CN205789949U - A kind of lead frame being applicable to back bonding chip - Google Patents
A kind of lead frame being applicable to back bonding chip Download PDFInfo
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- CN205789949U CN205789949U CN201620502837.0U CN201620502837U CN205789949U CN 205789949 U CN205789949 U CN 205789949U CN 201620502837 U CN201620502837 U CN 201620502837U CN 205789949 U CN205789949 U CN 205789949U
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- lead frame
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Abstract
The utility model discloses a kind of lead frame being applicable to back bonding chip.This lead frame, including bonding pin, slide holder and crystal pins welding region, wherein, bonding pin extends in chip area, and with pressure point one_to_one corresponding in chip to be bonded.It is evenly distributed with columns through hole on slide holder, and this columns through hole is for strengthening the adhesion strength of chip and lead frame, and the deformation produced when reducing lead frame solidification.This utility model carries out back bonding encapsulation, enhance the bond strength of lead frame and chip, reduce the pin deformation caused because of gold thread bonding and chip bonding die, thus avoid the warpage of lead frame configuration, chip is made preferably to fix on the lead frames, and reduce integral thickness, it is simple to following process.
Description
Technical field
This utility model belongs to field of semiconductor package, particularly relates to a kind of lead frame being applicable to back bonding chip.
Background technology
Lead frame is as the chip carrier of integrated circuit, it it is a kind of electrical connection realizing chip internal circuits exit and outer pin by means of bonding medium, form the key structure part of electric loop, it serves the function served as bridge connected with outer lead, major part integrated antenna package form is required for using lead frame, is base components important in electronics and information industry.
In prior art, as shown in Fig. 1, for lead frame local unit structure, for a kind of lead frame coordinating chip package for columnar crystal oscillator, including multiple bonding pins and slide holder, the bonding pin of slide holder side is crystal oscillator pin weld, and slide holder is in order to chip placement and crystal oscillator, and the both sides of slide holder are that gold thread is bonded pin.
As shown in Fig. 2, for the lead frame machining sketch chart of prior art, for the processing of the lead frame of columnar crystal oscillator encapsulation, including crystal, chip and bonding gold thread；Each bonding point needs to carry out die terminals, twice bonding of leads ends, and wherein leads ends bonding steps is easier to make to be partially in the lead frame generation warpage of vacant state, causes later process processing difficulties.
In existing technique, using gold thread bonding, due to the radian of gold thread between twice bonding, cause packaging body thickness relatively big, application is limited, and, in the course of processing, gold thread arc is the most fragile, and the transmission of inter process and displacement will be inefficient through special handling.Meanwhile, using gold thread bonding relatively costly, gold thread accounts for more than the 30% of overall package cost.After welding crystal, lead frame can occur slight deformation, chip is in slide holder bonding die engineering, owing to bonding die glue can only flow at slide holder region inner plane, chip can be caused after solidification again to deform upon with lead frame plane, after above-mentioned deformation superposition, gold thread bonding technology is had no significant effect, but flip chip bonding process can thereby result in bigger yield loss and bonding rosin joint hidden danger.
Summary of the invention
The deficiency existed for prior art, the utility model proposes a kind of lead frame being applicable to flip-chip bonding.
In order to solve above-mentioned technical problem, this utility model adopts the following technical scheme that:
A kind of lead frame, including bonding pin, slide holder and crystal pins welding region, wherein, described bonding pin extends in chip area, and with pressure point one_to_one corresponding in chip to be bonded；
It is evenly distributed with columns through hole on described slide holder, and this columns through hole is for strengthening the adhesion strength of chip and lead frame, and the deformation produced when reducing lead frame solidification.
Preferably, in described lead frame, described slide holder is positioned at lead frame center, and area is 5.5mm × 1.5mm, and surface carries out silver-plated process, is bonded pin insulation with each.
Preferably, in described lead frame, described columns through hole is more than three, each columns via area is 0.1mm × 0.8mm, and columns through-hole spacing is from for 0.5mm, columns through hole gap becomes arranged vertically with slide glass director limit, and columns through hole Distances Between Neighboring Edge Points is 0.5mm.
Compared with prior art, this utility model has the advantage that
This utility model is by changing slide holder area, increasing slide holder columns through hole and bonding Pin locations, shape, it is applicable to back bonding chip package, avoid using gold thread bonding, decrease the welding times of each bonding pin, thus avoid the yield loss that lead frame generation type becomes.Reduce the thickness of packaging body so that application is wider, and production efficiency is higher, and cost is lower simultaneously.
The utility model is described in further detail with detailed description of the invention below in conjunction with the accompanying drawings.
Accompanying drawing explanation
Fig. 1 is the lead frame overall structure figure for columnar crystal oscillator encapsulation of prior art.
Fig. 2 is that the lead frame for columnar crystal oscillator encapsulation of prior art produces schematic diagram.
Fig. 3 is this utility model lead frame overall structure figure.
Fig. 4 is the production schematic diagram of this utility model lead frame.
Detailed description of the invention
As shown in Fig. 3, for the overall structure figure of this utility model lead frame；Including multiple bonding pins and slide holder, slide holder is evenly distributed with columns through hole, and the bonding pin of slide holder side is crystal oscillator pin welding region, and slide holder is in order to chip placement and crystal oscillator, and the both sides of slide holder are bonding pin.Bonding pin, by scolding tin or the electrical connection that completes crystal oscillator and lead frame by the way of pressing butt-joint, completes the electrical connection of chip and lead frame by the way of gold ball bond, and chip and crystal oscillator is also to be electrically connected with external circuit by lead frame.
As shown in Fig. 4, for the production schematic diagram of this utility model lead frame；Wherein, flip-chip packaged is carried out with pressure point one_to_one corresponding in chip, use gold goal in bonding pin extends into chip area, each bonding point only needs once to be bonded, and gold goal is between chip and lead frame, the most almost can ignore, packaging body thickness is substantially reduced.The relatively gold thread of gold goal used by back bonding bonding reduces a lot, and the more original technique of packaging cost declines 15%.
Slide holder contained by this utility model, centre is uniformly distributed through hole, can strengthen bonding die glue contact area, promote bonding die intensity in the case of slide holder area reduces.Making bonding die glue can pass through flow therethrough, after solidification, the change of chip flatness is less, thus avoids back bonding point impaired simultaneously.Lead frame can use the iron-nickel alloy of conduction and copper master alloy to prepare, and uses the C194 copper alloy that cost performance is high, electrical and thermal conductivity performance is excellent in being originally embodied as.
Above are only specific embodiment of the utility model; those of ordinary skill in the art can have many deformation and change on the basis of without departing from this utility model technical thought, and these technical schemes obviously formed are also contained in the technical scope of this utility model protection.
Claims (3)
1. a lead frame, including bonding pin, slide holder and crystal pins welding region, it is characterised in that described bonding pin extends in chip area, and with pressure point one_to_one corresponding in chip to be bonded；
It is evenly distributed with columns through hole on described slide holder, and this columns through hole is for strengthening the adhesion strength of chip and lead frame, and the deformation produced when reducing lead frame solidification.
2. according to the lead frame described in claim 1, it is characterised in that:
Described slide holder is positioned at lead frame center, and area is 5.5mm × 1.5mm, and surface carries out silver-plated process, is bonded pin insulation with each.
3. according to the lead frame described in claim 1 or 2, it is characterised in that:
Described columns through hole is multiple, and each columns via area is 0.1mm × 0.8mm, and columns through-hole spacing is from for 0.5mm, and columns through hole gap becomes arranged vertically with slide glass director limit, and columns through hole Distances Between Neighboring Edge Points is 0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620502837.0U CN205789949U (en) | 2016-05-30 | 2016-05-30 | A kind of lead frame being applicable to back bonding chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620502837.0U CN205789949U (en) | 2016-05-30 | 2016-05-30 | A kind of lead frame being applicable to back bonding chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205789949U true CN205789949U (en) | 2016-12-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620502837.0U Active CN205789949U (en) | 2016-05-30 | 2016-05-30 | A kind of lead frame being applicable to back bonding chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205789949U (en) |
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2016
- 2016-05-30 CN CN201620502837.0U patent/CN205789949U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |