CN205518836U - Automatic cleaning equipment - Google Patents

Abstract

The utility model discloses an automatic cleaning equipment, automatic cleaning equipment include the material loading platform, treat xi tai, a belt cleaning device, cleaning robot, material level, drying tunnel and unloading platform down. The material loading platform is for a plurality of chips of splendid attire. It is used for receiving the chip from the conveying of material loading platform to wait to wash the platform. Belt cleaning device is used for fixedly from waiting to wash the chip that the platform conveying comes, and belt cleaning device contains lifting supporting plate, adsorption component and bottom plate, and on adsorption component located the bottom plate, adsorption component was for the adsorption - core piece, and lifting supporting plate can be for the bottom plate and remove. Lifting supporting plate takes mobile core piece holding carrier to descend in order to expose the chip, and injection channel is used for spraying the dry ice powder to the chip. The material level is used for receiving the chip after belt cleaning device rinses down. The drying tunnel chip from the unloading bit traffic that is used for drying. The chip from the drying tunnel conveying is received to the unloading platform.

Description

Automatic cleaning equipment

Technical field

This utility model is related to a kind of clean device, refers in particular to a kind of remove attachment in the way of dry ice The automatic clearing apparatus of thing.

Background technology

Up-to-date semiconductor IC system level encapsulation (System in Package, SIP) skill upgrading The integrated level of chip, and microminiaturization can be realized.This SIP encapsulation technology has been applied successfully to respectively at present Plant Wifi chip module, wearable device (such as intelligent watch) circuit module and mobile device display and drive mould The production of block.For example, Apple will be at next-generation mobile phone, tablet PC and pens such as A7 processors Remember that this computer uses SIP encapsulation technology in a large number.

In terms of products application, the chip of SIP encapsulation mainly should be in small portable electronic product, in order to will be by The chip of this SIP encapsulation is directly embedded into interiors of products, and the profile of the chip of this SIP encapsulation have to be with product Shell matches, thus the profile of the chip of SIP encapsulation is no longer simple rectangle, therefore cannot use diamond grain Flywheel knife cuts, and must use cut, to cut out the contour curve meeting Product Assembly.

The chip of system in package has complete function, and the active parts such as Wifi therein, bluetooth is for electricity Passive component in road interferes, it is therefore necessary to by vacuum splashing and plating, chip is carried out electromagnetic isolation.And swash Light produced trace cinder on otch sticks on chip, has influence on the adhesive strength of sputtered layer, makes screen Cover metal level cannot effectively adhere to and easily come off, and then produce electromagnetic leakage, it is therefore necessary to before sputter Wash the cinder sticking on chip.

Existing cleaning method, is the mode with hairbrush washing, and this measure not only efficiency is low and needs waste water to process. Additionally, when vacuum splashing and plating, the chip double-sided adhesive of single is pasted on tool.Sputter completes After when tool takes off chip, chip still has the adhesive sticker soft flocks sticking jet-plating metallization, cause chip touch Point short-circuit risks.So, if the soft flocks that adhesive sticker is remained need to be washed, existing process is to use to have Machine solvent dissolves adhesive sticker, but organic solvent is the most poisonous and harmful human body, and preventing mechanism need to be had to protect.

Summary of the invention

This utility model provides a kind of automatic cleaning equipment, can effectively clean and produce on chip because of processing procedure The soft flocks that cinder and adhesive sticker are remained, the cinder washed down and soft flocks can be as general solid waste at Reason, thus reduce and endanger produced by human body.

An embodiment of the present utility model proposes a kind of automatic cleaning equipment, and automatic cleaning equipment includes a feeding Platform, one to be washed, one clean device, a cleaning robot, a blanking position, a Drying tunnel and once Material platform.Accommodating carrier on feeding platform is in order to contain multiple chip.To be washed the downstream being positioned at feeding platform, treats Wash platform in order to be received from the accommodating carrier taking up multiple chip that feeding platform transmits.Clean device and be positioned to be washed The downstream of platform, cleans device in order to fixing multiple chips on to be washed the accommodating carrier transmitted, cleaning dress Putting and comprise a lifting supporting plate, multiple absorbent module and a base plate, multiple absorbent module are located on base plate, many Individual absorbent module is in order to adsorb multiple chip, and lifting supporting plate can move relative to base plate.Cleaning robot coupling Being connected to clean device, cleaning robot comprises an injection channel, and wherein lifting supporting plate drives accommodating carrier to decline To expose multiple chip, injection channel is in order to by dry ice powderject to multiple chips.Blanking position is positioned at cleaning The downstream of device, blanking position is in order to receive the multiple chips after self-stripping unit cleans and accommodating carrier thereof.Dry Dry tunnel is positioned at the downstream of blanking position, and Drying tunnel is in order to dry the multiple chips transmitted from blanking position and to house Carrier.Blanking bench is positioned at the downstream of Drying tunnel, blanking bench be received from Drying tunnel transmit multiple chips and Accommodating carrier.

In one of this utility model embodiment, above-mentioned each absorbent module and base plate have a distance.

In one of this utility model embodiment, above-mentioned cleaning device further includes a trousers, multiple absorption groups Part, lifting supporting plate and base plate lay respectively in this trousers.

In one of this utility model embodiment, above-mentioned cleaning device further include a vacuum sensor, one liter Fall cylinder and a negative pressure cavity, negative pressure cavity is positioned under base plate, and vacuum sensor is positioned at negative pressure cavity, lifting Cylinder is positioned at trousers, and vacuum sensor, in order to the vacuum detected under base plate in negative pressure cavity, lifts vapour Cylinder connects lifting supporting plate, and lift cylinder is in order to moving lifting supporting plate.

In one of this utility model embodiment, above-mentioned automatic cleaning equipment further includes a dust-collecting filter, collection Dirt filter is communicated in cleaning device.

In one of this utility model embodiment, above-mentioned automatic cleaning equipment further includes an aerator and an electricity Heater, aerator is coupled to dust-collecting filter, and electric heater is coupled to aerator, and Drying tunnel is coupled to Electric heater.

In one of this utility model embodiment, above-mentioned automatic cleaning equipment further includes a dry ice pulverizer, dry Ice pulverizer is coupled to cleaning robot, and dry ice pulverizer is in order to provide dry ice powder to the spray of cleaning robot Penetrating passage, the negative pressure that dry ice powder is produced by compressed air sucks the injection channel of cleaning robot.

In one of this utility model embodiment, above-mentioned automatic cleaning equipment further include a feeding robot arm and One blanking robot arm, feeding robot arm is to be washed and cleans between device, and feeding robot arm is by be washed Accommodating carrier be sent to clean device, blanking robot arm is cleaning between device and blanking position, blanking machine Device hands will clean device clean after multiple chips and accommodating carrier be sent to blanking position.

In one of this utility model embodiment, above-mentioned automatic cleaning equipment further includes an airtight chamber, wherein To be washed, clean device, blanking position, Drying tunnel, this cleaning robot, this feeding robot arm with this under Material robot arm is all located in airtight chamber.

In one of this utility model embodiment, above-mentioned automatic cleaning equipment further includes an air exhaust passage, air draft The air inlet of passage is positioned at airtight chamber, and air exhaust passage is for discharging compressed air and the dry ice evaporation of injection The excess gas produced.

Based on above-mentioned, in the automatic cleaning equipment that this utility model is proposed, dry ice powderject to chip, Dry ice powder sublimes needs to absorb amount of heat, therefore can allow attachment (such as cinder or the soft flocks) cooling on chip, And make attachment solidification, embrittlement, meanwhile, dry ice powder volume when distillation also can expand and be formed micro- Quick-fried so that solidification or embrittlement after attachment come off, the most just can effectively remove the attachment on chip.

Accompanying drawing explanation

Fig. 1 is this utility model automatic cleaning equipment schematic diagram.

Fig. 2 is the axonometric chart cleaning device.

Fig. 3 is the schematic diagram cleaning device.

Fig. 4 is the schematic diagram of cleaning robot.

Fig. 5 is the schematic diagram of the air circulation heating system of automatic cleaning equipment of the present utility model.

Description of reference numerals: 100-automatic cleaning equipment；1-feeding platform；11-houses carrier；To be washed of 2-； 3-feeding robot arm；4-cleans device；41-trousers；42-lifts supporting plate；43-lift cylinder；At the bottom of 44- Plate；45-absorbent module；46-discharges assembly；461-outlet；462-siphunculus；47-vacuum sensor； 5-cleaning robot；51-dry ice passage；52-injection channel；6-blanking robot arm；7-blanking position；8-dries Dry tunnel；9-blanking bench；10-airtight chamber；15-dust-collecting filter；12-aerator；13-electric heater； 14-hot air circulating pipe；16-air exhaust passage；A1-dry ice pulverizer；A2-air compressor；C1-chip； H-distance.

Detailed description of the invention

Below the most in conjunction with the accompanying drawings and embodiments, detailed description of the invention of the present utility model is further described. Following example are only used for clearly illustrating the technical solution of the utility model, and can not limit this with this The protection domain of utility model.

Fig. 1 is this utility model automatic cleaning equipment schematic diagram.Fig. 2 is the axonometric chart cleaning device, Fig. 3 For cleaning the schematic diagram of device.Fig. 4 is the schematic diagram of cleaning robot.Please referring initially to Fig. 1.Automatically clean and set Standby 100, it is clear that it includes that 1, one to be washed 2, one feeding robot arm 3, of a feeding platform cleans device 4, Wash robot 5, blanking robot arm 6, blanking position 7, Drying tunnel 8, blanking bench 9 and Airtight chamber 10.

In the present embodiment, automatic cleaning equipment 100 be by feeding platform 1, to be washed 2, rinsing table 4, under Material position 7, Drying tunnel 8 and blanking bench 9 totally six stations are constituted, and so, this utility model is not limited, Technological requirement according to the difference or cleaning that are cleaned by product is different, and actual cleaning equipment can be by therein a few Individual station is constituted.

Feeding platform 1 is in order to install chip to be washed additional to system.Feeding platform 1 comprises multiple accommodating carrier 11, chip It is placed on accommodating carrier 11 in the slotted eye of correspondence.In the present embodiment, accommodating carrier 11 can be at feeding platform 1 Upper movement, to transmit chip.

To be washed 2 downstream being positioned at feeding platform 1, to be washed 2 in order to be received from the carrying that feeding platform 1 transmits The accommodating carrier 11 of multiple chip.

Feeding robot arm 3 is to be washed 2 and cleans between device 4, cleans device 4 and is positioned to be washed 2 Downstream, feeding robot arm 3 the accommodating carrier 11 of to be washed 2 is sent to clean device 4.

Clean device 4 in order to fixing multiple chips on to be washed the 2 accommodating carrier transmitted.

Specifically, as shown in Figures 2 and 3, clean device 4 and comprise trousers 41, lifting supporting plate 42, one group of lift cylinder 43, base plate 44, multiple absorbent module 45, discharge assembly 46, vacuum Degree sensor 47, negative pressure cavity 48 and a negative pressure mouth 49.

Lifting supporting plate 42, lift cylinder 43, base plate 44 and absorbent module 45 lay respectively in trousers 41, Negative pressure cavity 48 is positioned at base plate 44 times, and vacuum sensor 47 is positioned at negative pressure cavity 48, discharges assembly 46 even Lead in trousers 41.

Lift cylinder 43 connects lifting supporting plate 42, and lift cylinder 43 is in order to moving lifting supporting plate 42, so, Lifting supporting plate 42 can rise or fall movement relative to base plate 44.

Multiple absorbent module 45 are located on base plate 44, and absorbent module 45, in order to adsorb chip C1, is adsorbed at this Assembly 45 e.g. one vacuum cup.Additionally, each absorbent module 45 has distance H with base plate 44, make Supporting plate 42 must be lifted and have enough decline spaces.Lifting supporting plate 42 drives each chip after accommodating carrier 11 decline C1 is suspended on accommodating carrier 11.

Discharge assembly 46 and comprise an outlet 461 and two siphunculus 462, described siphunculus 462 row of being communicated in Outlet 461.

Vacuum sensor 47 is in order to detect the vacuum in 44 times negative pressure cavities 48 of base plate.Negative pressure cavity 48 is saturating Cross negative pressure mouth 49 to couple with vacuum pump.

It should be noted that, above-mentioned trousers 41, lifting supporting plate 42, base plate 44 and absorbent module 45 are to replace The component changed, can according to be cleaned by the difference of chip and the chip geometric layout in accommodating carrier different and Design.

Referring back to Fig. 1.Cleaning robot 5 is coupled to clean device 4.Specifically, as shown in Figure 4, Cleaning robot 5 comprises dry ice passage 51 and an injection channel 52.

One dry ice pulverizer A1 is coupled to cleaning robot 5, wherein dry ice pulverizer by injection channel 52 A1 is in order to provide dry ice powder, and described dry ice powder is transferred into injection channel 52 from dry ice passage 51.

One air compressor A2 is coupled to cleaning robot 5, wherein air compressor by injection channel 52 A2 is in order to provide compressed air to injection channel 52.Consequently, it is possible to dry ice powder is by bearing that compressed air produces Pressure sucks injection channel 52, i.e. dry ice powder by bearing that injection channel 52 compressed air flow at high speed produces Press and be inhaled into injection channel 52.Injection channel 52 is in order to by dry ice powderject to multiple chip C1.

Referring again to Fig. 1, blanking position 7 is positioned at the downstream cleaning device 4, and blanking position 7 is in order to be received from cleaning Multiple chips after device 4 cleaning and accommodating carrier 11.Specifically, blanking robot arm 6 is positioned at cleaning dress Putting between 4 and blanking position 7, blanking robot arm 6 will clean the multiple chips after device cleans and accommodating carrier 11 are sent to blanking position 7.

Drying tunnel 8 is positioned at the downstream of blanking position 7, and Drying tunnel 8 is many in order to dry from the transmission of blanking position Individual chip and accommodating carrier 11.

Blanking bench 9 is positioned at the downstream of Drying tunnel 8, and blanking bench 9 is received from the multiple of Drying tunnel 8 transmission Chip and accommodating carrier 11.

In each above-mentioned station, to be washed 2, clean device 4, blanking position 7, Drying tunnel 8 respectively It is positioned at airtight chamber 10.

At this under configuration, accommodating carrier 11 can be in feeding platform 1, to be washed 2, cleaning device 4, blanking position 7, move successively between Drying tunnel 8 and blanking bench 9, to transmit chip, to be washed 2 in order to be received from The accommodating carrier 11 of a plurality of chip C1 that material platform 1 transmits, feeding robot arm 3 is by the accommodating load of to be washed 2 Tool 11 is sent to clean device 4, cleans device 4 in order to fix on to be washed the 2 accommodating carrier 11 transmitted A plurality of chip C1.

Chip C1 is placed in absorbent module 45, and vacuum sensor 47 is in order to detect in negative pressure cavity 48 Vacuum, to guarantee that the vacuum in negative pressure cavity 48 reaches setting value, and makes absorbent module 45 by vacuum The mode of suction adsorbs chip C1.Then, lifting supporting plate 41 drives accommodating carrier 11 to decline, and makes chip C1 Edge is the most exposed so that cleaning.The injection channel 52 of cleaning robot 5 is in order to by dry ice powder and compression Air injection extremely multiple chip C1.

Dry ice powderject is to after chip C1, owing to dry ice powder distils rapidly when-79 DEG C, and now dry ice Powder absorbs amount of heat, and makes the attachment (such as cinder or soft flocks) on chip C1 lower the temperature, and then allows attachment Thing solidification, embrittlement, simultaneously, dry ice powder volume when distillation also can expand about 700 times and be formed micro- Quick-fried so that solidification or embrittlement after attachment come off, and compressed air can blow away solidification or embrittlement after attachment Thing, the most just can effectively clean the soft flocks that the cinder produced on chip C1 is remained with adhesive sticker because of processing procedure.

Additionally, due to absorbent module 45 and base plate 44 have distance H so that each chip C1 is suspended on the end Plate 44, to vacate space, makes compressed-air actuated air-flow flow downward dust suction, it is to avoid the attachment that washes (as Cinder or soft flocks) excessive.Further, due to dry ice be from combustion of fossil fuel tail gas extraction carbon dioxide It is prepared, can be directly discharged in air not produce extra carbon emission burden.Further, after cleaning Attachment after solidification or embrittlement is trace, by under the drive of air-flow, flows out to via siphunculus 462 Outlet 461, concentrates in dust-collecting filter 15 (see Fig. 5), can process as general solid waste.

After chip C1 is cleaned by, blanking robot arm 6 by clean device 4 clean after multiple chip C1 and Accommodating carrier 11 is sent to blanking position 7.

Then, Drying tunnel 8 is in order to dry the multiple chips and accommodating carrier 11 transmitted from blanking position.

Then, blanking bench 9 is received from multiple chips and the accommodating carrier 11 that Drying tunnel 8 transmits.

In each above-mentioned station, in two adjacent stations, when next station is cleared, upper one Individual station transferring work piece immediately (such as chip and accommodating carrier 11).For example, will treat when feeding robot arm 3 Wash multiple chip C1 of platform 2 and time accommodating carrier 11 is sent to clean device 4, to be washed 2 there is no appearance Putting carrier 11 and chip, meanwhile, the feeding platform 1 of a upper station will load the accommodating load of chip at once Tool 11 is delivered to be washed 2.At another for example, after cleaning chip C1, blanking robot arm 6 will be clear Multiple chip C1 and accommodating carrier 11 after cleaning device 4 cleaning are sent to blanking position 7, now, clean device 4 are cleared, and are transmitted by multiple chip C1 and the accommodating carrier 11 of to be washed 2 by feeding robot arm 3 immediately To cleaning device 4.Consequently, it is possible to each station concurrent working of the automatic cleaning equipment 100 of the present embodiment, Each station of any moment is made to have a workpiece (such as chip) processed or prepare to next work Position feed, uses and promotes the cleaning efficiency that automatic cleaning equipment is overall.

In each above-mentioned station, in addition to feeding platform 1 with blanking bench 9, to be washed 2, cleaning device 4, blanking position 7, Drying tunnel 8 are respectively positioned in airtight chamber 10, and cleaning robot 5, feeding robot arm 3 also are located in airtight chamber 10 with blanking robot arm 6 so that the carbon dioxide produced after dry ice sublimation Airtight chamber 10 can be positioned at, and reach the effect preventing carbon dioxide excessive.

Further, in one embodiment, owing to needing to absorb amount of heat when dry ice volatilizees, therefore this enforcement Example arranges an air circulation heating system, as it is shown in figure 5, Fig. 5 is automatic cleaning equipment of the present utility model The schematic diagram of air circulation heating system.

In the present embodiment, automatic cleaning equipment 100 further includes a dust-collecting filter 15, aerator 12, electricity Heater 13 and connect the hot air circulating pipe 14 of these devices.

Dust-collecting filter 15 is communicated in the outlet 461 (see Fig. 2) cleaning device 4.

Aerator 12 is coupled to dust-collecting filter 15, and electric heater 13 is coupled to aerator 12, Drying tunnel 8 are coupled to electric heater 13.

The air inlet of air exhaust passage 16 is positioned at airtight chamber 10, and air exhaust passage 16 is for discharging the pressure of injection The excess gas that contracting air and dry ice evaporation produce, maintains the negative pressure state in airtight chamber 10, thus prevents Carbon dioxide leaks.

At this under configuration, solidification after cleaning or attachment after embrittlement by under the drive of air-flow, warp Outlet 461 is flowed out to and the dust-collecting filter 15 that arrives by siphunculus 462.By dust-collecting filter 15 to remove Solidification after cleaning or the attachment after embrittlement and can process as general solid waste, and the gas after dedusting Flowing through by aerator 12, then, the air-flow after dedusting is electrically heated device 13 and heats, and the air-flow mat after heating It is fed to Drying tunnel 8 by hot air circulating pipe 14, to dry the condensed water on chip C1, therefore can be formed One air circulation heating system, favorably promotes chip temperature.The hot blast flowed out from Drying tunnel 8 injects airtight Chamber 10, gathers together through trousers 41, utilizes remaining thermal compensation dry ice sublimation institute calorific requirement, subtracts simultaneously Frosting on few chip.

Additionally, due to the air-flow after now heating is positioned at airtight chamber 10, the heat of air-flow utilization own is dried After condensed water on chip C1, moreover it is possible to waste heat is supplemented dry ice volatilization time institute's calorific requirement.

In sum, in the automatic cleaning equipment that this utility model is proposed, dry ice powderject is to chip After, owing to dry ice powder distils rapidly when-79 DEG C, now dry ice powder absorbs amount of heat, and makes core Attachment (such as cinder or soft flocks) cooling on sheet, and then allow attachment solidification, brittle, meanwhile, dry Ice powder end volume when distillation also can expand about 700 times and forms microexplosion, so that the attachment after solidification or embrittlement Thing comes off, and compressed air can blow away the attachment solidified or after embrittlement, the most just can effectively clean because of laser Cutting technique and produce the cinder on chip or the adhesive sticker institute caused on chip because of vacuum splashing and plating technique Residual soft flocks.

Automatic cleaning equipment is by feeding platform, to be washed, rinsing table, blanking position, Drying tunnel and blanking bench Totally six stations constitute (or can be made up of) certain several station therein, and each station is concurrent working, makes Each station of any moment have a workpiece (such as chip or the accommodating carrier that carries chip) by Process or prepare, to next station feed, to use and promote the cleaning efficiency that automatic cleaning equipment is overall.

In each above-mentioned station, in addition to feeding platform and blanking bench, to be washed, clean device, under Material position, Drying tunnel are respectively positioned in airtight chamber, and cleaning robot, feeding robot arm and blanking robot arm It also is located in airtight chamber so that the carbon dioxide gas physical ability produced after dry ice sublimation is positioned at airtight chamber, To avoid carbon dioxide excessive to extraneous.

Additionally, due to absorbent module and base plate have a distance so that each chip is unsettled and vacates space, makes Compressed-air actuated air-flow is gathered and the traction of circulating air and the dust suction that flows downward due to trousers, it is to avoid clear The attachment (such as cinder or soft flocks) washed off is excessive.

Furthermore, owing to dry ice is to extract carbon dioxide from combustion of fossil fuel tail gas to be prepared, can be direct It is emitted in air and does not produce extra carbon emission burden.Further, attached after solidification after cleaning or embrittlement Thing is trace, is expelled to by the solidification after cleaning under the drive of air-flow or the attachment after embrittlement Outside cleaning device.

Further, can make to remove the solidification after cleaning or the attachment after embrittlement by dust-collecting filter Process for general solid waste, and the air-flow after dedusting is via aerator, after being then electrically heated device heating, It is fed to Drying tunnel by hot air circulating pipe, to dry the condensed water on chip, therefore can be formed Gas loop heating system, favorably promotes chip temperature, reduces the frosting on chip.

Further, since the air-flow after now heating is positioned at airtight chamber, the heat of air-flow utilization own dries core After condensed water on sheet, moreover it is possible to waste heat is supplemented dry ice volatilization time institute's calorific requirement.

Described above it is merely exemplary for this utility model, and nonrestrictive, the common skill in this area Art personnel understand, in the case of the spirit and scope limited without departing from claims appended below, can do Go out many amendments, change, or equivalence, but all will belong to protection domain of the present utility model.

Claims (10)

1. an automatic cleaning equipment, it is characterised in that including:

One feeding platform, houses carrier in order to add cartridge chip, and each accommodating carrier is in order to contain multiple chip；

One to be washed, being positioned at the downstream of this feeding platform, this to be washed in order to be received from holding of this feeding platform transmission It is filled with this accommodating carrier of the plurality of chip；

One cleans device, is positioned at this downstream of to be washed, and this cleaning device is in order to fix from this to be washed transmission This accommodating carrier on the plurality of chip, this cleaning device comprise a lifting supporting plate, multiple absorbent module with And a base plate, the plurality of absorbent module is located on this base plate, and the plurality of absorbent module is in order to adsorb the plurality of core Sheet, this lifting supporting plate can move relative to this base plate；

One cleaning robot, is coupled to this cleaning device, and this cleaning robot comprises an injection channel, wherein This lifting supporting plate drives this accommodating carrier to decline to expose the plurality of chip, and this injection channel is in order to by dry ice powder End injection is to the plurality of chip；

One blanking position, is positioned at the downstream of this cleaning device, and this blanking position is cleaned in order to be received from this cleaning device After the plurality of chip and this accommodating carrier；

One Drying tunnel, is positioned at the downstream of this blanking position, and this Drying tunnel transmits from this blanking position in order to dry The plurality of chip and this accommodating carrier；And

One blanking bench, is positioned at the downstream of this Drying tunnel, and this blanking bench is received from being somebody's turn to do of this Drying tunnel transmission Multiple chips and this accommodating carrier.

2. automatic cleaning equipment as claimed in claim 1, it is characterised in that respectively this absorbent module and this end Plate has a distance.

3. automatic cleaning equipment as claimed in claim 1, it is characterised in that this cleaning device further includes Trousers, the plurality of absorbent module, this lifting supporting plate and this base plate lay respectively in this trousers.

4. automatic cleaning equipment as claimed in claim 3, it is characterised in that this cleaning device further includes Vacuum sensor, one group of lift cylinder and a negative pressure cavity, this negative pressure cavity is positioned under this base plate, this vacuum Degree sensor is positioned at this negative pressure cavity, and this group lift cylinder is positioned at this trousers, and this vacuum sensor is used With the vacuum detected under this base plate in this negative pressure cavity, this group lift cylinder connects this lifting supporting plate, this group liter Sending down the abnormal ascending QI cylinder is in order to this lifting supporting plate mobile.

5. automatic cleaning equipment as claimed in claim 1, it is characterised in that further include:

One dust-collecting filter, is communicated in this cleaning device.

6. automatic cleaning equipment as claimed in claim 5, it is characterised in that further include:

One aerator, is coupled to this dust-collecting filter；And

One electric heater, is coupled to this aerator, and this Drying tunnel is coupled to this electric heater.

7. automatic cleaning equipment as claimed in claim 1, it is characterised in that further include:

One dry ice pulverizer, this dry ice pulverizer is coupled to this cleaning robot, and this dry ice pulverizer is in order to carry For this injection channel of this dry ice powder to this cleaning robot, this dry ice powder is by bearing that compressed air produces Pressure sucks this injection channel of this cleaning robot.

8. automatic cleaning equipment as claimed in claim 1, it is characterised in that further include:

One feeding robot arm, between this to be washed and this cleaning device, this feeding robot arm is to be washed by this This accommodating carrier of platform is sent to this cleaning device；And

One blanking robot arm, between this cleaning device and this blanking position, this blanking robot arm is by this cleaning The plurality of chip and accommodating carrier thereof after device cleaning are sent to this blanking position.

9. automatic cleaning equipment as claimed in claim 8, it is characterised in that further include:

One airtight chamber, wherein this to be washed, this cleaning device, this blanking position, this Drying tunnel, this is clear Wash robot, this feeding robot arm is all located in this airtight chamber with this blanking robot arm.

10. automatic cleaning equipment as claimed in claim 9, it is characterised in that further include:

One air exhaust passage, its air inlet is positioned at this airtight chamber, and air exhaust passage is for discharging the compression of injection The excess gas that air and dry ice evaporation produce.