CN205752214U - A kind of uniform etching device of photovoltaic silicon wafer - Google Patents
A kind of uniform etching device of photovoltaic silicon wafer Download PDFInfo
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- CN205752214U CN205752214U CN201620458600.7U CN201620458600U CN205752214U CN 205752214 U CN205752214 U CN 205752214U CN 201620458600 U CN201620458600 U CN 201620458600U CN 205752214 U CN205752214 U CN 205752214U
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- etching
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
nullThe open a kind of uniform etching device of photovoltaic silicon wafer of this utility model，Including controlling terminal、Charging aperture、Etching groove、Wafer Cleaning shower nozzle、Alkaline bath、Remove PSG groove、Divide blade hair dryer and discharging opening，Control terminal bottom side and be provided with charging aperture，Charging aperture is fixing with etching groove to be connected，Wafer Cleaning shower nozzle is installed in etching groove，Etching groove one end is fixing with alkaline bath to be connected，Alkaline bath one end with go that PSG groove is fixing to be connected，PSG groove one end is gone to be connected with a point blade hair dryer，Point blade hair dryer one end is provided with discharging opening，This utility model strong adaptability，Surface etch uniformity is good、Few to silicon chip damage，It is suitable for almost all of metal、Glass、Plastic or other material，Relative to traditional etching system，This utility model collects data by controlling terminal，The data collected are analyzed，Etching homogeneity is adjusted by adjusting etching homogeneous system，It is effectively improved work efficiency，There is good economic benefit and social benefit，Suitably promote the use of.
Description
Technical field
This utility model relates to a kind of etching system, is specially a kind of uniform etching device of photovoltaic silicon wafer, belongs to semiconductor technology neck
Territory.
Background technology
Semiconductor fabrication process is a kind of plane manufacturing process, this technique combine photoetching, etch, deposit, the multiple work of ion implanting
Skill, needs to form a large amount of various types of complex devices on the same substrate, and is interconnected have complete electric function.
Wherein, there is deviation in the technique of any step, is all likely to result in the performance parameter off-design value of circuit.At present, along with super large
The device feature size of scale integrated circuit constantly scale smaller, integrated level constantly improves, control and the work thereof to each step process
The degree of accuracy of skill result is had higher requirement, and etching, it is semiconductor fabrication process, microelectronics manufacture and micro-nano system
Making the considerable step of the one in technique, current etching system can only adjust an i.e. etch period of etching parameters to control mesh
Scale value, and the uniformity of etching can not be adjusted, cause the conforming product rate produced to be substantially reduced, increase production cost, therefore pin
To the problems referred to above, we have proposed a kind of uniform etching device of photovoltaic silicon wafer.
Utility model content
This utility model provides a kind of uniform etching device of photovoltaic silicon wafer, by being provided with etching homogeneous system in controlling terminal, solves
The problem that existing etching system etching is uneven.
In order to solve above-mentioned technical problem, this utility model provides following technical scheme:
This utility model provides a kind of uniform etching device of photovoltaic silicon wafer, clear including operation controller, charging aperture, etching groove, silicon chip
Wash shower nozzle, alkaline bath, go PSG groove, point blade hair dryer and discharging opening, described control terminal bottom side to be provided with charging aperture, described in enter
Material mouth is fixing with etching groove to be connected, and is provided with Wafer Cleaning shower nozzle in described etching groove, and described etching groove one end is fixing with alkaline bath even
Connect, described alkaline bath one end with go that PSG groove is fixing to be connected, described in go to PSG groove one end to be connected with a point blade hair dryer, described point of cutter
Formula hair dryer one end is provided with discharging opening.
As a kind of optimal technical scheme of the present utility model, in described alkaline bath, it is provided with described Wafer Cleaning shower nozzle.
As a kind of optimal technical scheme of the present utility model, described in remove PSG groove in be provided with described Wafer Cleaning shower nozzle.
As a kind of optimal technical scheme of the present utility model, in described etching groove and described alkaline bath, it is provided with multiple severe corrosive chemistry
Medicine.
This utility model is reached to provide the benefit that:
This utility model strong adaptability, surface etch uniformity is good, few to silicon chip damage, be suitable for almost all of metal, glass,
Plastic or other material, relative to traditional etching system, this utility model collects data by controlling terminal, enters the data collected
Row is analyzed, and by adjusting etching homogeneity system call interception etching homogeneity, is effectively improved work efficiency, has good economic effect
Benefit and social benefit, suitably promote the use of.
Accompanying drawing explanation
Accompanying drawing is used for providing being further appreciated by of the present utility model, and constitutes a part for description, with reality of the present utility model
Execute example together for explaining this utility model, be not intended that restriction of the present utility model.
In the accompanying drawings:
Fig. 1 is structure chart figure of the present utility model；
Label in figure: 1, control terminal；2, charging aperture；3, etching groove；4, Wafer Cleaning shower nozzle；5, alkaline bath；6, go
PSG groove；7, blade hair dryer is divided；8, discharging opening.
Detailed description of the invention
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is illustrated, it will be appreciated that preferred embodiment described herein
It is merely to illustrate and explains this utility model, being not used to limit this utility model.
Embodiment: as it is shown in figure 1, this utility model provides a kind of uniform etching device of photovoltaic silicon wafer, including controlling terminal 1, entering
Expect mouth 2, etching groove 3, Wafer Cleaning shower nozzle 4, alkaline bath 5, remove PSG groove 6, point blade hair dryer 7 and discharging opening 8, control
Terminal 1 bottom side processed is provided with charging aperture 2, and charging aperture 2 is fixing with etching groove 3 to be connected, and is provided with Wafer Cleaning shower nozzle in etching groove 3
4, etching groove 3 one end and alkaline bath 5 is fixing to be connected, alkaline bath 5 one end with go PSG groove 6 to fix to be connected, remove PSG groove 6 one
End is connected with a point blade hair dryer 7, and point blade hair dryer 7 one end is provided with discharging opening 8.
Being provided with Wafer Cleaning shower nozzle 4 in alkaline bath 5, Wafer Cleaning shower nozzle 4 can effectively clean product and wash in alkaline bath 5
Time the alkaline matter that is stained with.
Being provided with Wafer Cleaning shower nozzle 4 in removing PSG groove 6, it is viscous in PSG groove 6 that Wafer Cleaning shower nozzle 4 can effectively clean product
On impurity.
Being provided with multiple severe corrosive chemical drugs in etching groove 3 and alkaline bath 5, product is served very by the acidic materials of etching groove 3
Corrasion well, the strong base substance in alkaline bath 5 can play a good neutralization for strong acid.
In use, starting device, material enters in etching groove from charging aperture this utility model, first sprays material in erosion groove
Wax, wax spray uses KOH and BDG that product goes wax removing and porous silicon, uses HF and HCL that material goes dephosphorization silicon afterwards after completing
Glass and metal ion, collect data by controlling terminal, be analyzed the data collected, by adjusting etching homogeneous system
Adjusting etching homogeneity, use Wafer Cleaning shower nozzle to be carried out material after having etched, the strong base substance in alkaline bath 5 can
Very well the acidic materials being stained with in etching groove 3 is played neutralization, just can be with discharging after being carried out and drying.
This utility model is reached to provide the benefit that:
This utility model strong adaptability, surface etch uniformity is good, few to silicon chip damage, be suitable for almost all of metal, glass,
Plastic or other material, relative to traditional etching system, this utility model collects data by controlling terminal, enters the data collected
Row is analyzed, and adjusts etching homogeneity by adjusting etching homogeneous system, is effectively improved work efficiency, has good economic benefit
And social benefit, suitably promote the use of.
Finally it is noted that the foregoing is only preferred embodiment of the present utility model, it is not limited to this utility model,
Although being described in detail this utility model with reference to previous embodiment, for a person skilled in the art, it still may be used
So that the technical scheme described in foregoing embodiments to be modified, or wherein portion of techniques feature is carried out equivalent.All
Within spirit of the present utility model and principle, any modification, equivalent substitution and improvement etc. made, should be included in this utility model
Protection domain within.
Claims (4)
1. the uniform etching device of photovoltaic silicon wafer, including controlling terminal (1), charging aperture (2), etching groove (3), silicon chip
Clean shower nozzle (4), alkaline bath (5), go PSG groove (6), point blade hair dryer (7) and discharging opening (8), its feature
Being, described control terminal (1) bottom side is provided with charging aperture (2), and described charging aperture (2) is fixing with etching groove (3) to be connected,
Being provided with Wafer Cleaning shower nozzle (4) in described etching groove (3), described etching groove (3) one end is fixing with alkaline bath (5) to be connected,
Described alkaline bath (5) one end with go that PSG groove (6) is fixing to be connected, described in remove PSG groove (6) one end and point blade hair dryer (7)
Connecting, described point of blade hair dryer (7) one end is provided with discharging opening (8).
A kind of uniform etching device of photovoltaic silicon wafer the most according to claim 1, it is characterised in that in described alkaline bath (5)
It is provided with described Wafer Cleaning shower nozzle (4).
A kind of uniform etching device of photovoltaic silicon wafer the most according to claim 1, it is characterised in that described in remove PSG groove (6)
Inside it is provided with described Wafer Cleaning shower nozzle (4).
A kind of uniform etching device of photovoltaic silicon wafer the most according to claim 1, it is characterised in that described etching groove (3) with
Multiple severe corrosive chemical drugs it is provided with in described alkaline bath (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620458600.7U CN205752214U (en) | 2016-05-13 | 2016-05-13 | A kind of uniform etching device of photovoltaic silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620458600.7U CN205752214U (en) | 2016-05-13 | 2016-05-13 | A kind of uniform etching device of photovoltaic silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205752214U true CN205752214U (en) | 2016-11-30 |
Family
ID=57364150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620458600.7U Expired - Fee Related CN205752214U (en) | 2016-05-13 | 2016-05-13 | A kind of uniform etching device of photovoltaic silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205752214U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108831847A (en) * | 2018-06-19 | 2018-11-16 | 江苏燕山光伏设备有限公司 | A kind of uniformity photovoltaic silicon wafer etching mechanism |
-
2016
- 2016-05-13 CN CN201620458600.7U patent/CN205752214U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108831847A (en) * | 2018-06-19 | 2018-11-16 | 江苏燕山光伏设备有限公司 | A kind of uniformity photovoltaic silicon wafer etching mechanism |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161130 Termination date: 20170513 |