CN107178714A - A kind of high-power polychrome adopting surface mounted LED light source - Google Patents
A kind of high-power polychrome adopting surface mounted LED light source Download PDFInfo
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- CN107178714A CN107178714A CN201710426019.6A CN201710426019A CN107178714A CN 107178714 A CN107178714 A CN 107178714A CN 201710426019 A CN201710426019 A CN 201710426019A CN 107178714 A CN107178714 A CN 107178714A
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- light source
- chip
- ceramic substrate
- high heat
- led light
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- PLXMOAALOJOTIY-FPTXNFDTSA-N Aesculin Natural products OC[C@@H]1[C@@H](O)[C@H](O)[C@@H](O)[C@H](O)[C@H]1Oc2cc3C=CC(=O)Oc3cc2O PLXMOAALOJOTIY-FPTXNFDTSA-N 0.000 title claims abstract description 31
- 239000000919 ceramic Substances 0.000 claims abstract description 85
- 239000000758 substrate Substances 0.000 claims abstract description 85
- 239000000178 monomer Substances 0.000 claims description 9
- 229910052573 porcelain Inorganic materials 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 150000004767 nitrides Chemical class 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 6
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 12
- 238000009434 installation Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 8
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 6
- 239000011324 bead Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000010433 feldspar Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of high-power polychrome adopting surface mounted LED light source, including high heat-conducting ceramic substrate, the outer surface of the high heat-conducting ceramic substrate offers via hole, the upper surface of the high heat-conducting ceramic substrate is provided with ink coverage areas, chip is installed with the top of the ink coverage areas, the chip is fixedly connected by wire with high heat-conducting ceramic substrate, and the via hole is located at the vacancy between wire.By the present invention in that directly chip is mounted with flip-chip, it need not be attached using metal wire, the situation of electric leakage can be avoided the occurrence of, it is to avoid the situation of short circuit occurs in lamp, so as to make the security performance of product more preferable, potential safety hazard can be reduced, the safety used is ensure that, and is directly installed and is fixed instead of using bolt using attachment process, the installation of chip can be made more to stablize, chip can be avoided to be damaged, be conducive to the service life of extension etc..
Description
Technical field
The present invention relates to LED/light source technical field, specially a kind of high-power polychrome adopting surface mounted LED light source.
Background technology
LED/light source is exactly the light source that light emitting diode (LED) is illuminator.Light emitting diode invention was in 60 years 20th century
In generation, in subsequent many decades, its basic purposes is the indicator lamp as electronic equipments such as radio cassette players.This bulb has efficiency
It the characteristics of high and long lifespan, can continuously use 100,000 hours, steep long 100 times than ordinary incandescent lamp.LED passes through the technology of decades
Improvement, its luminous efficiency has larger lifting.Incandescent lamp and halogen tungsten lamp light efficiency are 12-24 lumens/watts, and fluorescent lamp 50~70 flows
Bright/watt, the lumens/watt of sodium vapor lamp 90~140, most power consumption becomes thermal losses.Be up to after LED light effect is improved up to 50~
200 lumens/watts, and the monochromaticjty of its light is good and spectrum is narrow, and coloured visible ray can be directly sent without filtering.Countries in the world are equal
Step up the research in raising LED light efficacious prescriptions face, its luminous efficiency there will be bigger raising in the near future.
A kind of LED/light source module electric coupler proposed according to China Patent No. CN103032839B, where it is proposed
LED/light source currently on the market relatively consumes one's energy when use, and cost is also higher, and operation is cumbersome, and
Waterproof effect is bad, wherein the cooperation by female connection end with certain length and the male connection end realizes LED/light source mould
Plug-in type electrical connection during group assembling, simultaneously as female connection end has certain length, the behaviour for the personnel that are convenient to operation
Make, because certain length, which is the hand that can ensure the operating personnel, there can be the space of operation, so as to solve existing skill
The problem of in the presence of art.
