CN105810624A - Automatic wafer correction device - Google Patents
Automatic wafer correction device Download PDFInfo
- Publication number
- CN105810624A CN105810624A CN201610292436.1A CN201610292436A CN105810624A CN 105810624 A CN105810624 A CN 105810624A CN 201610292436 A CN201610292436 A CN 201610292436A CN 105810624 A CN105810624 A CN 105810624A
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- China
- Prior art keywords
- wafer
- jamming claw
- ring
- locating ring
- correction device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Abstract
The invention provides an automatic wafer correction device. The device comprises a rotation assembly, an XY moving assembly and a camera. The rotation assembly comprises a positioning ring, a power assembly and a base plate. The shape of the positioning ring is a circular ring. The inner round face of the positioning ring fits with the shape of a wafer ring. The power assembly drives the positioning ring to carry out autorotation. The power assembly is fixed on the base plate. The base plate is fixed on the upper surface of the XY moving assembly. The camera is fixed at upper side of the positioning ring. The position and angle of a wafer on the wafer ring are obtained through the camera. The position and angle of the wafer on the wafer ring are corrected through the XY moving assembly and the rotation assembly. The position and angle of the wafer are automatically corrected.
Description
Technical field
The present invention relates to wafer position correcting unit technical field, particularly to a kind of wafer automatic correction device.
Background technology
Bonder is the key equipment in LED packing producing line, its die bond process is: point glue equipment first puts glue on the die bond station of substrate, then by swing arm (also referred to as crystal taking arm), wafer (LED chip) is taken out from wafer ring, then be transferred on die bond station for dispensing glue.When acceptable wafers all on wafer ring are all removed, wafer ring just takes off wafer station, and again puts a wafer ring, has proofreaded angle, then has started die bond.Currently mainly adopting artificial by the wafer taking-up on wafer ring, manual operation is difficult to control in the process of check and correction angle, particularly with the identification mistake of the positive antielectrode of bipolar electrode chip, will cause chip electrode setup error, and cause damage.
The Chinese invention patent that publication number is CN1824592B discloses a kind of wafer transfer device, this wafer transfer device includes it and operates the mechanical arm assembly, the grafter placing wafer thereon and the holder that are controlled by driving device, this holder is for by the wafer orientation being placed on grafter and fix, namely secure the wafer on grafter by holder, grafter is driven to move by mechanical arm assembly, although adopting mechanical arm assembly can realize the location of wafer, but there is the shortcoming produced with R&D costs are high, programming is complicated.
Summary of the invention
The technical problem to be solved is: provide the wafer automatic correction device of a kind of accurate positioning.
In order to solve above-mentioned technical problem, the technical solution used in the present invention is:
A kind of wafer automatic correction device, including rotary components, XY moving assembly, photographic head, described rotary components includes locating ring, Power Component and base plate, the profile of described locating ring is annulus, the inner headed face of described locating ring is adaptive with wafer ring-shaped, and described Power Component drives described locating ring rotation, and described Power Component is fixed on described base plate, described base plate is fixed on described XY moving assembly upper surface, and described photographic head is fixed on the top of described locating ring.
nullThe beneficial effects of the present invention is: wafer is array arrangement on wafer ring，Wafer ring is fixed on locating ring，Power Component drives locating ring rotation，The locating ring rotation around self is realized by rotary components，Locating ring movement in horizontal plane is realized by XY moving assembly，Photographic head is positioned at the top of locating ring，Wafer ring set is connected on locating ring，During use，Photographic head maintains static，Locating ring and wafer ring can move in horizontal plane and rotate，Then photographic head is for obtaining position and the angle of wafer on wafer ring，The position of XY moving assembly and rotary components each wafer on calibration wafer ring and angle，Rational in infrastructure，Simple operation，Facilitate position and the angle of each wafer on positioning correcting wafer ring，Behind the position of wafer and angle correct accurately，It is easy to subsequent handling directly use，Improve production efficiency and qualification rate.
