CN205333218U - Temperature sensor with novel insulating packaging structure - Google Patents
Temperature sensor with novel insulating packaging structure Download PDFInfo
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- CN205333218U CN205333218U CN201521142473.1U CN201521142473U CN205333218U CN 205333218 U CN205333218 U CN 205333218U CN 201521142473 U CN201521142473 U CN 201521142473U CN 205333218 U CN205333218 U CN 205333218U
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- critesistor
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Abstract
The utility model provides a temperature sensor with novel insulating packaging structure, it includes thermistor, locates with thermistor's pin one end welded wire, cover the outside shell of thermistor, fill in space between shell and the thermistor has the stopping. The shell is the metal material. Temperature sensor still includes an insulating housing, insulating housing half surround the card locate thermistor the pin and with the outside of the partial wire of thermistor's pin welding one end with between the shell, the protruding baffle that forms in insulating housing middle part, this baffle card in between thermistor's two pins. Temperature sensor, good, the easy encapsulation of insulating nature.
Description
Technical field
This utility model belongs to electronic devices and components field, particularly relates to a kind of temperature sensor with New insulated encapsulating structure and method for packing thereof。
Background technology
By heat sensitive chip as core component, critesistor and the temperature sensor of taking different packing forms composition are widely used in various temperature sensing, temperature-compensating, temperature-control circuit, and it plays the central role of the electronic signal that the variables transformations of temperature becomes required in circuit。
Referring to Fig. 1, it is the structural representation of the temperature sensor with insulation-encapsulated structure of prior art。Existing temperature sensor, the wire 2 welded including the pin of critesistor 1 with critesistor 1, is packaged in the shell 3 outside critesistor 1, is filled with implant 4 between described shell 3 and critesistor 1。The pin being typically employed in critesistor 1 puts two thicker Teflon sleeve pipes 52 to play insulating effect, and overlaps a sleeve pipe 51 again at inductive head place, critesistor 1 top, plays and prevents drawing crack head encapsulated substance and anti-current breakdown effects。Additionally, be also cased with heat-shrinkable T bush 53 outside the weld 12 of critesistor 1 and wire 2。
Above-mentioned prior art has the disadvantage that
One, process operability is difficult, production efficiency is low；Owing to the sheathed more piece sleeve pipe of needs completes insulating protection, not only production efficiency is low, and cost of labor is high；
Two, between critesistor pin and sleeve pipe, gap is narrow and small, and after causing embedding, implant 4 cannot be filled up the gap of sleeve pipe, causes trapped gas。
Three, in potting process and finished product use procedure, two pins or the pad of resistance are easily sticked together due to deformation, cause product short circuit。
Utility model content
In order to solve above-mentioned technical problem, this utility model provides a kind of good insulating, is prone to the temperature sensor with New insulated encapsulating structure of encapsulation。
This utility model be the technical scheme is that
A kind of temperature sensor with New insulated encapsulating structure, the wire welded with pin one end of critesistor including critesistor, is sheathed on the shell outside described critesistor, and the space between described shell and critesistor is filled with inserts。Described shell is metal material。Described temperature sensor also includes an insulation shell, between described insulation shell semi-surrounding is arranged in the pin of critesistor and welds outside and the described shell of part wire of one end with the pin of critesistor；Convexing to form a dividing plate in the middle part of described insulation shell, this dividing plate is stuck between the two pins of described critesistor。
Compared to prior art, temperature sensor with New insulated encapsulating structure described in the utility model is by arranging the insulation shell being positioned between critesistor and wire weld and critesistor pin gap, avoid temperature sensor semi-finished product in potting process insert out after bottom metal-back firmly excessive cause critesistor pin or pin bend with wire weld deformation touch together with thus situation about being short-circuited, also effectively prevent the metal exposed part contacting metal shell of critesistor from affecting pressure performance。
