Conducting-heat elements 35 to a groove portion 34.
In the state of configuring light emitting module 12 in framework 11, it is disposed in the connection member in the hole portion 61 of substrate 50
54 is arranged opposite with the end face of electrode pin 21.In this condition, connection member 54 and the end face of electrode pin 21 separate.
Then, will be equipped with the screw 64 insertion connection member 54 of plate washer 62 and spring washer 63 and be screwed on electricity
The screwed hole 47 of pole pin 21.By this screw 64, make connection member 54 displacement so that connection member 54 presses on electrode pin 21
On end face, and clip connection member 54, plate washer 62 and spring washer 63 between the end face of screw 64 and electrode pin 21 and
Fastened.
Under the stationary state based on this screw 64, the end contact of connection member 54 and electrode pin 21 is so that connecting portion
Part 54 and electrode pin 21 electrically connect, and connection member 54 contacts with plate washer 62 so that connection member 54 and electrode pin 21 are led to
Cross plate washer 62, spring washer 63 and screw 64 and electrically connect.Therefore, the power circuit 52 of light emitting module 12 and electrode pin 21 electricity
Connect.And, by the connection member 54 being fastened by screw 64, so that substrate 50 is pressed on including arranging face 33 and conducting-heat elements 35
In interior substrate disposed portion 23, and substrate 50 is fixed on framework 11.
The light-emitting component 51 being installed on the middle section of substrate 50 is located in the region of conducting-heat elements 35 via substrate 50.If
The lead putting lead member in the circuit block 53 of the power circuit 52 of the outer region of substrate 50 is to ring-type teat 31
The spatial portion 28 of outside diameter projects, be formed between the metallic plate 29 of lead and annulus 24 be able to ensure that insulating properties away from
From.
Afterwards, conducting-heat elements 35 are made to solidify.The metallic plate 29 of conducting-heat elements 35 and substrate disposed portion 23 and resin portion 30
With the rear-face contact of substrate 50 so that substrate disposed portion 23 and substrate 50 thermally coupled.Conducting-heat elements 35 be partly into gold
Belong to plate 29 multiple hole portions 29e and with metallic plate 29 thermally coupled.
Then, reflector 13 is inserted in the inner side of framework 11, and diffuser 14 is arranged in framework 11.Now, profit
Being pressed in framework 11 flange part 73 of reflector 13 with the embedded division 80 of diffuser 14 makes it be clamped in embedded division 80 and frame
Between body 11.And, the peripheral edge portions of the peristome 70 of the reflector 13 being pressed in framework 11 by diffuser 14 are connected to
Substrate 50, substrate 50 is pressed on substrate disposed portion 23.
In addition, the assembling sequence of lamp device 10 is not limited to said sequence.
Then, using the illuminator 90 of lamp device 10 shown in Fig. 4.Illuminator 90 is, for example, Down lamp.Illuminator
90 have：Appliance body 91, lamp socket 92, lamp device 10.
Appliance body 91 opening downward, and appliance body 91 also constitutes reflector.
Lamp socket 92 has：Lamp holder body 93, the terminal being contained in this lamp holder body 93.Lamp holder body 93 is by having insulation
Property resin formation be ring-type, be formed with its center for lamp device 10 protuberance 27 insertion inserting hole 94.
In lamp holder body 93 lower surface with respect to the centrosymmetric position of lamp socket 92, it is formed with each for lamp device 10
A pair of connecting hole 95 that electrode pin 21 is inserted and rotated.These connecting holes 95 are long elongated hole in the circumference of lamp holder body 93,
It is formed with the inserting hole 96 that the large-diameter portion 48 of electrode pin 21 can be made to insert in its one end.Accommodate in the inner side of each connecting hole 95
The terminal electrically connecting with the electrode pin 21 being inserted in connecting hole 95.
There is key 97 the inner peripheral surface of lamp holder body 93 is projecting, this key 97 is with by electrode pin 21 company of insertion of lamp holder 22
Connect hole 95 and rotated and be embedded in the keyway 42 of the generally L-shaped of protuberance 27 outer peripheral face being formed at lamp holder 22, thus
Lamp holder 22 is supported on lamp holder body 93.
And, in the state of lamp device 10 is installed on lamp socket 92, alternating electromotive force fills through the terminal of lamp socket 92 and lamp
Put 10 electrode pin 21 and be supplied to power circuit 52, thus, alternating electromotive force is converted into predetermined unidirectional current by power circuit 52
Supply after power to light-emitting component 51, so that light-emitting component 51 lights.
The light that light-emitting component 51 is sent is irradiated to illumination space by reflector 13 and through diffuser 14.
The heat that light-emitting component 51 produces when luminous is transferred mainly to substrate 50, and from this substrate 50 through heat-conducting part
Part 35 is delivered to the metallic plate 29 of framework 11.The heat passing over from substrate 50 in the central part of metallic plate 29 is to metallic plate 29
The diffusion of external diameter direction, and be delivered to resin portion 30 from the whole region of metallic plate 29.Thus, it is transferred to the heat of resin portion 30
Radiate in the air from the surface of resin portion 30.And, because lamp holder 22 is connected on lamp socket 92, thus heat also can be from lamp holder
22 radiate to lamp socket 92.
And, in the lamp device 10 of present embodiment, in the central authorities with substrate 50 of the substrate disposed portion 23 of framework 11
Between region (light-emitting component installation region 56) and neighboring area (circuit block installation region 57), corresponding position is provided with
Project from resin portion 30 and be formed as the ring-type teat 31 of ring-type, and substrate 50 is disposed on this ring-type teat 31, accordingly, it is capable to
Enough increasing is arranged on the power circuit 52 of neighboring area (circuit block installation region 57) of substrate 50 and the metallic plate of framework 11
The distance between 29 it can be ensured that the insulating properties of the power circuit 52 of substrate 50.