Accompanying drawing explanation
Fig. 1 be the wafer automatic correction device of the embodiment of the present invention turn figure；
Fig. 2 is the rotary components explosive view with snap ring assemblies of the embodiment of the present invention；
Fig. 3 is the rotary components installation diagram with snap ring assemblies of the embodiment of the present invention；
Fig. 4 is the installation diagram of the XY moving assembly of the embodiment of the present invention；
Fig. 5 is the structural representation of the left jamming claw of the embodiment of the present invention.
Label declaration:
1, rotary components；2, snap ring assemblies；3, XY moving assembly；4, photographic head；5, wafer ring；
11, change；12, roller bearing；13, base plate；131, the first through hole；14, fixing post；15, locating ring；16, Power Component；161, conveyer belt；162, the first belt wheel；163, the second belt wheel；164, motor；17, detection lug；18, sensor；
21, left jamming claw；211, convex edge；22, right jamming claw；23, left spring；24, right spring；25, cylinder；26, it is abutted against post.
Detailed description of the invention
By describing the technology contents of the present invention in detail, being realized purpose and effect, below in conjunction with embodiment and coordinate accompanying drawing to be explained.
The design of most critical of the present invention is in that: obtained position and the angle of wafer on wafer ring by photographic head, by the position of wafer on XY moving assembly and rotary components calibration wafer ring and angle, it is achieved wafer position and angle from dynamic(al) correction.
Refer to Fig. 1 to Fig. 5, the invention provides a kind of wafer automatic correction device, including rotary components 1, XY moving assembly 3, photographic head 4, described rotary components 1 includes locating ring 15, Power Component 16 and base plate 13, the profile of described locating ring 15 is annulus, the inner headed face of described locating ring 15 and wafer ring 5 shape adaptation, described Power Component 16 drives the rotation of described locating ring 15, described Power Component 16 is fixed on described base plate 13, described base plate 13 is fixed on described XY moving assembly 3 upper surface, and described photographic head 4 is fixed on the top of described locating ring 15.
Further, described rotary components 1 also includes the roller bearing 12 of change 11, at least three circle distribution, the projection of shape of described change 11 is circular or annular, the periphery shape adaptation of the periphery of described change 11 and described roller bearing 12, and described change 11 and described roller bearing 12 are slidably matched, described roller bearing 12 is fixed on described base plate 13.
Seen from the above description, by the roller bearing 12 of at least three and being slidably matched of change 11, realize being rotationally connected between change 11 and base plate 13, the cross sectional shape of roller bearing 12 periphery is V-arrangement, roller bearing 12 and change 11 shape adaptation, can limit degree of freedom that is mobile in change 11 space and that rotate, compact conformation, taking up room little, change 11 is smooth and easy relative to the rotation of base plate 13；The projection of shape of change 11 is circular or annular, then change 11 center is solid or hollow, has flexible structure, joint space-efficient advantage.
Further, described rotary components 1 also includes fixing post 14, and described base plate 13 is provided with the first through hole 131, and described fixing post 14 is spirally connected through the inner ring of described first through hole 131 and roller bearing 12 with nut.
Seen from the above description, roller bearing 12 is fixing on base 13 by fixing post 14, simple and reasonable, is taken up space little.
Further, described Power Component 16 includes conveyer belt the 161, first belt wheel the 162, second belt wheel 163, motor 164, described conveyer belt 161 engages with described first belt wheel 162 and the second belt wheel 163, described first belt wheel 162 is connected with the output shaft of described motor 164, and described second belt wheel 163 is fixed be connected with described change 11 and locating ring 15.
Seen from the above description, motor 164 rotates and drives the first belt wheel 162, conveyer belt 161 and the second belt wheel 163 to rotate, second belt wheel 163 is fixed be connected with change 11 and locating ring 15, then the second belt wheel 163 rotates and drives change 11 and locating ring 15 to rotate, realize change 11 and the rotation of locating ring 15, rational in infrastructure compact.
