CN205723624U - A kind of anti-sulfuration and halogenation and the LED light source with anti-oxidation function - Google Patents

A kind of anti-sulfuration and halogenation and the LED light source with anti-oxidation function Download PDF

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Publication number
CN205723624U
CN205723624U CN201620115150.1U CN201620115150U CN205723624U CN 205723624 U CN205723624 U CN 205723624U CN 201620115150 U CN201620115150 U CN 201620115150U CN 205723624 U CN205723624 U CN 205723624U
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China
Prior art keywords
metal substrate
led
light source
halogenation
sulfuration
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CN201620115150.1U
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Chinese (zh)
Inventor
李俊东
刘云
李绍军
袁国平
曹丽华
张路华
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SHENZHEN SMALITE OPTO-ELECTRONIC Co Ltd
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SHENZHEN SMALITE OPTO-ELECTRONIC Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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  • Led Device Packages (AREA)

Abstract

The utility model discloses a kind of anti-sulfuration and halogenation and the LED light source with anti-oxidation function, it relates to LED light source technical field.Product support (2) is internal is provided with metal substrate (1), and it on metal substrate (1), is provided with LED (3), being connected by bonding wire (4) between two mutual LED (3), product support (2) is internal and LED (3) top uses packaging plastic (5) encapsulation.Base material is chosen flexibly, can choose according to product performance demands, support processing technology is simple, can directly punching press injection mo(u)lding, it is not required to plating, suitably process in metallic substrate surfaces, effective can prevent sulfuration, halogenation, oxidations etc. are polluted, therefore light source can use under more adverse circumstances at higher temperature, improve product self performance further.

Description

A kind of anti-sulfuration and halogenation and the LED light source with anti-oxidation function
Technical field
The utility model relates to a kind of anti-sulfuration and halogenation and the LED light source with anti-oxidation function, belongs to LED light source skill Art field.
Background technology
LED is more than coming out, in widespread attention and developed rapidly, is not had the advantage that point not with itself Open.These advantages sum up and are: brightness is high, operating voltage is low, power consumption is little, miniaturization, life-span length, impact resistance and performance steady Fixed.The development prospect of LED is extremely wide, currently towards more high brightness, more high weather resistance, higher luminous density, higher Uniformity of luminance direction develop.
But reality is during production and application LED product, we often meet with, and " product sulfuration (comprises sulfuration, halogen The contamination phenomenon such as change, oxidation) cause product failure " etc. problem, these problems all bring certain loss to client and manufacturer, After there is vulcanization reaction, product function district meeting melanism, luminous flux can be gradually reduced, and substantially drift occurs in colour temperature.Its principle is: because of For the support of paster LED be on the base material of copper silver-plated (silver layer can play shinny, the effect of reflection light), TOP LED is at high temperature During welding, encountered sulphur or sulfur vapor, then can cause silver layer on support and sulphur generation chemical reaction Ag+S=AgS ↓, formed AgS, the number of visual response amount, its color is yellow or black.Silver layer the most serious has all reacted, and spun gold ruptures, and causes LED opens a way.It can be said that encapsulation manufacturer is almost talks sulfuration discoloration.
Content of the invention
For the problems referred to above, the technical problems to be solved in the utility model is to provide a kind of anti-sulfuration and halogenation and has anti- The LED light source of oxidative function.
The anti-sulfuration of the utility model and halogenation and the LED light source with anti-oxidation function, it comprises metal substrate the 1st, product Support the 2nd, LED the 3rd, bonding wire 4 and packaging plastic 5, product support 2 internal being provided with is provided with on metal substrate 1, and metal substrate 1 LED 3, is connected by bonding wire 4 between two mutual LED 3, and product support 2 is internal uses packaging plastic 5 above LED 3 Encapsulation.
As preferably, the upper surface of described metal substrate 1 is sequentially depositing aluminum oxide, silver, aluminum oxide, titanium oxide, metal The lower surface of substrate 1 is sequentially depositing copper and silver.
The beneficial effects of the utility model: the 1st, base material is chosen flexibly, can choose according to product performance demands, copper, aluminium, iron etc. Metal, by the other layer of metal of physical method metal surface deposition or metallic compound, according to demand, can selectivity Deposition, such as: silver can improve substrate reflectivity;Aluminum oxide can protect metal surface glossiness, prevents sulfuration, improves reflective Rate;Titanium oxide holding surface glossiness, protection surface does not cures, halogenation, and oxidation etc. is polluted;Base copper contributes on substrate Tin, bottom silver can protect metal substrate not to be contaminated, tin soldering effect in raising.
2nd, support processing technology is simple, can directly punching press injection mo(u)lding, be not required to electroplate, the series of complex work such as chemical medicinal liquid Skill.
3rd, suitably processing in metallic substrate surfaces, effective can preventing sulfuration, halogenation, oxidation etc. is polluted, therefore light source Can use under more adverse circumstances at higher temperature, improve product self performance further.
4th, by substrate surface process, it is possible to achieve some seem very difficult technique, such as: at base metal Aluminium, copper, the upper surface of base plate routing such as iron, bottom scolding tin;Realize that equivalent conventional patch production uses.
Brief description:
For ease of explanation, the utility model is embodied as and accompanying drawing is described in detail by following.
Fig. 1 is the utility model structural representation;
Fig. 2 is the structural representation of the metal substrate in the utility model after punching press;
Fig. 3 is the structural representation of product support in the utility model;
Fig. 4 is the status architecture schematic diagram of the unencapsulated packaging plastic of the utility model;
Fig. 5 is the structural representation of the metal substrate of non-punching press in the utility model;
Fig. 6 is the structural representation of metal substrate in detailed description of the invention two;
Fig. 7 is the structural representation of metal substrate in detailed description of the invention three;
Fig. 8 is the structural representation of metal substrate in detailed description of the invention four.
Detailed description of the invention:
Detailed description of the invention one: as Figure 1-5, this detailed description of the invention by the following technical solutions: it comprises metal Substrate the 1st, product support the 2nd, LED the 3rd, bonding wire 4 and packaging plastic 5, product support 2 is internal is provided with metal substrate 1, and metal substrate Being provided with LED 3 on 1, being connected by bonding wire 4 between two mutual LED 3, product support 2 is internal to be adopted above LED 3 Encapsulate with packaging plastic 5.
As preferably, the upper surface of described metal substrate 1 is sequentially depositing aluminum oxide, silver, aluminum oxide, titanium oxide, metal The lower surface of substrate 1 is sequentially depositing copper and silver.
Detailed description of the invention two: with reference to Fig. 6, this detailed description of the invention is with the difference of detailed description of the invention, institute The upper surface of the metal substrate 1 stated is sequentially depositing aluminum oxide, silver, aluminum oxide, titanium oxide, the lower surface deposition silver of metal substrate 1, Other compositions are identical with detailed description of the invention one with connected mode.
Detailed description of the invention three: with reference to Fig. 7, this detailed description of the invention is described with the difference of detailed description of the invention The upper surface of metal substrate 1 be sequentially depositing silver, aluminum oxide, titanium oxide, the lower surface deposition silver of metal substrate 1, other compositions Identical with detailed description of the invention one with connected mode.
Detailed description of the invention four: with reference to Fig. 8, this detailed description of the invention is described with the difference of detailed description of the invention The upper surface of metal substrate 1 be sequentially depositing aluminum oxide, silver, aluminum oxide, titanium oxide, the lower surface of metal substrate 1 is sequentially depositing Copper, silver, other compositions are identical with detailed description of the invention one with connected mode.
Of the present utility model general principle and principal character and of the present utility model advantage have more than been shown and described.One's own profession Skilled person will appreciate that of industry, the utility model is not restricted to the described embodiments, described in above-described embodiment and specification Principle of the present utility model is simply described, on the premise of without departing from the utility model spirit and scope, the utility model is also Have various changes and modifications, in the range of these changes and improvements both fall within claimed the utility model.The utility model Claimed scope is defined by appending claims and equivalent thereof.

Claims (5)

1. one kind anti-sulfuration and halogenation and the LED light source with anti-oxidation function, it is characterised in that: it comprise metal substrate (1), Product support (2), LED (3), bonding wire (4) and packaging plastic (5), the internal metal substrate (1) that is provided with of product support (2), and gold Belong to and be provided with LED (3) on substrate (1), connected by bonding wire (4) between two mutual LED (3), in product support (2) Portion and LED (3) top use packaging plastic (5) encapsulation.
2., according to a kind of anti-sulfuration described in claim 1 and halogenation and the LED light source with anti-oxidation function, its feature exists In: the upper surface of described metal substrate (1) is sequentially depositing aluminum oxide, silver, aluminum oxide, titanium oxide, the following table of metal substrate (1) Face is sequentially depositing copper and silver.
3., according to a kind of anti-sulfuration described in claim 1 and halogenation and the LED light source with anti-oxidation function, its feature exists In: the upper surface of described metal substrate (1) is sequentially depositing aluminum oxide, silver, aluminum oxide, titanium oxide, the following table of metal substrate (1) Face deposition silver.
4., according to a kind of anti-sulfuration described in claim 1 and halogenation and the LED light source with anti-oxidation function, its feature exists In: the upper surface of described metal substrate (1) is sequentially depositing silver, aluminum oxide, titanium oxide, the lower surface deposition of metal substrate (1) Silver.
5., according to a kind of anti-sulfuration described in claim 1 and halogenation and the LED light source with anti-oxidation function, its feature exists In: the upper surface of described metal substrate (1) is sequentially depositing aluminum oxide, silver, aluminum oxide, titanium oxide, the following table of metal substrate (1) Face deposits copper.
CN201620115150.1U 2016-02-05 2016-02-05 A kind of anti-sulfuration and halogenation and the LED light source with anti-oxidation function Active CN205723624U (en)

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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106898686A (en) * 2017-03-04 2017-06-27 深圳市斯迈得半导体有限公司 The LED support of high stability, LED light source and method
CN107046026A (en) * 2016-02-05 2017-08-15 深圳市斯迈得半导体有限公司 A kind of anti-vulcanization and halogenation and the LED/light source with anti-oxidation function

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107046026A (en) * 2016-02-05 2017-08-15 深圳市斯迈得半导体有限公司 A kind of anti-vulcanization and halogenation and the LED/light source with anti-oxidation function
CN106898686A (en) * 2017-03-04 2017-06-27 深圳市斯迈得半导体有限公司 The LED support of high stability, LED light source and method

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