CN205452259U - Fixing device for silicon piece - Google Patents
Fixing device for silicon piece Download PDFInfo
- Publication number
- CN205452259U CN205452259U CN201620197373.7U CN201620197373U CN205452259U CN 205452259 U CN205452259 U CN 205452259U CN 201620197373 U CN201620197373 U CN 201620197373U CN 205452259 U CN205452259 U CN 205452259U
- Authority
- CN
- China
- Prior art keywords
- fixing device
- silicon chip
- backboard
- width
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 69
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 69
- 239000010703 silicon Substances 0.000 title claims abstract description 69
- 238000005303 weighing Methods 0.000 claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 235000008216 herbs Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model discloses a fixing device for silicon piece for it is right when weighing the weight of silicon chip the silicon chip is fixed, wherein, fixing device includes the base, the marginal upwards arch of first end of base is provided with preceding baffle, the marginal upwards arch of the second end relative with first end of base is provided with the backplate, the top surface of backplate is the slope form, the lateral surface of backplate is higher than the medial surface, will the silicon chip is fixed when fixing device is last, the bottom quilt of silicon chip the base supports and the roof pressure is in on the preceding baffle, the back roof pressure of silicon chip is in quilt on the top surface of slope form the backplate supports. Fixing device for silicon piece has improved the accuracy that the silicon chip is weighed, use the device can also reduce the pollution of electronic scale to the silicon chip simultaneously.
Description
Technical field
This utility model relates to technical field of solar cell manufacturing, a kind of fixing device for silicon piece being used for when weighing the weight of silicon chip fixing silicon chip.
Background technology
Solar energy power generating is because of its cleaning, the feature such as safe and convenient, efficient, it has also become countries in the world common concern and the new industry given priority to.Therefore, further investigate and utilize solar energy resources, alleviation crisis of resource, tool of improving the ecological environment are of great significance.
In the production process of solaode, the weight that making herbs into wool and etching procedure are required to before and after processing silicon chip weighs, and carrys out the stability of monitoring process.In prior art, it is common that being directly placed on electronic scale by silicon chip and weigh, during weighing, silicon chip directly contacts with electronic scale table top, it is susceptible to slide, causes weighing error.Meanwhile, silicon chip directly with electronic scale deck contact, easily cause silicon chip surface pollution, affect solar cell photoelectric conversion efficiency.For the existing existing settling mode of weighing error it is: repeating to weigh repeatedly, average, this mode brings complexity to employee work, greatly reduces production work efficiency.Existing settling mode for the surface contamination caused when weighing is: increase the frequency of wiping electronic scale table top, reduces polluter, and this mode adds the job content of employee, and DeGrain.
Utility model content
In view of this, this utility model provides a kind of fixing device for silicon piece, when weighing the weight of silicon chip, first uses this fixing device to fix silicon chip, is placed on electronic scale weighing the most again, improves the accuracy of weighing；Use this device can also reduce the electronic scale pollution to silicon chip simultaneously.
To achieve the above object, this utility model have employed following technical scheme:
A kind of fixing device for silicon piece, for described silicon chip being fixed when weighing the weight of silicon chip, wherein, described fixing device includes base, first end margin of described base raises up and is provided with front apron, second end margin relative with the first end of described base raises up and is provided with backboard, the inclined shape of end face of described backboard, and the lateral surface of described backboard is higher than medial surface；When being fixed in described fixing device by described silicon chip, the bottom of described silicon chip is supported by described base and pushes up and is pressed on described front apron, and the top, the back side of described silicon chip is pressed on described skewed end face and is supported by described backboard.
Preferably, described base, front apron and backboard are respectively plate-like structure or grid Openworks shape structure.
Preferably, described base, front apron and backboard are integrated shape structure.
Preferably, the end face of described backboard is 25～35 ° with the angle of lateral surface.
Preferably, the width of described base is 70 ± 5mm, a length of 50 ± 5mm, and height is 10 ± 2mm.
Preferably, the width of described front apron is 3 ± 1mm, and height is 6 ± 2mm.
Preferably, the width of described backboard is 10 ± 2mm, and height is 80 ± 5mm.
In one preferably technical scheme, the width of described base is 70mm, a length of 50mm, and height is 10mm；The width of described front apron is 2mm, and height is 5mm, and length is equal with the width of described base；The width of described backboard is 10mm, and height is 80mm, and length is equal with the width of described base；The end face of described backboard and the angle of lateral surface are 31 °.
