CN106499975A - LED lamp bead and its manufacture method - Google Patents

LED lamp bead and its manufacture method Download PDF

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Publication number
CN106499975A
CN106499975A CN201610966791.2A CN201610966791A CN106499975A CN 106499975 A CN106499975 A CN 106499975A CN 201610966791 A CN201610966791 A CN 201610966791A CN 106499975 A CN106499975 A CN 106499975A
Authority
CN
China
Prior art keywords
substrate
light source
led
led light
lamp bead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610966791.2A
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Chinese (zh)
Inventor
包锋
王勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201610966791.2A priority Critical patent/CN106499975A/en
Publication of CN106499975A publication Critical patent/CN106499975A/en
Priority to PCT/CN2017/086800 priority patent/WO2018076692A1/en
Pending legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90Methods of manufacture
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015Fastening arrangements intended to retain light sources
    • F21V19/002Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array

Abstract

The present invention provides a kind of LED lamp bead and its manufacture method.The LED lamp bead includes:Lamp base component and the glass lamp shade being sheathed on the outside of the LED light source component that LED light source component is electrically connected with the LED light source component, wherein, are filled with noble gases in the glass lamp shade;The LED light source component includes substrate and the LED light source being laid on the substrate and drive circuit, and wherein, the surface of the substrate is provided with conductive material, and the lamp base component is electrically connected with the drive circuit by the conductive material;The drive circuit is electrically connected with the LED light source by the conductive material.The present invention can simplify the structure of existing LED lamp bead, convenient batch production.

Description

LED lamp bead and its manufacture method
Technical field
The present invention relates to technical field of LED illumination, more particularly to a kind of LED lamp bead and its manufacture method.
Background technology
Light emitting diode (Light Emitting Diode, LED) has brightness height, small power consumption, drives simple, life-span length The advantages of, it is widely used in lighting field.Core component of the LED lamp bead as LED, directly determines the performance of LED.
Existing LED lamp bead, such as G4, G9 type LED lamp bead, typically by LED luminous components and LED drive circuit part point Do not design on different PCB (Printed Circuit Board, printed circuit board), then assembled.
During the present invention is realized, inventor has found at least there is following technical problem in prior art:
LED luminous components and LED drive circuit part are separately designed, and cause LED lamp bead complex structure.
Content of the invention
LED lamp bead and its manufacture method that the present invention is provided, simple structure are easily manufactured.
In a first aspect, the present invention provides a kind of LED lamp bead, including:LED light source component and the LED light source component are electrically connected The lamp base component for connecing and the glass lamp shade being sheathed on the outside of the LED light source component, wherein,
Noble gases are filled with the glass lamp shade;
The LED light source component includes substrate and the LED light source being laid on the substrate and drive circuit, wherein,
The surface of the substrate is provided with conductive material, and the lamp base component is by the conductive material and the drive circuit Electrical connection;
The drive circuit is electrically connected with the LED light source by the conductive material.
Alternatively, the LED light source is AC high-voltage LED light sources.
Alternatively, the noble gases are argon.
Alternatively, the substrate is made up of transparent ceramic material.
Alternatively, the conductive material is nickel.
Alternatively, the model of the lamp base component includes:G9, GY6.35, G5.3 or G4.
Second aspect, the present invention provide a kind of manufacture method of LED lamp bead, and the manufacture method includes:
LED light source and drive circuit are attached on substrate, the surface of the substrate is provided with conductive material;
The LED light source for posting and drive circuit routing are connected on the conductive material of the substrate;
Substrate tow sides after to routing are distinguished dispensing and are toasted;
Substrate after to baking carries out envelope bubble.
Alternatively, the substrate after described pair of baking carries out envelope bubble, including:
Burn the substrate after the bubble baking;
Sealed and poured noble gases to burning the substrate after bubble using glass lamp shade.
Alternatively, the noble gases are argon.
The third aspect, the present invention provide a kind of LED, and the LED includes above-mentioned LED lamp bead.
LED lamp bead and its manufacture method that the present invention is provided, LED light source and drive circuit are integrated on one piece of substrate, The structure of existing LED lamp bead is simplified, further, substrate is made using transparent ceramic material, it is ensured that lighting angle reaches 360 °, while can ensure that LED light source heat-dissipating;Lampshade is adopted and conventional halogen lamp identical glass material, improves LED light source Light transmittance, light transmittance efficiency reach 1.6 times of existing level, while pouring argon in glass lamp shade, further facilitate LED light source and dissipate Heat, especially lampshade shape are consistent with conventional halogen lamp profile, can directly replace existing Halogen light.More importantly, whole production Flow process can all realize automatization, and efficiency high, production capacity are big, low cost.
Description of the drawings
The structural representation of the LED lamp bead that Fig. 1 is provided for one embodiment of the invention;
The flow chart of the manufacture method of the LED lamp bead that Fig. 2 is provided for another embodiment of the present invention.
Specific embodiment
Purpose, technical scheme and advantage for making the embodiment of the present invention is clearer, below in conjunction with the embodiment of the present invention In accompanying drawing, to the embodiment of the present invention in technical scheme be clearly and completely described, it is clear that described embodiment is only Only it is a part of embodiment of the invention, rather than whole embodiments.Embodiment in based on the present invention, ordinary skill The every other embodiment obtained under the premise of creative work is not made by personnel, belongs to the scope of protection of the invention.
The embodiment of the present invention provides a kind of LED lamp bead, as shown in figure 1, the LED lamp bead includes:LED light source component 1 and The lamp base component 2 and the glass lamp shade 3 being sheathed on the outside of the LED light source component 1 of the electrical connection of the LED light source component 1, its In, noble gases are filled with the glass lamp shade 3;The LED light source component 1 includes substrate 11, LED light source 12 and drives electricity Road 13, the LED light source 12 and drive circuit 13 are laid on the substrate 11, wherein, and 11 surface of the substrate is provided with conduction Material, the lamp base component 2 are electrically connected with the drive circuit 13 by the conductive material;The drive circuit 13 passes through institute State conductive material to electrically connect with the LED light source 12.
Alternatively, LED lamp bead provided in an embodiment of the present invention uses AC high-voltage LED light sources, can direct external AC, Drive circuit is simple.
Alternatively, argon is poured in the glass lamp shade, so as to LED light source heat-dissipating.
Alternatively, the substrate is made using transparent ceramic material, and being provided with nickel material on its surface is used for conduction.
Alternatively, LED lamp bead provided in an embodiment of the present invention can select Multiple Type lamp base component, such as G9, GY6.35, G5.3 or G4.
LED lamp bead provided in an embodiment of the present invention, LED light source and drive circuit is integrated on one piece of substrate, is simplified The structure of existing LED lamp bead, while ensureing good light efficiency and driving effect.Further, substrate adopts transparent ceramic material Make, it is ensured that lighting angle reaches 360 °, while can ensure that LED light source heat-dissipating;Lampshade is adopted and conventional halogen lamp identical Glass material, improves the light transmittance of LED light source, and light transmittance efficiency reaches 1.6 times of existing level, while pouring argon in glass lamp shade Gas, further facilitates LED light source heat-dissipating, and especially lampshade shape is consistent with conventional halogen lamp profile, can directly replace existing halogen Plain lamp.
The embodiment of the present invention also provides a kind of manufacture method of LED lamp bead, as shown in Fig. 2 the manufacture method include with Lower step:
S11, LED light source and drive circuit are attached on substrate, the surface of the substrate is provided with conductive material, can use nickel Make conductive material, the substrate is made using transparent ceramic material, in substrate processing, using new material by lamp base component with Combine closely between substrate, substrate can be used cooperatively with the lamp base component of the Multiple Types such as G9, GY6.35, G5.3 or G4;
S12, the LED light source for posting and drive circuit routing are connected on the conductive material of the substrate;
S13, to routing after substrate tow sides distinguish dispensing and toast, in order to improve light efficiency, mix in the glue for using Miscellaneous fluorescent material, two-sided dispensing can increase lighting angle, realize 360 ° of full irradiations;
S14, to baking after substrate carry out envelope bubble, specifically include:The substrate after the bubble baking is burnt, in ceramic substrate table Face sintered balls bubble;Noble gases are sealed and are poured using glass lamp shade to burning the substrate after bubble, can be selected argon here.
After the completion of envelope bubble, the product for normally sealing bubble is tested, including electric performance test and optical performance test, to surveying Dispatch from the factory by after trying normal product packaging.
Alternatively, for improve production efficiency, in substrate processing, multiple substrates can be bolted together, forms one Individual jigsaw, such automatization's chip mounter and wire bonder can be carried out to the LED light source and its drive circuit on the jigsaw simultaneously Paster and routing.After completing paster and routing, carry out two-sided dispensing and baking to the jigsaw, then to baking after jigsaw carry out Cutting, forms single substrate, and substrate size has been set in advance, such as 9mmX20mm, finally again to each single substrate Carry out envelope bubble.
As the embodiment of the present invention will be combined closely between lamp base component and substrate using new material so that product is burning Avoid during bubble due to burn bubble temperature too high and cause lamp base component to come off from substrate so as to cause low good and burn bubble different Often, while effectively increasing the service life of product.
The manufacture method of LED lamp bead provided in an embodiment of the present invention, using advanced integrated circuit SIP (System In Package, system in package) technology, effectively LED light source and drive circuit are integrated on one piece of substrate, simple structure, with When can also reduce stroboscopic, further, the manufacture method can realize the automation mechanized operation of whole production procedure, efficiency high, Production capacity is big, low cost.
The embodiment of the present invention also provides a kind of LED, and the LED includes above-mentioned LED lamp bead.
The above, the only specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, any Those familiar with the art the invention discloses technical scope in, the change or replacement that can readily occur in all are answered It is included within the scope of the present invention.Therefore, protection scope of the present invention should be defined by scope of the claims.

Claims (10)

1. a kind of LED lamp bead, it is characterised in that include:The lamp base group that LED light source component is electrically connected with the LED light source component Part and the glass lamp shade being sheathed on the outside of the LED light source component, wherein,
Noble gases are filled with the glass lamp shade;
The LED light source component includes substrate and the LED light source being laid on the substrate and drive circuit, wherein,
The surface of the substrate is provided with conductive material, and the lamp base component is electrically connected with the drive circuit by the conductive material Connect;
The drive circuit is electrically connected with the LED light source by the conductive material.
2. LED lamp bead according to claim 1, it is characterised in that the LED light source is AC high-voltage LED light sources.
3. LED lamp bead according to claim 1, it is characterised in that the noble gases are argon.
4. LED lamp bead according to claim 1, it is characterised in that the substrate is made up of transparent ceramic material.
5. LED lamp bead according to claim 1, it is characterised in that the conductive material is nickel.
6. LED lamp bead according to claim 1, it is characterised in that the model of the lamp base component includes:G9、GY6.35、 G5.3 or G4.
7. a kind of manufacture method of LED lamp bead, it is characterised in that the manufacture method includes:
LED light source and drive circuit are attached on substrate, the surface of the substrate is provided with conductive material;
The LED light source for posting and drive circuit routing are connected on the conductive material of the substrate;
Substrate tow sides after to routing are distinguished dispensing and are toasted;
Substrate after to baking carries out envelope bubble.
8. the manufacture method of LED lamp bead according to claim 7, it is characterised in that the substrate after described pair of baking is carried out Envelope bubble, including:
Burn the substrate after the bubble baking;
Sealed and poured noble gases to burning the substrate after bubble using glass lamp shade.
9. the manufacture method of LED lamp bead according to claim 8, it is characterised in that the noble gases are argon.
10. a kind of LED, it is characterised in that the LED includes the LED lamp bead as any one of claim 1 to 6.
CN201610966791.2A 2016-10-28 2016-10-28 LED lamp bead and its manufacture method Pending CN106499975A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201610966791.2A CN106499975A (en) 2016-10-28 2016-10-28 LED lamp bead and its manufacture method
PCT/CN2017/086800 WO2018076692A1 (en) 2016-10-28 2017-06-01 Led lamp bead and manufacturing method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610966791.2A CN106499975A (en) 2016-10-28 2016-10-28 LED lamp bead and its manufacture method

Publications (1)

Publication Number Publication Date
CN106499975A true CN106499975A (en) 2017-03-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
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CN (1) CN106499975A (en)
WO (1) WO2018076692A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018076692A1 (en) * 2016-10-28 2018-05-03 包锋 Led lamp bead and manufacturing method therefor
CN108167677A (en) * 2017-12-27 2018-06-15 亚浦耳照明股份有限公司 The preparation method and LED light of a kind of LED

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202957289U (en) * 2012-10-13 2013-05-29 江苏新广联科技股份有限公司 Light source module
CN204005359U (en) * 2014-07-18 2014-12-10 深圳市中电照明股份有限公司 A kind of LED light source
US20150043223A1 (en) * 2013-08-07 2015-02-12 Michael Chen LED Recessed Lighting Device
CN104930371A (en) * 2015-06-02 2015-09-23 常州阿拉丁照明电器有限公司 Single-ended full-glass 360-degree LED lamp
CN205424447U (en) * 2015-12-18 2016-08-03 常州市福兴电器有限公司 LED lamp bead

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2624047Y (en) * 2003-06-18 2004-07-07 樊邦弘 Foldable screen lamp
CN106499975A (en) * 2016-10-28 2017-03-15 包锋 LED lamp bead and its manufacture method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202957289U (en) * 2012-10-13 2013-05-29 江苏新广联科技股份有限公司 Light source module
US20150043223A1 (en) * 2013-08-07 2015-02-12 Michael Chen LED Recessed Lighting Device
CN204005359U (en) * 2014-07-18 2014-12-10 深圳市中电照明股份有限公司 A kind of LED light source
CN104930371A (en) * 2015-06-02 2015-09-23 常州阿拉丁照明电器有限公司 Single-ended full-glass 360-degree LED lamp
CN205424447U (en) * 2015-12-18 2016-08-03 常州市福兴电器有限公司 LED lamp bead

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018076692A1 (en) * 2016-10-28 2018-05-03 包锋 Led lamp bead and manufacturing method therefor
CN108167677A (en) * 2017-12-27 2018-06-15 亚浦耳照明股份有限公司 The preparation method and LED light of a kind of LED

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Application publication date: 20170315

RJ01 Rejection of invention patent application after publication