Further, described conveyer belt 161 is synchronous cog belt.
Seen from the above description, conveyer belt 161 is synchronous cog belt, the advantage with angle control precision height, long service life.
Further, also include snap ring assemblies 2, described snap ring assemblies 2 includes left jamming claw 21, right jamming claw 22, left spring 23, right spring 24, cylinder 25, described left jamming claw 21 is symmetrical set with right jamming claw 22, and be rotationally connected with described locating ring 15, described left jamming claw 21 is near being provided with left spring 23 between the end of right jamming claw 22 and described locating ring 15, described right jamming claw 22 is near being provided with right spring 24 between the end of left jamming claw 21 and locating ring 15, and the piston rod of described cylinder 25 touches the immediate both ends of described left jamming claw 21 and right jamming claw 22 when ejecting.
Seen from the above description, wafer ring 5 is fixed on locating ring 15, left jamming claw 21 and right jamming claw 22 are symmetrical arranged, left spring 23 is between left jamming claw 21 and locating ring 15, right spring 24 is between right jamming claw 22 and locating ring 15, under left spring 23 and right spring 24 act on, left jamming claw 21 and right jamming claw 22 eject to locating ring 15 direction, namely left jamming claw 21 and the right jamming claw 22 thrust on wafer ring 5 are regulated by left spring 23 and right spring 24, when the piston rod of cylinder 25 ejects, left jamming claw 21 is ejected together with right jamming claw 22, left jamming claw 21 does not now contact with wafer ring 5 with right jamming claw 22, achieve the clamping of wafer ring 5 and send here, rational in infrastructure, run firm, the uniform force of wafer ring 5.
Further, described snap ring assemblies 2 also includes being abutted against post 26, described in be abutted against the cross sectional shape of post 26 be T-shaped, described in be abutted against post 26 and be fixed on described locating ring 15, and be oppositely arranged with described left jamming claw 21 and right jamming claw 22, described in be abutted against the periphery of post 26 and contact with wafer ring 5.
Seen from the above description, be provided with on the opposite of left jamming claw 21 with right jamming claw 22 and be abutted against post 26, then wafer ring 5 one end contacts with left jamming claw 21 and right jamming claw 22, and the other end contacts with being abutted against post 26, wafer ring 5 accurate positioning；The cross sectional shape being abutted against post 26 is T-shaped, then can prevent wafer ring 5 from warpage occurring, and makes wafer ring 5 keep level, and the location repeatable accuracy of wafer ring 5 is high.
Further, the end face that described left jamming claw 21 contacts with wafer ring 5 with right jamming claw 22 is provided with the convex edge 211 that bottom surface is inclined-plane.
Seen from the above description, the end face that left jamming claw 21 contacts with wafer ring 5 with right jamming claw 22 is provided with the convex edge 211 that bottom surface is inclined-plane, then, when left jamming claw 21 contacts with right jamming claw 22, can prevent wafer ring 5 from warpage occurring, ensure the levelness of wafer ring 5, it is ensured that the repetitive positioning accuracy of wafer ring 5.
Further, described rotary components 1 also includes detection lug 17 and sensor 18, and described detection lug 17 is fixed on described locating ring 15, and described sensor 18 is fixed on described base plate 13, for sensing the presence or absence of described detection lug 17.
Seen from the above description, sensor 18 is for sensing the detection lug 17 being connected with locating ring 15, then sensor 18 can sense the angle that locating ring 15 rotates, and the position of detection lug 17 can be used for setting the zero point angle position that locating ring 15 rotates, rational in infrastructure, it is simple to device interior runs and safeguards.
