CN205408372U - Semiconductor power source module and have its microwave applicator spare - Google Patents
Semiconductor power source module and have its microwave applicator spare Download PDFInfo
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- CN205408372U CN205408372U CN201620146157.XU CN201620146157U CN205408372U CN 205408372 U CN205408372 U CN 205408372U CN 201620146157 U CN201620146157 U CN 201620146157U CN 205408372 U CN205408372 U CN 205408372U
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- power source
- semiconductor power
- blower tray
- heat sink
- metal heat
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Abstract
The utility model discloses a semiconductor power source module and have its microwave applicator spare. Semiconductor power source module includes: metal radiating piece, power generation unit subassembly, metallic shield spare, fan bracket and a fan, the metal radiating piece has first terminal surface, power generation unit subassembly is established on first terminal surface, metallic shield spare establish on first terminal surface and the dustcoat on power generation unit subassembly, fan bracket establishes on the metal radiating piece and is located one side relative with first terminal surface, the fan is established in order will blow to the metal radiating piece in fan bracket. According to the utility model discloses a semiconductor power source module, the noise reduction is saved space.
Description
Technical field
This utility model relates to heating art, especially relates to a kind of semiconductor power source module and has its microwave heating device.
Background technology
Quasiconductor high-frequency heating apparatus, because of advantages such as its uniformity is good, controllability strong, low-power consumption, life-span length, is more and more applied to commercialization, civilian, industrial field of microwave heating.But the semiconductor power source of quasiconductor high-frequency heating apparatus can produce substantial amounts of heat in the course of the work, the input power of about 50-60% can only be converted into the heat energy for heating, the input power of all the other 40-50% is converted into the heat of dissipation, if the heat of these dissipation can not be discharged in time, cause the semiconductor power source efficiency of heating surface to reduce, accelerate device aging, the lost of life used.
Existing semiconductor power source adopts two co-current swirl fans to dispel the heat, semiconductor power source is fixed on the end face of radiation tooth, with blower tray, two co-current swirl fans are fixed, blower tray is located at the side of radiation tooth, and cold wind is blown into radiation tooth from the blower tray air outlet consistent with radiation tooth shape, reach the purpose in cooling semiconductor power source.Two turbo-dynamo fans of existing employing dispel the heat, and not only noise is big and overall structure takes up room greatly.
Utility model content
One of technical problem that this utility model is intended to solve in correlation technique at least to a certain extent.
For this, the utility model proposes a kind of semiconductor power source module, reduce noise, save space.
This utility model also proposes a kind of microwave heating device with above-mentioned semiconductor power source module.
Semiconductor power source module according to this utility model embodiment, including: metal heat sink, described metal heat sink has the first end face；Signal generating unit assembly and metal screen, described signal generating unit assembly is located on described first end face, and described metal screen is located on described first end face and covers on described signal generating unit assembly outward；Blower tray, described blower tray is located in described metal heat sink and is positioned at the side relative with described first end face；One fan, described fan be located in described blower tray with by wind to described metal heat sink.
Semiconductor power source module according to this utility model embodiment, adopt a fan that signal generating unit assembly is dispelled the heat, signal generating unit assembly, metal screen, blower tray and fan are integrated in the both sides of metal heat sink simultaneously, thus being possible not only to reduce noise, it is also possible to save space.
In embodiments more of the present utility model, described fan and described blower tray are clasped.
In embodiments more of the present utility model, the internal perisporium of described blower tray is provided with at least one draw-in groove, and described fan is provided with the fastener stretching into each described draw-in groove.
In specific embodiments more of the present utility model, described blower tray is formed as the structure of hollow, the side deviating from described metal heat sink of described blower tray has backstop roof, each described draw-in groove is limited by stop block and described backstop roof, each described stop block is located on the internal perisporium of described blower tray, is provided with gap between remainder and the described backstop roof of the part being provided with each described stop block of the perisporium of described blower tray and the perisporium of described blower tray.
In embodiments more of the present utility model, described blower tray is provided with the first fixing hole, described metal heat sink is provided with the second fixing hole, described blower tray and described metal heat sink by connecting through the fixture of described second fixing hole and described first fixing hole is fixing.
Preferably, described first fixing hole is formed as slotted hole.
In embodiments more of the present utility model, the side towards described fan of described metal heat sink is provided with multiple fin.
In embodiments more of the present utility model, one end towards described metal heat sink of described blower tray extends beyond described fan.
Preferably, the internal perisporium of described blower tray is positioned at the outside of the periphery wall of described metal heat sink.
In embodiments more of the present utility model, semiconductor power source module also includes securing member, and described securing member sequentially passes through the circuit board of described metal screen and described signal generating unit assembly and is fixed in described metal heat sink.
In embodiments more of the present utility model, the periphery wall of described blower tray is provided with the installation portion for installing auxiliary circuit.
Preferably, described fan is direct current aerofoil fan.
Microwave heating device according to this utility model embodiment, including the semiconductor power source module according to this utility model above-described embodiment.
Microwave heating device according to this utility model embodiment, by adopting above-mentioned semiconductor power source module, it is possible to saves space, reduces noise.
Accompanying drawing explanation
Fig. 1 is the decomposing schematic representation of the semiconductor power source module according to this utility model embodiment；
Fig. 2 is the assembling schematic diagram of the semiconductor power source module shown in Fig. 1；
Fig. 3 is the assembling schematic diagram of another angle of the semiconductor power source module shown in Fig. 1；
Fig. 4 is the profile in the B-B direction of the semiconductor power source module shown in Fig. 3；
Fig. 5 is the enlarged diagram of part A in Fig. 4.
Accompanying drawing labelling:
Semiconductor power source module 1000,
Metal heat sink 1, groove the 10, second fixing hole 11, fin 12,
Signal generating unit assembly 2, circuit board 20, semiconductor power amplifier 21, power attenuator 22, circulator 23,
Metal screen 3,
Blower tray 4, draw-in groove 40, backstop roof 41, stop block 42, separated part 43, gap the 44, first fixing hole 45, installation portion 46, connecting portion 47, connecting hole 470, wind-guiding face 48,
Fan 5, fastener 50, groove 51,
Auxiliary circuit 6,
Radio frequency connector 7.
Detailed description of the invention
Being described below in detail embodiment of the present utility model, the example of described embodiment is shown in the drawings.The embodiment described below with reference to accompanying drawing is illustrative of, it is intended to be used for explaining this utility model, and it is not intended that to restriction of the present utility model.
In description of the present utility model, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", " counterclockwise ", " axially ", " radially ", orientation or the position relationship of the instruction such as " circumference " are based on orientation shown in the drawings or position relationship, it is for only for ease of description this utility model and simplifies description, rather than the device of instruction or hint indication or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to restriction of the present utility model.
Additionally, term " first ", " second " are only for descriptive purposes, and it is not intended that indicate or imply relative importance or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or implicitly include at least one this feature.In description of the present utility model, " multiple " are meant that at least two, for instance two, three etc., unless otherwise expressly limited specifically.
In this utility model, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, for instance, it is possible to it is fixing connection, it is also possible to be removably connect, or integral；Can be mechanically connected, it is also possible to be electrical connection or each other can communication；Can be joined directly together, it is also possible to be indirectly connected to by intermediary, it is possible to be connection or the interaction relationship of two elements of two element internals, unless otherwise clear and definite restriction.For the ordinary skill in the art, it is possible to understand above-mentioned term concrete meaning in this utility model as the case may be.
Semiconductor power source module 1000 according to this utility model embodiment being described in detail below with reference to Fig. 1-Fig. 5, wherein this semiconductor power source module 1000 can be applied in microwave heating device for producing heat energy with heating article such as food.
As it is shown in figure 1, the semiconductor power source module 1000 according to this utility model embodiment, including: metal heat sink 1, signal generating unit assembly 2, metal screen 3, blower tray 4 and a fan 5.It is understandable that, semiconductor power source module 1000 could be included for the radio frequency connector 7 of signal transmission, radio frequency connector 7 is connected with signal generating unit assembly 2, when semiconductor power source module 1000 is applied on microwave heating device, radio frequency connector 7 is connected with microwave feed-in structure (such as antenna).
Metal heat sink 1 has the first end face, and alternatively, metal heat sink 1 can be Al-alloy parts, it is of course possible to understanding, metal heat sink 1 can also use other metal materials such as copper to make.
Signal generating unit assembly 2 is located on the first end face, specifically, signal generating unit assembly 2 can include the elements such as circuit board 20, semiconductor power amplifier 21, power attenuator 22, circulator 23, semiconductor power amplifier 21, power attenuator 22 and circulator 23 are respectively provided on circuit board 20, and circuit board 20 is located on the first end face.More specifically, the position of the corresponding semiconductor power amplifier 21 of the first end face, power attenuator 22, circulator 23 can be provided with groove 10 so that the cabling of said elements and installation.Preferably, can adopt between circuit board 20 and metal heat sink 1, semiconductor power amplifier 21 and circuit board 20 and be welded to connect.
Metal screen 3 is located on the first end face and covers on signal generating unit assembly 2 outward; thus metal screen 3 is possible not only to play the effect of shielded signal interference; may also operate as the effect sealing signal generating unit assembly 2, signal generating unit assembly 2 can be protected.
Blower tray 4 is located in metal heat sink 1 and is positioned at the side relative with the first end face, say, that blower tray 4 is positioned at the side relative with the first end face, and blower tray 4 is fixed in metal heat sink 1.
Fan 5 be located in blower tray 4 with by wind to metal heat sink 1.Preferably, fan 5 is direct current aerofoil fan, and wherein direct current aerofoil fan has the advantage that area of dissipation is big and volume is thin, such that it is able to improve radiating effect and reduce the size of semiconductor power source module 1000.
The position relationship of all parts in semiconductor power source module 1000 is described for the orientation shown in Fig. 1 below, as shown in Figure 1, signal generating unit assembly 2 is located on the lower surface of metal heat sink 1, metal screen 3 is fixed on the lower surface of metal heat sink 1 and is enclosed within signal generating unit assembly 2 outward, and blower tray 4 is located in metal heat sink 1 and is positioned at the top of metal heat sink 1.In short, signal generating unit assembly 2 and metal screen 3 are respectively provided at the lower section of metal heat sink 1, blower tray 4 and fan 5 lays respectively at the top of metal heat sink 1.In other words, signal generating unit assembly 2 and metal screen 3 are integrated in the side of metal heat sink 1, blower tray 4 and fan 5 and are integrated in the opposite side of metal heat sink 1.
By wind to metal heat sink 1 when fan 5 rotates, metal heat sink 1 dispels the heat to take away the heat produced when signal generating unit assembly 2 works, thus realizing the heat radiation to signal generating unit assembly 2.
Semiconductor power source module 1000 according to this utility model embodiment, adopt a fan 5 that signal generating unit assembly 2 is dispelled the heat, signal generating unit assembly 2, metal screen 3, blower tray 4 and fan 5 are integrated in the both sides of metal heat sink 1 simultaneously, thus being possible not only to reduce noise, it is also possible to save space.
In embodiments more of the present utility model, fan 5 and blower tray 4 are clasped.Consequently facilitating the cooperation of fan 5 and blower tray 4, save installation time.Specifically, the internal perisporium of blower tray 4 is provided with at least one draw-in groove 40, and fan 5 is provided with the fastener 50 stretching into each draw-in groove 40, thereby through the cooperation of fastener 50 and draw-in groove 40 to be located on blower tray 4 by fan 5.
More specifically, as Figure 1-Figure 5, blower tray 4 is formed as the structure of hollow, the side deviating from metal heat sink 1 of blower tray 4 has backstop roof 41, each draw-in groove 40 is limited by stop block 42 and backstop roof 41, each stop block 42 is located on the internal perisporium of blower tray 4, is provided with gap 44 between remainder and the backstop roof 41 of the part being provided with each stop block 42 of the perisporium of blower tray 4 and the perisporium of blower tray 4.In other words, the perisporium of blower tray 4 be provided with each stop block 42 partially defined go out a separated part 43, the perisporium of blower tray 4 has multiple separated part 43, in the circumferential direction of blower tray 4, the both sides of separated part 43 are respectively provided with gap 44, concurrently separating and have gap 44 between the one end in portion 43 and backstop roof 41, thus under external force, separated part 43 can deform with the other end of separated part 43 for fulcrum.The inner surface of each separated part 43 is provided with stop block 42, as it is shown in figure 5, limit a draw-in groove 40 between each stop block 42 and backstop roof 41.Fastener 50 on fan 5 extend in draw-in groove 40, wherein in assembling process, separated part 43 can outwards deform so that the stretching into of fastener 50, after fastener 50 extend in draw-in groove 40, separated part 43 inwardly resets to be positioned in draw-in groove 40 fastener 50, consequently facilitating fastener 50 snaps onto in draw-in groove 40.
In the concrete example of Fig. 1, four corners of the periphery wall of the shell of fan 5 are equipped with groove 51 to limit four fasteners 50, the internal perisporium of blower tray 4 is provided with four draw-in grooves 40, and four fasteners 50 coordinate to be fixed in blower tray 4 fan 5 with four draw-in groove 40 one_to_one corresponding respectively.
As shown in Figure 1, in concrete examples more of the present utility model, blower tray 4 is provided with the first fixing hole 45, metal heat sink 1 is provided with the second fixing hole 11, and blower tray 4 and metal heat sink 1 are by connecting through the fixture of the second fixing hole 11 and the first fixing hole 45 (not shown go out) is fixing.So that the assembling mode between blower tray 4 and metal heat sink 1 is simple.Specifically, fixture can be screw.Preferably, the first fixing hole 45 is formed as slotted hole, consequently facilitating adjust the installation site of blower tray 4.Of course, it should be understood that the assembling mode between blower tray 4 and metal heat sink 1 is not limited to this, other modes between blower tray 4 with metal heat sink 1, can also be adopted to carry out assembling for example with snapping connection, rivet or welding.
According to embodiments more of the present utility model, as depicted in figs. 1 and 2, the side towards fan 5 of metal heat sink 1 is provided with multiple fin 12.Such that it is able to improve the radiating rate of metal heat sink 1.Wherein in order to ensure that the wind blown out by fan 5 all leads metal heat sink 1, as shown in Figure 4, one end towards metal heat sink 1 of blower tray 4 extends beyond fan 5, the inner surface beyond the part of fan 5 of blower tray 4 is formed as wind-guiding face 48, under the guiding in wind-guiding face 48, may insure that the cold wind that fan 5 blows out will not leak in environment before arriving metal heat sink 1, reached the purpose of high efficiency and heat radiation.
Preferably, the internal perisporium of blower tray 4 is positioned at the outside of the periphery wall of metal heat sink 1.Such that it is able to be further ensured that the wind blown out by fan 5 is on whole metal heat sink 1, improves radiating effect further.
In embodiments more of the present utility model, semiconductor power source module 1000 also includes securing member (not shown go out), and securing member sequentially passes through the circuit board 20 of metal screen 3 and signal generating unit assembly 2 and is fixed in metal heat sink 1.Alternatively, securing member is screw.Of course, it should be understood that metal screen 3 can also adopt other modes to be fixed in metal heat sink 1 for example with welding or riveted joint.
As depicted in figs. 1 and 2, according to embodiments more of the present utility model, the periphery wall of blower tray 4 is provided with the installation portion 46 for installing auxiliary circuit 6, and in other words, auxiliary circuit 6 is arranged on installation portion 46, thus provide the support of auxiliary circuit 6 for circuit board 20.Specifically, auxiliary circuit 6 can be the control circuit etc. of the temperature sensing circuit of each element, semiconductor power amplifier 21 on the power-measuring circuit of semiconductor power amplifier 21, circuit board 20.More specifically, as it is shown in figure 1, installation portion 46 is two projections, the circuit board of auxiliary circuit 6 is fixed in two projections by its fixing connector.
According to embodiments more of the present utility model, as shown in figures 1 and 3, blower tray 4 is provided with connecting portion 47, is easy to be positioned on the ad-hoc location of microwave heating device semiconductor power source module 1000 by being provided with connecting portion 47.Thus semiconductor power source module 1000 can have only to be connected with corresponding element with radio frequency connector 7 and connecting portion 47 and allow for semiconductor power source module 1000 and can be applied in different types of microwave heating device so that semiconductor power source module 1000 flexible for installation.Specifically, as shown in figures 1 and 3, connecting portion 47 is provided with connecting hole 470 so that being located by connecting.
Microwave heating device according to this utility model embodiment, including the semiconductor power source module 1000 according to this utility model above-described embodiment.Wherein microwave heating device can be microwave oven.
Microwave heating device according to this utility model embodiment, by adopting above-mentioned semiconductor power source module 1000, it is possible to saves space, reduces noise.
In this utility model, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score can be that the first and second features directly contact, or the first and second features are by intermediary mediate contact.And, fisrt feature second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be fisrt feature immediately below second feature or obliquely downward, or be merely representative of fisrt feature level height less than second feature.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means in conjunction with this embodiment or example describe are contained at least one embodiment of the present utility model or example.In this manual, the schematic representation of above-mentioned term is necessarily directed to identical embodiment or example.And, the specific features of description, structure, material or feature can combine in one or more embodiments in office or example in an appropriate manner.Additionally, when not conflicting, the feature of the different embodiments described in this specification or example and different embodiment or example can be carried out combining and combining by those skilled in the art.
Although above it has been shown and described that embodiment of the present utility model, it is understandable that, above-described embodiment is illustrative of, it is not intended that to restriction of the present utility model, above-described embodiment can be changed in scope of the present utility model, revises, replace and modification by those of ordinary skill in the art.
Claims (13)
1. a semiconductor power source module, it is characterised in that including:
Metal heat sink, described metal heat sink has the first end face；
Signal generating unit assembly and metal screen, described signal generating unit assembly is located on described first end face, and described metal screen is located on described first end face and covers on described signal generating unit assembly outward；
Blower tray, described blower tray is located in described metal heat sink and is positioned at the side relative with described first end face；
One fan, described fan be located in described blower tray with by wind to described metal heat sink.
2. semiconductor power source according to claim 1 module, it is characterised in that described fan and described blower tray are clasped.
3. semiconductor power source according to claim 2 module, it is characterised in that the internal perisporium of described blower tray is provided with at least one draw-in groove, and described fan is provided with the fastener stretching into each described draw-in groove.
4. semiconductor power source according to claim 3 module, it is characterized in that, described blower tray is formed as the structure of hollow, the side deviating from described metal heat sink of described blower tray has backstop roof, each described draw-in groove is limited by stop block and described backstop roof, each described stop block is located on the internal perisporium of described blower tray, is provided with gap between remainder and the described backstop roof of the part being provided with each described stop block of the perisporium of described blower tray and the perisporium of described blower tray.
5. semiconductor power source according to claim 1 module, it is characterized in that, described blower tray is provided with the first fixing hole, described metal heat sink is provided with the second fixing hole, described blower tray and described metal heat sink by connecting through the fixture of described second fixing hole and described first fixing hole is fixing.
6. semiconductor power source according to claim 5 module, it is characterised in that described first fixing hole is formed as slotted hole.
7. semiconductor power source according to claim 1 module, it is characterised in that the side towards described fan of described metal heat sink is provided with multiple fin.
8. semiconductor power source according to claim 1 module, it is characterised in that one end towards described metal heat sink of described blower tray extends beyond described fan.
9. semiconductor power source according to claim 8 module, it is characterised in that the internal perisporium of described blower tray is positioned at the outside of the periphery wall of described metal heat sink.
10. semiconductor power source according to claim 1 module, it is characterised in that also include securing member, described securing member sequentially passes through the circuit board of described metal screen and described signal generating unit assembly and is fixed in described metal heat sink.
11. semiconductor power source according to claim 1 module, it is characterised in that the periphery wall of described blower tray is provided with the installation portion for installing auxiliary circuit.
12. the semiconductor power source module according to any one of claim 1-11, it is characterised in that described fan is direct current aerofoil fan.
13. a microwave heating device, it is characterised in that include the semiconductor power source module according to any one of claim 1-12.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620146157.XU CN205408372U (en) | 2016-02-26 | 2016-02-26 | Semiconductor power source module and have its microwave applicator spare |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201620146157.XU CN205408372U (en) | 2016-02-26 | 2016-02-26 | Semiconductor power source module and have its microwave applicator spare |
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| CN205408372U true CN205408372U (en) | 2016-07-27 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109416183A (en) * | 2016-12-27 | 2019-03-01 | 惠而浦公司 | Nanometer in solid-state culinary art micro-wave oven is cooling |
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- 2016-02-26 CN CN201620146157.XU patent/CN205408372U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109416183A (en) * | 2016-12-27 | 2019-03-01 | 惠而浦公司 | Nanometer in solid-state culinary art micro-wave oven is cooling |
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