CN205645872U - High light efficiency LED light source of miniwatt - Google Patents

Abstract

The utility model provides a high light efficiency LED light source of miniwatt, the chip is placed in the middle basically, it includes support (1), chip (2), the upper surface of branch parting bead (8) between first oral area and the second oral area, the upper surface of first copper sheet (4), this three of upper surface of second copper sheet (5) maintains an equal level in order to form an installation face, this installation face is less than the upper surface of support (1), installation face is connected with sapphire substrate (6), the upper surface of sapphire substrate (6) is higher than the upper surface of support (1), chip (2) are located support (1) middle part top and install at sapphire substrate (6) upper surface, sapphire substrate (6) surface is equipped with metallic wiring, based on metallic wiring, first copper sheet (4), each chip (2), second copper sheet (5) are connected according to the preface electricity and are established ties in order to form.

Description

Small-power high light efficiency LED light source

Technical field

This utility model relates to LED technology field, is especially a kind of small-power high light efficiency LED light source.

Background technology

LED, i.e. light emitting diode, be a kind of light emitting semiconductor device, when light emitting semiconductor device connects with support Semiconductor light-emitting elements, semiconductor light emitting element just can be formed after connecing and being covered by the object of the printing opacity containing fluorescent material Part is by core parts as LED, and the operation principle of semiconductor light-emitting elements is usually blue light or ultraviolet Optical chip excitated fluorescent powder, it is visible that the Optical-excitation fluorescent powder that chip sends under electric current drives produces its all band Light, each several part light colour mixture forms white light or the light of other colors.

The applicant investigated a kind of LED light source, and its support has multiple structure, and concrete scheme is, Frame is with day font metal frame as skeleton and is covered with the framework of PPA plastics at Skeleton Table bread, and metal frame includes Character segment on the one and second day character segment, the lower surface of character segment on the firstth and the upper surface of second day character segment are even Connecing, metal frame cross section is inverted T-shaped, and the vertical portion of this inverted T-shaped is character segment on the firstth, this inverted T-shaped Lateral part is second day character segment, and the first oral area of framework is provided with the first copper sheet, and the second oral area of framework is provided with Second copper sheet, the first copper sheet inserts the peripheral part in PPA plastics, the second copper sheet inserts the week in PPA plastics Rim portion is respectively positioned on above metal frame, and the first copper sheet surface is bonded with chip through heat-conducting glue, although above-mentioned support tool There are preferable intensity and preferable heat dispersion, but chip be all located at character segment on the firstth, say, that be to the left, The property placed in the middle of chip is to be improved.

Utility model content

Technical problem to be solved in the utility model is, overcomes the defect of prior art, it is provided that a kind of small-power High light efficiency LED light source, chip is the most placed in the middle.

For solving above-mentioned technical problem, the utility model proposes a kind of small-power high light efficiency LED light source, it includes The object of support, chip and the covering printing opacity containing fluorescent material on chip, support is that insulant is made Day glyph framework, day the first oral area of glyph framework be provided with the first copper sheet, day the second oral area of glyph framework be provided with Second copper sheet, the upper surface of the divider between the first oral area and the second oral area, the upper surface of the first copper sheet, This three of the upper surface of two copper sheets maintains an equal level to form an installed surface, and this installed surface, less than the upper surface of support, is installed Face connects sapphire substrate, and the upper surface of sapphire substrate is higher than the upper surface of support, and chip is positioned in support Above portion and be arranged on sapphire substrate upper surface, sapphire substrate surface is provided with metallic circuit, and metallic circuit divides For between chip and the first copper sheet electrical connection the first metallic circuit, between chip electrical connection second Metallic circuit, between chip and the second copper sheet electrical connection the 3rd metallic circuit；Based on metallic circuit, the One copper sheet, each chip, the second copper sheet are sequentially electrically connected to form series connection.

After using said structure, compared with prior art, this utility model has the advantage that due to divider Upper surface, the upper surface of the first copper sheet, the second copper sheet this three of upper surface maintain an equal level to form an installed surface, Sapphire substrate just thus can be centrally located providing base for chip across the first oral area and the second oral area Plinth, therefore, overall plan can make chip substantially placed in the middle, additionally, obtain based on day glyph framework is whole Body scheme so that this utility model can use as SMD element, adapts to the paster during later stage LED produces Formula production line.

As improvement, chip upside down is arranged on sapphire substrate upper surface；Sapphire substrate lower surface is provided with insulation Reflector layer, the part that this insulation reflector layer is positioned at the first copper sheet is provided with the first metal being connected with the first metallic circuit Conductive layer, the part that this insulation reflector layer is positioned at the second copper sheet is provided with the second metal being connected with the second metallic circuit Conductive layer, the upper surface of the first metal conducting layer and the first copper sheet through conducting resinl connect, the second metal conducting layer with Second copper sheet upper surface connects through conducting resinl, so, is more beneficial for improving light extraction efficiency, is more beneficial for Gao Guang Effect.

Accompanying drawing explanation

Fig. 1 is the top view of this utility model small-power high light efficiency LED light source.

Fig. 2 is that the A-A of this utility model small-power high light efficiency LED light source is to sectional view.

Shown in figure, 1, support, 2, chip, 3, the object of printing opacity, the 4, first copper sheet, the 5, second bronze medal Sheet, 6, sapphire substrate, 7, insulation reflector layer, 8, divider, the 9, first metallic circuit, 10, second Metallic circuit, the 11, the 3rd metallic circuit, the 12, first metal conducting layer, the 13, second metal conducting layer, 14, First conducting resinl, the 15, second conducting resinl, 16, thermal plastic insulation.

Detailed description of the invention

Below this utility model is described in further detail:

This utility model small-power high light efficiency LED light source, it includes support 1, chip 2 and covers at chip 2 On the object 3 of the printing opacity containing fluorescent material, the day glyph framework that support 1 is made for insulant, day font First oral area of framework is provided with the first copper sheet 4, day the second oral area of glyph framework be provided with the second copper sheet 5, first The upper surface of divider 8 between oral area and the second oral area, the upper surface of the first copper sheet 4, the second copper sheet 5 This three of upper surface maintain an equal level to form an installed surface, this installed surface is less than the upper surface of support 1, and installed surface is even Being connected to sapphire substrate 6, the upper surface of sapphire substrate 6 is higher than the upper surface of support 1, and chip 2 is positioned at and props up In the middle part of frame 1 top and be arranged on sapphire substrate 6 upper surface, sapphire substrate 6 surface is provided with metallic circuit, Metallic circuit is divided into the first metallic circuit 9 for electrically connecting between chip 2 and the first copper sheet 4, for chip Between 2 electrical connection the second metallic circuit 10, between chip 2 and the second copper sheet 5 electrical connection the 3rd gold medal Belong to circuit 11；Based on metallic circuit, the first copper sheet 4, each chip the 2, second copper sheet 5 sequentially electrically connect with shape Become series connection.

Chip 2 is two, is the same rectangular dies of structure 2, two rectangular dies about 2 distributions phase The most parallel, the second metallic circuit 10 is angularly disposed, and an electrode of lower die 2 is positioned at lower die 2 The lower right corner.

Chip 2 is reverse mounted at sapphire substrate 6 upper surface；It is reflective that sapphire substrate 6 lower surface is provided with insulation Layer 7, this insulation reflector layer 7 is positioned at the part of the first copper sheet 4 and is provided with first be connected with the first metallic circuit 9 Metal conducting layer 12, this insulation reflector layer 7 is positioned at the part of the second copper sheet 5 and is provided with and the second metallic circuit 10 The second metal conducting layer 13 connected, the upper surface of the first metal conducting layer 12 and the first copper sheet 4 is led through first Electricity glue 14 connects, and the second metal conducting layer 13 is connected through the second conducting resinl 15 with the second copper sheet 5 upper surface.

In this example, the first metal conducting layer 12 is positioned on the left of sapphire substrate 6, the second metal conducting layer 13 On the right side of sapphire substrate 6, it is provided with insulation between the first metal conducting layer 12 and the second metal conducting layer 13 and leads Hot glue 16, insulation reflector layer 7 between the first metal conducting layer 12 and the second metal conducting layer 13 Part is connected with installed surface through thermal plastic insulation 16, and so, one provides more preferably support to sapphire substrate 6, The two thermal plastic insulation 16 is positioned at the lower section of chip 2 position, is more beneficial for heat conduction, heat radiation, and three is exhausted First metal conducting layer 12 and the second metal conducting layer 13 are thoroughly separated by edge heat-conducting glue 16；Metallic circuit with And the making of conductive metal layer uses prior art, it is not added with repeating；The object 3 of printing opacity uses transparent colloid, Due to transparent, for succinct diagram, Fig. 1 be not drawn into the object 3 of printing opacity, and draw signal in fig. 2；Lift The support 1 of example is ordinary construction, naturally it is also possible to is the multiple structure of background technology introduction, uses multiple structure, For intensity, heat conduction, heat radiation can be more preferably.

The above is only better embodiment of the present utility model, therefore all according to the structure described in present patent application scope Make, equivalence change that feature and principle are done or modify, be all included in this utility model patent claim.

Claims (2)

1. a small-power high light efficiency LED light source, it includes support (1), chip (2) and covers at chip (2) object (3) of the printing opacity containing fluorescent material on, support (1) is the day font frame that insulant is made Frame, day the first oral area of glyph framework be provided with the first copper sheet (4), day the second oral area of glyph framework be provided with second Copper sheet (5), it is characterised in that the upper surface of the divider (8) between the first oral area and the second oral area, The upper surface of one copper sheet (4), this three of upper surface of the second copper sheet (5) maintain an equal level to form an installed surface, should Installed surface is less than the upper surface of support (1), and installed surface connects sapphire substrate (6), sapphire substrate (6) Upper surface higher than the upper surface of support (1), chip (2) is positioned at above support (1) middle part and is arranged on Sapphire substrate (6) upper surface, sapphire substrate (6) surface is provided with metallic circuit, and metallic circuit is divided into use Between chip (2) and the first copper sheet (4) electrical connection the first metallic circuit (9), for chip (2) Between electrical connection the second metallic circuit (10), between chip (2) and the second copper sheet (5) electrical connection The 3rd metallic circuit (11)；Based on metallic circuit, the first copper sheet (4), each chip (2), the second copper sheet (5) series connection sequentially it is electrically connected to form.

Small-power high light efficiency LED light source the most according to claim 1, it is characterised in that chip (2) Reverse mounted at sapphire substrate (6) upper surface；Sapphire substrate (6) lower surface is provided with insulation reflector layer (7), The part that this insulation reflector layer (7) is positioned at the first copper sheet (4) is provided with and is connected with the first metallic circuit (9) First metal conducting layer (12), the part that this insulation reflector layer (7) is positioned at the second copper sheet (5) is provided with and the The second metal conducting layer (13) that two metallic circuits (10) connect, the first metal conducting layer (12) and first The upper surface of copper sheet (4) connects through the first conducting resinl (14), the second metal conducting layer (13) and the second bronze medal Sheet (5) upper surface connects through the second conducting resinl (15).