(row is red using straight-through copper coin or aluminium sheet queue-type arrangement making for the integral LED/light source of existing high power CO B polychromes
Color, row green, row blueness, row's yellow) to realize the electrical connection of LED chip, the product made by the making form
Realize many color chip high power packages of LED, but light when subsequent installation lens or reflector mixing different colours light
Road makes difficult, causes monochromatic light light extraction polarisation because the refraction angle of various wavelength lights differs greatly, polychromatic light mixing inequality,
Substantially, light loss is big for hot spot.
The content of the invention
(1) technical problem solved
In view of the shortcomings of the prior art, the invention provides a kind of high-power polychrome adopting surface mounted LED light source, possesses security
The advantages of energy is well and service life is long, the LED/light source light loss solved in market seriously causes the problem of service life is short.
(2) technical scheme
For realize it is above-mentioned have a safety feature and the long purpose of service life, the present invention provides following technical scheme：A kind of big work(
Rate polychrome adopting surface mounted LED light source, including high heat-conducting ceramic substrate, the outer surface of the high heat-conducting ceramic substrate offers conducting
Hole, the upper surface of the high heat-conducting ceramic substrate, which is provided with the top of ink coverage areas, the ink coverage areas, to be installed with
Chip, the chip is fixedly connected by wire with high heat-conducting ceramic substrate, and the via hole is located at the vacancy between wire.
It is preferred that, the high heat-conducting ceramic substrate includes one layer of monomer plate.
It is preferred that, the high heat-conducting ceramic substrate includes at least two layers monomer plate.
It is preferred that, the high heat-conducting ceramic substrate is in alumina ceramic plate, al nitride ceramic board or sapphire ceramic plate
One or more.
It is preferred that, the thickness of the high heat-conducting ceramic substrate is .- millimeters.
It is preferred that, a diameter of .-. millimeters of the via hole.
It is preferred that, the quantity of the ink coverage areas is four, and the top of each ink coverage areas is installed with
Chip.
It is preferred that, the quantity of the ink coverage areas is nine, and the top of each ink coverage areas is installed with
Chip.
A kind of high-power polychrome adopting surface mounted LED light source, comprises the following steps：
S, by high heat-conducting ceramic substrate metal, then open up via hole in the outer surface of high heat-conducting ceramic substrate；
S, by four color pasters or nine color pasters directly against on high heat-conducting ceramic substrate, then by whole highly heat-conductive carbon/ceramic
Porcelain substrate is directly against on mainboard；
S, by the mainboard after attachment using laser separation into integral light source module, then by integral light source module.
(3) beneficial effect
Compared with prior art, the invention provides a kind of high-power polychrome adopting surface mounted LED light source, possesses following beneficial effect
Really：
1st, the high-power polychrome adopting surface mounted LED light source, is directly mounted chip by using flip-chip, it is not necessary to
It is attached using metal wire, the situation of electric leakage can be avoided the occurrence of, it is to avoid the situation of short circuit occurs in lamp, so as to make product
Security performance it is more preferable, it is possible to reduce potential safety hazard, ensure that the safety used, and directly pacified using attachment process
Dress is fixed instead of using bolt, and the installation of chip can be made more to stablize, chip can be avoided to be damaged, and by opening up
Via hole, facilitates and is electrically connected between upper surface of base plate and lower surface, facilitate the connection on substrate two sides, is conducive to extending lamp
Service life.
2nd, the high-power polychrome adopting surface mounted LED light source, multiple junior units, Ke Yian are divided into by using laser by substrate
Multiple polychrome lamp beads are filled, and junior unit can be used to secondary optical design, then coordinate the lens of different angles, Ke Yishi
The angle of existing light is adjusted between being spent 2 to 60, and use more facilitates, and carries out paster using machine, can pacify chip
Dress it is more accurate, the generation of substandard products can be reduced, so as to ensure the quality of product, and operating efficiency can be improved,
More benefits can be brought.
Brief description of the drawings
Fig. 1 is high heat-conducting ceramic substrate top view of the present invention；
Fig. 2 is high heat-conducting ceramic substrate side view in the embodiment of the present invention 1；
Fig. 3 is high heat-conducting ceramic substrate side view in the embodiment of the present invention 2；
Fig. 4 is ink coverage areas top view in the embodiment of the present invention 1；
Fig. 5 is ink coverage areas top view in the embodiment of the present invention 2.
