CN205467772U - Optical divider wafer paster system - Google Patents
Optical divider wafer paster system Download PDFInfo
- Publication number
- CN205467772U CN205467772U CN201620237754.3U CN201620237754U CN205467772U CN 205467772 U CN205467772 U CN 205467772U CN 201620237754 U CN201620237754 U CN 201620237754U CN 205467772 U CN205467772 U CN 205467772U
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- Prior art keywords
- vacuum suction
- suction seat
- wafer
- circular arc
- seat
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Abstract
The utility model discloses an optical divider wafer paster system is equipped with the depression bar on the L type support, the depression bar lower extreme is equipped with the pressure head and withstands the clamp plate, down the vacuum is inhaled and is equipped with wafer laminating platform on the seat, and wafer laminating table center is equipped with the circular arc recess of breathing in, and the circular arc is breathed in the recess center and is equipped with suction hole intercommunication pump -line, wafer laminating bench uses the suction hole evenly to be equipped with annular air guide groove as the centre of a circle, and wafer laminating bench uses the suction hole to be the radial vertical bar air guide groove that is equipped with as the center, the annular air guide groove that inhale on the seat in lower vacuum communicates with vertical bar air guide groove each other, going up the vacuum and inhaling and be equipped with apron laminating platform below the seat, apron laminating table center is equipped with the circular arc recess of breathing in, and the circular arc is breathed in the recess center and is equipped with suction hole intercommunication pump -line, apron laminating bench uses the suction hole to be radial vertical bar air guide groove and the circular arc of evenly being equipped with as the center to breathe in the recess and feed through, the vacuum pump is all connected to the pump -line. It can improve the paster efficiency and the quality of wafer greatly, guarantees the reliability of optical divider chip.
Description
Technical field
The present invention relates to optic communication product scope, refer more particularly to a kind of optical branching device wafer patch system.
Background technology
Along with the development of Fibre Optical Communication Technology, fiber to the home (FTTH) has obtained fairly large commercialization also
Presenting good growth momentum, its distinguishing feature is that it uses EPON link, it is provided that bigger
Bandwidth, save line resource, strengthen the reliability of circuit, environment and power reguirements are reduced simultaneously,
In FTTH network, optical branching device is core devices therein, be particularly well-suited to EPON (EPON,
BPON, GPON etc.) in connect local side and terminal unit, it is achieved the distribution of luminous power.
Optical branching-device chip is that the light in the technology such as optic communication, light sensing, the integration of three networks, Internet of Things divides
The core devices of road device.Optical branching-device chip is passed through the bonding shape of UV glue by optical branching device wafer with cover plate
Become, the thickness of glue layer and paster quality directly affect optical branching-device chip reliability.Traditional
Can only rely on bonding with cover plate of optical branching device wafer completes manually, and man efficiency is low, laminating
Precision is low, has a strong impact on the reliability of production efficiency and optical branching-device chip.
By patent retrieval, there is following known prior art:
Patent 1:
Application number: 201220269074.1, the applying date: 2012.06.08, authorized announcement date:
2013.01.09, this utility model provides a kind of wafer chip mounter, including wafer holding structure, crystalline substance
Circle transfer device, wafer plaster mechanism and wafer transfer mechanism, described wafer holding structure includes that one is brilliant
Circle box, described wafer transfer machine structure include a metal hand basket, described wafer plaster mechanism include board,
Iron ring transporter, iron ring and the pad pasting roller being arranged on described board, at described metal hand basket
It is provided above ion gun.The beneficial effects of the utility model mainly avoid wafer to leave in wafer cassette
The electrostatic breakdown chip wafer circuit that the protecting film moment rising moment and open wafer frontside produces causes crystalline substance
The risk that circle is scrapped occurs.
Being found by above retrieval, above technical scheme can not affect novelty and the creation of the present invention
Property.
Summary of the invention
It is an object of the invention to for problem above, it is provided that a kind of optical branching device wafer patch system, it
Paster efficiency and the quality of wafer can be greatly improved, it is ensured that the reliability of optical branching-device chip.
For realizing object above, the technical solution used in the present invention is: a kind of optical branching device wafer paster
System, it includes the L-type support (10) being vertically set on base (1) side, described base (1)
It is provided above with lower vacuum suction seat (2)；Described lower vacuum suction seat (2) is provided above with vacuum suction seat
(3)；It is provided centrally with pressing plate (11) above described upper vacuum suction seat (3)；Described L-type support (10)
The upper threaded depression bar (8) that is vertically installed with is positioned at vacuum suction seat (3) center；Described depression bar (8)
Top is provided with knob (9), and lower end is provided with pressure head (5) and withstands pressing plate (11)；Described lower vacuum
Suction base (2) is provided above with wafer laminating platform (27), and described wafer laminating platform (27) is centrally disposed
Circular arc aspirating flutes (22), described circular arc aspirating flutes (22) is had to be provided centrally with suction hole (23)
Connection is arranged on the pump-line (13) that lower vacuum suction seat (2) is internal；Described wafer laminating platform (27)
On be that the center of circle is evenly arranged with ring-shaped gas-guiding trench (28) with suction hole (23), described wafer laminating platform (27)
On centered by suction hole (23), be evenly arranged with vertical bar air slot (21) and circular arc radially inhale
Gas groove (22) connects；Ring-shaped gas-guiding trench (28) on described lower vacuum suction seat (2) is led with vertical bar
Air drain (21) is interconnected；Described upper vacuum suction seat (3) is provided below cover plate laminating platform (20),
Described cover plate laminating platform (20) is provided centrally with circular arc aspirating flutes (22), described circular arc aspirating flutes
(22) it is provided centrally with suction hole (23) connection and is arranged on the exhaust tube that vacuum suction seat (3) is internal
Road (13)；The most uniformly set centered by suction hole (23) on described cover plate laminating platform (20)
It is equipped with vertical bar air slot (21) to connect with circular arc aspirating flutes (22)；Described pump-line (13)
All connect vacuum pump by air extraction connector (14).
Further, described upper vacuum suction seat (3) corner is provided with micrometer (29), and described thousand
Chi (29) is divided to be supported on lower vacuum suction seat (2) by height adjusting holes (30).
Further, on described cover plate laminating platform (20) centered by suction hole (23) radially
It is evenly arranged with hollow out (19).
Further, described lower vacuum suction seat (2) corner above is provided with boss (24), described
Alignment pin (26) it is provided with on boss (24)；Described upper vacuum suction seat (3) four corners below is respectively provided with
There is boss (24), described boss (24) is provided with the hole, location (25) coordinated with alignment pin (26).
Further, described pressure head (5) is semi-spherical shape, and described pressing plate (11) is the most centrally disposed
There is the arc groove (12) matched with pressure head (5).
Further, described depression bar (8) lower end is provided with two pieces of briquettings (6)；Described briquetting (6)
Between be provided with compression spring (7)；Described pressure head (5) is arranged on lower end briquetting (6) bottom centre.
Further, described lower vacuum suction seat (2) and upper vacuum suction seat (3) side are provided with top
Lifting device (18)；Described jacking system (18) includes jack-up knob (181), described jack-up knob (181)
Connecting rotary shaft (183), described rotary shaft (183) is provided with fixed block (182), end is arranged
There is jack-up block (184)；It is provided with jack-up boss (185) on described jack-up block (184).
Further, described lower vacuum suction seat (2) and upper vacuum suction seat (3) side are provided with not
Jacking system (18) less than two.
Further, described cover plate laminating platform (20) is higher than upper vacuum suction seat (3) lower surface；Described
Wafer laminating platform (20) is higher than lower vacuum suction seat (2) upper surface.
Further, described upper vacuum suction seat (3) surrounding above is evenly arranged with handle bar (4).
Beneficial effects of the present invention:
1, the present invention can realize in optical branching-device chip freely adjusting of bondline thickness between wafer and cover plate
Joint controls, it is ensured that wafer docks with the high accuracy of cover plate, is greatly improved stably may be used of optical branching-device chip
By property and precision.
2, the present invention holds cover plate by upper vacuum suction seat, hold wafer by lower vacuum suction seat, logical
The micrometer crossing vacuum suction seat corner realizes the high accuracy regulation of cover plate and wafer thickness, improves light and divides
The precision controlling of road device chip.
3, the present invention is provided with circular arc vacuum bothrium and vertical bar air slot, energy on upper vacuum suction seat bottom surface
Ensure cover plate holds stability and horizontality；Circular arc vacuum bothrium it is provided with on lower vacuum suction seat bottom surface
With vertical bar air slot and ring-shaped gas-guiding trench, can guarantee that wafer puts planarization and stability, improves crystalline substance
Circle and cover plate overlapping accuracy, and glue thickness adjusted between wafer and cover plate can be realized.
4, in the present invention, the hollow out on upper vacuum suction seat can guarantee that the UV glue between wafer and cover plate can
Contact enough ultraviolet lighting areas, it is ensured that the quick solidification of UV glue.
Accompanying drawing explanation
Fig. 1 is side schematic view of the present invention.
