CN205838911U - A kind of floatation type all-directional conductive glued membrane - Google Patents
A kind of floatation type all-directional conductive glued membrane Download PDFInfo
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- CN205838911U CN205838911U CN201620046608.2U CN201620046608U CN205838911U CN 205838911 U CN205838911 U CN 205838911U CN 201620046608 U CN201620046608 U CN 201620046608U CN 205838911 U CN205838911 U CN 205838911U
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- line
- glue
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- silver plated
- plated fiber
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Abstract
The utility model discloses a kind of floatation type all-directional conductive glued membrane, belong to conducting resinl field, overcome existing conducting resinl and have that conducting particles is oxidizable, the fragile shortcoming also destroyed of contact.All-directional conductive glued membrane of the present utility model includes top glue-line, bottom glue-line and insulation glue-line, top glue-line and bottom glue-line lay respectively on the two sides of insulation glue-line, insulation glue-line includes the first conductive particle layer, silver plated fiber layer and the second conductive particle layer, described silver plated fiber layer is between the first conductive particle layer and the second conductive particle layer, insulation glue-line is formed by insulating cement, conducting particles and silver plated fiber respectively, and described conducting particles and silver plated fiber are distributed in this insulating cement.This utility model has advantages such as conducting electricity very well, conductive capability is stable, the most also with electromagnetic wave shielding effect, it is adaptable to compact driving IC and the connection of substrate.
Description
Technical field
This utility model belongs to conducting resinl field, more particularly, it relates to a kind of floatation type all-directional conductive glued membrane.
Background technology
Entity between different electronic modules connects most-often used welding manner, mainly by the slicker solder having relatively low melting point
Alloy is as solder, and under suitably heating, instant melting solder is to contact the pin of two electronic building bricks, when removing heating, solder
The most curable and firm connection two electronic building brick.Another way is to use high temperature stannum stove, by surface mount technology (Surface-
Mount technology, SMT) electronic building brick be placed in advance on the electric circuit with solder, then wink through high temperature furnace
Between heat, cool down after, solder can connect all electronic building bricks.
The most traditional tin-lead back welding process cannot be applicable to the compact and application of relatively low power consumption, than
In Thin Film Transistor-LCD (Thin Film Transistor Liquid Crystal Display, TFT-LCD)
Drive the connection of (Integrated Circuit, IC) and substrate, because driving in IC in order to connect the golden projection of external circuit
The spacing of (Gold Bumping) is typically small, about 20um～40um, and the fusing point of gold projection is much higher relative to Solder Bumps.
Research report about conductive adhesive film has a lot at present, and such as, Chinese Patent Application No. is 201120474755.7,
Authorized announcement date is that the patent application document on July 11st, 2012 discloses a kind of anisotropic conductive tape/film, including the first glue
Sheet material layers, metal film layer and the second glue sheet material layers, described first glue sheet material layers and the second glue sheet material layers are respectively by insulating cement and multiple conduction
Particle is formed, and described conducting particles is distributed in this insulating cement；Described metal film layer has relative two side, and described
One, two glue sheet material layers are respectively arranged on two sides of this metal film layer.Chinese Patent Application No. is 201310011479.4, Shen
Please date of publication be the patent application document on July 17th, 2013 disclose conducting particles, insulation-coated electroconductive particles and respectively to
Opposite sex conductive adhesive；The conducting particles of this invention possesses resin particle and the metal on the surface being arranged at this resin particle
Layer；Above-mentioned metal level comprises nickel and copper, and has copper and become along with the surface away from resin particle relative to the elemental ratio of nickel
High part.Generally adding nickel ball conducting particles in existing conductive adhesive film, nickel ball has oxidizable, and contact fragility is also destroyed
Shortcoming, and existing conductive adhesive film electromagnetic shielding effect is poor, is not suitable for being applied to the most compact currently designed driving
On dynamic IC.
Summary of the invention
1, problem to be solved
There is the problems such as contact fragility is also destroyed, electromagnetic shielding effect is poor for existing conductive adhesive film, this practicality is new
Type provides a kind of floatation type all-directional conductive glued membrane, including top glue-line, bottom glue-line and insulation glue-line, top glue-line and bottom
Glue-line lays respectively on the two sides of insulation glue-line, and insulation glue-line includes that the first conductive particle layer, silver plated fiber layer and second are led
Electrochondria sublayer, described silver plated fiber layer is between the first conductive particle layer and the second conductive particle layer, of the present utility model
Conductive adhesive film can overcome existing nickel ball conducting particles to there is oxidizable, the fragile shortcoming also destroyed of contact, has very well simultaneously
Electromagnetic shielding effect.
2, technical scheme
For solving the problems referred to above, this utility model adopts the following technical scheme that.
A kind of floatation type all-directional conductive glued membrane, including top glue-line, bottom glue-line and insulation glue-line, described top glue
Layer and bottom glue-line lay respectively on the two sides of insulation glue-line；Described insulation glue-line respectively by insulating cement, conducting particles and
Silver plated fiber is formed, and described conducting particles and silver plated fiber are distributed in this insulating cement.
Preferably, described insulation glue-line includes the first conductive particle layer, silver plated fiber layer and the second conductive particle layer, institute
The silver plated fiber layer stated is between the first conductive particle layer and the second conductive particle layer.
Preferably, described silver plated fiber layer is formed by insulating cement and silver plated fiber, and described silver plated fiber is distributed in this
In insulating cement；The first described conductive particle layer and the second conductive particle layer are formed by insulating cement and conducting particles, described
Conducting particles is distributed in this insulating cement.
Preferably, described conducting particles is copper facing ping-pong ball conducting particles, mean diameter is 30～70nm, density 1.5～
3g/cm3。
Preferably, described top glue-line is thermoplastic resin layer；Described bottom glue-line is release film layer.
Preferably, described insulating cement is pressure-sensing glue.
Preferably, described top bondline thickness is 0.1-0.2mm；The thickness of described bottom glue-line is 0.05-
0.1mm；The thickness of described insulation glue-line is 0.2-1.0mm.
Preferably, the thickness of described silver plated fiber layer is 0.02-0.1mm.
3, beneficial effect
Compared to prior art, the beneficial effects of the utility model are:
(1) all-directional conductive glued membrane of the present utility model is applicable to the connection of compact driving IC and substrate, this reality
With novel conductive adhesive film include top glue-line, bottom glue-line and insulation glue-line, insulation glue-line be divided into again the first conductive particle layer,
Silver plated fiber layer and the second conductive particle layer, formed by insulating cement, conducting particles and silver plated fiber, owing to insulating cement material is in heating
Under there is viscosity, and under external pressure at right angle, conducting particles therein moves up to pressurized side, so contact with each other or
Crimp, thus form the effect on the vertical longitudinal direction of pressurized with electrically conducting, when making insulating cement material through after a while
After solidification, conducting particles and conduction silver plated fiber are no longer the most mobile by external force and form comprehensive conducting rock-steady structure, therefore,
Use all-directional conductive glued membrane of the present utility model that TFT-LCD can be made to drive IC and substrate to form good electrical connection；
(2) in conductive adhesive film of the present utility model, conducting particles is copper facing ping-pong ball conducting particles, can overcome existing nickel ball
There is oxidizable, the fragile shortcoming also destroyed of contact in conducting particles, ping-pong ball copper coating can increase its electric conductivity, increases preferably
Conductive capability；
(3) all-directional conductive glued membrane of the present utility model has silver plated fiber layer, can bring electromagnetic wave shielding effect；Due to
The design of IC now is got over more and more compact, a lot of electronic building bricks has electromagnetic wave, impact property the most interfering with each other
The utilization of energy, and the electromagnetic wave produced on the effective docking point of conductive adhesive film of the present utility model energy produces and effectively shields effect
Really；
(4) all-directional conductive film thickness of the present utility model is moderate, and the thickness of silver plated fiber layer is 0.02-0.1mm,
While producing good electromagnetic shielding effect, it is unlikely to again to affect the electric conductivity of conductive adhesive film.
Accompanying drawing explanation
Fig. 1 is the structural representation of floatation type all-directional conductive glued membrane of the present utility model.
In figure: 1, top glue-line；2, bottom glue-line；3, insulation glue-line；301, the first conductive particle layer；302, silver plated fiber
Layer；303, the second conductive particle layer.
Detailed description of the invention
Below in conjunction with specific embodiment, this utility model is further described below.
Embodiment 1
As it is shown in figure 1, a kind of floatation type all-directional conductive glued membrane, including top glue-line 1 (thickness is 0.1mm), bottom glue
Layer 2 (thickness is 0.1mm) and insulation glue-line 3 (thickness is 0.6mm), top glue-line 1 and bottom glue-line 2 lay respectively at insulation glue-line
On the two sides of 3；Insulation glue-line 3 is formed by insulating cement, conducting particles and silver plated fiber respectively, and (particle diameter is distributed in conducting particles
In the range of 30～70nm, density 1.5～3g/cm3) and silver plated fiber (diameter 5～10 μm, length 10～30 μm, density 1-2g/
cm3) be distributed in this insulating cement；Insulation glue-line 3 includes the first conductive particle layer 301, silver plated fiber layer 302 and the second conductive particle
Sublayer 303, silver plated fiber layer 302 (thickness is 0.05mm) be positioned at the first conductive particle layer 301 and the second conductive particle layer 303 it
Between.Wherein, silver plated fiber layer 302 is formed by insulating cement and silver plated fiber, and silver plated fiber is distributed in this insulating cement；First conduction
Particle layer 301 and the second conductive particle layer 303 are formed by insulating cement and conducting particles, and conducting particles is distributed in this insulating cement
In.Conducting particles in the present embodiment is copper facing ping-pong ball conducting particles, and insulating cement is pressure-sensing glue.Top glue-line 1 is thermoplasticity
Resin bed；Bottom glue-line 2 is release film layer.
The all-directional conductive glued membrane of the present embodiment is applicable to the connection of compact driving IC and substrate, due to insulating cement
Material has viscosity under heating, and under external pressure at right angle, conducting particles therein moves up to pressurized side, Jin Erxiang
Contact or crimp mutually, thus form the effect on the vertical longitudinal direction of pressurized with electrically conducting, when making through after a while
After the solidification of insulating cement material, conducting particles and conduction silver plated fiber are no longer the most mobile by external force and form comprehensive conducting and stably tie
Structure, therefore, uses all-directional conductive glued membrane of the present utility model that TFT-LCD can be made to drive IC to form good electrically connecting with substrate
Connect；Owing to the all-directional conductive glued membrane of the present embodiment has silver plated fiber layer, electromagnetic wave shielding effect can be brought.
Embodiment 2
As it is shown in figure 1, a kind of floatation type all-directional conductive glued membrane, including top glue-line 1 (thickness is 0.2mm), bottom glue
Layer 2 (thickness is 0.08mm) and insulation glue-line 3 (thickness is 0.2mm), top glue-line 1 and bottom glue-line 2 lay respectively at insulating cement
On the two sides of layer 3；Insulation glue-line 3 is formed by insulating cement, conducting particles and silver plated fiber respectively, conducting particles and silver plated fiber
It is distributed in this insulating cement；Insulation glue-line 3 includes the first conductive particle layer 301, silver plated fiber layer 302 and the second conductive particle layer
303, silver plated fiber layer 302 (thickness is 0.02mm) is between the first conductive particle layer 301 and the second conductive particle layer 303.
Wherein, silver plated fiber layer 302 is formed by insulating cement and silver plated fiber, and silver plated fiber is distributed in this insulating cement；First conductive particle
Sublayer 301 and the second conductive particle layer 303 are formed by insulating cement and conducting particles, and conducting particles is distributed in this insulating cement.
Conducting particles in the present embodiment is copper facing ping-pong ball conducting particles, and insulating cement is pressure-sensing glue.Top glue-line 1 is thermoplastic resin
Layer；Bottom glue-line 2 is release film layer.
Embodiment 3
As it is shown in figure 1, a kind of floatation type all-directional conductive glued membrane, including top glue-line 1 (thickness is 0.15mm), bottom glue
Layer 2 (thickness is 0.05mm) and insulation glue-line 3 (thickness is 1.0mm), top glue-line 1 and bottom glue-line 2 lay respectively at insulating cement
On the two sides of layer 3；Insulation glue-line 3 is formed by insulating cement, conducting particles and silver plated fiber respectively, conducting particles and silver plated fiber
It is distributed in this insulating cement；Insulation glue-line 3 includes the first conductive particle layer 301, silver plated fiber layer 302 and the second conductive particle layer
303, silver plated fiber layer 302 (thickness is 0.1mm) is between the first conductive particle layer 301 and the second conductive particle layer 303.Its
In, silver plated fiber layer 302 is formed by insulating cement and silver plated fiber, and silver plated fiber is distributed in this insulating cement；First conducting particles
Layer 301 and the second conductive particle layer 303 are formed by insulating cement and conducting particles, and conducting particles is distributed in this insulating cement.This
Conducting particles in embodiment is copper facing ping-pong ball conducting particles, and insulating cement is pressure-sensing glue.Top glue-line 1 is thermoplastic resin
Layer；Bottom glue-line 2 is release film layer.
Claims (5)
1. a floatation type all-directional conductive glued membrane, it is characterised in that: include top glue-line (1), bottom glue-line (2) and insulating cement
Layer (3), described top glue-line (1) and bottom glue-line (2) lay respectively on the two sides of insulation glue-line (3)；Described insulation
Glue-line (3) includes the first conductive particle layer (301), silver plated fiber layer (302) and the second conductive particle layer (303), described plating
Silver fibrous layer (302) is positioned between the first conductive particle layer (301) and the second conductive particle layer (303).
A kind of floatation type all-directional conductive glued membrane the most according to claim 1, it is characterised in that: described top glue-line
(1) it is thermoplastic resin layer；Described bottom glue-line (2) is release film layer.
A kind of floatation type all-directional conductive glued membrane the most according to claim 1, it is characterised in that: described insulating cement is sense
Moulding.
A kind of floatation type all-directional conductive glued membrane the most according to claim 1, it is characterised in that: described top glue-line
(1) thickness is 0.1-0.2mm；The thickness of described bottom glue-line (2) is 0.05-0.1mm；The thickness of described insulation glue-line (3)
Degree is 0.2-1.0mm.
A kind of floatation type all-directional conductive glued membrane the most according to claim 1, it is characterised in that: described silver plated fiber layer
(302) thickness is 0.02-0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620046608.2U CN205838911U (en) | 2016-01-18 | 2016-01-18 | A kind of floatation type all-directional conductive glued membrane |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620046608.2U CN205838911U (en) | 2016-01-18 | 2016-01-18 | A kind of floatation type all-directional conductive glued membrane |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205838911U true CN205838911U (en) | 2016-12-28 |
Family
ID=57627986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620046608.2U Expired - Fee Related CN205838911U (en) | 2016-01-18 | 2016-01-18 | A kind of floatation type all-directional conductive glued membrane |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205838911U (en) |
-
2016
- 2016-01-18 CN CN201620046608.2U patent/CN205838911U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161228 Termination date: 20180118 |