CN208077971U - LED light source - Google Patents
LED light source Download PDFInfo
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- CN208077971U CN208077971U CN201820299847.8U CN201820299847U CN208077971U CN 208077971 U CN208077971 U CN 208077971U CN 201820299847 U CN201820299847 U CN 201820299847U CN 208077971 U CN208077971 U CN 208077971U
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Abstract
The utility model discloses a kind of LED light sources, including：Substrate, line layer, ink solder mask, specular layer, Eutectic Layer, LED wafer and glue-line, the line layer is set on the substrate, the line layer includes pad area and non-pad area, the Eutectic Layer is set to the pad area, the ink solder mask covers the non-pad area, the LED wafer is set to the Eutectic Layer, and the specular layer covers the ink solder mask, and the LED wafer and at least partly described specular layer is completely covered in the glue-line.Compared with the relevant technologies, LED light source provided by the utility model has the advantages that：By covering one layer of specular layer on ink solder mask, so that the reflectivity of light reaches 98% or more, improve luminous flux, moreover, when using metallic mirror surface reflecting layer when, heat resistance more preferably, the Liu Ming sustainment rate highers of light source, the heat transfer efficiency for increasing substrate keeps light source applications more reliable.
Description
Technical field
The utility model is related to technical field of LED illumination, and in particular to a kind of LED light source.
Background technology
Nowadays with the development process of modernization China, the emerging product of all trades and professions also gradually modernizes.Just take illumination
For industry, bulb before, incandescent lamp, it is the energy-saving lamp modernized that sight lamp gradually updates, and LED light etc. is more
Energy saving more environmentally-friendly illuminator.With the development of science and technology and further going deep into for application practice, LED lighting technology is
As most popular, most promising, the highest lighting engineering of acceptance level.
Flip LED light source structure in the related technology, the printed wire on light source substrate, circuit pack are used in addition to pad
Solder mask covers, and LED wafer is welded on pad, and substrate reflection realizes that this structure is because of solder mask mainly by ink
Weather resistance is bad, the easy yellow of high temperature, causes extinction seriously to reflect light ability decline, it is serious integrally to go out optical attenuation.
Accordingly, it is desirable to provide a kind of new LED light source is to solve the above technical problems.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of whole LED light sources for improving luminous efficiency of source.
The technical solution of the utility model is as follows：
A kind of LED light source, including：Substrate, line layer, ink solder mask, specular layer, Eutectic Layer, LED wafer and
Glue-line, the line layer are set on the substrate, and the line layer includes pad area and non-pad area, the Eutectic Layer setting
In the pad area, the ink solder mask covers the non-pad area, and the LED wafer is set to the Eutectic Layer, described
Specular layer covers the ink solder mask, and the LED wafer is completely covered in the glue-line and at least partly described minute surface is anti-
Penetrate layer.
Preferably, the specular layer is metallic mirror surface reflecting layer.
Preferably, the specular layer is non-metallic specular reflector layer.
Preferably, the glue-line is fluorescent glue.
Preferably, the specular layer is plated on the ink solder mask.
Preferably, the LED light source further includes the electrode for being set to the substrate and being electrically connected with the LED wafer.
Compared with the relevant technologies, LED light source provided by the utility model has the advantages that：By being hindered in ink
One layer of specular layer is covered on layer so that the reflectivity of light reaches 98% or more, improves luminous flux, moreover, when
When using metallic mirror surface reflecting layer, more preferably, the Liu Ming sustainment rate highers of light source increase the heat transfer efficiency of substrate to heat resistance,
Keep light source applications more reliable.
Description of the drawings
It is required in being described below to embodiment in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing to be used is briefly described, and the accompanying drawings in the following description is only some embodiments of the utility model, for this
For the those of ordinary skill of field, without creative efforts, others are can also be obtained according to these attached drawings
Attached drawing, wherein：
Fig. 1 is the structural schematic diagram of the utility model LED light source；
Fig. 2 is the floor map of the utility model LED light source.
Specific implementation mode
Below by the technical scheme in the utility model embodiment is clearly and completely described, it is clear that described
Embodiment is only a part of the embodiment of the utility model, instead of all the embodiments.Based on the implementation in the utility model
Example, all other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to
The range of the utility model protection.
Referring to Fig. 1, the utility model provides a kind of LED light source 100, including：Substrate 1, line layer 2, ink solder mask
3, specular layer 4, Eutectic Layer 5, LED wafer 6 and glue-line 7, the LED light source 100 is encapsulated using reverse installation process, to carry
High light-emitting efficiency.
The line layer 2 is set on the substrate 1, and the line layer 2 includes pad area and non-pad area, the eutectic
Layer 5 is set to the pad area, and the ink solder mask 3 covers the non-pad area.
The LED wafer 6 is set to the Eutectic Layer 5, and is packaged by COB (chip-on-board) technique.
The specular layer 4 covers the ink solder mask 3, and the specular layer 4 is plated on the ink welding resistance
Layer, ensures that the specular layer 4 can be with ink solder mask 3 described in uniform fold, and the surface of the specular layer 4 is smooth
It is smooth.In the preferred embodiment of the utility model, the specular layer 4 is metallic mirror surface reflecting layer, in this way, the minute surface
More preferably, the Liu Ming sustainment rate highers of light source increase the heat transfer efficiency of substrate, make light source applications more the heat resistance in reflecting layer 4
Reliably.Certainly, the specular layer 4 or non-metallic specular reflector layer can equally be obtained using suitable material
Extraordinary effect.
The LED wafer 6 and at least partly described specular layer 4 is completely covered in the glue-line 7, and the glue-line 7 is glimmering
Optical cement has the features such as light transmittance is high, and high refractive index, thermal stability is good, and stress is small, and hygroscopicity is low using fluorescent glue, after solidification.
Shown in Fig. 2, the LED light source 100 further includes being set to the substrate 1 and being electrically connected with the LED wafer 6
The electrode 8 connect, the electrode 8 will not be hermetically sealed, the positive and negative anodes for connection external circuit to be connected, therefore, in this practicality
In novel specific embodiment, the quantity of the electrode 8 is two, but the utility model is not intended to limit the specific of the electrode 8
Quantity, other suitable feasible quantity ought to also belong in the scope of protection of the utility model.
Compared with the relevant technologies, LED light source provided by the utility model has the advantages that：By being hindered in ink
One layer of specular layer is covered on layer so that the reflectivity of light reaches 98% or more, improves luminous flux, moreover, when
When using metallic mirror surface reflecting layer, more preferably, the Liu Ming sustainment rate highers of light source increase the heat transfer efficiency of substrate to heat resistance,
Keep light source applications more reliable.
The above description is only the embodiments of the present invention, and it does not limit the scope of the patent of the present invention, every
Equivalent structure or equivalent flow shift made based on the specification and figures of the utility model, is applied directly or indirectly in
Other relevant technical fields, are equally included in the patent within the scope of the utility model.
Claims (6)
1. a kind of LED light source, which is characterized in that including：Substrate, line layer, ink solder mask, specular layer, Eutectic Layer,
LED wafer and glue-line, the line layer are set on the substrate, and the line layer includes pad area and non-pad area, institute
It states Eutectic Layer and is set to the pad area, the ink solder mask covers the non-pad area, and the LED wafer is set to described
Eutectic Layer, the specular layer cover the ink solder mask, and the LED wafer and at least partly is completely covered in the glue-line
The specular layer.
2. LED light source according to claim 1, which is characterized in that the specular layer is metallic mirror surface reflecting layer.
3. LED light source according to claim 1, which is characterized in that the specular layer is non-metallic specular reflector layer.
4. LED light source according to claim 2 or 3, which is characterized in that the glue-line is fluorescent glue.
5. LED light source according to claim 1, which is characterized in that the specular layer is plated on the ink welding resistance
Layer.
6. LED light source according to claim 1, which is characterized in that the LED light source further includes being set to the substrate simultaneously
The electrode being electrically connected with the LED wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820299847.8U CN208077971U (en) | 2018-03-05 | 2018-03-05 | LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820299847.8U CN208077971U (en) | 2018-03-05 | 2018-03-05 | LED light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208077971U true CN208077971U (en) | 2018-11-09 |
Family
ID=64038571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820299847.8U Active CN208077971U (en) | 2018-03-05 | 2018-03-05 | LED light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208077971U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110242877A (en) * | 2019-04-12 | 2019-09-17 | 华芯半导体研究中心(广州)有限公司 | A kind of high heat dissipation high-power LED lamp bead and preparation method thereof |
| CN111244254A (en) * | 2018-11-29 | 2020-06-05 | 诺沛半导体有限公司 | High-coverage-rate light-emitting diode carrier plate |
-
2018
- 2018-03-05 CN CN201820299847.8U patent/CN208077971U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111244254A (en) * | 2018-11-29 | 2020-06-05 | 诺沛半导体有限公司 | High-coverage-rate light-emitting diode carrier plate |
| CN110242877A (en) * | 2019-04-12 | 2019-09-17 | 华芯半导体研究中心(广州)有限公司 | A kind of high heat dissipation high-power LED lamp bead and preparation method thereof |
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