WO2017156951A1

WO2017156951A1 - Silicon wafer securing apparatus

Info

Publication number: WO2017156951A1
Application number: PCT/CN2016/091832
Authority: WO
Inventors: 林瀚琪
Original assignee: 张甘霖
Priority date: 2016-03-15
Filing date: 2016-07-27
Publication date: 2017-09-21
Also published as: CN205452259U

Abstract

A silicon wafer securing apparatus, used for securing a silicon wafer (100) whilst weighing said silicon wafer (100), the securing apparatus comprising a base (1), the edge of a first end (11) of the base (1) protruding upward and being provided with a front baffle (2), and the edge of the second end (12) of the base (1) opposite the first end (11) protruding upward and being provided with a rear baffle (3), the top face (31) of the rear baffle (3) having an oblique shape, and the outer side face (32) of the rear baffle (3) being higher than the inner side face (33); when a silicon wafer (100) is secured on the present securing apparatus, the bottom end (101) of the silicon wafer (100) is supported by the base (1) and is pressed onto the front baffle (2), the back face (102) of the silicon wafer (100) being pressed onto the oblique top face (31) and being supported by the rear baffle (3). The present silicon wafer securing apparatus increases silicon wafer (100) weighing accuracy; using the present apparatus can also reduce contamination of the silicon wafer (100) by an electronic scale.

Description

Silicon wafer fixing device

Technical field

The invention relates to the technical field of solar cell manufacturing, in particular to a silicon wafer fixing device for fixing a silicon wafer when weighing the silicon wafer.

Background technique

Due to its clean, safe, convenient and efficient characteristics, solar photovoltaic power generation has become an emerging industry with universal attention and key development in the world. Therefore, in-depth study and utilization of solar energy resources is of great significance for alleviating resource crises and improving the ecological environment.

In the production process of solar cells, both the texturing and etching processes need to weigh the weight before and after processing of the silicon wafer to monitor the stability of the process. In the prior art, the silicon wafer is usually placed directly on the electronic scale for weighing. During the weighing process, the silicon wafer is in direct contact with the electronic scale surface, which is prone to slippage and causes weighing error. At the same time, the silicon wafer is directly in contact with the surface of the electronic scale, which is likely to cause surface contamination of the silicon wafer and affect the photoelectric conversion efficiency of the solar cell. The existing solution to the weighing error is to repeat the weighing multiple times and take the average value. This method brings complexity to the work of the employees and greatly reduces the production efficiency. The existing solution to the surface contamination caused by weighing is to increase the frequency of wiping the electronic weighing table and reduce the pollution source. This method increases the work content of the employees, and the effect is not obvious.

Summary of the invention

In view of this, the present invention provides a silicon wafer fixing device. When weighing the silicon wafer, the fixing device is used to fix the silicon wafer, and then placed on the electronic scale for weighing, thereby improving the accuracy of weighing. At the same time, the use of the device can also reduce the contamination of the silicon scale by the electronic scale.

In order to achieve the above object, the present invention adopts the following technical solutions:

A silicon wafer fixing device for fixing the silicon wafer when weighing the silicon wafer, wherein the fixing device comprises a base, and the first end edge of the base is convexly provided with a front bezel a second end edge of the base opposite to the first end is upwardly provided with a tailgate, a top surface of the tailgate is inclined, and an outer side surface of the tailgate is higher than an inner side; When the silicon wafer is fixed on the fixing device, the bottom end of the silicon wafer is supported by the base and pressed against the front baffle, and the back surface of the silicon wafer is pressed against the inclined shape. The top surface is supported by the tailgate.

Wherein, the base, the front baffle and the rear baffle are respectively a flat structure or a mesh hollow structure.

Wherein, the base, the front baffle and the rear baffle are integrally formed.

Wherein, the angle between the top surface and the outer side surface of the tailgate is 25 to 35 degrees.

Wherein, the base has a width of 70±5 mm, a length of 50±5 mm, and a height of 10±2 mm.

Wherein, the front baffle has a width of 3±1 mm and a height of 6±2 mm.

Wherein, the back baffle has a width of 10±2 mm and a height of 80±5 mm.

In one embodiment, the base has a width of 70 mm, a length of 50 mm, and a height of 10 mm; the front baffle has a width of 2 mm and a height of 5 mm, and the length is equal to the width of the base; The width of the plate is 10 mm, the height is 80 mm, and the length is equal to the width of the base; the angle between the top surface and the outer side of the tailgate is 31°.

The silicon wafer fixing device provided by the invention firstly fixes the silicon wafer by using the fixing device when weighing the weight of the silicon wafer, and then placing it on the electronic scale for weighing, thereby avoiding sliding of the silicon wafer and improving the accuracy of weighing. Sex. Further, the silicon wafer is fixed in the fixing device in an inclined manner, and the contact area between the silicon wafer and the fixing device is small, and the contamination of the silicon wafer can be reduced during the weighing process.

DRAWINGS

1 is a schematic structural view of a silicon wafer fixing device provided by the present invention;

2 is an exemplary illustration of a silicon wafer holding device provided with the present invention loaded with a silicon wafer.

detailed description

The invention is further illustrated below in conjunction with specific embodiments. It is to be understood that the examples are not intended to limit the scope of the invention. In addition, it should be understood that various changes and modifications may be made by those skilled in the art in the form of the present invention.

In this context, it is also to be noted that in order to avoid obscuring the invention by unnecessary detail, only the structures and/or processing steps closely related to the solution according to the invention are shown in the drawings, and the Other details that are not relevant to the present invention.

The embodiment of the present invention provides a silicon wafer fixing device. Referring to FIG. 1 and FIG. 2, the fixing device is mainly used for fixing the silicon wafer 100 when weighing the silicon wafer 100. Specifically, as shown in FIG. 1 , the fixing device includes a base 1 , and the first end 11 of the base 1 has an edge protruding upwardly. The front baffle 2, the edge of the second end 12 of the base 1 opposite to the first end 11 is convexly disposed with a tailgate 3, and the top surface 31 of the tailgate 3 is inclined, the rear block The outer side 32 of the plate 3 is higher than the inner side 33. Referring to FIG. 2, when the silicon wafer 100 is fixed on the fixing device, the bottom end 101 of the silicon wafer 100 is supported by the base 1 and pressed against the front baffle 2, the silicon wafer The back surface 102 of the 100 is pressed against the inclined top surface 31 by the tailgate 3.

When weighing the weight of the silicon wafer, the fixing device is used to fix the silicon wafer, and then placed on the electronic scale for weighing, thereby avoiding sliding of the silicon wafer and improving the accuracy of weighing. Further, the silicon wafer is fixed in the fixing device in an inclined manner, and the contact area between the silicon wafer and the fixing device is small, and the contamination of the silicon wafer can be reduced during the weighing process.

In the present embodiment, as shown in FIG. 1, the base 1 has a width D1 of 70 mm, a length L1 of 50 mm, and a height H1 of 10 mm. The front baffle 2 has a width D2 of 2 mm, a height H2 of 5 mm, and a length equal to the width D1 of the base 1. The tailgate 3 has a width D3 of 10 mm, a height H3 of 80 mm, and a length equal to the width D1 of the base 1. The angle α between the top surface 31 and the outer side surface 32 of the tailgate 3 is 31°.

It should be noted that the specific parameters of the length, width and height of the base 1, the front baffle 2 and the tailgate 3 described above are only described as a specific example, and in other embodiments, other parameters may be taken. The value. Wherein, the width D1 of the base 1 is in the range of 70±5 mm, the length L1 is in the range of 50±5 mm, and the height is in the range of 10±2 mm; the width of the front baffle 2 The value of D2 is in the range of 3±1 mm, the height H2 is in the range of 6±2 mm, and the length may be greater or smaller than the width D1 of the base 1; the width D3 of the tailgate 3 is In the range of 10±2 mm, the height H3 is in the range of 80±5 mm, and the length may also be greater or smaller than the width D1 of the base 1; the top surface 31 and the outer side 32 of the tailgate 3 The angle α is in the range of 25 to 35°.

As shown in FIG. 1 , in the embodiment, the base 1 , the front baffle 2 and the rear baffle 3 respectively have a flat structure. Of course, in other embodiments, the base 1, the front baffle 2 and the tailgate 3 may also be designed as a mesh hollow structure, which can reduce the weight of the fixing device and save material. Of course, one or both of the structure of the base 1, the front baffle 2 and the tailgate 3 may be designed as a flat structure, and the rest of the design is a mesh hollow structure.

As shown in FIG. 1 , in the embodiment, the base 1 , the front baffle 2 and the rear baffle 3 have an integral structure. Of course, in other embodiments, the base 1, the front baffle 2, and the tailgate 3 may also be separate structures, and then the portions are then fixedly coupled by fasteners (eg, screws).

In summary, the silicon wafer fixing device provided by the present invention first uses the fixing device to fix the silicon wafer when weighing the silicon wafer, and then puts it on the electronic scale for weighing, thereby improving the accuracy of weighing. At the same time, it can reduce the contamination of the silicon wafer. In the process of weighing silicon wafers, the workload of the workers is reduced, and work efficiency is improved.

The above description is only a specific embodiment of the present application, and it should be noted that those skilled in the art can also make several improvements and retouchings without departing from the principles of the present application. It should be considered as the scope of protection of this application.

Claims

A silicon wafer fixing device for fixing the silicon wafer when weighing the silicon wafer, wherein the fixing device comprises a base, and the first end edge of the base is convexly provided with a front bezel a second end edge of the base opposite to the first end is upwardly provided with a tailgate, a top surface of the tailgate is inclined, and an outer side surface of the tailgate is higher than an inner side; When the silicon wafer is fixed on the fixing device, the bottom end of the silicon wafer is supported by the base and pressed against the front baffle, and the back surface of the silicon wafer is pressed against the inclined shape. The top surface is supported by the tailgate.
The silicon wafer fixing device according to claim 1, wherein the base, the front bezel, and the rear baffle are respectively a flat plate structure or a mesh hollow structure.
The silicon wafer holding device according to claim 1, wherein the base, the front bezel, and the rear baffle are of a unitary structure.
The silicon wafer fixing device according to claim 1, wherein an angle between a top surface and an outer side surface of the tailgate is 25 to 35°.
The silicon wafer holding device according to claim 1, wherein the base has a width of 70 ± 5 mm, a length of 50 ± 5 mm, and a height of 10 ± 2 mm.
The silicon wafer holding device according to claim 1, wherein the front baffle has a width of 3 ± 1 mm and a height of 6 ± 2 mm.
The silicon wafer holding device according to claim 1, wherein the tailgate has a width of 10 ± 2 mm and a height of 80 ± 5 mm.
The silicon wafer fixing device according to claim 1, wherein the base has a width of 70 mm, a length of 50 mm, and a height of 10 mm; and the front baffle has a width of 2 mm and a height of 5 mm, and the length of the base is The width of the tailgate is 10 mm, the height is 80 mm, and the length is equal to the width of the base; the angle between the top surface and the outer side of the tailgate is 31°.
The silicon wafer fixing device according to claim 2, wherein an angle between a top surface and an outer side surface of the tailgate is 25 to 35 degrees.
The silicon wafer holding device according to claim 2, wherein the base has a width of 70 ± 5 mm, a length of 50 ± 5 mm, and a height of 10 ± 2 mm.
The silicon wafer fixture of claim 2, wherein the width of the front bezel is 3±1mm, height is 6±2mm.
The silicon wafer holding device according to claim 2, wherein the tailgate has a width of 10 ± 2 mm and a height of 80 ± 5 mm.
The silicon wafer fixing device according to claim 2, wherein the base has a width of 70 mm, a length of 50 mm, and a height of 10 mm; and the front baffle has a width of 2 mm and a height of 5 mm, and the length of the base is The width of the tailgate is 10 mm, the height is 80 mm, and the length is equal to the width of the base; the angle between the top surface and the outer side of the tailgate is 31°.
The silicon wafer fixing device according to claim 3, wherein an angle between a top surface and an outer side surface of the tailgate is 25 to 35°.
The silicon wafer holding device according to claim 3, wherein the base has a width of 70 ± 5 mm, a length of 50 ± 5 mm, and a height of 10 ± 2 mm.
The silicon wafer holding device according to claim 3, wherein the front baffle has a width of 3 ± 1 mm and a height of 6 ± 2 mm.
The silicon wafer holding device according to claim 3, wherein the tailgate has a width of 10 ± 2 mm and a height of 80 ± 5 mm.
The silicon wafer fixing device according to claim 3, wherein the base has a width of 70 mm, a length of 50 mm, and a height of 10 mm; and the front baffle has a width of 2 mm and a height of 5 mm, and the length of the base is The width of the tailgate is 10 mm, the height is 80 mm, and the length is equal to the width of the base; the angle between the top surface and the outer side of the tailgate is 31°.