CN205845076U - A kind of one side covers copper double-interface smart card band - Google Patents
A kind of one side covers copper double-interface smart card band Download PDFInfo
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- CN205845076U CN205845076U CN201620598569.7U CN201620598569U CN205845076U CN 205845076 U CN205845076 U CN 205845076U CN 201620598569 U CN201620598569 U CN 201620598569U CN 205845076 U CN205845076 U CN 205845076U
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Abstract
This utility model provides a kind of one side and covers copper double-interface smart card band, including envelope surfaces and contact surface, it is made up of Copper Foil and epoxy glass fabric, the Copper Foil of contact surface forms six contacts being not turned on mutually of C1, C2, C3, C5, C6, C7 by the way of chemical etching, the size of contact and position meet ISO 7816 protocol requirement, wherein, eliminate two contacts of C4 and C8, each newly-increased contact being not turned on mutually on C1, C5 contact, two newly-increased contacts connect the input/output port of chip non-contact interface, and C6 is unsettled.This utility model have employed one side and covers copper bar band technique making double-interface smart card, reduce the cost of double-interface smart card, the problem solving epoxy glass fabric surface roughness concordance difference, make card raising word location increase with module position simultaneously, when reducing raising word, cause the risk of wafer damage.
Description
Technical field
This utility model relates to smart card production and the production of application, especially double-interface smart card band and answers
With.
Background technology
Existing double-interface smart card band uses double-sided copper-clad technique, because epoxy glass fabric two sides is required for covering one layer of copper
Paper tinsel, production cost is high.As it is shown in figure 1, be ribbon contacts face, existing pair of interface top view, contact surface is covered with one layer of Copper Foil, Copper Foil
Being formed with C1 ~ C8 totally eight contacts being not turned on mutually by the way of chemical etching, its size and position meet ISO 7816 and assist
View requirement, wherein C1, C2, C3, C5, C7 connect the fan-out of chip contact interface, and tri-contacts of C4, C6, C8 are unsettled.
As in figure 2 it is shown, be existing pair of interface band envelope surfaces top view, wherein, the epoxy glass fabric of envelope surfaces is at C1 ~ C8
Position be respectively arranged with a punching, punching position expose contact surface metal formed 8 pads (1), chip (4) contact interface input
Outfan is linked with these pads (1) by spun gold (5).Envelope surfaces at epoxy glass fabric is covered with one layer of Copper Foil, Copper Foil equally
The mode using chemical etching forms two non-outer pad (2) and two or more non-interior pads (3) that connect of connecing, and the most non-connects outside weld
Dish (2) connects with the antenna end of card when fabrication, non-connects interior pad (3) when module encapsulates by spun gold (5) and core
The input/output terminal of sheet (4) non-contact interface connects.
As it is shown on figure 3, be existing pair of interface strips A-A profile, the envelope surfaces of band and contact surface are covered with one layer respectively
Copper Foil, has one layer of epoxy glass fabric (6) in the middle of two-layer Copper Foil, epoxy glass fabric (6) plays the copper of fixing contact surface and envelope surfaces
The effect of paper tinsel.
As shown in Figure 4, for existing pair of interface fabrication figure, card base has two long limits and two broadsides, two long limits it
Between relative distance be 86mm, the relative distance between two broadsides is 54mm, the strip edge distance wherein long limit of card base
Distance is 18mm, and the distance on a distance wherein card sound stage width limit is 9mm, so that C1 ~ C8 contact position meets ISO 7816 respectively
Protocol requirement.
Existing double-interface smart card band uses double-sided copper-clad technique, and the raw material that its band factory buys is one layer of copper
Paper tinsel and one laminated has covered copper epoxy glass fabric, so the surface of epoxy glass fabric cannot process again, band envelope surfaces
Metal is poor with the bonding force of UV glue, the reliability of the double interface module of impact, the type print position distance mould of double-interface card sheet
Block position is close, has the risk causing Module Fail during raising word.
Summary of the invention
Using double-sided copper-clad technique not enough for double-interface smart card band present in above-mentioned prior art, this practicality is newly
The purpose of type is to provide a kind of use one side and covers copper bar band technique making double-interface smart card.
In order to reach above-mentioned technical purpose, this utility model be the technical scheme is that
A kind of one side covers copper double-interface smart card band, including envelope surfaces and contact surface, by Copper Foil and epoxy glass fabric group
Becoming, the Copper Foil of contact surface forms six contacts being not turned on mutually of C1, C2, C3, C5, C6, C7, contact by the way of chemical etching
Size and position meet ISO 7816 protocol requirement, wherein,
Each newly-increased contact being not turned on mutually above C1, C5 contact；
C1, C2, C3, C5, C7 contact is connected to the fan-out of chip contact interface, and two newly-increased contacts connect
The input/output port of chip non-contact interface, C6 is unsettled.
Preferably, in one side covers copper double-interface smart card band, the epoxy glass fabric of described envelope surfaces C1, C2, C3,
C5, C6, C7 contact position is respectively arranged with a punching, and punching position exposes Copper Foil and forms six pads, the contact interface input of chip
Outfan is connected with pad by spun gold.
Preferably, in one side covers copper double-interface smart card band, the epoxy glass fabric of described envelope surfaces touches newly-increased
Point is respectively arranged with a small circular punching, and small circular punching position respectively exposes one and non-connects interior pad.
Preferably, in one side covers copper double-interface smart card band, described newly-increased contact is respectively arranged with a big circular punching,
Big circular punching position respectively exposes one and non-connects outer pad.
Preferably, in one side covers copper double-interface smart card band, described non-pass through spun gold when connecing interior pad for encapsulating
Connect with the input/output terminal of chip non-contact interface.
Preferably, in one side covers copper double-interface smart card band, described non-connect outer pad when fabrication and card
Antenna end connects.
Preferably, in one side covers copper double-interface smart card band, when fabrication, the long limit of strip edge distance one card base
Distance is 16.5mm, and the distance on distance one card sound stage width limit is 9mm, makes C1, C2, C3, C5, C6, C7 contact and the position of newly-increased contact
Put and meet ISO 7816 protocol requirement.
This utility model have employed above-mentioned one side and covers copper bar band technique making double-interface smart card, the beneficial effect obtained
It is to reduce the cost of double-interface smart card, the problem solving epoxy glass fabric surface roughness concordance difference, make simultaneously
Card raising word location increases with module position, causes the risk of wafer damage when reducing raising word.
With detailed description of the invention, this utility model is described further below in conjunction with the accompanying drawings.
Accompanying drawing explanation
Fig. 1 is existing pair of interface ribbon contacts facial plane figure.
Fig. 2 is existing pair of interface band envelope surfaces plane graph.
Fig. 3 is existing pair of interface band profile.
Fig. 4 is existing a kind of double-interface smart card top view.
Fig. 5 is that a kind of one side of this utility model specific embodiment covers copper double interfaces ribbon contacts facial plane figure.
Fig. 6 is that a kind of one side of this utility model specific embodiment covers copper double interfaces band envelope surfaces plane graph.
Fig. 7 is that a kind of one side of this utility model specific embodiment covers copper double interfaces band profile.
Fig. 8 is that a kind of one side of this utility model specific embodiment covers copper double-interface smart card top view.
Detailed description of the invention
As it is shown in figure 5, a kind of one side for this utility model specific embodiment covers copper double interfaces ribbon contacts facial plane figure；
In the band of double interfaces, contact surface is covered with one layer of Copper Foil, Copper Foil be formed by the way of chemical etching C1, C2, C3, C5, C6,
C7 totally six contacts being not turned on mutually, the size of contact and position meet ISO 7816 protocol requirement.Eliminate following no
Two contacts of C4 and C8, additionally each newly-increased contact being not turned on mutually (20) on C1 and C5 the two contact；Wherein
C1, C2, C3, C5, C7 contact is connected to the fan-out of chip contact interface, and it is non-that two newly-increased contacts (20) connect chip
The input/output port of contact interface, C6 is unsettled.Eliminate C4 and the C8 the two contact not used, C1 and C5 the two contact
Top respectively newly increased a contact as chip and the connection of card non-contact interface, such card is in test and uses
Journey is not affected by card reader C4, C8 contacts status.
As shown in Figure 6, a kind of one side of this utility model specific embodiment covers copper double interfaces band envelope surfaces plane graph；Bag
The epoxy glass fabric of front cover is respectively arranged with a punching in the position of C1, C2, C3, C5, C6, C7, and punching position exposes Copper Foil and forms six
Individual pad (21), the contact interface input/output terminal of chip (24) is connected with these pads (21) by spun gold (25)；Envelope surfaces
Epoxy glass fabric be respectively arranged with a small circular punching in newly-increased contact (20) position, small circular punching position respectively expose one non-
Connecing interior pad (23), the two is non-to be connect when interior pad (23) is used for encapsulating by spun gold (25) and chip (24) non-contact interface
Input/output terminal connects；Newly-increased contact (20) is respectively arranged with a big circular punching, and big circular punching position respectively exposes one and non-connects
Outer pad (22), the two is non-to be connect outer pad pad (22) and connects with the antenna end of card when fabrication.
As it is shown in fig. 7, a kind of one side of this utility model specific embodiment covers copper double interfaces band profile；By one layer of ring
Oxygen glass cloth (26) and one layer of Copper Foil composition of contact surface, epoxy glass fabric (26) plays the effect of fixing contact surface Copper Foil.
As shown in Figure 8, a kind of one side of this utility model specific embodiment covers copper double-interface smart card top view；Fabrication
Time, card base has two long limits and two broadsides, and the relative distance between two long limits is 86mm, the phase between two broadsides
Adjusting the distance as 54mm, the strip edge distance apart from one of them long limit of card base is 16.5mm, apart from one of them card sound stage width limit
Distance is 9mm, makes the position of C1, C2, C3, C5, C6, C7 contact and newly-increased contact meet ISO 7816 protocol requirement, so exists
When individualized test and terminal use use, C4, C8 contacts status of card reader does not interferes with the normal work of card.
Above are only specific embodiment of the utility model, those of ordinary skill in the art are without departing from this utility model skill
Can have many deformation and change on the basis of art thinking, these technical schemes obviously formed are also contained in this utility model
In the technical scope of protection.
Claims (7)
1. one side covers a copper double-interface smart card band, including envelope surfaces and contact surface, is made up of Copper Foil and epoxy glass fabric,
The Copper Foil of contact surface forms six contacts being not turned on mutually of C1, C2, C3, C5, C6, C7 by the way of chemical etching, contact
Size and position meet ISO 7816 protocol requirement, it is characterised in that
Each newly-increased contact being not turned on mutually above C1, C5 contact；
C1, C2, C3, C5, C7 contact is connected to the fan-out of chip contact interface, and two newly-increased contacts connect that chip is non-to be connect
Touching the input/output port at interface, C6 is unsettled.
One side the most according to claim 1 covers copper double-interface smart card band, it is characterised in that the epoxy of described envelope surfaces
Glass cloth is respectively arranged with a punching at C1, C2, C3, C5, C6, C7 contact position, and punching position exposes Copper Foil and forms six pads, core
The contact interface input/output terminal of sheet is connected with pad by spun gold.
One side the most according to claim 1 covers copper double-interface smart card band, it is characterised in that the epoxy of described envelope surfaces
Glass cloth is respectively arranged with a small circular punching in newly-increased contact, and small circular punching position respectively exposes one and non-connects interior pad.
One side the most according to claim 1 covers copper double-interface smart card band, it is characterised in that described newly-increased contact is each
There are a big circular punching, big circular punching position respectively to expose one and non-connect outer pad.
One side the most according to claim 3 covers copper double-interface smart card band, it is characterised in that described non-connect interior pad use
Connected by the input/output terminal of spun gold and chip non-contact interface when encapsulation.
One side the most according to claim 4 covers copper double-interface smart card band, it is characterised in that described non-connect outer pad use
When fabrication and card antenna end connect.
One side the most according to claim 1 covers copper double-interface smart card band, it is characterised in that during fabrication, strip edge
The distance on the long limit of distance one card base is 16.5mm, and the distance on distance one card sound stage width limit is 9mm, makes C1, C2, C3, C5, C6, C7 touch
The position of point and newly-increased contact meets ISO 7816 protocol requirement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620598569.7U CN205845076U (en) | 2016-06-17 | 2016-06-17 | A kind of one side covers copper double-interface smart card band |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620598569.7U CN205845076U (en) | 2016-06-17 | 2016-06-17 | A kind of one side covers copper double-interface smart card band |
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| Publication Number | Publication Date |
|---|---|
| CN205845076U true CN205845076U (en) | 2016-12-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620598569.7U Active CN205845076U (en) | 2016-06-17 | 2016-06-17 | A kind of one side covers copper double-interface smart card band |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106960240A (en) * | 2017-04-14 | 2017-07-18 | 恒宝股份有限公司 | A kind of double-interface smart card and its method for packing using single interface band |
-
2016
- 2016-06-17 CN CN201620598569.7U patent/CN205845076U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106960240A (en) * | 2017-04-14 | 2017-07-18 | 恒宝股份有限公司 | A kind of double-interface smart card and its method for packing using single interface band |
| CN106960240B (en) * | 2017-04-14 | 2018-02-13 | 恒宝股份有限公司 | A kind of double-interface smart card and its method for packing using single interface band |
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