KR101194864B1 - Back contact solar cell module and manufacturing method thereof - Google Patents

Abstract

PURPOSE: A rear electrode type solar cell module and a manufacturing method thereof are provided to remove an insulation substrate for forming a wire by using a wire sheet with a wire on an isotropic conductive adhesive member. CONSTITUTION: A release film is adhered to one side of an isotropic conductive adhesive member(120). A wire sheet(110b) with a wire(111) is formed on the other side of the isotropic conductive adhesive member. A rear substrate(220), a wire sheet, and an electrode(131) are formed in a cell. A laminate structure is formed by laminating the cell, a first filler, and a front substrate. The electrode is electrically connected to the wire by melting the first filler and the isotropic conductive adhesive member.

Description

BACK CONTACT SOLAR CELL MODULE AND MANUFACTURING METHOD THEREOF}

The present invention relates to a back electrode solar cell module and a method of manufacturing the same that can simplify the manufacturing process of the solar cell module.

Conventionally, a conductive adhesive and an insulating film were used to connect the electrode and the wiring in the back electrode solar cell.

Specifically, the conductive adhesive was applied at a position corresponding to the wiring, and the perforated portions of the perforated film having insulating properties were aligned on the conductive adhesive to connect the electrodes and the wiring.

In the above case, there was an inconvenience of using the insulating member and the conductive member, and precise control was necessary because the conductive adhesive and the insulating perforated film should be positioned at the correct positions.

Moreover, when laminating an insulating film, there existed inconvenience which should perforate the site | part corresponding to a conductive adhesive so that electricity may flow between an electrode and a wiring.

In order to solve the above problems, the present invention is to provide a back-electrode type solar cell module and a method for manufacturing the same, the manufacturing process is simplified and the manufacturing cost is reduced.

Method of manufacturing a back electrode solar cell module according to an embodiment of the present invention comprises the steps of forming a wiring sheet on which the wiring is formed on the other surface of the anisotropic conductive adhesive member to which the release film is bonded to one surface, the back substrate, the wiring sheet, the electrode Stacking the formed cells, the first filler and the front substrate to form a laminate structure, and laminating the laminate structure to melt the first filler and the anisotropic conductive adhesive member to electrically connect the electrode and the wiring. Connecting.

The forming of the wiring sheet includes coating an insulating resin in which conductive particles are distributed on the release film, laminating the copper foil on the insulating resin, and patterning the copper foil to form wiring.

Alternatively, the forming of the wiring sheet may include coating an insulating resin having conductive particles on the copper foil, temporarily attaching the release film to the insulating resin, and forming the wiring by patterning the copper foil. can do.

And in the step of forming the wiring sheet, the anisotropic conductive adhesive member is conductive particles are distributed in the insulating resin, the thickness of the insulating resin may be formed larger than the average diameter of the conductive particles.

Alternatively, in the forming of the wiring sheet, the anisotropic conductive adhesive member may have conductive particles distributed in an insulating resin, and the thickness of the insulating resin may be smaller than twice the maximum diameter of the conductive particles.

In addition, the forming of the laminated structure may include removing the release film, laminating the wiring sheet on the back substrate, and laminating the cell on the wiring sheet.

The method may further include stacking a second filler on the rear substrate and laminating the wiring sheet on the second filler in the forming of the laminated structure.

According to another aspect of the present invention, there is provided a method of manufacturing a back electrode solar cell module, the method comprising: forming a wiring board having wiring formed on an insulating substrate, the wiring board, the anisotropic conductive adhesive member, a cell on which an electrode is formed, and a first Laminating a filler and a front substrate to form a laminated structure, and laminating the laminated structure to electrically connect the wiring and the electrode.

In this case, the forming of the wiring board includes laminating and patterning a copper foil on a rear substrate to form wiring.

Alternatively, the forming of the wiring board may include forming a wiring by laminating and patterning a copper foil on the auxiliary substrate, and laminating the auxiliary substrate on the back substrate.

The method may further include stacking a second filler on the back substrate before the stacking of the auxiliary substrate on the back substrate.

In addition, the forming of the laminated structure may include temporarily attaching an anisotropic conductive film to the wiring or the electrode.

In addition, the forming of the laminated structure may include coating an anisotropic conductive adhesive on one surface or the wiring board of the cell in which the electrode is formed.

In the forming of the wiring board, the anisotropic conductive adhesive member may have conductive particles distributed in an insulating resin, and the thickness of the insulating resin may be greater than an average diameter of the conductive particles.

In the forming of the wiring board, the anisotropic conductive adhesive member may have conductive particles distributed in an insulating resin, and the thickness of the insulating resin may be smaller than twice the maximum diameter of the conductive particles.

In the lamination step, the anisotropic conductive adhesive member may be melted to electrically connect the electrode and the wire and to be electrically connected.

The back electrode solar cell module according to an embodiment of the present invention is a back electrode solar cell module manufactured by the manufacturing method.

In this case, the anisotropic conductive adhesive member may include an epoxy resin or vinyl acetate ethylene (Vinyl Acetate-Ethylene), the front substrate or the back substrate may be ethylene tetra fluoro ethylene (Ethylene TetraFluoroEthylene).

According to the embodiments of the present invention, since the electrode and the wiring are connected by using the anisotropic conductive adhesive member, the back electrode type solar cell may be easily manufactured.

In addition, in the case of using the wiring sheet having the wiring formed on the anisotropic conductive adhesive member, the insulating substrate for forming the wiring can be omitted, thereby reducing the manufacturing cost.

1 is a flow chart of a method for manufacturing a back electrode solar cell module according to a first embodiment of the present invention.
2 is a view showing the anisotropic conductive adhesive member shown in FIG.
Figure 3 (a) and (b) is a view showing a connection relationship between the wiring and the electrode by the anisotropic conductive adhesive member.
Figure 4 is a flow chart of a method of manufacturing a back electrode solar cell module according to a second embodiment of the present invention.
5 is a flow chart of a method of manufacturing a back electrode solar cell module according to a third embodiment of the present invention.
6 is a view showing a back electrode solar cell module according to a first embodiment of the present invention.
7 is a view showing a back electrode solar cell module according to a second embodiment of the present invention.
8 is a view showing a back electrode solar cell module according to a third embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. Like parts are designated by like reference numerals throughout the specification.

1 is a flow chart of a method of manufacturing a back electrode solar cell module according to a first embodiment of the present invention, Figure 2 is a view showing the anisotropic conductive adhesive member shown in Figure 1, Figures 3 (a) and (b) Is a view showing a connection relationship between the wiring and the electrode by the anisotropic conductive adhesive member.

A method of manufacturing a back electrode solar cell module according to a first embodiment of the present invention includes forming a wiring sheet, forming a laminated structure, and laminating the laminated structure.

In the forming of the wiring sheet 110b, the wiring 111 is formed by laminating and patterning the copper foil on the an-isotropic conductive adhesive 120.

The anisotropic conductive adhesive member 120 is a member that bonds the electrode 131 and the wiring 111 and electrically connects the electrons or holes between the electrode 131 and the wiring 111 to allow current to flow.

As shown in FIG. 2, the anisotropic conductive adhesive member 120 is a member in which the conductive particles 120b are dispersed at a low concentration in the insulating resin 120a.

The conductive particles 120b may be any particles having conductivity, and may be, for example, metal powder particles, conductive polymer particles, or particles coated with a conductor on insulating resin particles. Alternatively, the metal particles may be plated on a soft plastic ball so as to press the conductive particles 120b to facilitate the connection between the electrode 131 and the wiring 111 in the lamination process.

Depending on the distribution concentration of the conductive particles 120b, the adhesive member may be anisotropic in which current flows in one direction and no current flows in the other direction, or isotropic in which current flows in all directions.

The percolation threshold at which the conductive particles 120b are distributed in the insulating resin 120a to show anisotropy is different depending on the use and the field in which the anisotropic conductive adhesive member 120 is used. In the present invention, the weight ratio of the conductive particles in the anisotropic conductive adhesive member 120 may be less than about 10%. However, the critical concentration for determining the property of the anisotropic conductive adhesive member 120 may vary depending on the size of the conductive particles and the pattern of the electrode and the wiring.

When the electroconductive particle 120b is distributed below the critical density in the insulating resin 120a, the electrode 131 and the wiring 111 are electrically energized by the electroconductive particle 120b, and the electrode 131 and the electrode ( 131 or between the wiring 111 and the wiring 111 is not electrically passed by the insulating resin (120a).

The anisotropic conductive adhesive member 120 may be, for example, an anisotropic conductive film.

At this time, an epoxy resin, an acrylic resin, vinyl acetate ethylene (hereinafter, referred to as "VAE") or silicone may be used as the insulating resin 120a.

Epoxy resin is a kind of thermosetting resin, which has good adhesive strength, is not affected by temperature, and has excellent electrical insulation. In addition, it has excellent properties such as durability, chemical resistance, water resistance and the like.

In addition, the epoxy resin may contain only a small amount of volatile organic compounds (VOC), thereby producing environment-friendly products.

Epoxy-based resin is a technique used to bond a semiconductor chip and a glass substrate (Chip On Glass, hereinafter referred to as "COG"), a technique used to bond a semiconductor chip and a flexible PCB (FPCB) (Chip on Film, hereinafter " COF ") or FPCB and glass substrate or PCB (Printed Circuit Board) bonding technology.

In the case of COG or COF, the technique of connecting an electrode and a wiring using an anisotropic conductive film is technically similar in terms of its function and material. Therefore, the electrode 131 and the wiring 111 can be easily connected by using the known technique.

Acrylic resin has a property of high fluidity in the molten state. Therefore, in the lamination process, the acrylic resin distributed between the wiring 111 and the electrode 131 moves to the side thereof, that is, the lower portion of the cell 130 in which the electrode 131 is not formed and the wiring 111 are formed. The electrode 131 and the wiring 111 are energized by the electroconductive particles and move to the upper portion of the wiring sheet 110b that is not in the wiring sheet 110b. The space between can be used as an anisotropic conductive adhesive member of excellent performance to be insulated with an insulating resin.

VAE is a complex of vinyl acetate and ethylene.

VAE can be synthesized in a colloidal form dispersed in water, and can be laminated on the wiring 111 in a solution state.

By dispersing and coating the filler such as silica and the conductive particles in the emulsion VAE, a thin and uniform anisotropic film can be produced. And when it is coated on the wiring 111 by a known printing method, an anisotropic conductive film can be selectively coated on a desired portion. In this case, the silica filler may function to adjust the viscosity of the coating solution and the coefficient of thermal expansion of the anisotropic conductive film.

Silicone has excellent chemical resistance and does not chemically react with other chemicals, and has excellent weather resistance and heat resistance. In addition, it is an environmentally friendly material that does not generate a lot of harmful substances even when burned.

In addition, silicon is a proven material commonly used as a filler for solar cells. Silicone can be applied on the wiring in a liquid state, when using the silicone as an adhesive film, there is an effect that it is easy to laminate the adhesive film on the wiring.

The forming of the wiring sheet 110b may include coating an insulating resin in which conductive particles are distributed on a release film, laminating copper foil on the insulating resin, and patterning the copper foil to form wiring. Include.

The release film (not shown) is a member for protecting the adhesive surface of the anisotropic conductive adhesive member 120 and for easily moving the anisotropic conductive adhesive member 120. The release film may be made of polyethylene terephtalate (PET).

First, an insulating resin in which conductive particles are distributed is coated on one surface of the release film. In this case, the insulating resin may be in a gel state.

Thereafter, copper foil is laminated to the insulating resin and bonded. And copper foil is patterned by photolithography etc., and wiring is formed. The method of patterning copper foil can use other methods, such as a screen printing method, in addition to a well-known photolithography method.

Alternatively, the wiring sheet 110b is reversed by coating an insulating resin in which conductive particles are distributed to copper foil, temporarily bonding a release film to the insulating resin, and patterning the copper foil to form wiring. Can be formed.

That is, the insulating resin of the gel form in which electroconductive particle is distributed in the flat copper foil is coated. Thereafter, the release film is bonded onto the insulating resin. And this is reversed to etch the copper foil to form a patterned wiring copper foil.

Accordingly, the wiring sheet 110b having the wiring 111 formed on the anisotropic conductive adhesive member 120 is formed.

At this time, the thickness of the insulating resin 120a is thicker than the average diameter of the conductive particles 120b, and is formed smaller than twice the maximum diameter of the conductive particles 120b.

When the thickness of insulating resin 120a is smaller than the average diameter of electroconductive particle 120b, there exists a possibility that the contact surface of the anisotropically conductive adhesive member 120 may not be formed flat.

The electroconductive particle 120b generally has a spherical shape and is wrapped by the insulating resin 120a. In this case, when the thickness of the insulating resin 120a is smaller than the conductive particles 120b, a part of the conductive particles 120b protrudes out of the insulating resin 120a, so that an adhesive surface of the anisotropic conductive adhesive member 120 is unevenly formed. . In this case, when the anisotropic conductive adhesive member 120 comes into contact with the electrode 131, the contact area becomes inconsistent and thus there is a problem in that the adhesive force is lowered.

In addition, when the thickness of the insulating resin 120a is greater than twice the average diameter of the conductive particles 120b, the pressure to be applied to the laminated structure in order to electrically connect the electrode 131 and the wiring 111 becomes very high. do.

Thereafter, a laminated structure is formed as shown in FIG.

The laminated structure includes a back substrate 220, a wiring sheet 110 b, a cell 130, a first filler and a front substrate 210.

The front substrate 210 and the rear substrate 220 are disposed at the outermost sides of the solar cell module and face each other.

The front substrate 210 is a member disposed on the front surface of the solar cell module. The front substrate 210 is generally a substrate of a transparent material such as glass is used. Sunlight is transmitted through the front substrate 210 to generate electrons and holes due to the photoelectric effect in the cell, so that current flows.

An ETFE (Ethylene Tetra Fluoro Ethylene) film may be used as the front substrate 210.

ETFE film is a colorless transparent resin with high light transmittance. It is excellent in chemical resistance, abrasion resistance, etc. and its thermal stability is not changed even if heat of about 300 ℃ is applied continuously.

Therefore, when the ETFE film is used as the outermost layer of the solar cell module and directly receives the solar heat, the ETFE film is excellent in thermal stability and light is transmitted well, thereby increasing the efficiency of the solar cell.

When using a high-strength material such as glass as the front substrate 210, it is possible to prevent the solar cell module from bending during the lamination process, it is possible to maintain excellent strength of the solar cell module.

On the other hand, when the ETFE film is used as the front substrate 210, the rear substrate 220 may supplement the strength of the solar cell module by using a high-strength material such as glass to maintain the strength of the solar cell module. .

Alternatively, the thickness of the solar cell module can be maintained by forming thicker than the rear substrate 220.

The rear substrate 220 is a member disposed on the rear of the solar cell module. Since the rear substrate 220 does not have to transmit sunlight, an opaque material may be used. For example, a plastic or PCB substrate such as FR-4 (EpoxyResin) may be used. However, a glass substrate or an ETFE film may be used, such as the front substrate 210.

The cell 130 is formed of a silicon semiconductor as a minimum unit for generating electricity. An electrode 131 is formed on one surface of the cell 130.

The wiring 111 is a member connecting the base electrode and the emitter electrode of the cell 130 to electrically connect the cells 130.

The filler 230 is disposed between the front substrate 210 and the rear substrate 220 to integrate the front substrate 210, the rear substrate 220, and internal components thereof, and serves to protect the cell 130.

As the filler 230, ethylene vinyl acetate or poly vinyl butyral may be used. In addition, other known fillers may be used.

In this step, the rear substrate 220, the wiring sheet 110b, the cell 130, the first filler 230a and the front substrate 210 are sequentially stacked to form a stacked structure.

When the wiring sheet 110b is stacked on the rear substrate 220, the wiring 111 faces the rear substrate 220 so that the wiring 111 and the electrode 131 are connected by the anisotropic conductive adhesive member 120. By laminating.

Since the wiring 111 and the electrode 131 should be connected by the anisotropic conductive adhesive member 120, the release film of the wiring sheet 110b should be removed before the cells 130 are stacked. To this end, in addition to the step of simply stacking the wiring sheet 110b on the rear substrate 220, the step of temporarily attaching the wiring sheet 110b to the rear substrate 220 may be further included.

Temporary adhesion refers to making the release film easily detach from the anisotropic conductive adhesive member by laminating the wiring sheet 110b on the rear substrate 220 and then applying pressure and heating.

At this time, the heating sheet 110b may be adhered to the rear substrate 220 by applying a pressure of approximately 0.9 MPa to 1.1 MPa under heating conditions of about 70 ° C. to 80 ° C. However, the provisional adhesion conditions may be different depending on the material of the insulating resin.

When the insulating resin of the anisotropic conductive adhesive member 120 is cured during temporary adhesion, the insulating resin is prevented from moving between the electrode 131 and the wiring 111 when laminating and stacking the cells 130 later. ) And the wiring 111 may not be electrically connected. Therefore, the temporary adhesive conditions may vary depending on the material of the insulating resin such that the insulating resin of the anisotropic conductive adhesive member 120 is not cured, and at the same time, the release film may be easily dropped.

On the other hand, before the wiring sheet 110b is laminated on the rear substrate 220, the release film adhered to one surface of the anisotropic conductive adhesive member 120 is removed to remove the release film from the rear substrate 220. ) Can be adhered to.

If the release film is removed after temporarily attaching the wiring sheet 110b to the rear substrate 220, the force is applied to the wiring sheet 110b in the process of removing the release film so that the position of the wiring sheet 110b can be moved. have. Accordingly, the wiring sheet 110b may not be positioned at the center of the rear substrate 220 and may be biased toward one side, or a portion of the wiring sheet 110b may protrude out of the rear substrate 220.

However, after removing the release film as described above, if the wiring sheet is laminated on the rear substrate, the wiring sheet does not move from the rear substrate so that the wiring sheet can be aligned at the position intended by the user on the rear substrate 220.

In addition, before the wiring sheet 110b is laminated on the rear substrate 220, the second filler 230b may be laminated on the rear substrate 220, and the wiring sheet 110b may be stacked thereon.

The second filler 230b may have the same material as the aforementioned first filler 230a.

In this case, since the second filler 230b is stacked between the wiring 111 and the rear substrate 220, the second filler 230b may protect the wiring 111 from external shock during the lamination process.

However, the step of stacking the second filler 230b may be omitted. When the second filler 230b is omitted, the amount of filler used when manufacturing the solar cell module is reduced, thereby reducing the manufacturing cost.

In addition, since the insulating resin 120a is disposed between the wiring 111 and the electrode 131 even if the second filler 230b is omitted, the cell 130 is connected to the insulating resin and the first filler 230a during the lamination process. It can be wrapped to protect the cell 130 from external impact.