The fixing device for silicon piece that this utility model provides, when weighing the weight of silicon chip, first uses this fixing device to fix silicon chip, is placed on electronic scale weighing the most again, silicon chip can be avoided to slide, improve the accuracy of weighing.Further, being fixed in described fixing device, silicon chip is little with the contact area of fixing device the inclined shape of silicon chip, can reduce the pollution to silicon chip during weighing.
Accompanying drawing explanation
Fig. 1 is the structural representation of the fixing device for silicon piece that this utility model provides；
Fig. 2 is the graphical representation of exemplary being mounted with silicon chip in the fixing device for silicon piece that this utility model provides.
Detailed description of the invention
Below in conjunction with specific embodiment, this utility model is expanded on further.Should be understood that these embodiments are merely to illustrate this utility model rather than limit scope of the present utility model.In addition, it is to be understood that after having read the content that this utility model is lectured, this utility model can be made various changes or modifications by those skilled in the art, and these equivalent form of values fall within the application appended claims limited range equally.
At this, it can further be stated that, in order to avoid having obscured this utility model because of unnecessary details, illustrate only in the accompanying drawings and according to the closely-related structure of scheme of the present utility model and/or process step, and eliminate other details little with this utility model relation.
This utility model embodiment provides a kind of fixing device for silicon piece, and refering to Fig. 1 and Fig. 2, this fixing device is mainly used for when weighing the weight of silicon chip 100 being fixed described silicon chip 100.Concrete ground, as shown in Figure 1, described fixing device includes base 1, first end 11 edge of described base 1 raises up and is provided with front apron 2, second end 12 edge relative with the first end 11 of described base 1 raises up and is provided with backboard 3, the inclined shape of end face 31 of described backboard 3, the lateral surface 32 of described backboard 3 is higher than medial surface 33.Refering to Fig. 2, when described silicon chip 100 is fixed in described fixing device, the bottom 101 of described silicon chip 100 is supported by described base 1 and pushes up and is pressed on described front apron 2, and the top, the back side 102 of described silicon chip 100 is pressed on described skewed end face 31 and is supported by described backboard 3.
When weighing the weight of silicon chip, first use this fixing device to fix silicon chip, be placed on electronic scale weighing the most again, silicon chip can be avoided to slide, improve the accuracy of weighing.Further, being fixed in described fixing device, silicon chip is little with the contact area of fixing device the inclined shape of silicon chip, can reduce the pollution to silicon chip during weighing.
In the present embodiment, as it is shown in figure 1, the width D 1 of described base 1 is 70mm, length L1 be 50mm, highly H1 be 10mm.The width D 2 of described front apron 2 be 2mm, highly H2 be 5mm, length is equal with the width D 1 of described base 1.The width D 3 of described backboard 3 be 10mm, highly H3 be 80mm, length is equal with the width D 1 of described base 1.The end face 31 of described backboard 3 is 31 ° with the angle α of lateral surface 32.
It should be noted that the design parameter of the length of the above base 1, front apron 2 and backboard 3 illustrates only as a specific example, some other embodiments can also take other numerical value.Even more preferably, width D 1 value of described base 1 is in the range of 70 ± 5mm, and length L1 value is in the range of 50 ± 5mm, and highly value is in the range of 10 ± 2mm for ratio；Width D 2 value of described front apron 2 is in the range of 3 ± 1mm, and highly H2 value is in the range of 6 ± 2mm, and its length can also be greater than or be less than the width D 1 of described base 1；Width D 3 value of described backboard 3 is in the range of 10 ± 2mm, and highly H3 value is in the range of 80 ± 5mm, and its length can also be greater than or be less than the width D 1 of described base 1；The end face 31 of described backboard 3 and the angle α value of lateral surface 32 are in the range of 25～35 °.
Wherein, as it is shown in figure 1, in the present embodiment, described base 1, front apron 2 and backboard 3 are respectively plate-like structure.Certainly, in some other embodiments, described base 1, front apron 2 and backboard 3 can also be to separately design as grid Openworks shape structure, the most both can alleviate the weight of fixing device, it is also possible to save material.It is of course also possible to be that wherein one or two structure of base 1, front apron 2 and backboard 3 is designed as plate-like structure, remaining is designed as grid Openworks shape structure.
Wherein, as it is shown in figure 1, in the present embodiment, described base 1, front apron 2 and backboard 3 are integrated shape structure.Certainly in some other embodiments, described base 1, front apron 2 and backboard 3 can also be Split type structures, and then each several part connects by securing member (such as screw element) is fixing again.
In sum, the fixing device for silicon piece that this utility model provides, when weighing the weight of silicon chip, first use this fixing device to fix silicon chip, be placed on electronic scale weighing the most again, improve the accuracy of weighing, the pollution to silicon chip can be reduced simultaneously.During silicon chip weighs, alleviate the work load of operation employee, improve work efficiency.
The above is only the detailed description of the invention of the application; it should be pointed out that, for those skilled in the art, on the premise of without departing from the application principle; can also make some improvements and modifications, these improvements and modifications also should be regarded as the protection domain of the application.
Claims (8)
1. a fixing device for silicon piece, for described silicon chip being fixed when weighing the weight of silicon chip, it is characterized in that, described fixing device includes base, first end margin of described base raises up and is provided with front apron, second end margin relative with the first end of described base raises up and is provided with backboard, the inclined shape of end face of described backboard, and the lateral surface of described backboard is higher than medial surface；When being fixed in described fixing device by described silicon chip, the bottom of described silicon chip is supported by described base and pushes up and is pressed on described front apron, and the top, the back side of described silicon chip is pressed on described skewed end face and is supported by described backboard.
Fixing device for silicon piece the most according to claim 1, it is characterised in that described base, front apron and backboard are respectively plate-like structure or grid Openworks shape structure.
Fixing device for silicon piece the most according to claim 1, it is characterised in that described base, front apron and backboard are integrated shape structure.
4. according to the arbitrary described fixing device for silicon piece of claim 1-3, it is characterised in that the end face of described backboard and the angle of lateral surface are 25～35 °.
5. according to the arbitrary described fixing device for silicon piece of claim 1-3, it is characterised in that the width of described base is 70 ± 5mm, a length of 50 ± 5mm, and height is 10 ± 2mm.
6. according to the arbitrary described fixing device for silicon piece of claim 1-3, it is characterised in that the width of described front apron is 3 ± 1mm, and height is 6 ± 2mm.
7. according to the arbitrary described fixing device for silicon piece of claim 1-3, it is characterised in that the width of described backboard is 10 ± 2mm, and height is 80 ± 5mm.
8. according to the arbitrary described fixing device for silicon piece of claim 1-3, it is characterised in that the width of described base is 70mm, a length of 50mm, and height is 10mm；The width of described front apron is 2mm, and height is 5mm, and length is equal with the width of described base；The width of described backboard is 10mm, and height is 80mm, and length is equal with the width of described base；The end face of described backboard and the angle of lateral surface are 31 °.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620197373.7U CN205452259U (en) | 2016-03-15 | 2016-03-15 | Fixing device for silicon piece |
| PCT/CN2016/091832 WO2017156951A1 (en) | 2016-03-15 | 2016-07-27 | Silicon wafer securing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620197373.7U CN205452259U (en) | 2016-03-15 | 2016-03-15 | Fixing device for silicon piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205452259U true CN205452259U (en) | 2016-08-10 |
Family
ID=56602807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620197373.7U Active CN205452259U (en) | 2016-03-15 | 2016-03-15 | Fixing device for silicon piece |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205452259U (en) |
| WO (1) | WO2017156951A1 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003282670A (en) * | 2002-03-27 | 2003-10-03 | Dainippon Screen Mfg Co Ltd | Substrate holding arm, substrate transport device, substrate processing device, and substrate holding method |
| CN201364885Y (en) * | 2009-01-13 | 2009-12-16 | 中芯国际集成电路制造(上海)有限公司 | Identifying tool |
| CN204885097U (en) * | 2015-08-18 | 2015-12-16 | 珠海宏光照明器材有限公司 | A device that is used for solid brilliant bonding wire of LED to inspect |
-
2016
- 2016-03-15 CN CN201620197373.7U patent/CN205452259U/en active Active
- 2016-07-27 WO PCT/CN2016/091832 patent/WO2017156951A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017156951A1 (en) | 2017-09-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |