CN206490958U - Heat sink for electronic equipment - Google Patents
Heat sink for electronic equipment Download PDFInfo
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- CN206490958U CN206490958U CN201720205070.XU CN201720205070U CN206490958U CN 206490958 U CN206490958 U CN 206490958U CN 201720205070 U CN201720205070 U CN 201720205070U CN 206490958 U CN206490958 U CN 206490958U
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- heat sink
- electronic equipment
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- electromagnetic
- boss
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Abstract
A kind of heat sink for electronic equipment is disclosed, the surface of the heat sink is provided with the groove for accommodating electronic device, wherein there is the groove noise spot that electromagnetic radiation is produced in electromagnetic shielding chamber, the electronic device to be located at above-mentioned electromagnetic shielding intracavitary.Above-mentioned heat sink can be while heat transfer be gone out, by electromagnetic radiation consumption inside heat sink.
Description
Technical field
The utility model is related to technical field of electronic products, more particularly to a kind of heat sink for electronic equipment.
Background technology
At present, such as power tube, transformer, inductor constant power device after printed circuit board (PCB) welding processing, are also easy to produce
Just inconsistent phenomenon.As shown in figure 1, A and C represent power semiconductor, B indication transformers, the two difference in height can reach 3mm
To 8mm.However, a kind of radiator of existing slab construction, such as shown in Fig. 2 the heat sink can only be pasted with highest device
Tightly, i.e., it is in contact with the transformer B in Fig. 1, causes that there is larger space between power semiconductor A, C and fin, it is impossible to good
Good radiating.Fig. 3 is another existing heat sink, and the heat sink will be local padded, so that be engaged with heater members, but this
Plant heat sink and do not take into account electromagnetic interference suppression.As can be seen here, produced when Fig. 2 radiator can not allow the product to work heat with
Most direct mode is conducted, and internal temperature is high when causing the product to work in itself, reduces reliability.Fig. 3 heat sink
Although having improvement to radiating, the problem of due to not accounting for electromagnetic field radiation, electromagnetic radiation still can be transmitted externally, by
In not shielding reasonably, electromagnetic field is externally smoothly spread out of, and influences the EMC performances of complete machine.
Utility model content
To solve the above problems, the utility model provides a kind of heat-radiating substrate for electronic equipment.The heat sink
Surface is provided with the groove for accommodating electronic device, is produced wherein the groove has in electromagnetic shielding chamber, the electronic device
The noise spot of raw electromagnetic radiation is located at the electromagnetic shielding intracavitary.
In one example, the bottom surface of the groove and the surface of the electronic device are in contact with each other, and the groove
Inwall is centered around the surrounding of the electronic device, and the bottom surface of the groove is less than the surface of the heat sink.
In one example, above-mentioned heat sink also includes the multiple bar shaped steps for being arranged on the radiating plate surface, wherein
The surface of the bar shaped step is higher than the bottom surface of the groove.
In one example, above-mentioned heat sink also includes multiple electromagnetic absorption platforms, and each electromagnetic absorption platform includes one
Boss and the metal antenna being arranged on the boss.
In one example, the multiple electromagnetic absorption platform is arranged on the edge or corner of the heat sink.
In one example, one electromagnetic absorption platform is respectively set in the corner of the heat sink.
In one example, the boss and the metal antenna are electrical connection.
In one example, cross sectional shape of the boss in the face parallel with the heat sink is sector.
In one example, the height of the metal antenna be 8.5mm, for frequency be 35GHz, 17.5GHz,
8.75GHz, 4.375GHz electromagnetic wave produce shielding action.
In one example, the metal antenna is gold-plated copper pin.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme of the utility model embodiment, it will make simple to the accompanying drawing of embodiment below
Introduce on ground, it should be apparent that, drawings in the following description merely relate to some embodiments of the present utility model, rather than to this practicality
New limitation.
Fig. 1 is the schematic diagram of existing printed circuit board (PCB)；
Fig. 2 is a kind of schematic diagram of existing heat sink；
Fig. 3 is the schematic diagram of another existing heat sink；
Fig. 4 is the structural representation of the heat sink of the embodiment of the utility model one；
Fig. 5 is the schematic diagram after the heat sink and printed circuit board of the embodiment of the utility model one.
Embodiment
It is new below in conjunction with this practicality to make the purpose, technical scheme and advantage of the utility model embodiment clearer
The accompanying drawing of type embodiment, the technical scheme to the utility model embodiment is clearly and completely described.Obviously, it is described
Embodiment is a part of embodiment of the present utility model, rather than whole embodiments.Based on described of the present utility model
Embodiment, the every other embodiment that those of ordinary skill in the art are obtained on the premise of without creative work, all belongs to
The scope protected in the utility model.
Fig. 4 is the structural representation of the heat sink of the embodiment of the utility model one, and Fig. 5 is the embodiment of the utility model one
Schematic diagram after heat sink and printed circuit board.As shown in Figure 4 and Figure 5, the embodiment of the utility model one provides a kind of use
In the heat sink of electronic equipment, the surface of heat sink is provided with for accommodating electronic device (such as transformation on printed circuit board (PCB)
Device B) groove B', its further groove B' has electromagnetic shielding chamber, and the noise spot that electromagnetic radiation is produced in electronic device is located at the electricity
Magnetic screen intracavitary.As shown in figure 5, when heat sink and being welded with transformer B, function element A, C printed circuit board one
After rising, due to an electromagnetic shielding chamber B' is formed at position corresponding with transformer B on heat sink, then produced in transformer B
The noise spot of raw electromagnetic radiation is shielded by the madial wall positioned at the groove B' of its surrounding, is thus reduced electromagnetic radiation and is led to
Road, shielding interference.In the two fitting tight, electromagnetic radiation passage can reduce more than 90%.Arrow a-e, a'-e' in Fig. 5
The noise spot from transformer B is represented to the ray of external radiation, when the heat sink using the present embodiment, these are to the equal quilt of external radiation
Heat sink is shielded.
Preferably, groove B' bottom surface and transformer B surface are in contact with each other, and groove B' inwall is centered around change
Depressor B surrounding, groove B' bottom surface is less than the surface of heat sink.When the surface of heat sink refers to being not provided with any groove
The outermost surface of heat sink, it is understood that be the initial surface of heat sink, adjacent groove B' both sides are expressed as in Figure 5
Raised surface.
Preferably, heat sink also include be arranged on radiating plate surface multiple bar shaped steps, such as bar shaped step A' and C',
The position of the two corresponds respectively to the position of function element A, C on printed circuit board (PCB), and it is that function element A, C are risen respectively that it, which is acted on,
To radiating and the effect of electromagnetic shielding.Because function element A, C height are less than transformer B height, bar shaped step A' and C'
Surface be higher than groove bottom surface, so thermolysis preferably can be played to function element A, C.
Preferably, heat sink also includes multiple electromagnetic absorption platforms, and each electromagnetic absorption platform includes a boss and setting
Metal antenna D' on boss.For example, multiple electromagnetic absorption platforms are arranged on the edge or corner of heat sink.As shown in figure 4,
One electromagnetic absorption platform is respectively set in the corner of heat sink, and each platform includes boss and is riveted together by interference fit
Gold plated copper pin.It is understood that the connected mode of boss and metal needle be not limited to riveting, can also by weld etc. other
Electrically connect.Metal antenna D' on four angles be also referred to as be electromagnetically shielded antenna, can effectively absorb product in itself or
The electromagnetic wave that external radiation comes, is translated into alternating current, is consumed by the way that metal antenna is grounded.In assembling radiating
Plate with when printed circuit board (PCB), metal antenna D' passes through from heat sink.Preferably, the height of shielding pin is about 8.5mm, will be right
35GHz, 17.5GHz, 8.75GHz, 4.375GHz produce good shielding action.It is understood that the height of antenna is not
8.5mm is confined to, can be other height, but otherwise less than by the surface of protection circuit plate.In fact, different height, can
To absorb the interference of different frequency range, therefore this can highly be needed to determine by design.In actual production, below 17.5GHz frequency
Section, which is belonged to, needs the part of high spot reviews in radiation test.
Preferably, cross sectional shape of the boss in the face parallel with heat sink (such as in horizontal plane) is sector.Can be with
Understand, the cross sectional shape is not limited to sector, can also be the other shapes such as rectangle, circle, semicircle.
In the utility model above-described embodiment, the shapes of electromagnetic shielding chamber B' in the horizontal plane are approximate rectangular, but
In other embodiment, its flat shape, which should try one's best, meets the profile of electronic device, and its depth is higher than electromagnetism in electronic device
The position of leakage.Metal antenna D''s is highly desirable in the case where structure meets the requirements, slightly above circuit board highest device, leads
It is electric good, it is in close contact with boss, and the earth can be connected by the means of welding when necessary., can after Partial Height change
Targetedly to reduce sensitive band interference.
In the utility model above-described embodiment, by setting continuous groove on heat sink, do electromagnetism in electronic device
The side wall that transmitting position is less than groove is disturbed, so that while heat transfer is gone out using heat sink, electromagnetic radiation consumption be existed
Inside heat sink, therefore the shielding shell of whole product that need not be complete is that can realize good electromagnetic shielding and anti-interference
Performance, reduces volume.Further, for the different electronic device of height in printed circuit board (PCB) corresponding position on heat sink
Put to form height different groove and bar shaped step, make the electronic device on printed circuit board (PCB) close proximity to heat-radiating substrate, product
Radiating effect greatly improve.
Heat sink of the present utility model can be applied to the radiating of the power device of electronic product printed board assembling, and in product
The electromagnetic interference shield that outside is produced.Control device temperature is applicable to, while controlling the occasion of electromagnetic interference.
Feature, structure or characteristic described in above example can be attached in any other suitable manner one or
In multiple embodiments.There is provided some concrete details in superincumbent description, such as frequency, height, to provide to this practicality
The comprehensive understanding of new embodiment.However, it is understood by those of ordinary skill in the art that, the utility model is without said one or many
Individual concrete details just can be realized, or can also be realized using other components, material, method etc..In other instances, it is known
Structure, material or operation be not shown or described in detail so as not to obscure various aspects of the present utility model.
It the above is only exemplary embodiment of the present utility model, not for limitation protection domain of the present utility model,
Protection domain of the present utility model is determined by appended claim.
Claims (10)
1. a kind of heat sink for electronic equipment, it is characterised in that the surface of the heat sink is provided with for accommodating electronics
The groove of device, wherein there is the groove noise spot that electromagnetic radiation is produced in electromagnetic shielding chamber, the electronic device to be located at
The electromagnetic shielding intracavitary.
2. the heat sink according to claim 1 for electronic equipment, it is characterised in that the bottom surface of the groove with it is described
The surface of electronic device is in contact with each other, and the inwall of the groove is centered around the surrounding of the electronic device, the bottom of the groove
Face is less than the surface of the heat sink.
3. the heat sink according to claim 1 or 2 for electronic equipment, in addition to it is arranged on the radiating plate surface
Multiple bar shaped steps, wherein the surface of the bar shaped step is higher than the bottom surface of the groove.
4. the heat sink according to claim 1 for electronic equipment, in addition to multiple electromagnetic absorption platforms, each electromagnetism
Absorbing platform includes a boss and the metal antenna being arranged on the boss.
5. the heat sink according to claim 4 for electronic equipment, it is characterised in that the multiple electromagnetic absorption platform
It is arranged on the edge or corner of the heat sink.
6. the heat sink according to claim 4 for electronic equipment, it is characterised in that each in the corner of the heat sink
One electromagnetic absorption platform is set.
7. the heat sink for electronic equipment according to any one of claim 4 to 6, it is characterised in that the boss and
The metal antenna is electrical connection.
8. the heat sink for electronic equipment according to any one of claim 4 to 6, it is characterised in that the boss exists
Cross sectional shape in the face parallel with the heat sink is sector.
9. the heat sink for electronic equipment according to any one of claim 4 to 6, it is characterised in that the metal day
The height of line is 8.5mm, is made for producing shielding to frequency for 35GHz, 17.5GHz, 8.75GHz, 4.375GHz electromagnetic wave
With.
10. the heat sink for electronic equipment according to any one of claim 4 to 6, it is characterised in that the metal day
Line is gold-plated copper pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720205070.XU CN206490958U (en) | 2017-03-05 | 2017-03-05 | Heat sink for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720205070.XU CN206490958U (en) | 2017-03-05 | 2017-03-05 | Heat sink for electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206490958U true CN206490958U (en) | 2017-09-12 |
Family
ID=59762511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720205070.XU Active CN206490958U (en) | 2017-03-05 | 2017-03-05 | Heat sink for electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206490958U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108513510A (en) * | 2018-05-30 | 2018-09-07 | 江苏师范大学 | A kind of communication cabinet automatic heat radiator |
| CN108633238A (en) * | 2018-08-03 | 2018-10-09 | 中国航空工业集团公司雷华电子技术研究所 | It is a kind of to be used for radiator of the two panels to making sheet of printing in |
| CN112888237A (en) * | 2021-01-21 | 2021-06-01 | 重庆蓝岸通讯技术有限公司 | Multipurpose radiating, shielding and anti-static structure for electronic product device |
-
2017
- 2017-03-05 CN CN201720205070.XU patent/CN206490958U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108513510A (en) * | 2018-05-30 | 2018-09-07 | 江苏师范大学 | A kind of communication cabinet automatic heat radiator |
| CN108633238A (en) * | 2018-08-03 | 2018-10-09 | 中国航空工业集团公司雷华电子技术研究所 | It is a kind of to be used for radiator of the two panels to making sheet of printing in |
| CN112888237A (en) * | 2021-01-21 | 2021-06-01 | 重庆蓝岸通讯技术有限公司 | Multipurpose radiating, shielding and anti-static structure for electronic product device |
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