CN205789967U

CN205789967U - Full integrated chip upside-down mounting AC LED light source module

Info

Publication number: CN205789967U
Application number: CN201620625705.7U
Authority: CN
Inventors: 杨华进
Original assignee: SHENZHEN HONGRI PHOTOELECTRIC Co Ltd
Current assignee: SHENZHEN HONGRI PHOTOELECTRIC Co Ltd
Priority date: 2016-06-22
Filing date: 2016-06-22
Publication date: 2016-12-07
Anticipated expiration: 2026-06-22

Abstract

The utility model discloses a kind of full integrated chip upside-down mounting AC LED light source module, including lens, LED chip group, up-conversion luminescent material and substrate, wherein LED chip group is in series by multiple LED chip；Be covered with lens respectively in described each LED chip, these lens can be hemispherical and and substrate between formed one close containing cavity；Being filled with up-conversion luminescent material in described containing cavity, the exiting surface of LED chip is completely covered by this up-conversion luminescent material.This utility model has that volume is little, good illumination effect, length in service life, low cost and other advantages, and compared with common LED chip, whole chip area may serve to luminescence, adds the luminous efficiency of unit are；Full integrated chip AC LED light source only includes a substrate being provided with area source, no longer has other independent power control part, reduces the volume of LED light source, makes postorder easy to assembly, and enclosure designs is the simplest, and cost is greatly reduced.

Description

Full integrated chip upside-down mounting AC-LED light source module

Technical field

This utility model relates to technical field of LED illumination, particularly to one full integrated chip upside-down mounting AC-LED light source die Block.

Background technology

LED light source develops rapidly as green, energy-conservation, power saving, long-life forth generation lighting.At present, LED 90% is alreadyd more than in the application permeability of field of liquid crystal panel display as backlight.Backlight source module framework mainly has side to enter Formula and straight-down negative two kinds, side entering-type LED backlight is the side that LED light source is arranged on light guide plate, and the light that LED sends is by coupling Enter light guide plate, by reflector plate, the reflection of site and scattering by light-output, this have the disadvantage that formed picture pair More relatively poor than degree, it is not available for local dimming；Direct-light type LED backlight is then to present image more accurately, and shows outstanding Color and comparison of light and shade effect and be increasingly becoming the main trend in market, the LED distribution density of existing direct-light-type backlight is little, The distance of the crosslights between LED light source is big, for the light utilizing LED to send, may result in the thickness of backlight module relatively Greatly, it is difficult to realize ultrathin.

Utility model content

One of technical problem that this utility model is intended to solve in correlation technique the most to a certain extent.To this end, this reality It is to provide a kind of full integrated chip upside-down mounting AC-LED light source module by novel main purpose, it is intended to improve sending out of LED chip Light efficiency.

For achieving the above object, this utility model provides a kind of full integrated chip upside-down mounting AC-LED light source module, including thoroughly Mirror, LED chip group, up-conversion luminescent material and substrate, wherein LED chip group is in series by multiple LED chip；Described each Be covered with lens in LED chip respectively, these lens can be hemispherical and and substrate between formed one close containing cavity；Described Being filled with up-conversion luminescent material in containing cavity, the exiting surface of LED chip is completely covered by this up-conversion luminescent material.

Preferably, described upper surface of base plate is provided with one layer for the silver slurry layer fixing LED chip and lens.

Preferably, described LED chip is provided with the first electrode and the second electrode, wherein the first electrode and the end of the second electrode It is coated with one layer of gold-tin alloy layer；First electrode of described LED chip and the second electrode utilize eutectic metal by flip chip bonding Mode is integrated with substrate.

Preferably, the material of described lens is glass, silica gel, macromolecule transparent plastic or epoxy resin.

Preferably, described LED chip group is in series by 3～200 LED chip, and wherein LED chip is nitridation gallio LED chip.

This utility model has that volume is little, good illumination effect, length in service life, low cost and other advantages, with common LED core Sheet is compared, and whole chip area may serve to luminescence, adds the luminous efficiency of unit are；Full integrated chip AC-LED light Source only includes a substrate being provided with area source, no longer has other independent power control part, reduces the body of LED light source Long-pending, make postorder easy to assembly, enclosure designs is the simplest, and cost is greatly reduced.

Accompanying drawing explanation

In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, below will be to embodiment Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, the accompanying drawing in describing below is only It is embodiments more of the present utility model, for those of ordinary skill in the art, in the premise not paying creative work Under, it is also possible to other accompanying drawing is obtained according to the structure shown in these accompanying drawings.

Fig. 1 is structural representation of the present utility model；

Fig. 2 is structure enlarged diagram at A shown in Fig. 1.

Drawing reference numeral illustrates:

Label	Title	Label	Title
				10	Lens	30	Up-conversion luminescent material
20	LED chip group	40	Substrate
				201	LED chip	50	First gold-tin alloy layer
2011	LED chip the first electrode	60	Second gold-tin alloy layer
				2012	LED chip the second electrode	70	Silver slurry layer

Detailed description of the invention

Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the present utility model rather than all Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not making creative work premise Lower obtained every other embodiment, broadly falls into the scope of this utility model protection.

It is to be appreciated that directional instruction (such as up, down, left, right, before and after ...) in this utility model embodiment It is only used for explanation relative position relation under a certain particular pose (as shown in drawings) between each parts, motion conditions etc., as When really this particular pose changes, then directionality instruction changes the most therewith.

In this utility model such as relating to the description of " first ", " second " etc. be only used for describe purpose, and it is not intended that Indicate or imply its relative importance or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", The feature of " second " can express or implicitly include at least one this feature.In description of the present utility model, " multiple " It is meant that at least two, such as two, three etc., unless otherwise expressly limited specifically.

In this utility model, unless otherwise clearly defined and limited, term " connects ", " fixing " etc. should do broad sense reason Solving, such as, " fixing " can be fixing connection, it is also possible to is to removably connect, or integral；Can be to be mechanically connected, it is possible to To be electrical connection；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, can be the connection of two element internals Or the interaction relationship of two elements, unless otherwise clear and definite restriction.For the ordinary skill in the art, permissible Understand above-mentioned term concrete meaning in this utility model as the case may be.

It addition, the technical scheme between each embodiment of this utility model can be combined with each other, but must be with ability Based on territory those of ordinary skill is capable of, when technical scheme combination occur conflicting maybe cannot realize time will be understood that The combination of this technical scheme does not exists, the most not within the protection domain that this utility model requires.

The utility model proposes a kind of full integrated chip upside-down mounting AC-LED light source module.

Incorporated by reference to reference to Fig. 1, Fig. 2, a kind of full integrated chip upside-down mounting AC-LED light source module, including lens 10, LED chip Group 20, up-conversion luminescent material 30 and substrate 40, wherein LED chip group 20 is in series by 3～200 LED chip 201, its Middle LED chip 201 is galliumnitride base LED chip；Being covered with lens 10 respectively in each LED chip 201, these lens 10 can be half Spherical, and and substrate 40 between formed one close containing cavity；Up-conversion luminescent material 30 it is filled with, on this turn in containing cavity Change luminescent material 30 to be completely covered by the exiting surface of LED chip 201.

In this utility model, the material of lens 10 can be glass, silica gel, macromolecule transparent plastic or epoxy resin；Upper turn Change the compound that luminescent material 30 is doping with rare-earth ions, mainly have fluoride, oxide, sulfur-containing compound, oxyfluoride, halogen Compound etc..NaYF4 is the host material that current up-conversion luminescence efficiency is the highest, such as NaYF4:Er, Yb, when i.e. ytterbium erbium is double-doped, Er does activator, and Yb is as sensitizer.

Substrate 40 upper surface is provided with one layer for the silver slurry layer 70 fixing LED chip 201 and lens 10；LED chip 201 sets Having the first electrode 2011 and the second electrode 2012, wherein the first electrode 2011 is coated with the first gold-tin alloy layer 50, the second electrode The end coated second layer gold-tin alloy layer 60 of 2012；First electrode 2011 of described LED chip 201 and the second electrode 2012 profit With eutectic metal by the way of flip chip bonding integrated with substrate 40, wherein, the first electrode 2011 of LED chip 201 and the second electricity Contact with substrate 40 bottom pole 2012, so that the first gold-tin alloy layer 50 and second layer gold-tin alloy layer 60 plate as contact surface Layer, when substrate 40 is heated to the eutectic temperature being suitable for, the silver element of the silver slurry layer 70 on substrate 40 penetrates into the first gold medal stannum In alloy-layer 50 and second layer gold-tin alloy layer 60, solidified by Eutectic Layer and crystal grain be welded on the silver slurry layer 70 of substrate 40.

Further, LED chip 201 uses reverse installation process to have a three advantages: the first, lower chip thermal resistance, Ke Yishi The best conduction of heat, can reduce junction temperature, thus improve efficiency and life-span, reduces thermal resistance.The second, more preferable chip takes light, electricity Flow distribution is uniform, preferably injects；The back side is not blocked, and can carry out the coating of fluorescent material and the extraction of light, can do surface Image conversion, promotes further and takes light.3rd, without gold thread, gold thread rosin joint, resistance to big current capacity deficiency, packaging silicon rubber are improved Expand with heat and contract with cold and cause gold thread in gold thread fracture, processing procedure to affect the problems such as yield, improve the stability of whole module.

The foregoing is only preferred embodiment of the present utility model, not thereby limit the scope of the claims of the present utility model, Every under inventive concept of the present utility model, the equivalent structure utilizing this utility model description and accompanying drawing content to be made becomes Change, or directly/be indirectly used in other relevant technical fields and be included in scope of patent protection of the present utility model.

Claims

1. a full integrated chip upside-down mounting AC-LED light source module, including lens, LED chip group, up-conversion luminescent material and base Plate, wherein LED chip group is in series by multiple LED chip；It is characterized in that, described LED chip is covered with lens respectively, These lens be hemispherical and and substrate between formed one close containing cavity；Up-conversion luminescence material it is filled with in described containing cavity Material, the exiting surface of LED chip is completely covered by this up-conversion luminescent material.

Full integrated chip upside-down mounting AC-LED light source module the most according to claim 1, it is characterised in that table on described substrate Face is provided with one layer for the silver slurry layer fixing LED chip and lens.

Full integrated chip upside-down mounting AC-LED light source module the most according to claim 1, it is characterised in that described LED chip Being provided with the first electrode and the second electrode, wherein the end coated of the first electrode and the second electrode has one layer of gold-tin alloy layer；Described First electrode of LED chip and the second electrode utilize eutectic metal integrated with substrate by the way of flip chip bonding.

Full integrated chip upside-down mounting AC-LED light source module the most according to claim 1, it is characterised in that the material of described lens Matter is glass, silica gel, macromolecule transparent plastic or epoxy resin.

Full integrated chip upside-down mounting AC-LED light source module the most according to claim 1, it is characterised in that described LED chip Group is in series by 3～200 LED chip, and wherein LED chip is galliumnitride base LED chip.