Fig. 2 is the main cross-sectional schematic of the present invention.
Fig. 3 is upper vacuum suction seat elevational schematic view in the present invention.
Fig. 4 is upper vacuum suction seat schematic top plan view in the present invention.
Fig. 5 is lower vacuum suction seat schematic top plan view in the present invention.
Fig. 6 is jacking system structural representation in the present invention.
Fig. 7 is jack-up block structure schematic diagram in the present invention.
Numeral mark shown in figure is expressed as: 1, base, and 2, lower vacuum suction seat, 3, upper vacuum suction seat,
4, handle bar, 5, pressure head, 6, briquetting, 7, compression spring, 8, depression bar, 9, knob, 10, L
Type support, 11, pressing plate, 12, groove, 13, pump-line, 14, air extraction connector, 15, wafer,
16, glass cover-plate, 17, UV glue, 18, jacking system, 19, hollow slots, 20, cover plate laminating platform,
21, vertical bar air slot, 22, circular arc aspirating flutes, 23, suction hole, 24, boss, 25, location
Hole, 26, alignment pin, 27, wafer laminating platform, 28, ring-shaped gas-guiding trench, 29, micrometer, 30,
Height adjusting holes, 181, jack-up knob, 182, fixed block, 183, rotary shaft, 184, jack-up block,
185, jack-up boss.
Detailed description of the invention
In order to make those skilled in the art be more fully understood that technical scheme, below in conjunction with the accompanying drawings
Describing the present invention, the description of this part is only exemplary and explanatory, should be to this
Bright protection domain has any restriction effect.
As shown in Fig. 1-Fig. 7, the concrete structure of the present invention is: a kind of optical branching device wafer patch system,
It includes the L-type support 10 being vertically set on base 1 side, described base 1 be provided above with lower very
Suction seat 2；Described lower vacuum suction seat 2 is provided above with vacuum suction seat 3；Described upper vacuum suction seat 3
It is provided centrally with pressing plate 11 above；Threaded in described L-type support 10 it is vertically installed with depression bar 8
In upper vacuum suction seat 3 center；Described depression bar 8 top is provided with knob 9, and lower end is provided with pressure head 5 and pushes up
Live pressing plate 11；Described lower vacuum suction seat 2 is provided above with wafer laminating platform 27, described wafer laminating platform
27 are provided centrally with circular arc aspirating flutes 22, and described circular arc aspirating flutes 22 is provided centrally with suction hole
23 connections are arranged on the pump-line 13 within lower vacuum suction seat 2；Described wafer laminating platform 27 on
Suction hole 23 is evenly arranged with ring-shaped gas-guiding trench 28 for the center of circle, with air-breathing on described wafer laminating platform 27
It is evenly arranged with vertical bar air slot 21 centered by hole 23 radially to connect with circular arc aspirating flutes 22；
Ring-shaped gas-guiding trench 28 on described lower vacuum suction seat 2 is interconnected with vertical bar air slot 21；On described
Vacuum suction seat 3 is provided below cover plate laminating platform 20, and described cover plate laminating platform 20 is provided centrally with circular arc
Aspirating flutes 22, described circular arc aspirating flutes 22 is provided centrally with suction hole 23 connection and is arranged on very
Pump-line 13 within suction seat 3；Described cover plate laminating platform 20 on centered by suction hole 23 in
The radial vertical bar air slot 21 that is evenly arranged with connects with circular arc aspirating flutes 22；Described pump-line
13 are all connected with vacuum pump by air extraction connector 14.
Preferably, described upper vacuum suction seat 3 four jiaos is provided with micrometer 29, and described micrometer 29 leads to
Cross height adjusting holes 30 to be supported on lower vacuum suction seat 2.
Preferably, described cover plate laminating platform 20 is uniformly arranged centered by suction hole 23 radially
There is hollow out 19.
Preferably, described lower vacuum suction seat 2 corner above is provided with boss 24, on described boss 24
It is provided with alignment pin 26；Described upper vacuum suction seat 3 four corners below is provided with boss 24, described boss
The hole, location 25 coordinated with alignment pin 26 it is provided with on 24.
Preferably, described pressure head 5 is semi-spherical shape, is provided centrally with and pressure head above described pressing plate 11
The arc groove 12 that 5 match.
Preferably, described depression bar 8 lower end is provided with two pieces of briquettings 6；It is provided with pressure between described briquetting 6
Contracting spring 7；Described pressure head 5 is arranged on lower end briquetting 6 bottom centre.
Preferably, described lower vacuum suction seat 2 and upper vacuum suction seat 3 side are provided with jacking system 18；
Described jacking system 18 includes that jack-up knob 181, described jack-up knob 181 connect rotary shaft 183,
Being provided with fixed block 182 in described rotary shaft 183, end is provided with jack-up block 184；Described jack-up block
Jack-up boss 185 it is provided with on 184.
Preferably, described lower vacuum suction seat 2 and upper vacuum suction seat 3 side are provided with no less than two
Jacking system 18.
Preferably, described cover plate laminating platform 20 is higher than upper vacuum suction seat 3 lower surface；Described wafer is fitted
Platform 20 is higher than lower vacuum suction seat 2 upper surface.
Preferably, described upper vacuum suction seat 3 surrounding above is evenly arranged with handle bar 4.
When the present invention is specifically used, carry out in accordance with the following steps:
Step one, with tweezers clean wafer 15 is placed on wafer laminating platform 27, opens after putting well
Wafer 15 is held by the vacuum pump opening lower vacuum suction seat 2.
Step 2, drip UV glue 17 at wafer 15 center.
Step 3, clamp glass cover-plate 16 with tweezers, and drip a UV in glass cover-plate 16 bottom surface
Glue 17.
Step 4, by height regulating frame, glass cover-plate 16 is placed on above wafer, it is ensured that degree of overlapping.
Step 5, cover vacuum suction seat 2, after adjusting position, the vacuum of vacuum suction seat 2 in unlatching
Glass cover-plate 16 is held by pump.
Step 6, regulated by micrometer on upper vacuum suction seat 2 glass cover-plate 16 and wafer 15 it
Between difference in height and levelness, ensure that wafer 15 is tight with the laminating of glass cover-plate 16 by depression bar 8
Degree.
Step 7, UV lamp is utilized wafer 15 and glass cover-plate 16 to be carried out illumination by hollow out 19,
UV glue 17 is solidified.
Step 8, stopping vacuum pump, make jack-up by rotating the jack-up knob 181 of jacking system 18
Glass cover-plate 16 and wafer 15 are departed from vacuum suction seat and lower vacuum suction seat by boss 185 respectively, side
Just take off.
It should be noted that in this article, term " include ", " comprising " or its any other become
Body is intended to comprising of nonexcludability, so that include the process of a series of key element, method, thing
Product or equipment not only include those key elements, but also include other key elements being not expressly set out, or
Person is also to include the key element intrinsic for this process, method, article or equipment.
Principle and the embodiment of the present invention are set forth by specific case used herein, above
The explanation of example is only intended to help to understand method and the core concept thereof of the present invention.The above is only
The preferred embodiment of the present invention, it is noted that due to the finiteness of literal expression, and objectively deposit
At unlimited concrete structure, for those skilled in the art, without departing from this
On the premise of bright principle, it is also possible to make some improvement, retouch or change, it is also possible to by above-mentioned technology
Feature is combined by rights；These improve retouching, change or combine, or the most improved general
Design and the technical scheme of invention directly apply to other occasion, are regarded as the protection model of the present invention
Enclose.
Claims (10)
1. an optical branching device wafer patch system, it is characterised in that it includes being vertically set on base (1)
The L-type support (10) of side, described base (1) is provided above with lower vacuum suction seat (2)；Under described
Vacuum suction seat (2) is provided above with vacuum suction seat (3)；Described upper vacuum suction seat (3) center above
It is provided with pressing plate (11)；Described L-type support (10) is the most threaded is vertically installed with depression bar (8) position
In upper vacuum suction seat (3) center；Described depression bar (8) top is provided with knob (9), and lower end is provided with
Pressure head (5) withstands pressing plate (11)；Described lower vacuum suction seat (2) is provided above with wafer laminating platform (27),
Described wafer laminating platform (27) is provided centrally with circular arc aspirating flutes (22), described circular arc aspirating flutes
(22) it is provided centrally with suction hole (23) connection and is arranged on the exhaust tube that lower vacuum suction seat (2) is internal
Road (13)；It is that the center of circle is evenly arranged with annular with suction hole (23) on described wafer laminating platform (27)
Air slot (28), the most equal centered by suction hole (23) on described wafer laminating platform (27)
The even vertical bar air slot (21) that is provided with connects with circular arc aspirating flutes (22)；Described lower vacuum suction seat (2)
On ring-shaped gas-guiding trench (28) be interconnected with vertical bar air slot (21)；Described upper vacuum suction seat (3)
Cover plate laminating platform (20) is provided below, and described cover plate laminating platform (20) is provided centrally with circular arc air-breathing
Groove (22), described circular arc aspirating flutes (22) is provided centrally with suction hole (23) connection and is arranged on
The pump-line (13) that upper vacuum suction seat (3) is internal；With suction hole on described cover plate laminating platform (20)
(23) vertical bar air slot (21) and circular arc aspirating flutes (22) it are evenly arranged with centered by radially
Connection；Described pump-line (13) all connects vacuum pump by air extraction connector (14).
2. a kind of optical branching device wafer patch system as claimed in claim 1, it is characterised in that on described
Vacuum suction seat (3) corner is provided with micrometer (29), and described micrometer (29) passes through altitude mixture control
Hole (30) is supported on lower vacuum suction seat (2).
3. a kind of optical branching device wafer patch system as claimed in claim 1, it is characterised in that described lid
Centered by suction hole (23), hollow out (19) it is evenly arranged with radially on plate laminating platform (20).
4. a kind of optical branching device wafer patch system as claimed in claim 1, it is characterised in that under described
Vacuum suction seat (2) corner above is provided with boss (24), and described boss is provided with location on (24)
Pin (26)；Described upper vacuum suction seat (3) four corners below is provided with boss (24), described boss (24)
On be provided with the hole, location (25) coordinated with alignment pin (26).
5. a kind of optical branching device wafer patch system as claimed in claim 1, it is characterised in that described pressure
Head (5) is semi-spherical shape, is provided centrally with matching with pressure head (5) above described pressing plate (11)
Arc groove (12).
6. a kind of optical branching device wafer patch system as claimed in claim 1, it is characterised in that described pressure
Bar (8) lower end is provided with two pieces of briquettings (6)；Compression spring (7) it is provided with between described briquetting (6)；
Described pressure head (5) is arranged on lower end briquetting (6) bottom centre.
7. a kind of optical branching device wafer patch system as claimed in claim 1, it is characterised in that under described
Vacuum suction seat (2) and upper vacuum suction seat (3) side are provided with jacking system (18)；Described jack-up
Device (18) includes jack-up knob (181), and described jack-up knob (181) connects rotary shaft (183),
Being provided with fixed block (182) in described rotary shaft (183), end is provided with jack-up block (184)；Institute
State and on jack-up block (184), be provided with jack-up boss (185).
8. a kind of optical branching device wafer patch system as claimed in claim 1, it is characterised in that under described
Vacuum suction seat (2) and upper vacuum suction seat (3) side are provided with the jacking system (18) no less than two.
9. a kind of optical branching device wafer patch system as claimed in claim 1, it is characterised in that described lid
Plate laminating platform (20) is higher than upper vacuum suction seat (3) lower surface；Described wafer laminating platform (20) is higher than
Lower vacuum suction seat (2) upper surface.
10. a kind of optical branching device wafer patch system as claimed in claim 1, it is characterised in that on described
Vacuum suction seat (3) surrounding above is evenly arranged with handle bar (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620237754.3U CN205467772U (en) | 2016-03-25 | 2016-03-25 | Optical divider wafer paster system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620237754.3U CN205467772U (en) | 2016-03-25 | 2016-03-25 | Optical divider wafer paster system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205467772U true CN205467772U (en) | 2016-08-17 |
Family
ID=56652965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620237754.3U Expired - Fee Related CN205467772U (en) | 2016-03-25 | 2016-03-25 | Optical divider wafer paster system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205467772U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105711224A (en) * | 2016-03-25 | 2016-06-29 | 湖南新中合光电科技股份有限公司 | Wafer mounting system of optical splitter |
| CN107570892A (en) * | 2017-10-27 | 2018-01-12 | 苏州天步光电技术有限公司 | A kind of method for improving optical branching device wafer processing efficiency |
| WO2019127433A1 (en) * | 2017-12-29 | 2019-07-04 | 深圳市康成泰实业有限公司 | Film pasting device |
-
2016
- 2016-03-25 CN CN201620237754.3U patent/CN205467772U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105711224A (en) * | 2016-03-25 | 2016-06-29 | 湖南新中合光电科技股份有限公司 | Wafer mounting system of optical splitter |
| CN105711224B (en) * | 2016-03-25 | 2017-11-24 | 湖南新中合光电科技股份有限公司 | A kind of optical branching device wafer patch system |
| CN107570892A (en) * | 2017-10-27 | 2018-01-12 | 苏州天步光电技术有限公司 | A kind of method for improving optical branching device wafer processing efficiency |
| WO2019127433A1 (en) * | 2017-12-29 | 2019-07-04 | 深圳市康成泰实业有限公司 | Film pasting device |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20190325 |