CN205564725U - Wafer automatic correction of device - Google Patents
Wafer automatic correction of device Download PDFInfo
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- CN205564725U CN205564725U CN201620400361.XU CN201620400361U CN205564725U CN 205564725 U CN205564725 U CN 205564725U CN 201620400361 U CN201620400361 U CN 201620400361U CN 205564725 U CN205564725 U CN 205564725U
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- wafer
- ring
- jamming claw
- locating ring
- automatic correction
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Abstract
The utility model provides a wafer automatic correction of device, remove subassembly, camera including rotating assembly, XY, rotating assembly includes holding ring, power component and bottom plate, the appearance of holding ring is the ring, the interior disc and the wafer annular form adaptation of holding ring, power component drives the holding ring rotation, power component fixes on the bottom plate, the bottom plate is fixed XY removes the subassembly upper surface, the camera is fixed the top of holding ring. Acquire the wafer through the camera and encircle position and the angle that goes up the wafer, rectify the wafer through XY removal subassembly and rotating assembly and encircle the upward position and the angle of wafer, realize the automatic correction of of wafer position and angle.
Description
Technical field
This utility model relates to wafer position correcting unit technical field, particularly to a kind of wafer from dynamic(al) correction
Device.
Background technology
Bonder is the key equipment in LED packing producing line, and its die bond process is: point glue equipment is first at base
On the die bond station of plate put glue, then by swing arm (also referred to as crystal taking arm) by wafer (LED chip) from wafer
Take out on ring, then be transferred on die bond station the most for dispensing glue.When acceptable wafers all on wafer ring all by
Taking out, wafer ring just takes off from wafer station, and again puts a wafer ring, has proofreaded angle, then has opened
Beginning die bond.Currently mainly using and manually taken out by the wafer on wafer ring, manual operation is in the mistake of check and correction angle
Journey is difficult to control to, particularly with the identification mistake of the positive antielectrode of bipolar electrode chip, chip electrode will be caused to pacify
Wrongly installed mistake, causes damage.
The Chinese invention patent of Publication No. CN1824592B discloses a kind of wafer transfer device, this wafer
Transporter includes that it operates the mechanical arm assembly controlled by driving means, the grafter placing wafer thereon
And holder, this holder is used for the wafer orientation being placed on grafter and fixes, i.e. passing through holder
Secure the wafer on grafter, mechanical arm assembly drive grafter to move, although using mechanical arm assembly permissible
Realize the location of wafer, but have and produce and R&D costs height, the shortcoming of programming complexity.
Utility model content
Technical problem to be solved in the utility model is: provide the wafer of a kind of accurate positioning to fill from dynamic(al) correction
Put.
In order to solve above-mentioned technical problem, the technical solution adopted in the utility model is:
A kind of wafer automatic correction device, including rotary components, XY moving assembly, photographic head, described rotation
Assembly includes that locating ring, Power Component and base plate, the profile of described locating ring are annulus, described locating ring
Inner headed face is adaptive with wafer ring-shaped, and described Power Component drives described locating ring rotation, described Power Component
Being fixed on described base plate, described base plate is fixed on described XY moving assembly upper surface, and described photographic head is solid
It is scheduled on the top of described locating ring.
Further, described rotary components also includes change, the roller bearing of at least three circle distribution, institute
The projection of shape stating change is circular or annular, outside the periphery of described change is with described roller bearing
Disc shape adaptation, and described change is slidably matched with described roller bearing, described roller bearing is fixed on institute
State on base plate.
Further, described rotary components also includes fixing post, and described base plate is provided with the first through hole, described
Fixing post is spirally connected through the inner ring of described first through hole and roller bearing with nut.
Further, described Power Component includes conveyer belt, the first belt wheel, the second belt wheel, motor, described
Conveyer belt engages with described first belt wheel and the second belt wheel, and described first belt wheel connects with the output shaft of described motor
Connecing, described second belt wheel is fixing with described change and locating ring to be connected.
Further, described conveyer belt is synchronous cog belt.