And, by conducting-heat elements 35 being filled in the inner side of ring-type teat 31 it can be ensured that the radiating of light-emitting component 51
Property, the usage amount of conducting-heat elements 35 can be reduced so as to reduce the manufacturing cost of lamp device 10.
And, by the groove portion 34 of ring-type teat 31, can make to press the conducting-heat elements 35 during substrate 50 to framework 11 side
Outflow position fix, and, by arranging the window portion 59 opposed with this groove portion 34 on substrate 50, be able to confirm that to be filled with and lead
The situation of thermal part 35.That is, because the substrate disposed portion 23 of framework 11 is covered by substrate 50, therefore, if there is no window on substrate 50
Portion 59 then cannot be confirmed whether to be filled with conducting-heat elements 35, but, by arranging window portion 59 on substrate 50, window portion can be passed through
59 are confirmed whether to be filled with conducting-heat elements 35 such that it is able to judge the quality of lamp device 10.
And, because metallic plate 29 bends corresponding to ring-type teat 31 between substrate disposed portion 23 and annulus 24
Not it is configured to linear, that is, be provided with sheet metal part 29b, the surface area of therefore metallic plate 29 is increased such that it is able to carry
High-cooling property.
And, the inner side of the annulus 24 in framework 11, the circumference being provided with along annulus 24 in resin portion 30 is formed as
The hole 37 of elongated hole-shape so that metallic plate 29 exposes, therefore, it is possible to the light-emitting component 51 in lamp device 10 or power circuit 52 institute
The heat producing is radiated.
In addition, the lamp device that the structure of present embodiment is not limited solely to possess GX53 shape lamp holder possesses it is also possible to be applied to
GH76p shape lamp holder or the lamp device of GH69h shape lamp holder.
More than, some embodiments of the present utility model are illustrated, but these embodiments are merely illustrative,
Do not limit the intention of utility model scope.These new embodiments can be implemented in other various modes, without departing from
In the range of this utility model objective, various omissions, displacement, change can be carried out.These embodiments or its deformation belong to this
In the scope of utility model or objective, and it is also contained in utility model and its equivalent scope described in technical scheme.
Claims (3)
1. a kind of lamp device is it is characterised in that possess：
Light emitting module, it has substrate, the light-emitting component of middle section being installed on described substrate and is arranged on described substrate
Neighboring area power circuit；
Framework, it has main part, lamp holder and substrate disposed portion, and described main part has metallic plate and is arranged at described gold
Belong to the resin portion on the surface of plate, described lamp holder is arranged on a side of described main part, described substrate disposed portion is arranged on described
The another side of main part and arranging, in the middle section with described substrate and the periphery of described substrate disposed portion for described substrate
Between region, corresponding position is provided with and projects from described resin portion and be formed as the ring-type teat of ring-type, and described metallic plate exists
The inner side of described ring-type teat is exposed；
Conducting-heat elements, it is filled in the inner side of described ring-type teat and is contacted with described substrate and described metallic plate.
2. lamp device according to claim 1 it is characterised in that
Described ring-type teat has, in the front end face projecting from described main part, the arranging face arranging for described substrate, and described
The groove portion that ring-type teat is had in the part being arranged on described arranging face and connected with the inner side of described ring-type teat,
Described substrate has the window portion of opening in the way of opposed with described groove portion.
3. a kind of illuminator is it is characterised in that possess：
Lamp device described in claim 1 or 2；
The lamp socket installed for the described lamp holder of described lamp device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-254414 | 2015-12-25 | ||
| JP2015254414A JP6646255B2 (en) | 2015-12-25 | 2015-12-25 | Lamp equipment and lighting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205979236U true CN205979236U (en) | 2017-02-22 |
Family
ID=58040128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621040236.9U Expired - Fee Related CN205979236U (en) | 2015-12-25 | 2016-09-06 | Lamp device and lighting device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6646255B2 (en) |
| CN (1) | CN205979236U (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7050556B2 (en) * | 2018-04-09 | 2022-04-08 | 三菱電機株式会社 | Light source unit and lighting equipment |
| JP6803415B2 (en) * | 2019-01-30 | 2020-12-23 | Hoya株式会社 | Circuit board fixed structure and light irradiation device equipped with this |
| JP7285463B2 (en) * | 2019-04-18 | 2023-06-02 | パナソニックＩｐマネジメント株式会社 | Illumination light source and illumination device |
| CN211502702U (en) * | 2019-11-13 | 2020-09-15 | 松下知识产权经营株式会社 | Lighting device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5757214B2 (en) * | 2011-09-30 | 2015-07-29 | 東芝ライテック株式会社 | LED lighting device |
| US9200795B2 (en) * | 2012-06-01 | 2015-12-01 | Citizen Holdings Co., Ltd. | Lighting device |
| JP6252550B2 (en) * | 2014-07-31 | 2017-12-27 | 株式会社デンソー | Electronic device, driving device using the same, and method of manufacturing electronic device |
-
2015
- 2015-12-25 JP JP2015254414A patent/JP6646255B2/en active Active
-
2016
- 2016-09-06 CN CN201621040236.9U patent/CN205979236U/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017117736A (en) | 2017-06-29 |
| JP6646255B2 (en) | 2020-02-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170222 |