Refer to Fig. 1 to Fig. 5, embodiments of the invention one are:
nullA kind of wafer automatic correction device，Including rotary components 1、XY moving assembly 3、Photographic head 4、Snap ring assemblies 2，Described rotary components 1 includes locating ring 15、Power Component 16、Base plate 13、Change 11、The roller bearing 12 of at least three circle distribution、Fixing post 14、Detection lug 17 and sensor 18，The profile of described locating ring 15 is annulus，The inner headed face of described locating ring 15 and wafer ring 5 shape adaptation，The projection of shape of described change 11 is circular or annular，The periphery shape adaptation of the periphery of described change 11 and described roller bearing 12，And described change 11 and described roller bearing 12 are slidably matched，Described base plate 13 is provided with the first through hole 131，Described fixing post 14 is spirally connected through the inner ring of described first through hole 131 and roller bearing 12 with nut，Described Power Component 16 includes conveyer belt 161、First belt wheel 162、Second belt wheel 163、Motor 164，Described conveyer belt 161 is synchronous cog belt，Described conveyer belt 161 engages with described first belt wheel 162 and the second belt wheel 163，Described first belt wheel 162 is connected with the output shaft of described motor 164，Described second belt wheel 163 is fixed be connected with described change 11 and locating ring 15，Described Power Component 16 is fixed on described base plate 13，Described base plate 13 is fixed on described XY moving assembly 3 upper surface，Described detection lug 17 is fixed on described locating ring 15，Described sensor 18 is fixed on described base plate 13，For sensing the presence or absence of described detection lug 17，Described photographic head 4 is fixed on the top of described locating ring 15.
nullDescribed snap ring assemblies 2 includes left jamming claw 21、Right jamming claw 22、Left spring 23、Right spring 24、Cylinder 25、It is abutted against post 26，Described left jamming claw 21 is symmetrical set with right jamming claw 22，And be rotationally connected with described locating ring 15，Described left jamming claw 21 is near being provided with left spring 23 between the end of right jamming claw 22 and described locating ring 15，Described right jamming claw 22 is near being provided with right spring 24 between the end of left jamming claw 21 and locating ring 15，The piston rod of described cylinder 25 touches the immediate both ends of described left jamming claw 21 and right jamming claw 22 when ejecting，The end face that described left jamming claw 21 contacts with wafer ring 5 with right jamming claw 22 is provided with the convex edge 211 that bottom surface is inclined-plane，The described cross sectional shape being abutted against post 26 is T-shaped，The described post 26 that is abutted against is fixed on described locating ring 15，And be oppositely arranged with described left jamming claw 21 and right jamming claw 22，The described periphery being abutted against post 26 contacts with wafer ring 5.
Wafer is circumference array arrangement on wafer ring 5, and wafer automatic correction device to realize carrying out putting location with same putting position and angle by each wafer on wafer ring 5.During use, adjust the position between photographic head 4 and locating ring 15 and distance, photographic head 4 is fixed on above locating ring 15 motionless, sensor 18 detects the existence of detection lug 17, realize the dead-center position correction of locating ring 15, the piston rod of cylinder 25 stretches out, left jamming claw 21 and right jamming claw 22 is made to rotate, wafer ring 5 is placed on locating ring 15, the piston rod of cylinder 25 is retracted, the resilience under the effect of left spring 23 and right spring 24 respectively of left jamming claw 21 and right jamming claw 22, left jamming claw 21 and right jamming claw 22 block wafer ring 5, left jamming claw 21 and right jamming claw 22 be provided opposite to be abutted against post 26, wafer ring 5 abuts against and is abutted against on post 26, realize fixing between wafer ring 5 and locating ring 15；Photographic head 4 obtains the pictorial information of wafer on wafer ring 5, according to the picture analyzing received, processor judges that whether the position of wafer that photographic head 4 is directed at and angle be correct, if malposition, then it is corrected by XY moving assembly 3, if angle is incorrect, then it is corrected by rotary components 1, after adjustment, obtains the pictorial information of wafer again by photographic head 4, the picture received is analyzed by processor again, until the position of the wafer of photographic head 4 alignment and angle are correct；The mechanical arm of subsequent processing captures the wafer of correction good position, XY moving assembly 3 and rotary components 1 coordinate and are tentatively adjusted in place by the wafer position of next use on wafer ring 5, continue through photographic head 4 and obtain the pictorial information of wafer on wafer ring 5, repeat above-mentioned photographic head 4 to judge and wafer position angle correct process, until the wafer on wafer ring 5 is captured complete by the mechanical arm of subsequent processing；The piston rod contracting of cylinder 25 is stretched out, and makes left jamming claw 21 and right jamming claw 22 turn to and separates with wafer ring 5, and used wafer ring 5 is removed, and repeats said process, completes the position angle trimming process of wafer on subsequent wafer ring 5.
nullIn sum，Wafer automatic correction device provided by the invention，Position and the angle of wafer on wafer ring 5 is obtained by photographic head 4，Wafer ring 5 movement along X-direction and Y direction in horizontal plane is realized by XY moving assembly 3，The rotation of wafer ring 5 is realized by rotary components 1，The change 11 rotation relative to base plate 13 is realized by roller bearing 12，By motor 164、First belt wheel 162、Second belt wheel 163、Conveyer belt 161 drives change 11 rotation，Change 11 time rotational locating ring 15 rotation together with wafer ring 5，Namely position and the angle of wafer on XY moving assembly 3 and rotary components 1 automatically calibrating wafer ring 5 are passed through，Wafer ring 5 position fixing on locating ring 15 is realized by snap ring assemblies 2，Rational in infrastructure flexibly，Production efficiency is high，Accurate positioning and repetitive positioning accuracy are high.The wafer being easy in subsequent processing on direct crawl wafer ring 5 uses.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every equivalents utilizing description of the present invention and accompanying drawing content to make, or directly or indirectly it is used in relevant technical field, all in like manner include in the scope of patent protection of the present invention.
Claims (9)
1. a wafer automatic correction device, it is characterized in that, including rotary components, XY moving assembly, photographic head, described rotary components includes locating ring, Power Component and base plate, and the profile of described locating ring is annulus, and the inner headed face of described locating ring is adaptive with wafer ring-shaped, described Power Component drives described locating ring rotation, described Power Component is fixed on described base plate, and described base plate is fixed on described XY moving assembly upper surface, and described photographic head is fixed on the top of described locating ring.
2. wafer automatic correction device according to claim 1, it is characterized in that, described rotary components also includes the roller bearing of change, at least three circle distribution, the projection of shape of described change is circular or annular, the periphery shape adaptation of the periphery of described change and described roller bearing, and described change and described roller bearing are slidably matched, described roller bearing is fixed on described base plate.
3. wafer automatic correction device according to claim 2, it is characterised in that described rotary components also includes fixing post, and described base plate is provided with the first through hole, described fixing post is spirally connected through the inner ring of described first through hole and roller bearing with nut.
4. wafer automatic correction device according to claim 2, it is characterized in that, described Power Component includes conveyer belt, the first belt wheel, the second belt wheel, motor, described conveyer belt engages with described first belt wheel and the second belt wheel, described first belt wheel is connected with the output shaft of described motor, and described second belt wheel is fixing with described change and locating ring to be connected.
5. wafer automatic correction device according to claim 4, it is characterised in that described conveyer belt is synchronous cog belt.
6. wafer automatic correction device according to claim 1, it is characterized in that, also include snap ring assemblies, described snap ring assemblies includes left jamming claw, right jamming claw, left spring, right spring, cylinder, described left jamming claw and right jamming claw are symmetrical set, and be rotationally connected with described locating ring, described left jamming claw is provided with left spring near between the end of right jamming claw and described locating ring, described right jamming claw is near being provided with right spring between the end and locating ring of left jamming claw, the piston rod of described cylinder touches the immediate both ends of described left jamming claw and right jamming claw when ejecting.
7. wafer automatic correction device according to claim 6, it is characterized in that, described snap ring assemblies also includes being abutted against post, the described cross sectional shape being abutted against post is T-shaped, the described post that is abutted against is fixed on described locating ring, and be oppositely arranged with described left jamming claw and right jamming claw, described in be abutted against the periphery of post and wafer loop contacts.
8. wafer automatic correction device according to claim 6, it is characterised in that the end face of described left jamming claw and right jamming claw and wafer loop contacts is provided with the convex edge that bottom surface is inclined-plane.
9. wafer automatic correction device according to claim 1, it is characterized in that, described rotary components also includes detection lug and sensor, and described detection lug is fixed on described locating ring, described sensor is fixed on described base plate, for sensing the presence or absence of described detection lug.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610292436.1A CN105810624A (en) | 2016-05-05 | 2016-05-05 | Automatic wafer correction device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610292436.1A CN105810624A (en) | 2016-05-05 | 2016-05-05 | Automatic wafer correction device |
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| Publication Number | Publication Date |
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| CN105810624A true CN105810624A (en) | 2016-07-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610292436.1A Pending CN105810624A (en) | 2016-05-05 | 2016-05-05 | Automatic wafer correction device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108986167A (en) * | 2017-06-05 | 2018-12-11 | 梭特科技股份有限公司 | It sets the bearing calibration of brilliant equipment and sets brilliant equipment using this method |
| CN112234004A (en) * | 2020-11-18 | 2021-01-15 | 深圳新益昌科技股份有限公司 | Chip automatic correction type die bonder |
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| CN1824592A (en) * | 2005-02-25 | 2006-08-30 | 细美事有限公司 | Wafer transfer device |
| CN102646572A (en) * | 2011-02-18 | 2012-08-22 | 株式会社日立高新技术仪器 | Die bonder and semiconductor manufacturing method |
| CN104191367A (en) * | 2014-08-29 | 2014-12-10 | 昆山仁特机械有限公司 | Cleaning and detecting device |
| CN104701233A (en) * | 2015-03-10 | 2015-06-10 | 北京七星华创电子股份有限公司 | Holding device for disc-like object |
| CN104867842A (en) * | 2014-02-26 | 2015-08-26 | 株式会社迪思科 | Method for detecting center of wafer of processing device |
| CN105304541A (en) * | 2015-09-30 | 2016-02-03 | 秦皇岛视听机械研究所 | Automatic semiconductor wafer positioning device |
| CN205564725U (en) * | 2016-05-05 | 2016-09-07 | 先进光电器材（深圳）有限公司 | Wafer automatic correction of device |
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2016
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1824592A (en) * | 2005-02-25 | 2006-08-30 | 细美事有限公司 | Wafer transfer device |
| CN102646572A (en) * | 2011-02-18 | 2012-08-22 | 株式会社日立高新技术仪器 | Die bonder and semiconductor manufacturing method |
| CN104867842A (en) * | 2014-02-26 | 2015-08-26 | 株式会社迪思科 | Method for detecting center of wafer of processing device |
| CN104191367A (en) * | 2014-08-29 | 2014-12-10 | 昆山仁特机械有限公司 | Cleaning and detecting device |
| CN104701233A (en) * | 2015-03-10 | 2015-06-10 | 北京七星华创电子股份有限公司 | Holding device for disc-like object |
| CN105304541A (en) * | 2015-09-30 | 2016-02-03 | 秦皇岛视听机械研究所 | Automatic semiconductor wafer positioning device |
| CN205564725U (en) * | 2016-05-05 | 2016-09-07 | 先进光电器材（深圳）有限公司 | Wafer automatic correction of device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108986167A (en) * | 2017-06-05 | 2018-12-11 | 梭特科技股份有限公司 | It sets the bearing calibration of brilliant equipment and sets brilliant equipment using this method |
| CN112234004A (en) * | 2020-11-18 | 2021-01-15 | 深圳新益昌科技股份有限公司 | Chip automatic correction type die bonder |
| CN112234004B (en) * | 2020-11-18 | 2021-06-18 | 深圳新益昌科技股份有限公司 | Chip automatic correction type die bonder |
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