CN205590788U - Internal type magnetron sputtering target coating machine - Google Patents

Internal type magnetron sputtering target coating machine Download PDF

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Publication number
CN205590788U
CN205590788U CN201620333221.5U CN201620333221U CN205590788U CN 205590788 U CN205590788 U CN 205590788U CN 201620333221 U CN201620333221 U CN 201620333221U CN 205590788 U CN205590788 U CN 205590788U
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CN
China
Prior art keywords
substrate frame
cover body
wheel rim
target
evaporation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201620333221.5U
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Chinese (zh)
Inventor
丁进金
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shaoxing Xinxing Textile Laser Technology Co Ltd
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Shaoxing Xinxing Textile Laser Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shaoxing Xinxing Textile Laser Technology Co Ltd filed Critical Shaoxing Xinxing Textile Laser Technology Co Ltd
Priority to CN201620333221.5U priority Critical patent/CN205590788U/en
Application granted granted Critical
Publication of CN205590788U publication Critical patent/CN205590788U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to a coating machine, it includes the bell housing body, cover body top sets up vacuum cap top flange, the cover body sub -unit connection vacuum system cover internal portion and is provided with substrate frame rotatory wheel rim, evaporation source and baffle, the rotatory wheel rim of substrate frame passes through the transfer line and cover body bottom links to each other, the evaporation source sets up in the baffle below, the baffle pass through the evaporation shield dwang and cover body bottom links to each other, and rotatable sputter substrate frame is installed to the rotatory wheel rim one end of substrate frame, and lie in the top of plate washer and install evaporation substrate frame on sputtering the vertical orientation of substrate frame, the rotatory wheel rim mid -mounting of substrate frame has the target body, the vertical orientation of the rotatory wheel rim other end of substrate frame is installed and is sputtered the baffle in advance, it installs the roast device with stoving to sputter baffle one side in advance. The utility model discloses an installation internal type magnetron sputtering target has increased original coating machine's function, make can the system of plating the film scope increase widely.

Description

A kind of embedded magnetic control sputtering target coater
Technical field
This utility model relates to a kind of coater, specifically, built-in particularly to one Formula magnetic controlled sputtering target coater.
Background technology
Coater refers mainly to the plated film that a class needs to carry out under higher vacuum, specifically wraps Include many types, evaporate including vacuum ionic, magnetron sputtering, MBE molecular beam epitaxy, PLD pulsed laser depositions etc. are a variety of.Main thought is divided into evaporation and two kinds of bases of sputtering In this point, needing the substrate that is referred to as of plated film, the material of plating is referred to as target.Substrate with Target is with in the vacuum chamber.
Evaporation coating is usually heating target makes surface component with atomic group or ionic species quilt It is evaporated.And be deposited in substrate surface, by film forming procedure scatterplot-island structure- Fan walks structure-layer growth and forms thin film.For sputtering class plated film, can simply be interpreted as Utilize electronics or superlaser bombardment target, and make surface component with atomic group or ion shape Formula is sputtered out, and is eventually deposited at substrate surface, experiences film forming procedure, finally Form thin film.
Original vacuum resistance heating evaporation coater is transformed by the applicant, On the basis of retaining its vacuum vapor plating original function, according to the construction features of coater, Devise a kind of embedded magnetic control sputtering target integrating evaporation coating and magnetic control film coating Coater.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, it is provided that Yi Zhongji Evaporation coating and magnetic control film coating are in the embedded magnetic control sputtering target coater of one.
This utility model solves problem and the technical scheme is that
A kind of embedded magnetic control sputtering target coater, including bell cover body, above described cover body Arranging vacuum (-tight) housing top flange, described cover body bottom connects vacuum system, in described cover body Portion is provided with substrate frame and rotates wheel rim, evaporation source and baffle plate, and described substrate frame rotates wheel Circle is connected with bottom cover body by drive link, and described evaporation source is arranged at below baffle plate, institute Stating baffle plate to be connected bottom described cover body by evaporation shield rotation bar, described substrate frame is revolved Runner circle one end is provided with rotatable sputtering substrate frame, is positioned at the top of plate washer and is spattering Penetrating and be provided with evaporation substrate frame on substrate frame vertical direction, described substrate frame rotates in wheel rim Portion is provided with target body, and described substrate frame rotates wheel rim other end vertical direction and is provided with pre-spattering Penetrating baffle plate, described pre-sputtering baffle plate side is provided with heated baking device.
In above-mentioned a kind of embedded magnetic control sputtering target coater, described target body is neodymium iron boron Permanent magnet.
In above-mentioned a kind of embedded magnetic control sputtering target coater, it is connected with inside described target body Cooling water.
In above-mentioned a kind of embedded magnetic control sputtering target coater, described cover body inner upper end It is provided with Baking out device.
In above-mentioned a kind of embedded magnetic control sputtering target coater, install below described target body There is target stand.
The beneficial effects of the utility model are: this utility model is by installing built-in type magnetic control Sputtering target, adds the function of original coater, make it to meet simultaneously evaporation coating and The requirement of sputter coating, the quality that improve equipment with prepare thin film, and make to be coated with Membrane domains greatly increase.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure: 1, cover body, 2, vacuum (-tight) housing top flange, 3, vacuum system, 4, base Horse rotates wheel rim, and 5, evaporation source, 6, baffle plate, 7, drive link, 8, evaporation shield Rotate bar, 9, sputtering substrate frame, 10, evaporation substrate frame, 11, target body, 12, heating Apparatus for baking, 13, pre-sputtering baffle plate, 14, Baking out device, 15, target stand.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail
Fig. 1 shows a kind of embodiment of the present utility model, and a kind of built-in type magnetic control spatters Shooting at the target coater, including bell cover body 1, described cover body 1 is provided above vacuum (-tight) housing top method Blue 2, described cover body 1 bottom connects vacuum system 3, and described cover body 1 is internally provided with base Horse rotates wheel rim 4, evaporation source 5 and baffle plate 6, and described substrate frame rotates wheel rim 4 Being connected bottom cover body 1 by drive link 7, described evaporation source 5 is arranged at baffle plate 6 times Side, described baffle plate 6 rotates bar 8 by evaporation shield and is connected bottom described cover body 1, Described substrate frame rotates wheel rim 4 one end and is provided with rotatable sputtering substrate frame 9, is positioned at The top of plate washer 6 and be provided with evaporation substrate frame on sputtering substrate frame 9 vertical direction 10, described substrate frame rotates and is provided with target body 11, described target body 11 times in the middle part of wheel rim 4 Side is provided with target stand 15, the Nd-Fe-B permanent magnet of target body internal arrangement definite shape, and leads to Having cooling water, the actual measurement magnetic field intensity of target surface sputtering zone is 450 Gausses.Cooling water passes through Bottom vacuum chamber of film coating machine, standby hole introduces vacuum chamber, and develops special water pipe head Make target and cooling water pipe to be tightly connected reliably, do not result in again short circuit.Described base Horse rotates wheel rim 4 other end vertical direction and is provided with pre-sputtering baffle plate 13, described pre-spatters Penetrating baffle plate 6 side and be provided with heated baking device 12, described cover body 1 inner upper end is arranged There is Baking out device 14.Heated baking device 12 or Baking out device 14 are all Conventional resistance heating manner, is just not repeated at this.
Vacuum chamber is mounted with to carry out substrate heated baking device 12, baking power supply and Shielding power supply all standby holes from vacuum chamber of film coating machine base plate introduce.At evaporation coating Substrate frame rotates substrate frame and the baffle plate of vertically-mounted sputter coating on wheel rim 4.When During pre-sputtering, baffle plate is positioned at the opposite of target, and connects the rotation of evaporator original substrate when sputtering Turn power supply, make sputtering substrate frame 9 in the face of target and around sputtering target rotation.Evaporate and spatter Penetrating division board makes original vacuum film coating chamber be separated into two coating film area in left and right, the most not Impact.Owing to during sputter coating, substrate can rotate around target, thus can prepare area big, The thin film that uniformity is good.Can be evaporated and sputter coating in same first use.Example As carried out Vacuum Deposition pyrite, before doing and evaporating, sputtering substrate frame is made to be placed in the right opposite of target, Prevent from polluting during evaporation the substrate of sputtering.After finishing evaporation, pre-sputtering baffle plate is rotated To the right opposite of target, at PAr=0.5Pa, sputtering power are to carry out under 1300~2000W Pre-sputtering, is then turned on rotating mechanism and carries out the sputter coating under substrate rotates, it is possible to very Intuitively according to the difference of color sample, it is recognised that the decomposition of alloy evaporation can cause thin film Lamination, and sputter coating substantially can make the composition of sputtered film and sputtering target material Composition keeps consistent.
This utility model, by installing embedded magnetic control sputtering target, adds original coater Function, make it to meet the requirement of evaporation coating and sputter coating simultaneously, improve and set Standby with prepare the quality of thin film, and make the membrane domains that can be coated with greatly increase.
The above is only preferred implementation of the present utility model, it is noted that for For those skilled in the art, before without departing from this utility model principle Putting, it is also possible to this utility model is carried out some improvement and modification, these improve and repair Decorations also fall in this utility model scope of the claims.

Claims (5)

  1. null1. an embedded magnetic control sputtering target coater,Including bell cover body (1),Described cover body (1) is provided above vacuum (-tight) housing top flange (2),Described cover body (1) bottom connects vacuum system (3),Described cover body (1) is internally provided with substrate frame and rotates wheel rim (4)、Evaporation source (5) and baffle plate (6),Described substrate frame is rotated wheel rim (4) and is connected with cover body (1) bottom by drive link (7),Described evaporation source (5) is arranged at baffle plate (6) lower section,Described baffle plate (6) rotates bar (8) by evaporation shield and is connected with described cover body (1) bottom,It is characterized in that: described substrate frame rotates wheel rim (4) one end and is provided with rotatable sputtering substrate frame (9),It is positioned at the top of baffle plate (6) and on sputtering substrate frame (9) vertical direction, evaporation substrate frame (10) is installed,Described substrate frame rotates wheel rim (4) middle part and is provided with target body (11),Described substrate frame rotates wheel rim (4) other end vertical direction and is provided with pre-sputtering baffle plate (13),Described pre-sputtering baffle plate (6) side is provided with heated baking device (12).
  2. A kind of embedded magnetic control sputtering target coater the most according to claim 1, it is characterised in that: described target body (11) is Nd-Fe-B permanent magnet.
  3. A kind of embedded magnetic control sputtering target coater the most according to claim 2, it is characterised in that: described target body (11) is internal is connected with cooling water.
  4. A kind of embedded magnetic control sputtering target coater the most according to claim 1, it is characterised in that: described cover body (1) inner upper end is provided with Baking out device (14).
  5. 5. according to a kind of embedded magnetic control sputtering target coater according to any one of claim 1-4, it is characterised in that: described target body (11) lower section is provided with target stand (15).
CN201620333221.5U 2016-04-18 2016-04-18 Internal type magnetron sputtering target coating machine Expired - Fee Related CN205590788U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620333221.5U CN205590788U (en) 2016-04-18 2016-04-18 Internal type magnetron sputtering target coating machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620333221.5U CN205590788U (en) 2016-04-18 2016-04-18 Internal type magnetron sputtering target coating machine

Publications (1)

Publication Number Publication Date
CN205590788U true CN205590788U (en) 2016-09-21

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Application Number Title Priority Date Filing Date
CN201620333221.5U Expired - Fee Related CN205590788U (en) 2016-04-18 2016-04-18 Internal type magnetron sputtering target coating machine

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108531870A (en) * 2018-05-21 2018-09-14 陈宝泗 A kind of novel evacuated coating apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108531870A (en) * 2018-05-21 2018-09-14 陈宝泗 A kind of novel evacuated coating apparatus

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160921

Termination date: 20170418