After forming the laminated structure as described above, the laminated structure is laminated (Fig. 1 (c)).

In this case, in order to minimize the loss occurring in the lamination structure during the lamination process, the lamination structure may be turned upside down so that the front substrate 210 having a higher strength or a thicker thickness than the rear substrate 220 is disposed below.

However, when the rear substrate 220 is superior in strength to the front substrate 210, the laminated structure may not be inverted.

In the lamination process, the anisotropic conductive adhesive member 120 is melted so that the electrode 131 and the wiring 111 are connected and filled by the molten anisotropic conductive adhesive member 120 in the space between the electrode 131 and the wiring 111. do.

In the lamination process, the first and second fillers 230a and 230b are melted to fill a space between the front substrate 210 and the rear substrate 220.

When the lamination process is performed, the pressure applied to the laminated structure is about 0.01 MPa to 0.2 MPa when using vacuum lamination, the temperature is 140 kPa to 220 kPa, and may be performed for about 10 minutes. However, the lamination environment may be different depending on the lamination method and the material of the filler 230.

That is, when lamination is not performed in a vacuum state and the nip-roll method is adopted, the temperature and pressure conditions may be different.

In addition, in the lamination process, the anisotropic conductive adhesive member 120 is melted to electrically connect the electrode 131 and the wiring 111.

Referring to FIGS. 3A and 3B, in the lamination process, the insulating resin 120a in the gel state increases fluidity and moves to both sides of the wiring 111 to between the electrode 131 and the neighboring electrode 131. The electrode 131 and the wiring 111 are moved between the wiring 111 and the neighboring wiring 111 or between the cell 130 and the back substrate 220.

The pressure is indirectly transmitted to the conductive particles 120b by the pressure applied to the rear substrate 220. Therefore, the conductive particles 120b are compressed between the electrode 131 and the wiring 111.

The pressure applied during the lamination process causes the electrode 131 to move closely to the wiring 111. Thereby, electroconductive particle between the electrode 131 and the wiring 111 is compressed. Therefore, electrons and holes are movable between the electrode 131 and the wiring 111, and the electrode 131 and the wiring 111 are electrically connected to each other.

However, in the conductive particles 120b between the electrode 131 and the neighboring electrode 131 and between the wiring 111 and the neighboring wiring 111, the electrode 131 or the wiring 111 is not positioned at the top and the bottom thereof. Not compressed. In addition, the distance between the electrode 131 and the electrode 131 and between the wiring 111 and the wiring 111 is not close by the pressure applied in the lamination process.

Specifically, the back electrode solar cell module is pressed in the vertical direction with reference to FIG. 3 (b) and the electrodes 131 and the wiring 111 facing each other are in close contact with each other at a very close distance. On the other hand, the distance between the electrode 131 and the electrode 131 or between the wiring 111 and the wiring 111 is greater than that of the electrode 131 and the wiring 111 which are aligned in the vertical direction to correspond to each other. The insulating resin 120a is filled between 120b). Accordingly, the electrode 131 and the wiring 111 corresponding to each other are energized, and the electrode 131 and the electrode 131 and the wiring 111 and the wiring 111 are insulated from each other.

In this case, when the thickness of the insulating resin 120a is high, high pressure must be applied to electrically connect the electrode 131 and the corresponding wiring 111 by the conductive particles 120b. That is, the insulating resin surrounding the conductive particles 120b is wired with the electrode 131 in order to pressurize the conductive particles 120b to deform the shape and to contact the electrodes 131 and the wiring 111 so that a current flows. (111) It must move outward and at the same time a high pressure must be applied to press the conductive particles (120b).

However, if the pressure is increased, the pressure applied to the cell 130 is increased, which may damage the cell 130.

Therefore, since the cell 130 is not damaged and the conductive particles 120b must be pressed, when the thickness of the insulating resin 120a is less than twice the maximum diameter of the conductive particles 120b as described above, a high pressure It is possible to electrically connect the electrode 131 and the wiring 111 even without adding.

Conventionally, a conductive adhesive is printed on a portion corresponding to the electrode 131 and the wiring 111, and then a perforated insulating film is laminated so that only the electrode 131 and the wiring 111 corresponding thereto are electrically connected.

At this time, the perforated film was inconvenient to adjust the position of the perforated film so that the perforated position and the position of the wiring 111 correspond to each other. In addition, a conductive adhesive had to be applied and then an insulating perforated film had to be placed separately.

However, as described above, when the anisotropic conductive adhesive member 120 is used, the wiring 111 is formed on one surface of the anisotropic conductive adhesive member 120 in a desired pattern, and the electrode 131 is simply stacked on the other surface. Due to the nature of the anisotropic conductive adhesive member 120 itself, only the wiring 111 and the corresponding electrode 131 are electrically connected. Therefore, the trouble of having to correspond to the anisotropic conductive adhesive member 120 and the electrode 131 at the correct position and the trouble of having to stack the conductive adhesive and the insulating film, respectively, are prevented.

In addition, since the anisotropic conductive adhesive member 120 insulates the neighboring wiring 111 and the neighboring electrode 131 and electrically connects only the wiring 111 and the corresponding electrode 131, the wiring 111. In order to electrically connect only the electrode 131 to the electrode 131, a process of drilling at a position corresponding to the wiring 111 and the electrode 131 may be omitted.

Therefore, the manufacturing process of the back electrode solar cell module can be simplified.

In addition, by forming the wiring 111 on the anisotropic conductive adhesive member 120 as described above, the insulating substrate used to form the wiring 111 may not be used. Therefore, there is an effect of reducing the manufacturing cost.

Specifically, conventionally, the wiring 111 is formed on a separate insulating substrate to form the wiring 111, a conductive adhesive is printed to connect the wiring 111 and the electrode 131, and the perforated filler film is formed. After stacking, the cells 130 were stacked.

However, when the wiring sheet 110b is formed by directly forming the wiring 111 on the anisotropic conductive adhesive member 120 as described above, an insulating substrate for forming the wiring 111 may not be used.

In addition, after the wiring 111 is formed on the insulating substrate, a process of applying a separate adhesive or insulating resin for electrically connecting the electrode 131 on the wiring 111 may be omitted. Therefore, the manufacturing process is simplified and the manufacturing cost is reduced.

4 illustrates a method of manufacturing a back electrode solar cell module according to a second embodiment of the present invention sequentially.

A method of manufacturing a back electrode solar cell module according to another embodiment of the present invention includes forming a wiring board, forming a laminated structure, and laminating the laminated structure.

First, as shown in FIG. 4A, the wiring 111 is formed on one surface of the rear substrate 220 by using a photolithography method for patterning and etching copper foil on the insulating rear substrate 220. The wiring board 110a is formed. Since the technique of patterning and etching copper foil on the insulating substrate 112 is a well-known technique, detailed description is abbreviate | omitted.

Thereafter, as shown in FIG. 4B, the anisotropic conductive adhesive member 120 is coated on the wiring 111, and the cells 130 are stacked thereon.

As described above, the anisotropically conductive adhesive member 120 is a member in which conductive particles are distributed in the insulating resin and insulated in one direction and energized in the other direction.

The anisotropic conductive adhesive member 120 may be an anisotropic conductive film or an anisotropic conductive adhesive.

When the anisotropic conductive adhesive member 120 is an anisotropic conductive film, the anisotropic conductive adhesive member 120 is temporarily bonded to the wiring 111. The provisional adhesion method may be the same as the first embodiment described above.

In this case, the anisotropic conductive film may be temporarily attached to the wiring 111, but alternatively, the anisotropic conductive film may be temporarily attached to the cell 130.

However, if the anisotropic conductive film is temporarily bonded to the cell 130, there is a risk that the cell 130 is damaged when pressure is applied to the cell 130 for temporary adhesion.

Therefore, when the anisotropic conductive adhesive member 120 is an anisotropic conductive film, it is preferable to temporarily attach to the back substrate 220 having a higher strength than the cell 130.

When the anisotropic conductive adhesive member 120 is an anisotropic conductive adhesive, it may be coated by coating it on one surface of the cell 130 in which the wiring 111 or the electrode 131 is formed.

When the anisotropic conductive adhesive is coated on the wiring 111, the insulating resin 120a may move to both sides of the wiring 111 before laminating the cell 130 on the anisotropic conductive adhesive or laminating the laminated structure.

The wiring 111 is formed to protrude upward from one surface of the rear substrate 220. The insulating resin of the anisotropic conductive adhesive is a member having fluidity in a gel state. Therefore, there is a fear that the insulating resin moves from the corners of the wiring 111 to the rear substrate 220. In this case, the electrode 131 and the wiring 111 may not be adhered to each other, or the cell 130 may be damaged due to insufficient insulating resin serving as a filler in the lower portion of the cell 130 during the lamination process.

On the other hand, the height of the electrode 131 is generally lower than that of the wiring 111. Therefore, even if the anisotropic conductive adhesive is applied to one surface of the cell 130, the anisotropic conductive adhesive is relatively less likely to move to the one surface of the cell 130 in which the electrode 131 is not formed at the corner of the electrode 131.

Therefore, when the anisotropic conductive adhesive member 120 is a liquid adhesive, it is preferable to coat the cell 130 rather than the wiring 111.

The thickness of the insulating resin of the anisotropic conductive adhesive member 120 according to the second embodiment may be the same as the conditions of the thickness of the insulating resin of the first embodiment described above. That is, the thickness of insulating resin may be formed thicker than the average diameter of electroconductive particle, and smaller than twice the maximum diameter of electroconductive particle.

Thereafter, as shown in FIG. 4C, the laminated structure is laminated to electrically connect the wiring 111 and the electrode 131.

In order to minimize the degree of damage of the solar cell module when the lamination, the position of the laminated structure is readjusted so that a high-strength substrate is positioned below the front substrate 210 and the rear substrate 220.

That is, when forming the laminated structure, the rear substrate 220 is laminated so as to be lower, but if the front substrate 210 has a higher strength than the rear substrate 220, the step of inverting the laminated structure before the lamination process may be further included. .

In the lamination process, the anisotropic conductive adhesive member 120 is melted, and the electrode 131 and the corresponding wiring 111 are electrically connected by conductive particles disposed therebetween, and the electrode 131 and the adjacent electrode ( 131 and the wiring 111 and the adjacent wiring 111 are insulated by the insulating resin filled therebetween.

In addition, the insulating resin bonds the electrode 131 and the wiring 111 and at the same time is filled between the cell 130 and the back substrate 220 to serve as a filler to protect the cell 130 in the lamination process.

In the lamination process, the first filler 230a is melted and filled between the front substrate 210 and the rear substrate 220 to protect the cell 130.

In the back electrode solar cell module according to the second embodiment, the wiring 111 is formed on the back substrate 220. Therefore, even if the release film adhered to one surface of the anisotropic conductive adhesive member 120 is removed, the wiring 111 does not move on the rear substrate 220. Accordingly, compared to the first embodiment in which the wiring 111 is simply stacked on the rear substrate 220, the position control of the wiring 111 may be easily performed.

In addition, since the wiring 111 is not formed on the anisotropic conductive adhesive member 120, the anisotropic conductive adhesive in addition to the anisotropic conductive film can be used as the anisotropic conductive adhesive member 120.

5 is a flowchart illustrating a method of manufacturing a back electrode solar cell module according to a third embodiment of the present invention.

A method of manufacturing a back electrode solar cell module according to a third embodiment includes forming a wiring board, forming a stacked structure, and laminating the stacked structure.

Forming and laminating the laminated structure according to the third embodiment is the same process as the forming and laminating step according to the second embodiment described above and the duplicated description is omitted.

In the step of forming the wiring board, first, the copper foil is laminated and patterned on the auxiliary substrate 112 having an insulating property to form the wiring 111.

The forming of the wiring 111 on the auxiliary substrate 112 may be performed in the same manner as the forming of the wiring 111 on the rear substrate 220 in the above-described second embodiment. That is, the wiring 111 is formed using a known photolithography method or the like.

Thereafter, the auxiliary substrate 112 on which the wiring 111 is formed is laminated on the rear substrate 220. At this time, the auxiliary substrate 112 is laminated to face the rear substrate 220 so that the wiring 111 can be connected to the electrode 131 by the anisotropic conductive adhesive member 120.

In this case, the second filler 230b may be stacked between the auxiliary substrate 112 and the back electrode 131.

In the case of laminating the second filler 230b on the back substrate 220, the second filler 230b and the first filler 230a are melted in the lamination process to form the auxiliary substrate 112 and the cell 130. By enclosing the outside of the wire, the wiring 111 and the cell 130 can be easily protected from external pressure.

6 shows a back electrode solar cell module according to a first embodiment of the present invention.

The back electrode solar cell module according to the first embodiment of the present invention includes a front substrate 210, a rear substrate 220, a cell 130, a wiring 111, an anisotropic conductive adhesive member 120, and a filler 230. It includes.

In the back electrode solar cell module according to the first embodiment, the filler 230 is filled between the front substrate 210 and the rear substrate 220.

The filler 230 surrounds the cell 130 and the wiring 111 and protects the cell 130 from external impact.

The electrode 131 and the wiring 111 of the cell 130 are electrically connected by the anisotropic conductive adhesive member 120 under the cell 130.

In this case, the anisotropic conductive adhesive member 120 electrically connects the wiring 111 and the electrode 131, and the wiring 111 adjacent to the wiring 111 and the electrode 131 adjacent to the electrode 131. Is insulated, and the insulating resin is melted in the lamination process to serve as a filler and to serve as a substrate for forming the wiring 111.

Therefore, since a separate insulating substrate for forming the wiring 111 may not be used, the manufacturing cost may be reduced.

7 shows a back electrode solar cell module according to a second embodiment of the present invention.

The back electrode solar cell module according to the second embodiment includes a back substrate 220, a front substrate 210, a wiring 111, an anisotropic conductive adhesive member 120, a cell 130, and a filler 230. .

The back electrode solar cell module according to the second embodiment is characterized in that the wiring 111 is formed on the back substrate 220.

In the above case, the rear substrate 220 serves to protect the solar cell module as the outermost substrate of the solar cell module and at the same time serves as the wiring substrate 110a in which the wiring 111 is formed. The wiring board 110a for forming can be omitted.

Therefore, the manufacturing cost is reduced.

In addition, since the filler 230 is not disposed between the wiring 111 and the rear substrate 220, the wiring 111 does not move based on the rear substrate 220 in the lamination process, so that The defective rate will be lowered.

8 shows a back electrode solar cell module according to a third embodiment of the present invention.

The back electrode solar cell module according to the third embodiment includes a back substrate 220, a front substrate 210, an auxiliary substrate 112, a wiring 111, an anisotropic conductive adhesive member 120, a cell 130, and a filler. 230.

In the back electrode type solar cell module according to the third embodiment, the wiring 111 is formed on the auxiliary substrate 112, and the filler 230 is disposed between the auxiliary substrate 112 and the back electrode 131. Since the wiring 111 is disposed on the auxiliary substrate 112 and is surrounded by the filler 230, even if an impact is applied from the outside, the filler may function as a buffer to reduce the risk of damage to the wiring 111 and the cell 130. do.

In the above, preferred embodiments of the present invention have been described in detail. The present invention uses an anisotropic conductive adhesive member to electrically connect the electrode and the wiring.

The electrode and the wiring are electrically connected by the conductive particles distributed in the insulating resin of the anisotropic conductive adhesive member, and the electrode and the wiring adjacent to the electrode and the wiring and the wiring adjacent are insulated by the insulating resin filled therebetween.

Therefore, in order to electrically connect only the electrode and the corresponding wiring, the step of applying a conductive adhesive to the wiring and laminating an insulating film perforated at a position corresponding to the conductive adhesive may be omitted.

That is, in the prior art, the conductive adhesive and the insulating film were respectively laminated, and when laminating them, the position was to be precisely controlled to be energized in the vertical direction and insulated in the horizontal direction. As in the embodiments of the present invention, the anisotropic conductive adhesive member In the case of using, the electrode 131 and the corresponding wiring 111 are electrically connected to each other even by simply coating or temporarily attaching the anisotropic conductive adhesive member to the wiring or the cell by the property of the anisotropic conductive adhesive member.

Therefore, there is an effect that the manufacturing process is simplified and easy.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, And falls within the scope of the invention.

110a: wiring board
111: wiring 112: auxiliary substrate
110b: Wiring sheet
120: anisotropic conductive adhesive member
120a: insulating resin 120b: electroconductive particle
130: cell
131: electrode
210: front substrate 220: rear substrate
230: filler
230a: first filler 230b: second filler

Claims (19)

Forming a wiring sheet having wiring formed on the other surface of the anisotropic conductive adhesive member having a release film adhered to one surface thereof,
Forming a laminated structure by laminating a back substrate, the wiring sheet, a cell in which an electrode is formed, a first filler and a front substrate, and
Laminating the laminated structure to melt the first filler and the anisotropic conductive adhesive member to electrically connect the electrode and the wiring.
Including;
Forming the laminated structure,
Removing the release film from the wiring sheet;
Stacking the wiring sheet on the rear substrate;
Stacking the cell, the first filler, and the front substrate on the wiring sheet;
Back electrode type solar cell module manufacturing method comprising a. In claim 1,
Forming the wiring sheet
Coating an insulating resin having conductive particles distributed on the release film;
Laminating copper foil on the insulating resin, and
Patterning the copper foil to form wiring
Back electrode type solar cell module manufacturing method comprising a. In claim 1,
Forming the wiring sheet
Coating an insulating resin having conductive particles on the copper foil,
Temporarily bonding the release film to the insulating resin, and
Patterning the copper foil to form wiring
Back electrode type solar cell module manufacturing method comprising a. In claim 1,
In the step of forming the wiring sheet,
In the anisotropic conductive adhesive member, conductive particles are distributed in an insulating resin,
The thickness of the insulating resin is a back electrode type solar cell module manufacturing method to be formed larger than the average diameter of the conductive particles. In claim 1,
In the step of forming the wiring sheet,
In the anisotropic conductive adhesive member, conductive particles are distributed in an insulating resin,
The thickness of the insulating resin is less than twice the maximum diameter of the conductive particles, the back electrode type solar cell module manufacturing method. delete In claim 1,
In the step of forming the laminated structure
Laminating a second filler on the back substrate, and further comprising the step of laminating the wiring sheet on the second filler material. A back electrode solar cell module manufactured by the manufacturing method according to any one of claims 1 to 5 and 7. 9. The method of claim 8,
The anisotropic conductive adhesive member is a back electrode type solar cell module comprising any one of an epoxy resin, an acrylic resin or vinyl acetate ethylene (Vinyl Acetate-Ethylene). 9. The method of claim 8,
The front substrate or the back substrate is ethylene tetra fluorine (Ethylene Tetra Fluoro Ethylene) back electrode type solar cell module. delete delete delete delete delete delete delete delete delete

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