CN205723624U - A kind of anti-sulfuration and halogenation and the LED light source with anti-oxidation function - Google Patents
A kind of anti-sulfuration and halogenation and the LED light source with anti-oxidation function Download PDFInfo
- Publication number
- CN205723624U CN205723624U CN201620115150.1U CN201620115150U CN205723624U CN 205723624 U CN205723624 U CN 205723624U CN 201620115150 U CN201620115150 U CN 201620115150U CN 205723624 U CN205723624 U CN 205723624U
- Authority
- CN
- China
- Prior art keywords
- metal substrate
- led
- light source
- halogenation
- sulfuration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of anti-sulfuration and halogenation and the LED light source with anti-oxidation function, it relates to LED light source technical field.Product support (2) is internal is provided with metal substrate (1), and it on metal substrate (1), is provided with LED (3), being connected by bonding wire (4) between two mutual LED (3), product support (2) is internal and LED (3) top uses packaging plastic (5) encapsulation.Base material is chosen flexibly, can choose according to product performance demands, support processing technology is simple, can directly punching press injection mo(u)lding, it is not required to plating, suitably process in metallic substrate surfaces, effective can prevent sulfuration, halogenation, oxidations etc. are polluted, therefore light source can use under more adverse circumstances at higher temperature, improve product self performance further.
Description
Technical field
The utility model relates to a kind of anti-sulfuration and halogenation and the LED light source with anti-oxidation function, belongs to LED light source skill
Art field.
Background technology
LED is more than coming out, in widespread attention and developed rapidly, is not had the advantage that point not with itself
Open.These advantages sum up and are: brightness is high, operating voltage is low, power consumption is little, miniaturization, life-span length, impact resistance and performance steady
Fixed.The development prospect of LED is extremely wide, currently towards more high brightness, more high weather resistance, higher luminous density, higher
Uniformity of luminance direction develop.
But reality is during production and application LED product, we often meet with, and " product sulfuration (comprises sulfuration, halogen
The contamination phenomenon such as change, oxidation) cause product failure " etc. problem, these problems all bring certain loss to client and manufacturer,
After there is vulcanization reaction, product function district meeting melanism, luminous flux can be gradually reduced, and substantially drift occurs in colour temperature.Its principle is: because of
For the support of paster LED be on the base material of copper silver-plated (silver layer can play shinny, the effect of reflection light), TOP LED is at high temperature
During welding, encountered sulphur or sulfur vapor, then can cause silver layer on support and sulphur generation chemical reaction Ag+S=AgS ↓, formed
AgS, the number of visual response amount, its color is yellow or black.Silver layer the most serious has all reacted, and spun gold ruptures, and causes
LED opens a way.It can be said that encapsulation manufacturer is almost talks sulfuration discoloration.
Content of the invention
For the problems referred to above, the technical problems to be solved in the utility model is to provide a kind of anti-sulfuration and halogenation and has anti-
The LED light source of oxidative function.
The anti-sulfuration of the utility model and halogenation and the LED light source with anti-oxidation function, it comprises metal substrate the 1st, product
Support the 2nd, LED the 3rd, bonding wire 4 and packaging plastic 5, product support 2 internal being provided with is provided with on metal substrate 1, and metal substrate 1
LED 3, is connected by bonding wire 4 between two mutual LED 3, and product support 2 is internal uses packaging plastic 5 above LED 3
Encapsulation.
As preferably, the upper surface of described metal substrate 1 is sequentially depositing aluminum oxide, silver, aluminum oxide, titanium oxide, metal
The lower surface of substrate 1 is sequentially depositing copper and silver.
The beneficial effects of the utility model: the 1st, base material is chosen flexibly, can choose according to product performance demands, copper, aluminium, iron etc.
Metal, by the other layer of metal of physical method metal surface deposition or metallic compound, according to demand, can selectivity
Deposition, such as: silver can improve substrate reflectivity；Aluminum oxide can protect metal surface glossiness, prevents sulfuration, improves reflective
Rate；Titanium oxide holding surface glossiness, protection surface does not cures, halogenation, and oxidation etc. is polluted；Base copper contributes on substrate
Tin, bottom silver can protect metal substrate not to be contaminated, tin soldering effect in raising.
2nd, support processing technology is simple, can directly punching press injection mo(u)lding, be not required to electroplate, the series of complex work such as chemical medicinal liquid
Skill.