Further, the weld of pin and wire that described dividing plate is positioned at described critesistor stretches out the anti-projection of being rebuffed of formation one。This anti-protruding setting of being rebuffed, can enable described insulation shell more be precisely located between critesistor and wire weld and critesistor pin gap on the one hand, and the edge making this anti-protruding and described wire of being rebuffed when mounted is inconsistent, with precise positioning；On the other hand, this anti-projection of being rebuffed can avoid the metal exposed part contacting metal shell of critesistor in embedding or use procedure to affect pressure performance further。
Further, described insulation shell passes through integrated injection molding。Integrated insulation shell, can be greatly decreased packaging technology step, improves production efficiency。
Further, described inserts is epoxy resin filling material。
In order to be more fully understood that and implement, describe this utility model in detail below in conjunction with accompanying drawing。
Accompanying drawing explanation
Fig. 1 is the structural representation of the temperature sensor with insulation-encapsulated structure of prior art
Fig. 2 is the structural representation of the temperature sensor with New insulated encapsulating structure described in embodiment 1
Fig. 3 is the front view of the temperature sensor with New insulated encapsulating structure described in embodiment 1
Fig. 4 is the structural representation of the insulation shell described in embodiment 1
Fig. 5 is the front view of the insulation shell described in embodiment 1
Fig. 6 is the schematic diagram of the step (2) of the method for packing described in embodiment 1
Fig. 7 is the schematic diagram of the step (3) of the method for packing described in embodiment 1
Fig. 8 is the structural representation of the temperature sensor with New insulated encapsulating structure described in embodiment 2
Fig. 9 is the front view of the temperature sensor with New insulated encapsulating structure described in embodiment 2
Figure 10 is the structural representation of the insulation shell described in embodiment 2
Figure 11 is the front view of the insulation shell described in embodiment 2
Figure 12 is the schematic diagram of the step (3) of the method for packing described in embodiment 2
Detailed description of the invention
Embodiment 1
Referring to Fig. 2, it is the structural representation of the temperature sensor with New insulated encapsulating structure described in the present embodiment；The temperature sensor with New insulated encapsulating structure described in the present embodiment includes wire 20 that critesistor 10 welds with pin one end of critesistor 10, is sheathed on the shell 30 outside described critesistor 10 and insulation shell 60, between described insulation shell 60 semi-surrounding is arranged in the pin of critesistor 10 and welds outside and the described shell 30 of part wire of one end with the pin of critesistor。Described shell 30 is metal material, and the space between itself and critesistor 10 is filled with inserts 40。
Specifically, please refer to Fig. 3～5, wherein, Fig. 3 is the front view of the temperature sensor with New insulated encapsulating structure described in the present embodiment, Fig. 4 is the structural representation of the insulation shell described in the present embodiment, and Fig. 5 is the front view of the insulation shell described in the present embodiment。Insulation shell 60 described in the present embodiment is that front end is narrower, rear end is wider, and half " " shape shell structure, and convex to form a dividing plate 61 in the middle part of its enclosure interior, this dividing plate 61 is stuck between the two pins of described critesistor 10 bottle。The weld 120 of pin and wire 20 that described dividing plate 61 is positioned at described critesistor 10 stretches out, and formation one is anti-is rebuffed protruding 611。In the present embodiment, described insulation shell 60 passes through integrated injection molding。
Compared to prior art, temperature sensor with New insulated encapsulating structure described in the utility model is by arranging the insulation shell 60 being positioned between critesistor and wire weld and critesistor pin gap, avoid temperature sensor semi-finished product in potting process insert out after bottom metal-back firmly excessive cause critesistor 10 pin or pin bend with wire weld 120 deformation touch together with thus situation about being short-circuited, also effectively prevent the metal exposed part contacting metal shell 30 of critesistor from affecting pressure performance。
Please refer to Fig. 4～7, the above-mentioned temperature sensor with New insulated encapsulating structure is formed by following steps encapsulation:
(1) insulation shell 60 as shown in Figure 4 is prepared by integrated injection molding technique；
(2) pin of critesistor 10 is welded with wire one end, as shown in Figure 6；
(3) between the pin that insulation shell 60 is arranged in critesistor 10 and outside and the described shell 30 of the part wire 20 welding one end with the pin of critesistor 10, and make the dividing plate 61 on insulation shell 60 be stuck between the two pins of critesistor 10, and make described anti-protruding 611 edges of being rebuffed inconsistent with described wire 20 edge, as shown in Figure 7；
(4) in shell 30, pour into inserts 40, then semi-finished product step (3) obtained insert in shell 30, are then filled and led up by shell 30 opening part with inserts 40, can obtain temperature sensor finished product as shown in Figure 2。The present embodiment adopts epoxy resin filling material。
Compared to prior art, method for packing of the present utility model is simple to operate, step is simplified, operability high, thus production efficiency being greatly improved, reducing human cost。In addition, by this method for packing, critesistor is packaged, can avoid semi-finished product in potting process insert out after bottom metal-back firmly excessive cause critesistor pin or pin bend with wire weld deformation touch together with thus situation about being short-circuited, also effectively prevent the metal exposed part contacting metal shell of critesistor from affecting pressure performance。
Embodiment 2
The present embodiment is substantially the same manner as Example 1, and it is distinctive in that the shape of insulation shell is different。Please refer to Fig. 8～11, wherein, Fig. 8 is the structural representation of the temperature sensor with New insulated encapsulating structure described in the present embodiment；Fig. 9 is the front view of the temperature sensor with New insulated encapsulating structure described in the present embodiment；Figure 10 is the structural representation of the insulation shell described in the present embodiment；Figure 11 is the front view of the insulation shell described in the present embodiment。
The temperature sensor with New insulated encapsulating structure described in the present embodiment includes wire 20 that critesistor 10 welds with pin one end of critesistor 10, is sheathed on the shell 30 outside described critesistor 10 and insulation shell 601, between described insulation shell 601 semi-surrounding is arranged in the pin of critesistor 10 and welds outside and the described shell 30 of part wire of one end with the pin of critesistor。Described shell 30 is metal material, and the space between itself and critesistor 10 is filled with inserts 40。
Insulation shell 601 described in the present embodiment is half tubular casing structure, and convexes to form a dividing plate 62 in the middle part of its enclosure interior, and this dividing plate 62 is stuck between the two pins of described critesistor 10。The weld 120 of pin and wire 20 that described dividing plate 62 is positioned at described critesistor 10 stretches out, and formation one is anti-is rebuffed protruding 621。In the present embodiment, described insulation shell 601 passes through integrated injection molding。
Compared to prior art, temperature sensor with New insulated encapsulating structure described in the utility model is by arranging the insulation shell 601 being positioned between critesistor and wire weld and critesistor pin gap, avoid temperature sensor semi-finished product in potting process insert out after bottom metal-back firmly excessive cause critesistor 10 pin or pin bend with wire weld 120 deformation touch together with thus situation about being short-circuited, also effectively prevent the metal exposed part contacting metal shell 30 of critesistor from affecting pressure performance。
Please refer to Fig. 6,10～12, the above-mentioned temperature sensor with New insulated encapsulating structure by following steps encapsulation form:
(1) insulation shell 601 as shown in Figure 10 is prepared by integrated injection molding technique；
(2) pin of critesistor 10 is welded with wire one end, as shown in Figure 6；
(3) between the pin that insulation shell 601 is arranged in critesistor 10 and outside and the described shell 30 of the part wire 20 welding one end with the pin of critesistor 10, and make the dividing plate 62 on insulation shell 601 be stuck between the two pins of critesistor 10, and make described anti-protruding 621 edges of being rebuffed inconsistent with described wire 20 edge, as shown in figure 12；
(4) in shell 30, pour into inserts 40, then semi-finished product step (3) obtained insert in shell 30, are then filled and led up by shell 30 opening part with inserts 40, can obtain temperature sensor finished product as shown in Figure 8。The present embodiment adopts epoxy resin filling material。
Compared to prior art, method for packing of the present utility model is simple to operate, step is simplified, operability high, thus production efficiency being greatly improved, reducing human cost。In addition, by this method for packing, critesistor is packaged, can avoid semi-finished product in potting process insert out after bottom metal-back firmly excessive cause critesistor pin or pin bend with wire weld deformation touch together with thus situation about being short-circuited, also effectively prevent the metal exposed part contacting metal shell of critesistor from affecting pressure performance。
This utility model is not limited to above-mentioned embodiment, if to various changes of the present utility model or deformation without departing from spirit and scope of the present utility model, if these are changed and deformation belongs within claim of the present utility model and equivalent technologies scope, then this utility model is also intended to comprise these changes and deformation。
Claims (4)
1. with a temperature sensor for New insulated encapsulating structure, the wire that welds with pin one end of critesistor including critesistor, being sheathed on the shell outside described critesistor, the space between described shell and critesistor is filled with inserts；It is characterized in that: also include an insulation shell, between described insulation shell semi-surrounding is arranged in the pin of critesistor and welds outside and the described shell of part wire of one end with the pin of critesistor；Convexing to form a dividing plate in the middle part of described insulation shell, this dividing plate is stuck between the two pins of described critesistor。
2. the temperature sensor with New insulated encapsulating structure according to claim 1, it is characterised in that: the weld of pin and wire that described dividing plate is positioned at described critesistor stretches out and forms an anti-projection of being rebuffed。
3. the temperature sensor with New insulated encapsulating structure according to claim 1, it is characterised in that: described insulation shell passes through integrated injection molding。
4. the temperature sensor with New insulated encapsulating structure according to any one of Claims 1 to 4, it is characterised in that: described inserts is epoxy resin filling material。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521142473.1U CN205333218U (en) | 2015-12-31 | 2015-12-31 | Temperature sensor with novel insulating packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521142473.1U CN205333218U (en) | 2015-12-31 | 2015-12-31 | Temperature sensor with novel insulating packaging structure |
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| CN205333218U true CN205333218U (en) | 2016-06-22 |
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| CN201521142473.1U Active CN205333218U (en) | 2015-12-31 | 2015-12-31 | Temperature sensor with novel insulating packaging structure |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105527037A (en) * | 2015-12-31 | 2016-04-27 | 广东爱晟电子科技有限公司 | Temperature sensor with novel insulated packaging structure and packaging method thereof |
| CN106225946A (en) * | 2016-07-27 | 2016-12-14 | 广东爱晟电子科技有限公司 | A kind of open temperature sensor and preparation method thereof |
| CN108885143A (en) * | 2017-02-09 | 2018-11-23 | 株式会社芝浦电子 | temperature sensor |
| CN108981950A (en) * | 2018-10-15 | 2018-12-11 | 上海文襄汽车传感器有限公司 | Integral temperature sensor |
| CN110987207A (en) * | 2019-12-30 | 2020-04-10 | 北京卫星环境工程研究所 | Method for fixing scattered wire type conducting wire outside spacecraft cabin |
-
2015
- 2015-12-31 CN CN201521142473.1U patent/CN205333218U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105527037A (en) * | 2015-12-31 | 2016-04-27 | 广东爱晟电子科技有限公司 | Temperature sensor with novel insulated packaging structure and packaging method thereof |
| CN105527037B (en) * | 2015-12-31 | 2019-03-26 | 广东爱晟电子科技有限公司 | A kind of temperature sensor and its packaging method with New insulated encapsulating structure |
| CN106225946A (en) * | 2016-07-27 | 2016-12-14 | 广东爱晟电子科技有限公司 | A kind of open temperature sensor and preparation method thereof |
| CN108885143A (en) * | 2017-02-09 | 2018-11-23 | 株式会社芝浦电子 | temperature sensor |
| CN108981950A (en) * | 2018-10-15 | 2018-12-11 | 上海文襄汽车传感器有限公司 | Integral temperature sensor |
| CN110987207A (en) * | 2019-12-30 | 2020-04-10 | 北京卫星环境工程研究所 | Method for fixing scattered wire type conducting wire outside spacecraft cabin |
| CN110987207B (en) * | 2019-12-30 | 2022-03-29 | 北京卫星环境工程研究所 | Method for fixing scattered wire type conducting wire outside spacecraft cabin |
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