CN205921571U - 一种低损耗高隔离的倒装芯片射频开关及其移动终端 - Google Patents
一种低损耗高隔离的倒装芯片射频开关及其移动终端 Download PDFInfo
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CN106100626A (zh) * | 2016-08-08 | 2016-11-09 | 苏州雷诚芯微电子有限公司 | 一种低损耗高隔离的倒装芯片射频开关及其移动终端 |
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Cited By (2)
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CN106100626A (zh) * | 2016-08-08 | 2016-11-09 | 苏州雷诚芯微电子有限公司 | 一种低损耗高隔离的倒装芯片射频开关及其移动终端 |
CN106100626B (zh) * | 2016-08-08 | 2022-11-08 | 安徽佳视通电子科技有限公司 | 一种低损耗高隔离的倒装芯片射频开关及其移动终端 |
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Effective date of registration: 20210225 Address after: Room a328, future center, Advanced Research Institute of China University of science and technology, 5089 Wangjiang West Road, high tech Zone, Hefei City, Anhui Province, 230088 Patentee after: Wang Gan Address before: 215123 4-a-403, creative industry park, 328 Xinghu Road, Suzhou City, Jiangsu Province Patentee before: SUZHOU LEICHENGXIN MICROELECTRONICS Co.,Ltd. |
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TR01 | Transfer of patent right | ||
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Effective date of registration: 20211009 Address after: 230601 room 213a, building 2, robot industry base, Hefei Qidi science and Technology City, intersection of Qinghua road and Susong Road, economic and Technological Development Zone, Hefei, Anhui Province Patentee after: Anhui jiashitong Electronic Technology Co.,Ltd. Address before: Room a328, future center, advanced research institute, University of science and technology, No. 5089, Wangjiang West Road, high tech Zone, Hefei, Anhui 230088 Patentee before: Wang Gan |
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AV01 | Patent right actively abandoned |
Granted publication date: 20170201 Effective date of abandoning: 20221108 |
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AV01 | Patent right actively abandoned |
Granted publication date: 20170201 Effective date of abandoning: 20221108 |
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AV01 | Patent right actively abandoned | ||
AV01 | Patent right actively abandoned |