In figure：1 high heat-conducting ceramic substrate, 2 via holes, 3 monomer plates, 4 ink coverage areas, 5 chips.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Embodiment 1
Refer to Fig. 1,2 and 4, a kind of high-power polychrome adopting surface mounted LED light source, including high heat-conducting ceramic substrate 1, high heat conduction
The outer surface of ceramic substrate 1 offers via hole 2, a diameter of 0.1-0.2 millimeters of via hole 2, square by opening up via hole 2
Just it is electrically connected between upper surface of base plate and lower surface, facilitates the connection on substrate two sides, the upper table of high heat-conducting ceramic substrate 1
Face is provided with ink coverage areas 4, and the quantity of ink coverage areas 4 is four, and the top of each ink coverage areas 4 is fixedly mounted
There is chip 5, the top of ink coverage areas 4 is installed with chip 5, and chip 5 is fixed by wire and high heat-conducting ceramic substrate 1 to be connected
Connect, directly installed and fixed instead of using bolt using attachment process, the installation of chip 5 can be made more to stablize, can be kept away
Exempt from chip 5 to be damaged, via hole 2 is located at the vacancy between wire, and high heat-conducting ceramic substrate 1 includes one layer of monomer plate 3, high
Thermal conductive ceramic substrate 1 is the one or more in alumina ceramic plate, al nitride ceramic board or sapphire ceramic plate, highly heat-conductive carbon/ceramic
The thickness of porcelain substrate 1 is 0.1-1 millimeters, and substrate is divided into multiple junior units using laser, multiple polychrome lamp beads can be installed,
And junior unit can be used to secondary optical design, then coordinate the lens of different angles, it is possible to achieve the angle of light is 2
It is adjusted between to 60 degree, use more facilitates, paster is carried out using machine, more accurate, the energy that can install chip 5
The generation of substandard products is enough reduced, so as to ensure the quality of product, and operating efficiency can be improved.
A kind of high-power polychrome adopting surface mounted LED light source, comprises the following steps：
S1, high heat-conducting ceramic substrate 1 metallized, then open up via hole 2 in the outer surface of high heat-conducting ceramic substrate 1；
S2, by four color pasters or nine color pasters directly against on high heat-conducting ceramic substrate 1, then by whole high heat conduction
Ceramic substrate 1 is directly mounted chip 5 by using flip-chip 5, it is not necessary to use metal directly against on mainboard
Line is attached, and can avoid the occurrence of the situation of electric leakage, it is to avoid the situation of short circuit occurs in lamp, so as to make the security of product
Can be more preferably, it is possible to reduce potential safety hazard, it ensure that the safety used；
S3, by the mainboard after attachment using laser separation into integral light source module, then by integral light source module.
Substrate is divided into multiple junior units by using laser, multiple polychrome lamp beads can be installed, and can will be small
Unit uses secondary optical design, then coordinates the lens of different angles, it is possible to achieve the angle of light is entered between being spent 2 to 60
Row regulation, use more facilitates, and paster is carried out using machine, can make the more accurate of the installation of chip 5, can reduce substandard products
Produce, so as to ensure the quality of product, and operating efficiency can be improved, more benefits can be brought.
Embodiment 2
Refer to Fig. 1,2 and 5, a kind of high-power polychrome adopting surface mounted LED light source, including high heat-conducting ceramic substrate 1, high heat conduction
Ceramic substrate 1 includes one layer of monomer plate 3, and high heat-conducting ceramic substrate 1 is alumina ceramic plate, al nitride ceramic board or sapphire pottery
One or more in porcelain plate, the thickness of high heat-conducting ceramic substrate 1 is 0.1-1 millimeters, and the outer surface of high heat-conducting ceramic substrate 1 is opened
Provided with via hole 2, a diameter of 0.1-0.2 millimeters of via hole 2, the upper surface of high heat-conducting ceramic substrate 1 is provided with ink covering
Area 4, the quantity of ink coverage areas 4 is nine, and the top of each ink coverage areas 4 is installed with chip 5, ink covering
The top in area 4 is installed with chip 5, and chip 5 is fixedly connected by wire with high heat-conducting ceramic substrate 1, and via hole 2, which is located at, leads
Vacancy between line.
A kind of high-power polychrome adopting surface mounted LED light source, comprises the following steps：
S1, high heat-conducting ceramic substrate 1 metallized, then open up via hole 2 in the outer surface of high heat-conducting ceramic substrate 1；
S2, by four color pasters or nine color pasters directly against on high heat-conducting ceramic substrate 1, then by whole high heat conduction
Ceramic substrate 1 is directly against on mainboard；
S3, by the mainboard after attachment using laser separation into integral light source module, then by integral light source module.
Embodiment 3
Refer to Fig. 1,3 and 4, a kind of high-power polychrome adopting surface mounted LED light source, including high heat-conducting ceramic substrate 1, high heat conduction
Ceramic substrate 1 includes at least two layers monomer plate 3, and high heat-conducting ceramic substrate 1 is alumina ceramic plate, al nitride ceramic board or blue precious
One or more in feldspar plate, the thickness of high heat-conducting ceramic substrate 1 is 0.1-1 millimeters, the appearance of high heat-conducting ceramic substrate 1
Face offers via hole 2, and a diameter of 0.1-0.2 millimeters of via hole 2, the upper surface of high heat-conducting ceramic substrate 1 is provided with ink
The area of coverage 4, the quantity of ink coverage areas 4 is four, and the top of each ink coverage areas 4 is installed with chip 5, ink
The top of the area of coverage 4 is installed with chip 5, and chip 5 is fixedly connected by wire with high heat-conducting ceramic substrate 1, via hole 2
Vacancy between wire.
A kind of high-power polychrome adopting surface mounted LED light source, comprises the following steps：
S1, high heat-conducting ceramic substrate 1 metallized, then open up via hole 2 in the outer surface of high heat-conducting ceramic substrate 1；
S2, by four color pasters or nine color pasters directly against on high heat-conducting ceramic substrate 1, then by whole high heat conduction
Ceramic substrate 1 is directly against on mainboard；
S3, by the mainboard after attachment using laser separation into integral light source module, then by integral light source module.
Embodiment 4
Refer to Fig. 1,3 and 5, a kind of high-power polychrome adopting surface mounted LED light source, including high heat-conducting ceramic substrate 1, high heat conduction
Ceramic substrate 1 includes at least two layers monomer plate 3, and high heat-conducting ceramic substrate 1 is alumina ceramic plate, al nitride ceramic board or blue precious
One or more in feldspar plate, the thickness of high heat-conducting ceramic substrate 1 is 0.1-1 millimeters, the appearance of high heat-conducting ceramic substrate 1
Face offers via hole 2, and a diameter of 0.1-0.2 millimeters of via hole 2, the upper surface of high heat-conducting ceramic substrate 1 is provided with ink
The area of coverage 4, the quantity of ink coverage areas 4 is nine, and the top of each ink coverage areas 4 is installed with chip 5, ink
The top of the area of coverage 4 is installed with chip 5, and chip 5 is fixedly connected by wire with high heat-conducting ceramic substrate 1, via hole 2
Vacancy between wire, and directly installed and fixed instead of using bolt using attachment process, chip can be made
Install and more stablize, chip can be avoided to be damaged, and by opening up via hole, facilitate upper surface of base plate and lower surface it
Between be electrically connected, facilitate the connection on substrate two sides, be conducive to extension etc. service life.
A kind of high-power polychrome adopting surface mounted LED light source, comprises the following steps：
S1, high heat-conducting ceramic substrate 1 metallized, then open up via hole 2 in the outer surface of high heat-conducting ceramic substrate 1；
S2, by four color pasters or nine color pasters directly against on high heat-conducting ceramic substrate 1, then by whole high heat conduction
Ceramic substrate 1 is directly against on mainboard；
S3, by the mainboard after attachment using laser separation into integral light source module, then by integral light source module.
The electric elements occurred in this article are electrically connected with extraneous main controller and 220V civil powers, and main controller can be meter
Calculation machine etc. plays the conventionally known equipment of control.
When in use, directly chip 5 is mounted by using flip-chip, it is not necessary to connected using metal wire
Connect, the situation of electric leakage can be avoided the occurrence of, it is to avoid the situation of short circuit occurs in lamp, so as to make the security performance of product more preferable,
Potential safety hazard can be reduced, the safety used is ensure that, and directly installed using attachment process instead of using bolt
It is fixed, the installation of chip 5 can be made more to stablize, chip 5 can be avoided to be damaged, and by opening up via hole 2, it is convenient
It is electrically connected between upper surface of base plate and lower surface, facilitates the connection on substrate two sides, is conducive to extending the service life of lamp.
In summary, the high-power polychrome adopting surface mounted LED light source, is directly pasted chip 5 by using flip-chip 5
Dress, it is not necessary to be attached using metal wire, the situation of electric leakage can be avoided the occurrence of, it is to avoid the situation of short circuit occurs in lamp, so that
The security performance of product can be made more preferable, it is possible to reduce potential safety hazard, ensure that the safety used, and directly using attachment
Technique is installed is fixed instead of using bolt, and the installation of chip 5 can be made more to stablize, chip 5 can be avoided to be damaged,
And by opening up via hole 2, facilitate and be electrically connected between upper surface of base plate and lower surface, facilitate the circuit on substrate two sides to connect
Connect, be conducive to extending the service life of lamp, substrate is divided into multiple junior units by using laser, multiple polychromes can be installed
Lamp bead, and junior unit can be used to secondary optical design, then coordinate the lens of different angles, it is possible to achieve the angle of light
Degree is adjusted between being spent 2 to 60, and use more facilitates, and paster is carried out using machine, can make the more smart of the installation of chip 5
Really, the generation of substandard products can be reduced, so as to ensure the quality of product, and operating efficiency can be improved, can brought more
Many benefits.
It should be noted that herein, such as first and second or the like relational terms are used merely to a reality
Body or operation make a distinction with another entity or operation, and not necessarily require or imply these entities or deposited between operating
In any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Nonexcludability is included, so that process, method, article or equipment including a series of key elements not only will including those
Element, but also other key elements including being not expressly set out, or also include being this process, method, article or equipment
Intrinsic key element.In the absence of more restrictions, the key element limited by sentence "including a ...", it is not excluded that
Also there is other identical element in process, method, article or equipment including the key element.Although there has been shown and described that
Embodiments of the invention, for the ordinary skill in the art, it is possible to understand that do not depart from the principle of the present invention and
A variety of change, modification, replacement and modification can be carried out to these embodiments, the scope of the present invention is by appended power in the case of spirit
Profit is required and its equivalent is limited.
Claims (9)
1. a kind of high-power polychrome adopting surface mounted LED light source, including high heat-conducting ceramic substrate (1), it is characterised in that：The high heat conduction
The outer surface of ceramic substrate (1) offers via hole (2), and the upper surface of the high heat-conducting ceramic substrate (1) is provided with ink and covered
Chip (5) is installed with the top of cover region (4), the ink coverage areas (4), the chip (5) passes through wire and high heat conduction
Ceramic substrate (1) is fixedly connected, and the via hole (2) is located at the vacancy between wire.
2. a kind of high-power polychrome adopting surface mounted LED light source according to claim 1, it is characterised in that：The highly heat-conductive carbon/ceramic
Porcelain substrate (1) includes one layer of monomer plate (3).
3. a kind of high-power polychrome adopting surface mounted LED light source according to claim 1, it is characterised in that：The highly heat-conductive carbon/ceramic
Porcelain substrate (1) includes at least two layers monomer plate (3).
4. a kind of high-power polychrome adopting surface mounted LED light source according to claim 1, it is characterised in that：The highly heat-conductive carbon/ceramic
Porcelain substrate (1) is the one or more in alumina ceramic plate, al nitride ceramic board or sapphire ceramic plate.
5. a kind of high-power polychrome adopting surface mounted LED light source according to claim 1, it is characterised in that：The highly heat-conductive carbon/ceramic
The thickness of porcelain substrate (1) is 0.1-1 millimeters.
6. a kind of high-power polychrome adopting surface mounted LED light source according to claim 1, it is characterised in that：The via hole (2)
A diameter of 0.1-0.2 millimeters.
7. a kind of high-power polychrome adopting surface mounted LED light source according to claim 1, it is characterised in that：The ink covering
The quantity in area (4) is four, and the top of each ink coverage areas (4) is installed with chip (5).
8. a kind of high-power polychrome adopting surface mounted LED light source according to claim 1, it is characterised in that：The ink covering
The quantity in area (4) is nine, and the top of each ink coverage areas (4) is installed with chip (5).
9. a kind of high-power polychrome adopting surface mounted LED light source, it is characterised in that comprise the following steps：
S1, by high heat-conducting ceramic substrate (1) metallize, then open up via hole in the outer surface of high heat-conducting ceramic substrate (1)
(2)；
S2, by four color pasters or nine color pasters directly against on high heat-conducting ceramic substrate (1), then by whole highly heat-conductive carbon/ceramic
Porcelain substrate (1) is directly against on mainboard；
S3, by the mainboard after attachment using laser separation into integral light source module, then by integral light source module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710426019.6A CN107178714A (en) | 2017-06-08 | 2017-06-08 | A kind of high-power polychrome adopting surface mounted LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710426019.6A CN107178714A (en) | 2017-06-08 | 2017-06-08 | A kind of high-power polychrome adopting surface mounted LED light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107178714A true CN107178714A (en) | 2017-09-19 |
Family
ID=59836161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710426019.6A Pending CN107178714A (en) | 2017-06-08 | 2017-06-08 | A kind of high-power polychrome adopting surface mounted LED light source |
Country Status (1)
| Country | Link |
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| CN (1) | CN107178714A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108278501A (en) * | 2018-01-23 | 2018-07-13 | 苏州晶品新材料股份有限公司 | A kind of 16 color integrated LED light sources |
| CN113410375A (en) * | 2021-06-30 | 2021-09-17 | 深圳可思美科技有限公司 | LED light source module for depilation and LED depilation instrument |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101335319A (en) * | 2008-05-30 | 2008-12-31 | 潮州市三江电子有限公司 | High-power LED ceramic package base |
| CN103022335A (en) * | 2012-12-07 | 2013-04-03 | 赵建光 | Integrated electronic cooling module of diaphragm panel ceramic (DPC) substrate of light-emitting diode (LED) flip chip and manufacturing method of integrated electronic cooling module |
| CN106299084A (en) * | 2016-08-30 | 2017-01-04 | 开发晶照明（厦门）有限公司 | LED flip chip base plate for packaging and LED encapsulation structure |
| CN207065110U (en) * | 2017-06-08 | 2018-03-02 | 苏州晶品新材料股份有限公司 | A kind of high-power polychrome adopting surface mounted LED light source |
-
2017
- 2017-06-08 CN CN201710426019.6A patent/CN107178714A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101335319A (en) * | 2008-05-30 | 2008-12-31 | 潮州市三江电子有限公司 | High-power LED ceramic package base |
| CN103022335A (en) * | 2012-12-07 | 2013-04-03 | 赵建光 | Integrated electronic cooling module of diaphragm panel ceramic (DPC) substrate of light-emitting diode (LED) flip chip and manufacturing method of integrated electronic cooling module |
| CN106299084A (en) * | 2016-08-30 | 2017-01-04 | 开发晶照明（厦门）有限公司 | LED flip chip base plate for packaging and LED encapsulation structure |
| CN207065110U (en) * | 2017-06-08 | 2018-03-02 | 苏州晶品新材料股份有限公司 | A kind of high-power polychrome adopting surface mounted LED light source |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108278501A (en) * | 2018-01-23 | 2018-07-13 | 苏州晶品新材料股份有限公司 | A kind of 16 color integrated LED light sources |
| CN108278501B (en) * | 2018-01-23 | 2020-04-24 | 苏州晶品新材料股份有限公司 | 16-color integrated LED light source |
| CN113410375A (en) * | 2021-06-30 | 2021-09-17 | 深圳可思美科技有限公司 | LED light source module for depilation and LED depilation instrument |
| CN113410375B (en) * | 2021-06-30 | 2022-04-29 | 深圳可思美科技有限公司 | LED light source module for depilation and LED depilation instrument |
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