CN205755222U - A kind of heat abstractor of high power digital circuit plate - Google Patents
A kind of heat abstractor of high power digital circuit plate Download PDFInfo
- Publication number
- CN205755222U CN205755222U CN201620439084.3U CN201620439084U CN205755222U CN 205755222 U CN205755222 U CN 205755222U CN 201620439084 U CN201620439084 U CN 201620439084U CN 205755222 U CN205755222 U CN 205755222U
- Authority
- CN
- China
- Prior art keywords
- high power
- digital circuit
- circuit plate
- power digital
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
This utility model belongs to circuit field of radiating, it is specifically related to the heat abstractor of a kind of high power digital circuit plate, the heat abstractor of described high power digital circuit plate, it is made up of electronic cabinet and high power digital circuit plate, high power digital circuit plate structure includes heat sink, heat conductive pad, circuit printing plate, components and parts are installed and is installed by the fixing locking of screw, the design of such structure improves the thermal environment dependability of high power digital circuit plate in inertial navigation system, and reduces the heating of high power digital circuit plate and cause the loss of significance of temperature sensor in system；By the design of heat conductive pad, the heat of the heater members (components and parts) on circuit board is transmitted on system chassis, prevents the infringement that heater members causes because being in the condition of high temperature for a long time, and reduce the temperature rise of internal system.
Description
Technical field
This utility model belongs to circuit field of radiating, is specifically related to the heat abstractor of a kind of high power digital circuit plate.
Background technology
Along with the development of science and technology, Military Electronic Equipment functionally presents multi-functional, the feature of high processing rate,
And require structural volume miniaturization, lightweight quantization.This necessarily brings the function electricity installed in electronic equipment
Road power consumption constantly rises and contradiction that physical dimension strictly limits.Equally, at supersonic speed, hypersonic missile
In electronic equipment in, high-performance, high power consumption functional circuit application more and more universal.Inertial navigation system
As control equipment particularly important in this kind of guided missile, the calorifics reliability of its high power digital circuit directly affects and is
The navigation accuracy of system, the operational performance even concerning whole guided missile is good and bad.Therefore, rational system calorifics sets
Meter, the cooling measure that high power digital circuit plate is taked, there is decisive significance in a way.Inertial navigation
It is the more commonly used that circuit board in system coordinates case guide rail (slot) fixing by T-shaped piece of locking device
A kind of version.It has solid and reliable, simple to operate, dismount the features such as rapid, easy to maintenance, should
With extremely wide.Therefore, for this kind of version, the heat radiation dress of a kind of high power digital circuit plate of utility model
Put and there is a certain degree of universal meaning.
Summary of the invention
This utility model provides the heat abstractor of a kind of high power digital circuit plate, improves Gao Gong in inertial navigation system
The thermal environment dependability of consumption circuit board, and reduce the heating of high power digital circuit plate and cause in system temperature sensitive
The loss of significance of device.
In order to realize this purpose, this utility model adopts the technical scheme that:
The heat abstractor of a kind of high power digital circuit plate, is made up of electronic cabinet and high power digital circuit plate, electronic machine
Case internal side wall is provided with case guide rail, and high power digital circuit plate side is located in case guide rail, also includes T-shaped piece
Locking device, high power digital circuit plate is locked by it, and described high power digital circuit plate includes heat sink, heat conduction
Pad, circuit printing plate and some high power components and parts；Described high power components and parts are located at circuit printing plate
Wherein side plate face on, high power components and parts are connected with heat sink by heat conductive pad；The limit of described heat sink
Edge and case guide rail compact siro spinning technology；Another lateral plates of circuit printing plate is provided with screw, and circuit is printed by screw
Making sheet is fastenedly connected with heat sink, compresses heat sink and high power components and parts simultaneously.
The heat abstractor of a kind of high power digital circuit plate, described heat sink is provided with convex for contact with heat conductive pad
Platform.
The heat abstractor of a kind of high power digital circuit plate, described high power components and parts 8 quantity is 3～5.
The heat abstractor of a kind of high power digital circuit plate, described heat sink is provided with debugging window.
The heat abstractor of a kind of high power digital circuit plate, described heat sink is smooth with the connection surface of case guide rail.
The heat abstractor of a kind of high power digital circuit plate, the boss on described heat sink contacts with heat conductive pad, and it connects
Touch smooth surface.