Further, also include snap ring assemblies, described snap ring assemblies include left jamming claw, right jamming claw, left spring,
Right spring, cylinder, described left jamming claw is symmetrical set with right jamming claw, and is rotationally connected with described locating ring,
Described left jamming claw is near being provided with left spring between the end of right jamming claw and described locating ring, described right jamming claw is close
Being provided with right spring between end and the locating ring of left jamming claw, the piston rod of described cylinder touches described when ejecting
Left jamming claw and the immediate both ends of right jamming claw.
Further, described snap ring assemblies also includes being abutted against post, described in be abutted against the cross sectional shape of post be T-shaped,
The described post that is abutted against is fixed on described locating ring, and is oppositely arranged with described left jamming claw and right jamming claw, described leans on
The periphery connecing post contacts with wafer ring.
Further, it is the convex of inclined-plane that the end face that described left jamming claw contacts with wafer ring with right jamming claw is provided with bottom surface
Edge.
Further, also to include that detection lug and sensor, described detection lug are fixed on described for described rotary components
On locating ring, described sensor is fixed on described base plate, for sensing the presence or absence of described detection lug.
The beneficial effects of the utility model are: wafer is array arrangement on wafer ring, and wafer ring is fixed on fixed
On the ring of position, Power Component drives locating ring rotation, realizes the locating ring rotation around self by rotary components,
Realizing locating ring movement in horizontal plane by XY moving assembly, photographic head is positioned at the top of locating ring,
Wafer ring set is connected on locating ring, and during use, photographic head maintains static, and locating ring and wafer ring can be in levels
Move in face and rotate, then photographic head is for obtaining position and the angle of wafer on wafer ring, and XY moves group
Part and rotary components are used for position and the angle of each wafer on calibration wafer ring, rational in infrastructure, simple operation,
After facilitating position and the angle of each wafer on positioning correcting wafer ring, the position of wafer and angle correct accurately,
It is easy to subsequent handling directly use, improves production efficiency and qualification rate.
Accompanying drawing explanation
Fig. 1 be the wafer automatic correction device of this utility model embodiment turn figure；
Fig. 2 is the rotary components explosive view with snap ring assemblies of this utility model embodiment；
Fig. 3 is the rotary components installation diagram with snap ring assemblies of this utility model embodiment；
Fig. 4 is the installation diagram of the XY moving assembly of this utility model embodiment；
Fig. 5 is the structural representation of the left jamming claw of this utility model embodiment.
Label declaration:
1, rotary components；2, snap ring assemblies；3, XY moving assembly；4, photographic head；5, wafer ring；
11, change；12, roller bearing；13, base plate；131, the first through hole；14, fixing post；15、
Locating ring；16, Power Component；161, conveyer belt；162, the first belt wheel；163, the second belt wheel；164、
Motor；17, detection lug；18, sensor；
21, left jamming claw；211, convex edge；22, right jamming claw；23, left spring；24, right spring；25, gas
Cylinder；26, it is abutted against post.
Detailed description of the invention
By describing technology contents of the present utility model in detail, being realized purpose and effect, below in conjunction with embodiment party
Formula also coordinates accompanying drawing to be explained.
The design of this utility model most critical is: obtained position and the angle of wafer on wafer ring by photographic head
Degree, by the position of wafer on XY moving assembly and rotary components calibration wafer ring and angle, it is achieved wafer
Position and angle from dynamic(al) correction.
Refer to Fig. 1 to Fig. 5, this utility model provides a kind of wafer automatic correction device, including rotation group
Part 1, XY moving assembly 3, photographic head 4, described rotary components 1 includes locating ring 15, Power Component 16
With base plate 13, the profile of described locating ring 15 is annulus, the inner headed face of described locating ring 15 and wafer ring 5
Shape adaptation, described Power Component 16 drives the rotation of described locating ring 15, described Power Component 16 to be fixed on
On described base plate 13, described base plate 13 is fixed on described XY moving assembly 3 upper surface, described photographic head 4
It is fixed on the top of described locating ring 15.
Further, described rotary components 1 also includes change 11, the roller bearing of at least three circle distribution
12, the projection of shape of described change 11 is circular or annular, and the periphery of described change 11 is with described
The periphery shape adaptation of roller bearing 12, and described change 11 is slidably matched with described roller bearing 12,
Described roller bearing 12 is fixed on described base plate 13.
Seen from the above description, by the roller bearing 12 of at least three and being slidably matched of change 11, real
Existing being rotationally connected between change 11 and base plate 13, the cross sectional shape of roller bearing 12 periphery is V-arrangement,
Roller bearing 12 and change 11 shape adaptation, the degree of freedom moving and rotating in change 11 space can be limited,
Compact conformation, takes up room little, and change 11 is smooth and easy relative to the rotation of base plate 13；The projection shape of change 11
Shape is circular or annular, then change 11 center is solid or hollow, has flexible structure, joint
Space-efficient advantage.
Further, described rotary components 1 also includes fixing post 14, and described base plate 13 is provided with the first through hole
131, described fixing post 14 is spirally connected through the inner ring of described first through hole 131 and roller bearing 12 with nut.
Seen from the above description, roller bearing 12 is fixing on base 13 by fixing post 14, simple in construction
Rationally, taken up space little.
Further, described Power Component 16 include conveyer belt the 161, first belt wheel the 162, second belt wheel 163,
Motor 164, described conveyer belt 161 engages with described first belt wheel 162 and the second belt wheel 163, and described first
Belt wheel 162 is connected with the output shaft of described motor 164, described second belt wheel 163 and described change 11 and calmly
Position ring 15 is fixing to be connected.
Seen from the above description, motor 164 rotates and drives the first belt wheel 162, conveyer belt 161 and the second belt wheel
163 rotate, and the second belt wheel 163 is fixed be connected with change 11 and locating ring 15, then the second belt wheel 163 rotates
Drive change 11 and locating ring 15 to rotate, it is achieved change 11 and the rotation of locating ring 15, rational in infrastructure tightly
Gather.
Further, described conveyer belt 161 is synchronous cog belt.
Seen from the above description, conveyer belt 161 is synchronous cog belt, has angle control precision height, uses
The advantage of life-span length.
Further, also include snap ring assemblies 2, described snap ring assemblies 2 include left jamming claw 21, right jamming claw 22,
Left spring 23, right spring 24, cylinder 25, described left jamming claw 21 is symmetrical set with right jamming claw 22, and
Being rotationally connected with described locating ring 15, described left jamming claw 21 is near the end of right jamming claw 22 and described locating ring
Being provided with left spring 23 between 15, described right jamming claw 22 is near between the end of left jamming claw 21 and locating ring 15
Being provided with right spring 24, the piston rod of described cylinder 25 touches described left jamming claw 21 and right jamming claw 22 when ejecting
Immediate both ends.
Seen from the above description, wafer ring 5 is fixed on locating ring 15, and left jamming claw 21 is right with right jamming claw 22
Claiming to arrange, left spring 23 is between left jamming claw 21 and locating ring 15, and right spring 24 is positioned at right jamming claw 22
And between locating ring 15, under left spring 23 and right spring 24 act on, left jamming claw 21 and right jamming claw 22 to
Locating ring 15 direction ejects, and i.e. regulates left jamming claw 21 and right jamming claw 22 by left spring 23 and right spring 24
Thrust on wafer ring 5, when the piston rod of cylinder 25 ejects by left jamming claw 21 together with right jamming claw 22
Ejecting, left jamming claw 21 does not contacts with wafer ring 5 with right jamming claw 22, it is achieved that the clamping of wafer ring 5
With send here, rational in infrastructure, run firm, the uniform force of wafer ring 5.
Further, described snap ring assemblies 2 also includes being abutted against post 26, described in be abutted against the cross sectional shape of post 26 and be
T-shaped, described in be abutted against post 26 and be fixed on described locating ring 15, and with described left jamming claw 21 and right jamming claw 22
Be oppositely arranged, described in be abutted against the periphery of post 26 and contact with wafer ring 5.
Seen from the above description, the opposite at left jamming claw 21 with right jamming claw 22 is provided with and is abutted against post 26, then wafer
Ring 5 one end contacts with left jamming claw 21 and right jamming claw 22, and the other end contacts with being abutted against post 26, and wafer ring 5 is fixed
Level is true；The cross sectional shape being abutted against post 26 is T-shaped, then can prevent wafer ring 5 from warpage occurring, make wafer ring
5 keep level, and the location repeatable accuracy of wafer ring 5 is high.
Further, the end face that described left jamming claw 21 contacts with wafer ring 5 with right jamming claw 22 is provided with bottom surface and is
The convex edge 211 on inclined-plane.
Seen from the above description, the end face that left jamming claw 21 contacts with wafer ring 5 with right jamming claw 22 is provided with bottom surface
For the convex edge 211 on inclined-plane, then, when left jamming claw 21 contacts with right jamming claw 22, can prevent wafer ring 5 from warpage occurring,
Ensure the levelness of wafer ring 5, it is ensured that the repetitive positioning accuracy of wafer ring 5.
Further, described rotary components 1 also includes detection lug 17 and sensor 18, described detection lug 17
Being fixed on described locating ring 15, described sensor 18 is fixed on described base plate 13, is used for sensing described
The presence or absence of detection lug 17.
Seen from the above description, the detection lug 17 that sensor 18 is connected with locating ring 15 for sensing, then pass
Sensor 18 can sense the angle that locating ring 15 rotates, and the position of detection lug 17 can be used for setting locating ring 15
The zero point angle position rotated, rational in infrastructure, it is simple to device interior runs and safeguards.
Refer to Fig. 1 to Fig. 5, embodiment one of the present utility model is:
A kind of wafer automatic correction device, including rotary components 1, XY moving assembly 3, photographic head 4, card
Ring assemblies 2, described rotary components 1 includes locating ring 15, Power Component 16, base plate 13, change 11, extremely
The roller bearing 12 of few three circle distribution, fixing post 14, detection lug 17 and sensor 18, described location
The profile of ring 15 is annulus, the inner headed face of described locating ring 15 and wafer ring 5 shape adaptation, described change
The projection of shape of 11 is circular or annular, the periphery of described change 11 and described roller bearing 12
Periphery shape adaptation, and described change 11 is slidably matched with described roller bearing 12, on described base plate 13
Being provided with the first through hole 131, described fixing post 14 is through described first through hole 131 and the inner ring of roller bearing 12
Be spirally connected with nut, described Power Component 16 include conveyer belt the 161, first belt wheel the 162, second belt wheel 163,
Motor 164, described conveyer belt 161 is synchronous cog belt, described conveyer belt 161 and described first belt wheel 162
Engaging with the second belt wheel 163, described first belt wheel 162 is connected with the output shaft of described motor 164, described
Second belt wheel 163 is fixed be connected with described change 11 and locating ring 15, and described Power Component 16 is fixed on institute
Stating on base plate 13, described base plate 13 is fixed on described XY moving assembly 3 upper surface, described detection lug 17
Being fixed on described locating ring 15, described sensor 18 is fixed on described base plate 13, is used for sensing described
The presence or absence of detection lug 17, described photographic head 4 is fixed on the top of described locating ring 15.
Described snap ring assemblies 2 includes left jamming claw 21, right jamming claw 22, left spring 23, right spring 24, cylinder
25, being abutted against post 26, described left jamming claw 21 is symmetrical set with right jamming claw 22, and with described locating ring 15
Being rotationally connected, described left jamming claw 21 is near being provided with left bullet between the end of right jamming claw 22 and described locating ring 15
Spring 23, described right jamming claw 22 near being provided with right spring 24 between the end of left jamming claw 21 and locating ring 15,
The piston rod of described cylinder 25 touches the immediate two ends of described left jamming claw 21 and right jamming claw 22 when ejecting
The end face that portion, described left jamming claw 21 and right jamming claw 22 contact with wafer ring 5 is provided with the convex edge that bottom surface is inclined-plane
211, described in be abutted against the cross sectional shape of post 26 be T-shaped, described in be abutted against post 26 and be fixed on described locating ring 15
On, and be oppositely arranged with described left jamming claw 21 and right jamming claw 22, described in be abutted against periphery and the wafer of post 26
Ring 5 contacts.
Wafer is circumference array arrangement on wafer ring 5, and wafer automatic correction device to realize on wafer ring 5
Each wafer carry out putting location with same putting position and angle.During use, adjust photographic head 4 with
Position between locating ring 15 and distance, be fixed on above locating ring 15 motionless by photographic head 4, sensor
18 existence detection lug 17 being detected, it is achieved the dead-center position correction of locating ring 15, the piston rod of cylinder 25
Stretch out, make left jamming claw 21 and right jamming claw 22 rotate, wafer ring 5 is placed on locating ring 15, cylinder 25
Piston rod retract, left jamming claw 21 and right jamming claw 22 are respectively under the effect of left spring 23 and right spring 24
Resilience, left jamming claw 21 and right jamming claw 22 block wafer ring 5, set on the opposite of left jamming claw 21 and right jamming claw 22
Resting against and connect post 26, wafer ring 5 abuts against and is abutted against on post 26, it is achieved between wafer ring 5 and locating ring 15
Fixing；Photographic head 4 obtains the pictorial information of wafer on wafer ring 5, and processor divides according to the picture received
Analysis judges the position of the wafer that photographic head 4 is directed at and angle the most correctly, if malposition, then passes through
XY moving assembly 3 is corrected, if angle is incorrect, is then corrected by rotary components 1, adjusts
After obtain the pictorial information of wafer again by photographic head 4, the picture received is carried out point by processor again
Analysis, until the position of the wafer of photographic head 4 alignment and angle are correct；The mechanical arm of subsequent processing is grabbed
Taking the wafer of correction good position, XY moving assembly 3 and rotary components 1 coordinate on wafer ring 5, next uses
Wafer position be tentatively adjusted in place, continue through photographic head 4 and obtain the pictorial information of wafer on wafer ring 5,
Repeat above-mentioned photographic head 4 to judge and wafer position angle correct process, until the wafer on wafer ring 5 by under
The mechanical arm of one operation captures complete；The piston rod contracting of cylinder 25 is stretched out, and makes left jamming claw 21 and right jamming claw
22 turn to separate with wafer ring 5, and the most used wafer ring 5 is removed, and repeat said process, complete
The position angle trimming process of wafer on subsequent wafer ring 5.
In sum, the wafer automatic correction device that this utility model provides, obtain wafer by photographic head 4
On ring 5, the position of wafer and angle, realize wafer ring 5 in horizontal plane along X by XY moving assembly 3
Direction of principal axis and the movement of Y direction, realized the rotation of wafer ring 5, pass through roller shaft by rotary components 1
Hold 12 and realize the change 11 rotation relative to base plate 13, by motor the 164, first belt wheel 162, second
Belt wheel 163, conveyer belt 161 drive change 11 rotation, change 11 time rotational locating ring 15 and wafer ring 5
Rotation together, i.e. by wafer on XY moving assembly 3 and rotary components 1 automatically calibrating wafer ring 5
Position and angle, realize wafer ring 5 position fixing on locating ring 15 by snap ring assemblies 2, and structure is closed
Flexibly, production efficiency is high for reason, and accurate positioning and repetitive positioning accuracy are high.It is easy in subsequent processing directly capture
Wafer on wafer ring 5 uses.
The foregoing is only embodiment of the present utility model, not thereby limit the scope of the claims of the present utility model,
Every equivalents utilizing this utility model description and accompanying drawing content to be made, or be directly or indirectly used in
Relevant technical field, is the most in like manner included in scope of patent protection of the present utility model.
Claims (9)
1. a wafer automatic correction device, it is characterised in that include rotary components, XY moving assembly,
Photographic head, described rotary components includes locating ring, Power Component and base plate, and the profile of described locating ring is circle
Ring, the inner headed face of described locating ring is adaptive with wafer ring-shaped, and described Power Component drives described locating ring certainly
Turning, described Power Component is fixed on described base plate, and described base plate is fixed on table on described XY moving assembly
Face, described photographic head is fixed on the top of described locating ring.
Wafer automatic correction device the most according to claim 1, it is characterised in that described rotary components
Also include change, the roller bearing of at least three circle distribution, the projection of shape of described change be circular or
Annular, the periphery shape adaptation of the periphery of described change and described roller bearing, and described change with
Described roller bearing is slidably matched, and described roller bearing is fixed on described base plate.
Wafer automatic correction device the most according to claim 2, it is characterised in that described rotary components
Also including fixing post, described base plate is provided with the first through hole, and described fixing post passes described first through hole and rolling
The inner ring of wheel bearing is spirally connected with nut.
Wafer automatic correction device the most according to claim 2, it is characterised in that described Power Component
Including conveyer belt, the first belt wheel, the second belt wheel, motor, described conveyer belt and described first belt wheel and second
Belt wheel engages, and described first belt wheel is connected with the output shaft of described motor, described second belt wheel and described change
Connection fixing with locating ring.
Wafer automatic correction device the most according to claim 4, it is characterised in that described conveyer belt is
Synchronous cog belt.
Wafer automatic correction device the most according to claim 1, it is characterised in that also include snap ring group
Part, described snap ring assemblies includes left jamming claw, right jamming claw, left spring, right spring, cylinder, described left jamming claw
Being symmetrical set with right jamming claw, and be rotationally connected with described locating ring, described left jamming claw is near right jamming claw
Be provided with left spring between end and described locating ring, described right jamming claw near the end of left jamming claw and locating ring it
Between be provided with right spring, the piston rod of described cylinder touches the closest of described left jamming claw and right jamming claw when ejecting
Both ends.
Wafer automatic correction device the most according to claim 6, it is characterised in that described snap ring assemblies
Also include being abutted against post, described in be abutted against the cross sectional shape of post be T-shaped, described in be abutted against post and be fixed on described locating ring
On, and be oppositely arranged with described left jamming claw and right jamming claw, described in be abutted against the periphery of post and contact with wafer ring.
Wafer automatic correction device the most according to claim 6, it is characterised in that described left jamming claw and
The end face that right jamming claw contacts with wafer ring is provided with the convex edge that bottom surface is inclined-plane.
Wafer automatic correction device the most according to claim 1, it is characterised in that described rotary components
Also including that detection lug and sensor, described detection lug are fixed on described locating ring, described sensor is fixed on
On described base plate, for sensing the presence or absence of described detection lug.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620400361.XU CN205564725U (en) | 2016-05-05 | 2016-05-05 | Wafer automatic correction of device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620400361.XU CN205564725U (en) | 2016-05-05 | 2016-05-05 | Wafer automatic correction of device |
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| Publication Number | Publication Date |
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| CN205564725U true CN205564725U (en) | 2016-09-07 |
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ID=56805849
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| Application Number | Title | Priority Date | Filing Date |
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| CN201620400361.XU Active CN205564725U (en) | 2016-05-05 | 2016-05-05 | Wafer automatic correction of device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810624A (en) * | 2016-05-05 | 2016-07-27 | 先进光电器材（深圳）有限公司 | Automatic wafer correction device |
| CN107665849A (en) * | 2017-11-09 | 2018-02-06 | 先进光电器材（深圳）有限公司 | A kind of LED wafer angle correct mechanism |
| CN108950487A (en) * | 2017-05-25 | 2018-12-07 | 株洲中车时代电气股份有限公司 | A kind of semiconductor chip apparatus for electron beam evaporation and its installation method |
-
2016
- 2016-05-05 CN CN201620400361.XU patent/CN205564725U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810624A (en) * | 2016-05-05 | 2016-07-27 | 先进光电器材（深圳）有限公司 | Automatic wafer correction device |
| CN108950487A (en) * | 2017-05-25 | 2018-12-07 | 株洲中车时代电气股份有限公司 | A kind of semiconductor chip apparatus for electron beam evaporation and its installation method |
| CN107665849A (en) * | 2017-11-09 | 2018-02-06 | 先进光电器材（深圳）有限公司 | A kind of LED wafer angle correct mechanism |
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