CN205845932U - The radiator structure of chip - Google Patents
The radiator structure of chip Download PDFInfo
- Publication number
- CN205845932U CN205845932U CN201620810424.9U CN201620810424U CN205845932U CN 205845932 U CN205845932 U CN 205845932U CN 201620810424 U CN201620810424 U CN 201620810424U CN 205845932 U CN205845932 U CN 205845932U
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- Prior art keywords
- chip
- heat dissipation
- bonding pad
- radiator structure
- dissipation bonding
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Abstract
This utility model relates to a kind of radiator structure.More specifically, this utility model relates to the radiator structure of a kind of chip, and described chip package is on the surface of pcb board, including pcb board, one heat dissipation bonding pad is installed on its at least one surface, described heat dissipation bonding pad is arranged at intervals with the through hole that multiple aperture is 0.2～0.3mm；Chip, it is arranged on described heat dissipation bonding pad.This utility model solves the heat dissipation problem of the chip of LQFP encapsulated type, it is ensured that the power consumption of chip is unlikely to too high, and arithmetic speed is unlikely to reduce, EMI will not be caused to disturb, will not go to disturb the sensitive signal in circuit, make the function-stable that circuit exports, it is ensured that the performance requirement of product.
Description
Technical field
This utility model relates to a kind of radiator structure.More specifically, this utility model relates to the heat radiation knot of a kind of chip
Structure.
Background technology
All can have a lot of chip on the most a lot of electronic products, these chips have different effects in circuit, process
The output input of data.Along with people are more and more higher to the requirement of properties of product, the requirement to chip is more and more higher.Owing to producing
The application program that product are installed gets more and more, and this just requires that chip processing speed is very fast, and altofrequency processes the situation of data must
Can cause the heating of chip.Heat such as fruit chip dispels the heat away the most timely, and temperature reaches to a certain degree, to will result in
Chip performance not normal, affects the function of product, also can cause EMI, thus affect the sensitive signal of chip, causes data to be forbidden
Really problem, most significantly picture stop is at that, it is impossible to wake up up, constantly restarts etc. various problems.So how process chip
Heat dissipation problem, most important to the performance of product, and according to the conventional method, in PCB design, often could not process scattered very well
The problem of heat, must cause bad problem during the high speed processing of data.
If the chip cooling effect of LQFP encapsulated type is bad, a lot of functions of product can be affected.Because temperature is too high,
Can produce radiation, first affect is the more sensitive holding wire of ratio, and these holding wires can be disturbed by EMI, especially radiofrequency signal
Impact is very big, affects clock signal besides, can reduce the frequency of signal, product function so can be caused abnormal, picture stop
At that, it is impossible to wake up up, directly shut down；If temperature is too high, especially in the case of unprotected circuit, can directly damage circuit
Power supply chip；Bad if dispelled the heat, temperature is too high, also can affect the speed of CPU computing, because increasing transistor accordingly
Power consumption；Also having is exactly that those critesistor in circuit and crystal oscillator all can be caused the biggest impact, can have a strong impact on those defeated
Enter and output signal frequency, make the bandwidth of output and input not in the range of suitably, cause the signal data of input and output to go out
Mistake, affects the performance of product；Bad if dispelled the heat, also can affect HW High Way and some USB impedance lines of LCD screen, if
Temperature is too high, interferes with HW High Way and some USB impedance lines of LCD screen, causes impedance inaccurate so that these signals
Through-put power reduce, may result in product data lose.Dispelling the heat in a word bad, the arithmetic speed of chip reduces, and power consumption will increase
Greatly, EMI is caused to disturb other holding wires of circuit or device.
Utility model content
A purpose of the present utility model is to solve at least the above, and provides the advantage that at least will be described later.
This utility model is it is also an object that solve the heat dissipation problem of the chip of LQFP encapsulated type, it is ensured that the merit of chip
Consumption is unlikely to too high, and arithmetic speed is unlikely to reduce, and EMI will not be caused to disturb, and will not go to disturb the sensitive signal in circuit, make
The function-stable of circuit output, it is ensured that the performance requirement of product.
In order to realize according to these purposes of the present utility model and further advantage, it is provided that the radiator structure of a kind of chip,
Described chip package on the surface of pcb board, including:
Pcb board, its at least one surface is provided with a heat dissipation bonding pad, and described heat dissipation bonding pad is arranged at intervals with multiple hole
Footpath is the through hole of 0.2～0.3mm；
Chip, it is arranged on described heat dissipation bonding pad.
Chip heat in running is distributed by the multiple through holes on heat dissipation bonding pad, so that chip exists
Running within the scope of certain temperature, it is ensured that the power consumption of chip is unlikely to too high, arithmetic speed is unlikely to reduce, and will not cause EMI
Interference.
Preferably, in the radiator structure of described chip, two surfaces that described pcb board is relative are respectively provided with one and dissipate
Hot weld dish, so that radiating effect is more preferable.
Preferably, in the radiator structure of described chip, on the surface of the described pcb board of non-chip described dissipate
It is provided with heat-conducting silica gel sheet on hot weld dish.Heat-conducting silica gel sheet contacts with the graphite heat radiation fin on machine, thus plays good dissipating
Heat effect.
Preferably, in the radiator structure of described chip, the distance being connected between two through holes is 0.9mm.Effectively
Space in be distributed more through hole, to improve radiating effect as far as possible.
Preferably, in the radiator structure of described chip, peripherally located through hole is apart from the edge of described heat dissipation bonding pad
0.6～0.7mm, the heat produced during to ensure to run chip sheds in time.
Preferably, in the radiator structure of described chip, described heat dissipation bonding pad be provided around multiple pin pad,
With fixed chip pin.
Preferably, in the radiator structure of described chip, described heat dissipation bonding pad is arranged in the surface of described pcb board
Between position, to improve radiating effect.
Preferably, in the radiator structure of described chip, described pcb board set gradually from top to bottom the first copper foil layer,
Substrate layer and the second copper foil layer, to form encapsulating structure.
This utility model at least includes following beneficial effect: beneath chips is provided with on heat dissipation bonding pad, and heat dissipation bonding pad and presses
Preset space length and aperture offer multiple through hole, and such chip heat in running will be by many on heat dissipation bonding pad
Individual through hole distributes, so that chip runs within the scope of certain temperature, it is ensured that the power consumption of chip is unlikely to too high, and fortune
Calculate speed to be unlikely to reduce, EMI will not be caused to disturb, will not go to disturb the sensitive signal in circuit, make the function that circuit exports
Stable, it is ensured that the performance requirement of product.
Part is embodied by further advantage of the present utility model, target and feature by description below, and part also will be passed through
Research of the present utility model and practice are understood by the person skilled in the art.
Accompanying drawing explanation
Fig. 1 is the front schematic view of the radiator structure of traditional die；
Fig. 2 is the schematic rear view of the radiator structure of traditional die；
Fig. 3 is the front schematic view of the radiator structure of chip of the present utility model；
Fig. 4 is the schematic rear view of the radiator structure of chip of the present utility model.
Detailed description of the invention
Below in conjunction with the accompanying drawings this utility model is described in further detail, to make those skilled in the art with reference to explanation
Book word can be implemented according to this.
Should be appreciated that used herein such as " have ", " comprising " and " including " term are not precluded from one or many
Other element individual or the existence of a combination thereof or interpolation.
For the chip of slim quad flat formula encapsulation (LQFP encapsulation) type, as illustrated in fig. 1 and 2, everybody is in PCB design
Processing procedure processes according to traditional method for designing often, radiator structure is not set.Owing to this chip type seals
Dress needs well to process heat radiation, and this chip package is unlike quad flat non-pin package (QFN encapsulation), core
Having a big ground pad below sheet, QPN encapsulation needs to be dispelled the heat by this ground pad, and LQFP encapsulation does not has this traditionally
Individual ground pad, so causing not taking into account that this ground connection heat dissipation bonding pad in traditional PCB design process, from without playing very
Good thermolysis.
As shown in Figures 3 and 4, this utility model provides the radiator structure of a kind of chip, and described chip 2 is encapsulated in pcb board 1
On surface, it is adaptable to the chip of LQFP encapsulated type, including:
Pcb board 1, its at least one surface is provided with a heat dissipation bonding pad 3, described heat dissipation bonding pad 3 is arranged at intervals with many
Individual aperture be the through hole 31 of 0.2～0.3mm, preferably aperture be 0.25mm.Multiple through holes 31 3 can be embarked on journey on heat dissipation bonding pad
Column distribution.
Chip 2, it is arranged on described heat dissipation bonding pad 3, and i.e. chip 2 is upper, heat dissipation bonding pad 3 under, chip 2 runs and produces
Heat distributed by heat dissipation bonding pad 3.
In the radiator structure of described chip, on two surfaces that described pcb board 1 is relative, i.e. respectively it is provided with on work surface
One heat dissipation bonding pad 3, two heat dissipation bonding pads 3 are correspondingly arranged.Chip 2 runs the heat produced and leads to through the multiple of two heat dissipation bonding pads 3
Hole 31 sheds simultaneously, and radiating effect is more preferable.
Described heat dissipation bonding pad 3 in the radiator structure of described chip, on the surface of the described pcb board 1 of non-chip 2
On be provided with heat-conducting silica gel sheet 4.Heat-conducting silica gel sheet 4 is with silica gel as base material, adds the various auxiliary materials such as metal-oxide, by spy
A kind of heat-conducting medium material of different technique synthesis；It is to reduce heat source surface (i.e. chip) by the main purpose of heat-conducting silica gel sheet 4
And the thermal contact resistance produced between radiating element (i.e. heat dissipation bonding pad) contact surface, heat-conducting silica gel sheet 4 can well fill contact
The gap in face.Heat-conducting silica gel sheet 4 will contact with the graphite heat radiation fin on machine, and conductive graphite sheet is also referred to as graphite heat radiation fin, is
A kind of brand-new heat conduction and heat radiation material, have uniqueness crystal grain orientation, along both direction uniform heat conduction, laminar structured can be fine
Ground adapts to any surface, improve the performance of consumer electronics product while shielding thermal source and assembly.
In the radiator structure of described chip, the distance being connected between two through holes 31 is 0.9mm, including lateral separation and
Fore-and-aft distance, the most both can guarantee that radiating effect, had taken into account again the reliability being connected between pcb board 1 with heat dissipation bonding pad 3.
In the radiator structure of described chip, peripherally located through hole 31 apart from the edge 0.6 of described heat dissipation bonding pad 3～
0.7mm, preferably 0.65mm.If through hole 31 is apart from the edge of heat dissipation bonding pad 3 farther out, the radiating effect of chip 2 is poor, if through hole
The edge of 31 distance heat dissipation bonding pads 3 is relatively near, then affect the fastness of whole heat dissipation bonding pad 3.
In the radiator structure of described chip, described heat dissipation bonding pad 3 be provided around multiple pin pad 5.Multiple draw
Foot pad 5 is evenly spaced in heat dissipation bonding pad 3 surrounding, and the pin of chip 2 is fixed in multiple pin pad 5, thus realizes chip 2
Relieved package with pcb board 1.
In the radiator structure of described chip, described heat dissipation bonding pad 3 is arranged on the centre position on the surface of described pcb board 1,
So that the installation of chip 2 is fixed, and the heat produced when chip 2 is run is distributed in time by middle heat dissipation bonding pad 3
Go out.
In the radiator structure of described chip, described pcb board 1 sets gradually the first copper foil layer 11, substrate layer from top to bottom
12 and second copper foil layer 13, chip 2 is arranged on pcb board 1, forms encapsulating structure.
Although embodiment of the present utility model is disclosed as above, but it is not restricted in description and embodiment
Listed utilization, it can be applied to various applicable field of the present utility model completely, for those skilled in the art,
It is easily achieved other amendment, therefore under the general concept limited without departing substantially from claim and equivalency range, this reality
It is not limited to specific details and shown here as the legend with description with novel.
Claims (8)
1. a radiator structure for chip, described chip package is on the surface of pcb board, it is characterised in that including:
Pcb board, its at least one surface is provided with a heat dissipation bonding pad, described heat dissipation bonding pad is arranged at intervals with multiple aperture and is
The through hole of 0.2～0.3mm；
Chip, it is arranged on described heat dissipation bonding pad.
2. the radiator structure of chip as claimed in claim 1, it is characterised in that each on two surfaces that described pcb board is relative
One heat dissipation bonding pad is installed.
3. the radiator structure of chip as claimed in claim 2, it is characterised in that the surface of the described pcb board of non-chip
On described heat dissipation bonding pad on be provided with heat-conducting silica gel sheet.
4. the radiator structure of chip as claimed in claim 1, it is characterised in that the distance being connected between two through holes is
0.9mm。
5. the radiator structure of chip as claimed in claim 1, it is characterised in that peripherally located through hole is apart from described heatsink welding
The edge 0.6～0.7mm of dish.
6. the radiator structure of chip as claimed in claim 1, it is characterised in that being provided around of described heat dissipation bonding pad is multiple
Pin pad.
7. the radiator structure of chip as claimed in claim 1, it is characterised in that described heat dissipation bonding pad is arranged on described pcb board
The centre position on surface.
8. the radiator structure of chip as claimed in claim 1, it is characterised in that described pcb board sets gradually the from top to bottom
One copper foil layer, substrate layer and the second copper foil layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620810424.9U CN205845932U (en) | 2016-07-28 | 2016-07-28 | The radiator structure of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620810424.9U CN205845932U (en) | 2016-07-28 | 2016-07-28 | The radiator structure of chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205845932U true CN205845932U (en) | 2016-12-28 |
Family
ID=57640443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620810424.9U Active CN205845932U (en) | 2016-07-28 | 2016-07-28 | The radiator structure of chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205845932U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11862529B2 (en) | 2020-09-30 | 2024-01-02 | Huawei Technologies Co., Ltd. | Chip and manufacturing method thereof, and electronic device |
-
2016
- 2016-07-28 CN CN201620810424.9U patent/CN205845932U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11862529B2 (en) | 2020-09-30 | 2024-01-02 | Huawei Technologies Co., Ltd. | Chip and manufacturing method thereof, and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No. 16, cuixing Road, Hui Xing street, Yubei District, Chongqing Patentee after: Chongqing Lanan Technology Co.,Ltd. Address before: No. 13-2, Jiangying Road, Nanan District, Chongqing, Chongqing Patentee before: CHONGQING BLUEBANK COMMUNICATION TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address |