3rd, suitably processing in metallic substrate surfaces, effective can preventing sulfuration, halogenation, oxidation etc. is polluted, therefore light source
Can use under more adverse circumstances at higher temperature, improve product self performance further.
4th, by substrate surface process, it is possible to achieve some seem very difficult technique, such as: at base metal
Aluminium, copper, the upper surface of base plate routing such as iron, bottom scolding tin；Realize that equivalent conventional patch production uses.
Brief description:
For ease of explanation, the utility model is embodied as and accompanying drawing is described in detail by following.
Fig. 1 is the utility model structural representation；
Fig. 2 is the structural representation of the metal substrate in the utility model after punching press；
Fig. 3 is the structural representation of product support in the utility model；
Fig. 4 is the status architecture schematic diagram of the unencapsulated packaging plastic of the utility model；
Fig. 5 is the structural representation of the metal substrate of non-punching press in the utility model；
Fig. 6 is the structural representation of metal substrate in detailed description of the invention two；
Fig. 7 is the structural representation of metal substrate in detailed description of the invention three；
Fig. 8 is the structural representation of metal substrate in detailed description of the invention four.
Detailed description of the invention:
Detailed description of the invention one: as Figure 1-5, this detailed description of the invention by the following technical solutions: it comprises metal
Substrate the 1st, product support the 2nd, LED the 3rd, bonding wire 4 and packaging plastic 5, product support 2 is internal is provided with metal substrate 1, and metal substrate
Being provided with LED 3 on 1, being connected by bonding wire 4 between two mutual LED 3, product support 2 is internal to be adopted above LED 3
Encapsulate with packaging plastic 5.
As preferably, the upper surface of described metal substrate 1 is sequentially depositing aluminum oxide, silver, aluminum oxide, titanium oxide, metal
The lower surface of substrate 1 is sequentially depositing copper and silver.
Detailed description of the invention two: with reference to Fig. 6, this detailed description of the invention is with the difference of detailed description of the invention, institute
The upper surface of the metal substrate 1 stated is sequentially depositing aluminum oxide, silver, aluminum oxide, titanium oxide, the lower surface deposition silver of metal substrate 1,
Other compositions are identical with detailed description of the invention one with connected mode.
Detailed description of the invention three: with reference to Fig. 7, this detailed description of the invention is described with the difference of detailed description of the invention
The upper surface of metal substrate 1 be sequentially depositing silver, aluminum oxide, titanium oxide, the lower surface deposition silver of metal substrate 1, other compositions
Identical with detailed description of the invention one with connected mode.
Detailed description of the invention four: with reference to Fig. 8, this detailed description of the invention is described with the difference of detailed description of the invention
The upper surface of metal substrate 1 be sequentially depositing aluminum oxide, silver, aluminum oxide, titanium oxide, the lower surface of metal substrate 1 is sequentially depositing
Copper, silver, other compositions are identical with detailed description of the invention one with connected mode.
Of the present utility model general principle and principal character and of the present utility model advantage have more than been shown and described.One's own profession
Skilled person will appreciate that of industry, the utility model is not restricted to the described embodiments, described in above-described embodiment and specification
Principle of the present utility model is simply described, on the premise of without departing from the utility model spirit and scope, the utility model is also
Have various changes and modifications, in the range of these changes and improvements both fall within claimed the utility model.The utility model
Claimed scope is defined by appending claims and equivalent thereof.
Claims (5)
1. one kind anti-sulfuration and halogenation and the LED light source with anti-oxidation function, it is characterised in that: it comprise metal substrate (1),
Product support (2), LED (3), bonding wire (4) and packaging plastic (5), the internal metal substrate (1) that is provided with of product support (2), and gold
Belong to and be provided with LED (3) on substrate (1), connected by bonding wire (4) between two mutual LED (3), in product support (2)
Portion and LED (3) top use packaging plastic (5) encapsulation.
2., according to a kind of anti-sulfuration described in claim 1 and halogenation and the LED light source with anti-oxidation function, its feature exists
In: the upper surface of described metal substrate (1) is sequentially depositing aluminum oxide, silver, aluminum oxide, titanium oxide, the following table of metal substrate (1)
Face is sequentially depositing copper and silver.
3., according to a kind of anti-sulfuration described in claim 1 and halogenation and the LED light source with anti-oxidation function, its feature exists
In: the upper surface of described metal substrate (1) is sequentially depositing aluminum oxide, silver, aluminum oxide, titanium oxide, the following table of metal substrate (1)
Face deposition silver.
4., according to a kind of anti-sulfuration described in claim 1 and halogenation and the LED light source with anti-oxidation function, its feature exists
In: the upper surface of described metal substrate (1) is sequentially depositing silver, aluminum oxide, titanium oxide, the lower surface deposition of metal substrate (1)
Silver.
5., according to a kind of anti-sulfuration described in claim 1 and halogenation and the LED light source with anti-oxidation function, its feature exists
In: the upper surface of described metal substrate (1) is sequentially depositing aluminum oxide, silver, aluminum oxide, titanium oxide, the following table of metal substrate (1)
Face deposits copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620115150.1U CN205723624U (en) | 2016-02-05 | 2016-02-05 | A kind of anti-sulfuration and halogenation and the LED light source with anti-oxidation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620115150.1U CN205723624U (en) | 2016-02-05 | 2016-02-05 | A kind of anti-sulfuration and halogenation and the LED light source with anti-oxidation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205723624U true CN205723624U (en) | 2016-11-23 |
Family
ID=57333803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620115150.1U Active CN205723624U (en) | 2016-02-05 | 2016-02-05 | A kind of anti-sulfuration and halogenation and the LED light source with anti-oxidation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205723624U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106898686A (en) * | 2017-03-04 | 2017-06-27 | 深圳市斯迈得半导体有限公司 | The LED support of high stability, LED light source and method |
| CN107046026A (en) * | 2016-02-05 | 2017-08-15 | 深圳市斯迈得半导体有限公司 | A kind of anti-vulcanization and halogenation and the LED/light source with anti-oxidation function |
-
2016
- 2016-02-05 CN CN201620115150.1U patent/CN205723624U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107046026A (en) * | 2016-02-05 | 2017-08-15 | 深圳市斯迈得半导体有限公司 | A kind of anti-vulcanization and halogenation and the LED/light source with anti-oxidation function |
| CN106898686A (en) * | 2017-03-04 | 2017-06-27 | 深圳市斯迈得半导体有限公司 | The LED support of high stability, LED light source and method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102601477B (en) | Microwelding eutectic method for LED chips | |
| CN205723624U (en) | A kind of anti-sulfuration and halogenation and the LED light source with anti-oxidation function | |
| CN204271142U (en) | OLED module package structure | |
| CN103531718B (en) | OLED encapsulating structure | |
| CN104103733B (en) | A kind of upside-down mounting LED chip and its manufacturing method | |
| CN106784243A (en) | A kind of deep ultraviolet LED packagings and preparation method thereof | |
| CN103155702A (en) | Organic electro-luminescence light-emitting device and production method of same | |
| CN106684227A (en) | Ultraviolet LED package method | |
| CN205752228U (en) | A kind of anti-sulfuration and halogenation and there is the upside-down mounting envelope LED light source of anti-oxidation function | |
| CN205723614U (en) | A kind of anti-sulfuration and halogenation and there is the LED light source of anti-oxidation function | |
| CN107706280A (en) | A kind of manufacture method of the LED light source manufactured by vacuum sputtering technique | |
| CN206349351U (en) | High-performance upside-down mounting COB encapsulating structures | |
| CN107706271A (en) | A kind of preparation method of the LED light source of new structure | |
| CN107046026A (en) | A kind of anti-vulcanization and halogenation and the LED/light source with anti-oxidation function | |
| CN208352328U (en) | A kind of Micro LED encapsulation structure | |
| CN106058021A (en) | Chip-scale package luminescence apparatus and manufacturing method thereof | |
| CN205303457U (en) | Chip frame of high bonding wire quality | |
| CN204558521U (en) | A kind of LED lamp bead | |
| CN205159355U (en) | Transparent ceramic base plate LED filament | |
| CN207637842U (en) | A kind of indoor display LED packagings of high contrast | |
| CN204441280U (en) | Crystal covering type LED lamp | |
| CN107516706A (en) | A kind of anti-vulcanization and halogenation and the LED light source with anti-oxidation function | |
| WO2021128029A1 (en) | Semiconductor chip, preparation method, and display panel | |
| CN206040689U (en) | Novel LED light source of structure | |
| CN106898686A (en) | The LED support of high stability, LED light source and method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |