CN205356802U - Biological identification module becket pastes dress structure - Google Patents
Biological identification module becket pastes dress structure Download PDFInfo
- Publication number
- CN205356802U CN205356802U CN201620147013.6U CN201620147013U CN205356802U CN 205356802 U CN205356802 U CN 205356802U CN 201620147013 U CN201620147013 U CN 201620147013U CN 205356802 U CN205356802 U CN 205356802U
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- becket
- pattern
- circuit board
- identification module
- copper foil
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Abstract
The utility model discloses a biological identification module becket pastes dress structure, including becket, adhesive, softness circuit board, its characterized in that, the becket bottom surface is provided with the pattern, is provided with the pattern on the copper foil of softness circuit board, and becket underrun adhesive is adhere with the pattern face of the copper foil of softness circuit board. The utility model discloses a handle to the becket bottom surface, the specific pattern of etching on softness circuit board copper foil is to softness circuit board surface handling to and the point glues the selection of orbit, more firm, reliable of the subsides dress that makes the becket.
Description
Technical field
This utility model one bio-identification module becket mounting structure, belongs to technical field of touch control.
Background technology
At present, the mounting method of bio-identification module becket is divided into two kinds, and one is to be welded by tin cream, and another kind is bonding with adhesive glue by elargol.By the mode that tin cream welds, due to the restriction of SMT technique, range of application ratio is relatively limited, and the mode bonding with adhesive glue by elargol is then widely used.The problem that elargol then often faces bonding fastness, reliability with the mode of adhesive glue.
Utility model content
The purpose of this utility model is in that to provide a kind of bio-identification module becket mounting structure, by arranging pattern in becket bottom surface, the Copper Foil of flexible circuit board etches specific pattern, uses elargol and adhesive glue to bond, make the attachment of becket more firmly, reliably.
This utility model is achieved in that a kind of bio-identification module becket mounting structure, including becket, binding agent, flexible circuit board, it is characterised in that becket bottom surface is provided with pattern, to increase the surface energy of becket bottom surface；The Copper Foil of flexible circuit board is provided with pattern, make flexible circuit board surface be regular have concavo-convex；The pattern plane bonding of the Copper Foil of becket underrun binding agent and flexible circuit board.
Preferably, binding agent includes elargol and adhesive glue, and adhesive glue covers the region that stress is bigger, and the region that stress is less is located at by elargol, by a setting for glue track, makes elargol be distributed in particular area ratio symmetrically shape with adhesive glue.
Preferably, the pattern of becket bottom surface is for arranging waffle-like pattern.
Preferably, the ruling width of the waffle-like pattern of described becket bottom surface is 0.03 ~ 0.10mm, and ruling is spaced apart 0.10 ~ 0.30mm.
Preferably, the pattern on flexible circuit board Copper Foil is waffle-like pattern.
Preferably, the ruling width of the waffle-like pattern on flexible circuit board Copper Foil is 0.06 ~ 0.15mm, and ruling is spaced apart 0.30 ~ 0.40mm.
Preferably, elargol is 1:3 ~ 2:3 with the area ratio of adhesive glue.
The beneficial effects of the utility model: make the attachment of becket more firmly, reliably.
Accompanying drawing explanation
Fig. 1 is the structural representation of this utility model embodiment.
Fig. 2 is the becket bottom surface pattern schematic diagram of this utility model embodiment.
Fig. 3 is the flexible circuit board copper foil pattern schematic diagram of this utility model embodiment.
Fig. 4 is elargol and the adhesive glue distribution schematic diagram of this utility model embodiment.
1. W2. flexible circuit board copper foil pattern ruling width P2. flexible circuit board copper foil pattern ruling interval, pattern ruling interval, pattern ruling width P1. becket bottom surface, pattern 2. binding agent 21. elargol 22. adhesive glue 3. flexible circuit board 31. flexible circuit board Copper Foil W1. becket bottom surface, becket 11. becket bottom surface in figure.
Detailed description of the invention
Below in conjunction with accompanying drawing, the technical scheme in this utility model embodiment is clearly and completely described.
Embodiment 1
As it is shown in figure 1, becket 1 underrun binding agent 2 is adhered to the surface of flexible circuit board 3, binding agent 2 comprises elargol 21 and adhesive glue 22.
As in figure 2 it is shown, etch waffle-like pattern 11 in becket 1 bottom surface.
Specifically, in becket 1 bottom surface radium-shine go out waffle-like pattern 11, ruling width W1 is 0.03mm, and ruling interval P1 is 0.10mm.
As it is shown on figure 3, arrange waffle-like pattern 31 on flexible circuit board 3 Copper Foil.
Specifically, etching waffle-like pattern at flexible circuit board 3 Copper Foil one, ruling width W2 is 0.06mm, and ruling interval P2 is 0.30mm.
As shown in Figure 4, elargol 21 and the distribution of adhesive glue 22 symmetrically shape.
Specifically, elargol 21 is 1:3 with the area ratio of adhesive glue 22.
Specifically, adhesive glue 22 covers the region that stress is bigger, and the region that stress is less is located at by elargol 21.
Embodiment 2
Bio-identification module becket mounting structure, including becket 1, binding agent 2, flexible circuit board 3, arranges waffle-like pattern 11 in becket 1 bottom surface.Specifically, in becket 1 bottom surface radium-shine go out waffle-like pattern 11, ruling width W1 is 0.10mm, and ruling interval P1 is 0.30mm.Flexible circuit board 3 Copper Foil arranges waffle-like pattern 31.Etching waffle-like pattern at flexible circuit board 3 Copper Foil one, ruling width W2 is 0.15mm, and ruling interval P2 is 0.40mm.Becket 1 underrun binding agent 2 is adhered to the patterned surfaces of the Copper Foil of flexible circuit board 3, and binding agent 2 comprises elargol 21 and adhesive glue 22, elargol 21 and the distribution of adhesive glue 22 symmetrically shape, and the area ratio of elargol 21 and adhesive glue 22 is 2:3.
The above is preferred implementation of the present utility model; it should be pointed out that, for those skilled in the art, under the premise without departing from this utility model principle; can also making some improvements and modifications, these improvements and modifications are also considered as protection domain of the present utility model.
Claims (7)
1. a bio-identification module becket mounting structure, including becket, binding agent, flexible circuit board, it is characterised in that becket bottom surface is provided with pattern, the Copper Foil of flexible circuit board is provided with the pattern plane bonding of the Copper Foil of pattern, becket underrun binding agent and flexible circuit board.
2. bio-identification module becket mounting structure according to claim 1, it is characterized in that: described binding agent includes elargol and adhesive glue, adhesive glue covers the region that stress is bigger, the region that stress is less is located at by elargol, by a setting for glue track, elargol is made to be distributed in particular area ratio symmetrically shape with adhesive glue.
3. bio-identification module becket mounting structure according to claim 1, it is characterised in that: the pattern of becket bottom surface is waffle-like pattern.
4. bio-identification module becket mounting structure according to claim 3, it is characterised in that: the ruling width of the waffle-like pattern of becket bottom surface is 0.03 ~ 0.10mm, and ruling is spaced apart 0.10 ~ 0.30mm.
5. bio-identification module becket mounting structure according to claim 1, it is characterised in that: the pattern on flexible circuit board Copper Foil is waffle-like pattern.
6. bio-identification module becket mounting structure according to claim 5, it is characterised in that: the ruling width of the waffle-like pattern on flexible circuit board Copper Foil is 0.06 ~ 0.15mm, and ruling is spaced apart 0.30 ~ 0.40mm.
7. bio-identification module becket mounting structure according to claim 2, it is characterised in that: the area ratio of described elargol and adhesive glue is 1:3 ~ 2:3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620147013.6U CN205356802U (en) | 2016-02-29 | 2016-02-29 | Biological identification module becket pastes dress structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620147013.6U CN205356802U (en) | 2016-02-29 | 2016-02-29 | Biological identification module becket pastes dress structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205356802U true CN205356802U (en) | 2016-06-29 |
Family
ID=56180114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620147013.6U Active CN205356802U (en) | 2016-02-29 | 2016-02-29 | Biological identification module becket pastes dress structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205356802U (en) |
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2016
- 2016-02-29 CN CN201620147013.6U patent/CN205356802U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |