CN205428922U - 带有ic功能的发光二极管 - Google Patents
带有ic功能的发光二极管 Download PDFInfo
- Publication number
- CN205428922U CN205428922U CN201521048875.5U CN201521048875U CN205428922U CN 205428922 U CN205428922 U CN 205428922U CN 201521048875 U CN201521048875 U CN 201521048875U CN 205428922 U CN205428922 U CN 205428922U
- Authority
- CN
- China
- Prior art keywords
- emitting diode
- chip
- light
- backlight unit
- diode chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003086 colorant Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000010354 integration Effects 0.000 abstract 1
- 230000002159 abnormal effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- 230000002452 interceptive effect Effects 0.000 description 2
- 238000005282 brightening Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Abstract
本实用新型涉及一种带有IC功能的发光二极管,其包括支架、至少一个发光二极管芯片以及IC芯片,发光二极管芯片以及IC芯片分别设置于支架上,每个发光二极管芯片分别与IC芯片连接,支架周边伸出多个引脚。上述发光二极管内置有IC芯片,每个发光二极管芯片分别与IC芯片连接,相互之间互不影响、无干涉,即使线路中任何一个发光二极管芯片不正常都不会影响其它芯片,而且,发光二极管后面可并联或串联其它不带IC芯片的发光二极管,形成一组灯带,多组灯带再并联联接,互不影响,稳定安全可靠。而且,IC芯片与各发光二极管芯片集成于支架上,节省空间,结构更加紧凑,降低制作成本。
Description
技术领域
本实用新型涉及照明技术领域,具体涉及一种带有IC功能的发光二极管。
背景技术
在人们日常生活中,照明灯光是不可缺少、最为常见的产品之一,例如,户外亮化及装饰照明等,各种各样的照明光源可广泛用于勾画建筑物,桥梁,公园广场,广告照明等亮化工程,因此,发光二极管的应用越来越广泛。
然而,目前的LED极少带有IC芯片,现有一种带有内置IC的RGB发光二极管,外观尺寸相同,同样具有IC恒流作用,但需要通过外部脉冲控制器,实现RGB幻彩效果。另外一种是通过外部IC,控制同线路中其他RGB发光二极管,同样通过外部脉冲信号达到幻彩效果。现有内置IC的RGB发光二极管,只能实现并联电路,而且线路中的其他RGB发光二极管要具有同样的IC,成本较高,而且线路中任何一个发光二极管信号传输不正常都将影响后面的信号。
实用新型内容
有鉴于此,提供一种结构紧凑、发光芯片互不影响、安全可靠的带有IC功能的发光二极管。
一种带有IC功能的发光二极管,其包括支架、至少一个发光二极管芯片以及IC芯片,所述发光二极管芯片以及IC芯片分别设置于支架上,每个发光二极管芯片分别与所述IC芯片连接,所述支架周边伸出多个引脚,所述多个引脚包括各发光二极管芯片的引脚以及信号输入引脚和信号输出引脚。
进一步地,所述至少一个发光二极管芯片为三原色发光二极管芯片。
进一步地,所述三原色发光二极管芯片分别是任意两种或以上波长的发光芯片。
进一步地,所述支架周边伸出多个引脚,所述多个引脚包括各发光二极管芯片的引脚以及信号输入引脚和信号输出引脚。
进一步地,所述支架为碗状或杯状,所述碗状或杯状支架的碗底或杯底规则排列有与引脚数量对应的焊脚,各发光二极管芯片以及IC芯片分别设于对应一个焊脚上。
进一步地,所述多个引脚分两排位于支架两侧边,每个发光二极管芯片分别通过引线与所述IC芯片连接。
进一步地,每个发光二极管芯片分别通过引线与所述IC芯片连接,所述IC芯片与每个焊脚形成电路连通。
进一步地,各发光二极管芯片以并联或串联形式连接到所述IC芯片。
进一步地,所述至少一个发光二极管芯片为三原色发光二极管芯片以及发白光的第四发光二极管芯片,所述第四发光二极管芯片封装有荧光粉
上述带有IC功能的发光二极管内置有IC芯片,每个发光二极管芯片分别与所述IC芯片连接,相互之间互不影响、无干涉,即使线路中任何一个发光二极管芯片不正常都不会影响其它芯片,而且,发光二极管后面可并联或串联其它不带IC芯片的发光二极管,形成一组灯带,多组灯带再并联联接,形成高亮光源,这些发光二极管即使其中一个信号不正常都不会影响后面芯片的信号,稳定安全可靠。而且,IC芯片集成与各发光二极管芯片集成于支架上,节省空间,结构更加紧凑,降低制作成本。
附图说明
图1是本实用新型实施例的带有IC功能的发光二极管的结构示意图。
具体实施方式
以下将结合具体实施例和附图对本实用新型进行详细说明。
请参阅图1,显示本实用新型实施例的带有IC功能的发光二极管10的结构,其包括支架11、至少一个发光二极管芯片以及IC芯片12,所述发光二极管芯片以及IC芯片12分别设置于支架11上,每个发光二极管芯片分别与所述IC芯片12连接。
本实施例中,发光二极管芯片包括三原色发光二极管芯片,即红光二极管芯片131、绿光二极管芯片132、蓝光二极管芯片133。当然,在另一个实施例中,还可包括发白光第四发光二极管芯片,该第四发光二极管芯片上封装有荧光粉。进一步地,所述三原色发光二极管芯片,即红光二极管芯片131、绿光二极管芯片132、蓝光二极管芯片133分别是任意两种或以上波长的发光芯片。
进一步地,所述支架11周边伸出多个引脚,所述多个引脚包括各发光二极管芯片的引脚以及信号输入引脚154和信号输出引脚。各发光二极管芯片的引脚分别为红光二极管芯片引脚151、绿光二极管芯片引脚152、蓝光二极管芯片引脚153。信号输出引脚有至少一个,图中显示有两个信号输出引脚DI1和DI2,其中一个信号输出引脚DI1直接连接到IC芯片12的焊脚上。
具体地,在多个引脚15中,包括一个VCC引脚156,各发光二极管芯片的引脚151、152、153、两个信号输入引脚DI1和DI2、一个信号输出引脚155、一个GND引脚157。进一步地,所述多个引脚15分两排位于支架11两侧边。如图所示,共有八个引脚,分成两列,每列四个分别伸出于支架的一侧边缘,当然,实际应用中引脚的数量并不限于八个,可以少于或多于8个。
每个发光二极管芯片分别通过引线与所述IC芯片12连接。每个发光二极管芯片分别通过引线17与所述IC芯片12连接。更进一步地,各发光二极管芯片以并联或串联形式连接到所述IC芯片12。
如图所示,所述支架11为碗状或杯状,外形呈方形,所述碗状或杯状支架11的碗底或杯底为圆形,所述碗底或杯底规则排列有与引脚数量对应的焊脚16,各发光二极管芯片以及IC芯片12分别设于对应一个焊脚16上。每个发光二极管芯片进一步通过引线连接于一焊脚16。焊脚16同样也是分两列,相对间隔均匀排布。所述IC芯片12与每个焊脚形成电路连通。
上述带有IC功能的发光二极管10内置有IC芯片12,每个发光二极管芯片131、132、133分别与所述IC芯片12连接,相互之间互不影响、无干涉,即使线路中任何一个发光二极管芯片不正常都不会影响其它芯片,而且发光二极管后面可并联或串联其它不带IC芯片的发光二极管,形成一组灯带,多组灯带再并联联接,形成高亮光源,这些发光二极管即使其中一个信号不正常都不会影响后面并联线路中其他芯片的信号,稳定安全可靠。而且,IC芯片12集成与各发光二极管芯片集成于支架11上,节省空间,结构更加紧凑,降低制作成本。
需要说明的是,本实用新型并不局限于上述实施方式,根据本实用新型的创造精神,本领域技术人员还可以做出其他变化,这些依据本实用新型的创造精神所做的变化,都应包含在本实用新型所要求保护的范围之内。
Claims (9)
1.一种带有IC功能的发光二极管,其特征在于,包括支架、至少一个发光二极管芯片以及IC芯片,所述发光二极管芯片以及IC芯片分别设置于支架上,每个发光二极管芯片分别与所述IC芯片连接,所述支架周边伸出多个引脚,所述多个引脚包括各发光二极管芯片的引脚以及信号输入引脚和信号输出引脚。
2.如权利要求1所述的带有IC功能的发光二极管,其特征在于,所述至少一个发光二极管芯片为三原色发光二极管芯片。
3.如权利要求2所述的带有IC功能的发光二极管,其特征在于,所述三原色发光二极管芯片分别是红光二极管芯片、绿光二极管芯片和蓝光二极管芯片。
4.如权利要求1所述的带有IC功能的发光二极管,其特征在于,所述支架周边伸出多个引脚,所述多个引脚包括一个VCC引脚、各发光二极管芯片的引脚、至少一个信号输入引脚、至少一个信号输出引脚、一个GND引脚。
5.如权利要求4所述的带有IC功能的发光二极管,其特征在于,所述支架为碗状或杯状,所述碗状或杯状支架的碗底或杯底规则排列有与引脚数量对应的焊脚,各发光二极管芯片以及IC芯片分别设于对应一个焊脚上。
6.如权利要求5所述的带有IC功能的发光二极管,其特征在于,所述多个引脚分两排位于支架两侧边,每个发光二极管芯片分别通过引线与所述IC芯片连接。
7.如权利要求5所述的带有IC功能的发光二极管,其特征在于,每个发光二极管芯片分别通过引线与所述IC芯片连接,所述IC芯片与每个焊脚形成电路连通。
8.如权利要求1所述的带有IC功能的发光二极管,其特征在于,各发光二极管芯片以并联或串联形式连接到所述IC芯片。
9.如权利要求1所述的带有IC功能的发光二极管,其特征在于,所述至少一个发光二极管芯片为三原色发光二极管芯片以及发白光的第四发光二极管芯片,所述第四发光二极管芯片封装有荧光粉。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201521048875.5U CN205428922U (zh) | 2015-12-11 | 2015-12-11 | 带有ic功能的发光二极管 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201521048875.5U CN205428922U (zh) | 2015-12-11 | 2015-12-11 | 带有ic功能的发光二极管 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205428922U true CN205428922U (zh) | 2016-08-03 |
Family
ID=56538130
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201521048875.5U Expired - Fee Related CN205428922U (zh) | 2015-12-11 | 2015-12-11 | 带有ic功能的发光二极管 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN205428922U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108649027A (zh) * | 2018-07-20 | 2018-10-12 | 深圳市天成照明有限公司 | 一种内置ic的芯片型发光二极管 |
CN111076110A (zh) * | 2019-12-05 | 2020-04-28 | 深圳市威尔晟光电有限公司 | 一种具有倒装结构的幻彩柔性灯带 |
-
2015
- 2015-12-11 CN CN201521048875.5U patent/CN205428922U/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108649027A (zh) * | 2018-07-20 | 2018-10-12 | 深圳市天成照明有限公司 | 一种内置ic的芯片型发光二极管 |
CN111076110A (zh) * | 2019-12-05 | 2020-04-28 | 深圳市威尔晟光电有限公司 | 一种具有倒装结构的幻彩柔性灯带 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3174371B1 (en) | Lighting string device, lighting string location identifying system, and lighting string location identifying method thereof | |
JP5557062B2 (ja) | Led発光ユニットの製造方法 | |
CN203218260U (zh) | 双芯片发光二极管 | |
CN101093068A (zh) | 白光器件及制造方法 | |
CN102956625A (zh) | 发光装置 | |
CN205428922U (zh) | 带有ic功能的发光二极管 | |
US20230262856A1 (en) | Light sources that increase object chroma when dimmed | |
CN204538080U (zh) | 一种内置rgbw晶片的led支架及其led产品 | |
CN1731907B (zh) | 内嵌串行驱动控制芯片的柔性灯带 | |
CN104347606A (zh) | 发光二极管封装结构及光源模块 | |
CN106463583B (zh) | 发光装置 | |
US8476653B2 (en) | Light-emitting diode package | |
CN202598261U (zh) | 一种高亮度高显色指数的暖白光led灯及led模组 | |
CN102005161B (zh) | 一种led显示屏的制作方法 | |
CN101630470A (zh) | Led显示屏 | |
CN205249533U (zh) | Led电路结构及其led光源 | |
CN201133611Y (zh) | Led与oled相配合的三基色器件 | |
US9635721B2 (en) | LED package structure with an integrated pin to transmit operation power and control signals | |
CN212005242U (zh) | 一种恒流ic及应用该恒流ic的led灯条 | |
CN102269390B (zh) | 发光二极管背光模组的设计方法 | |
CN204927348U (zh) | Led新型封装结构 | |
CN101520136A (zh) | 一种led精确模块及led显示装置 | |
CN204991753U (zh) | 一种多晶top型led封装支架及多晶top型led封装体 | |
CN205595328U (zh) | 全彩led封装结构 | |
US9978806B1 (en) | Three lead RGB LED |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160803 |
|
CF01 | Termination of patent right due to non-payment of annual fee |