The beneficial effects of the utility model are:
The board structure of circuit of this utility model design includes heat sink, heat conductive pad, circuit printing plate, by unit's device
Part is installed and is installed by the fixing locking of screw, and the design of such structure improves high power consumption in inertial navigation system
The thermal environment dependability of circuit board, and reduce high power digital circuit plate heating cause temperature sensing device in system
The loss of significance of part；
By the design of heat conductive pad, the heat of the heater members (components and parts) on circuit board is transmitted to System Computer
On case, prevent the infringement that heater members causes because being in the condition of high temperature for a long time, and reduce internal system
Temperature rise.
At heat sink design debugging window, it is simple to the veneer function debugging of high power digital circuit plate, and human users.
Accompanying drawing explanation
The heat abstractor pie graph of Fig. 1 height power digital circuit plate
The heat radiation schematic diagram (phantom) of the heat abstractor of Fig. 2 height power digital circuit plate
Fig. 3 height power digital circuit plate outline drawing (front)
Fig. 4 height power digital circuit plate outline drawing (back side)
Fig. 5 height power digital circuit intralaminar part heat radiation schematic diagram (sectional view)
In figure: 1, electronic cabinet；2, case guide rail；3, T-shaped piece of locking device；4, high power digital circuit plate；
5, heat sink；6, heat conductive pad；7, circuit printing plate；8, high power components and parts；9, screw；10, adjust
Examination window；11, electric connector.
Detailed description of the invention
Below in conjunction with the accompanying drawings and specific embodiment to this utility model describe in detail.
The present embodiment is as follows:
As it is shown in figure 1, this heat abstractor is made up of electronic cabinet 1 and high power digital circuit plate 4.Electronic cabinet 1
Internal side wall fixed installation case guide rail 2, high power digital circuit plate 4 side is arranged in case guide rail 2, then leads to
Cross T-shaped piece of locking device 3 to be locked.This mounting means easy accessibility, firm and reliable connection.
As shown in Fig. 2, Fig. 3, Fig. 4 and Fig. 5, the high power digital circuit plate 4 in the application include heat sink 5,
Heat conductive pad 6, circuit printing plate 7 and high power components and parts 8.
High power components and parts 8 have several, are typically chosen 3～5, are arranged in circuit printing plate 7 its
On middle side plate face, in Fig. 2, arrow is the schematic diagram of heat conduction condition, and high power components and parts 8 are by leading
Heat pad 6 is connected with heat sink 5, accurately control heat conductive pad 6 decrement thus control high power components and parts 8 and
The contact pressure of heat sink 5, heat sink 5 is provided with the boss for contacting with heat conductive pad 6, improves and dissipates
The surface smoothness on the boss on hot plate 5 and heat conductive pad 6 composition surface is to reduce the thermal resistance of conduction of heat, and raising is led
The thermal efficiency.
As in figure 2 it is shown, heat sink 5 edge and case guide rail 2 compact siro spinning technology, improve and connect the bright and clean of its contacting surface
Degree, to reduce thermal resistance, makes the heat sidewall being transmitted to electronic cabinet 1 as much as possible of high power circuit plate 4
On.
A screw 9 is installed in another lateral plates of circuit printing plate 7, both can play compression heat sink 5 with
The effect of high power components and parts 8, can make again circuit printing plate 7 be fastenedly connected with heat sink 5, improve
The rigidity of high power digital circuit plate 4, thus strengthen its mechanical environment adaptability.For convenience of high power digital circuit plate 4
Veneer function debugging, need on heat sink 5 processing and debugging window 10.
High power in this utility model, high power consumption be defined to 20-30W.
Claims (6)
1. a heat abstractor for high power digital circuit plate, by electronic cabinet (1) and high power digital circuit plate (4)
Composition, it is characterised in that: electronic cabinet (1) internal side wall is provided with case guide rail (2), high power digital circuit plate
(4) side is located in case guide rail (2), also includes T-shaped piece of locking device (3), and it is by high power consumption electricity
Road plate (4) is locked, described high power digital circuit plate (4) include heat sink (5), heat conductive pad (6),
Circuit printing plate (7) and some high power components and parts (8)；Described high power components and parts (8) are located at
On the wherein side plate face of circuit printing plate (7), high power components and parts (8) are by heat conductive pad (6) and dissipate
Hot plate (5) connects；The edge of described heat sink (5) and case guide rail (2) compact siro spinning technology；Circuit is printed
Another lateral plates of plate (7) is provided with screw (9), and screw (9) is by circuit printing plate (7) and heat sink
(5) it is fastenedly connected, compresses heat sink (5) and high power components and parts (8) simultaneously.
The heat abstractor of a kind of high power digital circuit plate the most as claimed in claim 1, it is characterised in that: described
Heat sink (5) is provided with the boss for contacting with heat conductive pad (6).
The heat abstractor of a kind of high power digital circuit plate the most as claimed in claim 1, it is characterised in that: described
High power components and parts 8 quantity is 3～5.
The heat abstractor of a kind of high power digital circuit plate the most as claimed in claim 1, it is characterised in that: described
Heat sink (5) is provided with debugging window (10).
The heat abstractor of a kind of high power digital circuit plate the most as claimed in claim 1, it is characterised in that: described
Heat sink (5) is smooth with the connection surface of case guide rail (2).
The heat abstractor of a kind of high power digital circuit plate the most as claimed in claim 2, it is characterised in that: described
Boss on heat sink (5) contacts with heat conductive pad (6), and its contact surface is smooth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620439084.3U CN205755222U (en) | 2016-05-13 | 2016-05-13 | A kind of heat abstractor of high power digital circuit plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620439084.3U CN205755222U (en) | 2016-05-13 | 2016-05-13 | A kind of heat abstractor of high power digital circuit plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205755222U true CN205755222U (en) | 2016-11-30 |
Family
ID=57366910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620439084.3U Active CN205755222U (en) | 2016-05-13 | 2016-05-13 | A kind of heat abstractor of high power digital circuit plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205755222U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106686880A (en) * | 2016-12-30 | 2017-05-17 | 株洲中车时代电气股份有限公司 | Onboard electronic part device for rail transit |
| CN108710424A (en) * | 2018-06-08 | 2018-10-26 | 山东超越数控电子股份有限公司 | A kind of reinforcing VPX module heat dissipating methods |
-
2016
- 2016-05-13 CN CN201620439084.3U patent/CN205755222U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106686880A (en) * | 2016-12-30 | 2017-05-17 | 株洲中车时代电气股份有限公司 | Onboard electronic part device for rail transit |
| CN108710424A (en) * | 2018-06-08 | 2018-10-26 | 山东超越数控电子股份有限公司 | A kind of reinforcing VPX module heat dissipating methods |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2017202254A1 (en) | Apparatus for mounting and fixing computer cpu heat sink and dedicated cpu heat sink | |
| CN205755222U (en) | A kind of heat abstractor of high power digital circuit plate | |
| CN100561401C (en) | Electronic installation and cooling unit | |
| CN107943254B (en) | A kind of portable computer device and its radiating module | |
| TWM550836U (en) | Partition for computer host | |
| CN202126420U (en) | Heat resistance detecting component for PCB (Printed circuit board) | |
| TW201405290A (en) | Electronic apparatus with touch sensing modules and cooling control method thereof | |
| CN203120368U (en) | Cooling device for electronic device | |
| CN104571398B (en) | Servomechanism and its radiating subassembly | |
| CN209201392U (en) | A kind of small-sized stacked circuit plate radiator structure | |
| CN206226918U (en) | A kind of data collecting card | |
| CN205537486U (en) | Capacitive gate formula digital display calliper of sensor and digital circuit separation | |
| CN206610387U (en) | The independent air guiding heat dissipation device of all-in-one | |
| CN208969594U (en) | A kind of vehicle diagnosis tablet computer | |
| CN206209486U (en) | Firm industrial panel computer easy to assemble | |
| CN201780542U (en) | Fanless non-contact radiator, motherboard consisting of fanless non-contact radiator and host computer | |
| CN208985057U (en) | A kind of micromainframe | |
| CN215526589U (en) | Accelerated heat dissipation structure of fan-free industrial personal computer | |
| CN201725233U (en) | Flow type multigap resistive plate chambers (MRPC) constant temperature testing cassete | |
| CN219087653U (en) | Heat conduction mounting structure of PCB board card | |
| CN205138499U (en) | Northern appearance is sought to high accuracy top | |
| CN111174966A (en) | Heat radiation structure and capacitive pressure sensor | |
| CN219372894U (en) | Low pressure casting CT appearance mainboard | |
| CN203706116U (en) | Cooling fin fixing device | |
| CN216450001U (en) | High-efficient radiating mainboard structure of computer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |