CN204829426U - Lamp device and lighting device - Google Patents
Lamp device and lighting device Download PDFInfo
- Publication number
- CN204829426U CN204829426U CN201520641289.5U CN201520641289U CN204829426U CN 204829426 U CN204829426 U CN 204829426U CN 201520641289 U CN201520641289 U CN 201520641289U CN 204829426 U CN204829426 U CN 204829426U
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- substrate
- connecting portion
- lamp
- main part
- framework
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Abstract
The utility model provides a can carry high heat dissipating's lamp device and lighting device. Lamp device (10) possess base plate (20) and framework (12). Distolateral surface mounting at base plate (20) has light emitting component (21). Framework (12) have: distolateral main part (30) that hold base plate (20), protruding portion (31) that go out from the other end pleurapophysis of main part (30), from the other end side direction main part (30) of protruding portion (31) in outstanding just be equipped with in the inboard to protruding portion (31) another distolateral open -ended concave part (46) and with connecting portion (43) of base plate (20) hot link.
Description
Technical field
Embodiment of the present utility model relates to a kind of the lamp device and the lighting device that use light-emitting component.
Background technology
In the past, as the lamp device using light-emitting component, such as, there is the lamp device of the flat type using GX53 shape lamp holder.
In lamp device, hold in the end side of framework the substrate being provided with light-emitting component, be provided with lamp head in another side of framework.The heat produced when light-emitting component is lighted is passed to framework from substrate, and dispels the heat to air from the outer surface of framework.The heat produced to make light-emitting component is more effectively released to substrate, has done following improvement, such as, adopt metal substrate, or carry metal derby etc. on substrate the structure of substrate.
Patent document 1: Japanese Unexamined Patent Publication 2007-157690 publication
To reject heat to the structure air from the outer surface of framework for the heat that produced by light-emitting component due to lamp device, therefore only the structure of the substrate be contained in framework is improved, sometimes heat cannot be delivered to framework effectively from substrate, cannot expect the raising of thermal diffusivity.
Summary of the invention
The technical problems to be solved in the utility model is to provide a kind of lamp device and the lighting device that can improve thermal diffusivity.
The lamp device of embodiment possesses substrate and framework.On the surface of the end side of substrate, light-emitting component is installed.Framework has: at one end side hold the main part of substrate, the protuberance given prominence to from the other end side of main part, from outstanding in the other end side direction main part of protuberance and the recess be provided with in inner side to the other end side opening of protuberance and connecting portion hot linked with substrate.
According to the utility model, thermal diffusivity can be improved.
Detailed description of the invention
Below, referring to figs. 1 through Fig. 4, the first embodiment is described.
Fig. 1 to Fig. 4 represents the lamp device 10 of flat type.Further, below the end side of lamp device is considered as downside, other end side-looking is upside and being described.
Lamp device 10 has: base board unit 11; Hold the framework 12 of described base board unit 11; From multiple electrode pin 13 that the uper side surface of described framework 12 is projecting; Be configured at the diffuser 14 etc. of the downside of framework 12.
Further, base board unit 11 has: substrate 20; Be installed on the light-emitting component 21 of the downside surface of described substrate 20; Be formed at the lamp circuit 22 on substrate 20.
Substrate 20 is made up of discoid printed wiring board.The downside surface of substrate 20 is the distribution face 20a being formed with Wiring pattern.Be formed with the installing hole 24 for being arranged on by substrate 20 in framework 12 on the base plate 20.
Light-emitting component 21 is configured at the middle section of the downside surface (i.e. distribution face 20a) of substrate 20.Light-emitting component 21 such as uses SMD (SurfaceMountDevice, the surface mount device) packaging body possessing LED chip.Further, multiple light-emitting component 21 centralized configuration is in the middle section of the downside surface of substrate 20.In addition, light-emitting component 21 also can be used in and installation base plate install multiple LED chip and by COB (ChipOnBoard, the chip on board) module of the transparent resin packaging LED chips containing fluorophor.
The alternating electromotive force that outside from lamp device 10 inputs is converted to predetermined direct current power and is supplied to light-emitting component 21 by lamp circuit 22.Lamp circuit 22 has the various electronic units 25 being installed on substrate 20.The electronic unit 25 at least with wire in electronic unit 25 is configured at the uper side surface of substrate 20, and wire inserts downside to substrate 20 and by brazing in Wiring pattern.The small-sized electronic part of the shaped like chips in electronic unit 25 to be configured on Wiring pattern and by brazing in Wiring pattern at the downside surface of substrate 20.The electronic unit 25 being configured at the uper side surface of substrate 20 is configured at around the middle section of the uper side surface of substrate 20, that is, electronic unit 25 is not configured at the middle section of the uper side surface of the substrate 20 of the side contrary with the middle section of the downside surface of the substrate 20 being provided with light-emitting component 21.Therefore, the spatial portion 26 that substrate 20 is exposed is formed at the middle section of the uper side surface of substrate 20.Further, electrode pin 13 is electrically connected with the alternating electromotive force input part of lamp circuit 22 by Wiring pattern, and light-emitting component 21 is electrically connected with the Wiring pattern of the direct current power efferent forming lamp circuit 22.
Further, the material that framework 12 such as has insulating properties by Merlon etc. forms as one.The protuberance 31 that framework 12 has main part 30, gives prominence to from the central authorities of the uper side surface of described main part 30.
Main part 30 has the planar portions 33 of ring-type, the surrounding's wall portion 34 that side is outstanding from described planar portions 33 downwards.At the downside surface of planar portions 33, projecting have multiple fixed part 35 for configuring also fixing base 20.Be formed with the inserting hole 37 inserted for screw 36 in the lower portion of fixed part 35, be formed with the embedded hole 38 that power pole pin 13 embeds in the upper portion of fixed part 35, inserting hole 37 and embedded hole 38 are coaxially formed.And, screw 36 runs through the installing hole 24 of substrate 20 and the inserting hole 37 of fixed part 35 and is screwed on electrode pin 13, thus, substrate 20, framework 12 and electrode pin 13 are integrally fixed, and by screw 36, the alternating electromotive force input part of lamp circuit 22 are electrically connected with electrode pin 13.When substrate 20 being fixed on framework 12 with screw 36, the head 36a of screw 36 is electrically connected with the Wiring pattern of substrate 20, is therefore electrically connected with the alternating electromotive force input part of lamp circuit 22 by Wiring pattern.
Protuberance 31 is projecting upward from the central authorities (i.e. the central authorities of planar portions 33) of main part 30.Protuberance 31 has: cylindric week face 40, week facial 40 upper ends end face portion 41.Further, the upper side of protuberance 31 and main part 30 together configuration example as the lamp head 42 with the corresponding shape of GX53 shape specification and size.
Connecting portion 43 outstanding in the mediad main part 30 of the downside surface of end face portion 41 is formed in the end face portion 41 of protuberance 31.Connecting portion 43 has: the connection face 45 of the lower end in cylindric cylinder portion 44, closed described cylinder portion 44.The recess 46 of the cylindrical shape of opening is upward formed in the inner side of connecting portion 43.Around connecting portion 43, be formed with accommodation section 47 in the inner side of protuberance 31, this accommodation section 47 is communicated with main part 30 and is configured with the electronic unit 25 of lamp circuit 22.
Under the state that substrate 20 is fixed on framework 12, connecting portion 43 is configured at the spatial portion 26 above the middle section of substrate 20.In this condition, there is gap between the connection face 45 of connecting portion 43 and the uper side surface of substrate 20, but there is conducting-heat elements 48 between the connection face 45 and the uper side surface of substrate 20 of connecting portion 43, thus connecting portion 43 is thermally coupled with substrate 20.Conducting-heat elements 48 is such as formed by having thermal conductivity, insulating properties and flexible conducting strip.Conducting-heat elements 48 is formed as discoideus.And, when framework 12, substrate 20 and electrode pin 13 being integrally fixed with screw 36, conducting-heat elements 48 is clipped in elastic deformation between connecting portion 43 and substrate 20, and the uper side surface of conducting-heat elements 48 and downside surface are crimped on connecting portion 43 and substrate 20 respectively.Further, the whole light-emitting components 21 being installed on the downside surface of substrate 20 are configured in the lower zone of the connection face 45 of connecting portion 43 and the downside surface of conducting-heat elements 48.
Protuberance 31 week face 40 the centrosymmetric position relative to protuberance 31 and be formed with the keyway 49 of a pair L-shaped from the position that the allocation position of pair of electrodes pin 13 departs from.
Further, pair of electrodes pin 13 is made up of the metal material with electric conductivity.Large-diameter portion 50 is formed in the upside of electrode pin 13.Be formed with the Embedded Division 51 of the embedded hole 38 being embedded in framework 12 in the downside of electrode pin 13, and be formed with the screwed hole 52 making screw 36 screw thread fixing.
Further, diffuser 14 is by having light transmission and diffusible synthetic resin material is formed as discoideus.The projecting prominent wall 60 had inside the wall portion 34 being embedded in framework 12 around diffuser 14, prominent wall 60 is provided with claw 61, and described claw 61 is locked to the wall portion 34 of framework 12 thus diffuser 14 is fixed on framework 12.The light-operated lens 62 making predetermined luminous intensity distribution sent by light-emitting component 21 are formed, such as Fresnel Lenses etc. at the inner surface of diffuser 14.
Below, the assembling of lamp device 10 is described.
From the upside of framework 12, electrode pin 13 is embedded in embedded hole 38, and from the downside placement substrate unit 11 of framework 12, and screw 36 is inserted through the installing hole 24 of substrate 20 and the inserting hole 37 of fixed part 35 and is screwed on the screwed hole 52 of electrode pin 13.
When from the downside placement substrate unit 11 of framework 12, connecting portion 43 is inserted in the spatial portion 26 on substrate 20, and there is conducting-heat elements 48 between the connection face 45 and the uper side surface of substrate 20 of connecting portion 43.In addition, by conducting-heat elements 48 being pasted on any one party of connecting portion 43 or substrate 20, assembleability can be improved thus.Further, the electronic unit 25 given prominence to from the uper side surface of substrate 20 is inserted in the accommodation section 47 around the connecting portion 43 in protuberance 31.
By screw 36 being screwed on the screwed hole 52 of electrode pin 13 and tightening, framework 12, substrate 20 and electrode pin 13 can be integrally fixed.Now, the mode that substrate 20 abuts with the fixed part 35 of framework 12 with its uper side surface is fixed on framework 12, and conducting-heat elements 48 is clipped in elastic deformation between connecting portion 43 and substrate 20, the uper side surface of conducting-heat elements 48 and downside surface are crimped on connecting portion 43 and substrate 20 respectively, and substrate 20 is thermally coupled by conducting-heat elements 48 and connecting portion 43.Further, under the state that substrate 20 is fixed on fixed part 35, be fixed portion 35 and conducting-heat elements 48 of substrate 20 supports.At this, the fixed part 35 contacted with substrate 20 and conducting-heat elements 48 in roughly same plane (comprising a little scale error), thus stably can obtain the thermally coupled state of the connecting portion 43 based on conducting-heat elements 48 and substrate 20.
And the head 36a of screw 36 is electrically connected with the Wiring pattern of substrate 20, the alternating electromotive force input part of lamp circuit 22 is electrically connected with electrode pin 13 by screw 36.
Finally, framework 12 installs diffuser 14.
Then, the lighting device 80 using lamp device 10 has been shown in Fig. 4.Lighting device 80 is such as Down lamp.Lighting device 80 has: appliance body 81, lamp socket 82, lamp device 10.
Appliance body 81 opening downwards, and form reflector.
Lamp socket 82 has: lamp holder body 83, the terminal be contained in described lamp holder body 83.Lamp holder body 83 is made up of the resin with insulating properties and is formed as ring-type, and centre is formed with the inserting hole 84 supplying the protuberance 31 of lamp device 10 to insert wherein.
Lamp holder body 83 lower surface relative to the centrosymmetric position of lamp socket 82, each electrode pin 13 be formed for lamp device 10 is inserted and a pair connecting hole 85 rotated.These connecting holes 85 are elongated holes long in the circumference of lamp holder body 83, are formed with the hole portion 86 that the large-diameter portion 50 of electrode pin 13 can be inserted in its one end.The terminal be electrically connected with the electrode pin 13 being inserted in connecting hole 85 is accommodated in the inner side of each connecting hole 85.
Have key 87 the inner peripheral surface of lamp holder body 83 is projecting, this key 87 is inserted in connecting hole 85 along with electrode pin 13 and carries out rotating and be embedded in the L-shaped keyway 49 of the outer peripheral face being formed in protuberance 31, thus lamp device 10 is supported on lamp holder body 83.
And, under the state that lamp device 10 is installed on lamp socket 82, alternating electromotive force is supplied to lamp circuit 22 through the terminal of lamp socket 82 and the electrode pin 13 of lamp device 10, thus, lamp circuit 22 converts alternating electromotive force to predetermined direct current power and is supplied to light-emitting component 21, makes light-emitting component 21 luminous.
The light transmission diffuser 14 that light-emitting component 21 sends is irradiated to lighting space.
The heat that light-emitting component 21 produces when luminescence is mainly transmitted to substrate 20, and is effectively passed to the connecting portion 43 of framework 12 by the conducting-heat elements 48 contacted with substrate 20 in the side contrary with light-emitting component 21.The heat being passed to connecting portion 43 is dispelled the heat to air from the inner surface of the recess 46 inside connecting portion 43, and is passed to whole framework 12 from connecting portion 43 and dispels the heat to air from the surface of framework 12.Further, heat is also passed to diffuser 14 from framework 12, and dispels the heat to air from the surface of diffuser 14.And because lamp device 10 is connected to lamp socket 82, thus the part heat of framework 12 goes back heat conduction to lamp socket 82.
And, according to the present embodiment, owing to being provided with from protuberance 31 outstanding and connecting portion 43 hot linked with substrate 20 in main part 30, therefore, it is possible to effectively by the heat trnasfer of light-emitting component 21 to connecting portion 43, and, owing to being provided with the recess 46 to the upper opening of protuberance 31 in the inner side of connecting portion 43, therefore, it is possible to increase the surface area of the connecting portion 43 contacted with surrounding air, the heat of the light-emitting component 21 being effectively passed to connecting portion 43 can be made to dispel the heat to air from the inner surface of recess 46, thus can thermal diffusivity be improved.
Further, by using the conducting-heat elements be present between connecting portion 43 and substrate 20, can make to become stable from substrate 20 to the heat conduction of connecting portion 43.And, under the state of fixed part 35 that substrate 20 is fixed on framework 12, be fixed portion 35 and conducting-heat elements 48 of substrate 20 supports, and fixed part 35 and conducting-heat elements 48 are in same plane, therefore, the thermally coupled state of the connecting portion 43 based on conducting-heat elements 48 and substrate 20 can stably be obtained.
And, because multiple light-emitting component 21 centralized configuration is in the middle section of the downside surface of substrate 20, the whole light-emitting components 21 being installed on the downside surface of substrate 20 are configured in the lower zone of the downside surface of connecting portion 43 and conducting-heat elements 48, therefore, it is possible to effectively by the heat trnasfer of light-emitting component 21 to conducting-heat elements 48 and connecting portion 43.
Further, be configured at the accommodation section 47 around the connecting portion 43 in protuberance 31 due to the electronic unit 25 given prominence to from the uper side surface of substrate 20, therefore, it is possible to make lamp device 10 thinning, and the thermal capacitance that electronic unit 25 can be made to produce easily is dispelled the heat to protuberance 31.
And, run through substrate 20 and framework 12 due to screw 36 and be screwed on electrode pin 13, therefore, it is possible to substrate 20, framework 12 and electrode pin 13 are integrally fixed, and lamp circuit 22 can be made to be electrically connected with electrode pin 13 by screw 36, thus do not need the attaching parts that connector etc. is special, can assembleability be improved.
Then, the second embodiment has been shown in Fig. 5.In addition, identical symbol is marked for the structure identical with the first embodiment, and omit illustrating for this structure and action effect.
The reflector 90 that the light that sends light-emitting component 21 reflects is equipped in the downside of substrate 20.The opening portion 91 that light-emitting component 21 is exposed is formed in the central authorities of reflector 90.
By the periphery of the downside surface of reflector 90 covered substrate 20, and make the light of being come by the internal surface reflection of diffuser 14 again towards diffuser 14, make the light penetrated from diffuser 14 increase thus, thus the delivery efficiency of light can be improved.
Then, the 3rd embodiment has been shown in Fig. 6.Further, identical symbol is marked for the structure identical with the first embodiment, and omit illustrating for this structure and action effect.
Metallic plate 95 is equipped throughout the inside (i.e. the inside of cylinder portion 44 and connection face 45) of the connecting portion 43 of framework 12.Metallic plate 95 is formed as the shape identical with connecting portion 43.Further, framework 12 is formed by the insert molding of the resin material covered metal plate 95 with formation main part 30 and protuberance 31.
Further, the heat that light-emitting component 21 produces when luminescence is passed to the connection face 45 of connecting portion 43 through substrate 20 and conducting-heat elements 48, and is passed to the described metallic plate 95 connecting the inside of face 45, diffuses to whole metallic plate 95.Thereby, it is possible to make heat effectively spread to whole connecting portion 43, improve the radiating effect dispelled the heat to air from the inner surface of recess 46.
In addition, metallic plate 95 can be set to the region of end face portion 41 from the region of connecting portion 43, even can be set to the week face region of 40, the region of planar portions 33, even can also be set to the region of wall portion 34.When metallic plate 95 being set to planar portions 33 from the region of connecting portion 43 or being set to the region of wall portion 34, metallic plate 95 arranges the opening that power pole pin 13 is inserted.
In addition, connecting portion 43 is thermally coupled by conducting-heat elements 48 and substrate 20, but connecting portion 43 also can directly contact with substrate 20.
Further, lamp device is not limited to the lamp device possessing GX53 shape lamp holder, also can be the lamp device possessing GH76p shape lamp holder or GH69 shape lamp holder.
Above, some embodiments of the present utility model are illustrated, but these embodiments just illustrate, do not limit the intention of utility model scope.These new embodiments can be implemented in other various mode, in the scope not departing from the utility model aim, can carry out various omission, displacement, change.These embodiments or its distortion all belong in scope of the present utility model or aim, and are also contained in the utility model and equivalent scope thereof recorded in technical scheme.
Accompanying drawing explanation
Fig. 1 is the sectional view of the lamp device representing the first embodiment.
Fig. 2 is the stereogram of the decomposing state representing above-mentioned lamp device.
Fig. 3 is the stereogram of the decomposing state representing above-mentioned lamp device.
Fig. 4 is the stereogram of the lighting device using above-mentioned lamp device.
Fig. 5 is the sectional view of the lamp device representing the second embodiment.
Fig. 6 is the sectional view of the lamp device representing the 3rd embodiment.
In figure: 10-lamp device, 12-framework, 13-electrode pin, 20-substrate, 21-light-emitting component, 22-lamp circuit, 25-electronic unit, 30-main part, 31-protuberance, 35-fixed part, 36-screw, 43-connecting portion, 46-recess, 48-conducting-heat elements, 80-lighting device, 82-lamp socket.
Claims (5)
1. a lamp device, is characterized in that,
Possess substrate and framework,
On the surface of the end side of described substrate, light-emitting component is installed,
Described framework has: at one end side holds the main part of described substrate, the protuberance given prominence to from the other end side of described main part, the outstanding and recess be provided with in inner side to the other end side opening of described protuberance connecting portion hot linked with described substrate in main part described in the other end side direction of described protuberance.
2. lamp device according to claim 1, is characterized in that:
Possess conducting-heat elements, described conducting-heat elements is present between described connecting portion and described substrate, and described connecting portion is connected with described substrate heat,
Described main part has the fixed part for fixing described substrate,
Under the state that described substrate is fixed on described fixed part, support described substrate by described fixed part and described conducting-heat elements.
3. lamp device according to claim 1 and 2, is characterized in that possessing:
Electrode pin, is configured at the surface of another side of described main part;
Screw, runs through described substrate and described main part and fixes with described electrode pin screw thread, thus described electrode pin be fixed on described main part and described electrode pin is electrically connected with described substrate.
4. lamp device according to claim 1 and 2, is characterized in that:
Possess lamp circuit, described lamp circuit is installed on described substrate,
Described lamp circuit has electronic unit, and described electronic unit is installed on the surface of another side of described substrate and is configured in around the described connecting portion in described protuberance.
5. a lighting device, is characterized in that, possesses:
Lamp device described in any one in Claims 1-4;
The lamp socket of described lamp device is installed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-000424 | 2015-01-05 | ||
| JP2015000424A JP2016126931A (en) | 2015-01-05 | 2015-01-05 | Lamp device and illuminating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204829426U true CN204829426U (en) | 2015-12-02 |
Family
ID=54687024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520641289.5U Expired - Fee Related CN204829426U (en) | 2015-01-05 | 2015-08-24 | Lamp device and lighting device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2016126931A (en) |
| CN (1) | CN204829426U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110062862A (en) * | 2016-12-21 | 2019-07-26 | 松下知识产权经营株式会社 | The mounting structure of light source substrate |
| CN111511154A (en) * | 2019-01-30 | 2020-08-07 | 豪雅冠得光电子株式会社 | Circuit board fixing structure and light irradiation device having the same |
| CN111853562A (en) * | 2019-04-18 | 2020-10-30 | 松下知识产权经营株式会社 | Light source for illumination and illumination device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020119740A (en) * | 2019-01-23 | 2020-08-06 | 東芝ライテック株式会社 | Illuminating device |
| JP2022021897A (en) * | 2020-07-22 | 2022-02-03 | パナソニックＩｐマネジメント株式会社 | Lamp unit, socket, lighting fixture body, lamp module, and lighting fixture |
-
2015
- 2015-01-05 JP JP2015000424A patent/JP2016126931A/en active Pending
- 2015-08-24 CN CN201520641289.5U patent/CN204829426U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110062862A (en) * | 2016-12-21 | 2019-07-26 | 松下知识产权经营株式会社 | The mounting structure of light source substrate |
| CN111511154A (en) * | 2019-01-30 | 2020-08-07 | 豪雅冠得光电子株式会社 | Circuit board fixing structure and light irradiation device having the same |
| CN111511154B (en) * | 2019-01-30 | 2024-01-26 | 豪雅株式会社 | Circuit board fixing structure and light irradiation device having the same |
| US11909158B2 (en) | 2019-01-30 | 2024-02-20 | Hoya Corporation | Circuit board fixing structure and light irradiation device having same |
| CN111853562A (en) * | 2019-04-18 | 2020-10-30 | 松下知识产权经营株式会社 | Light source for illumination and illumination device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016126931A (en) | 2016-07-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151202 Termination date: 20200824 |