CN205303637U - Ka frequency channel waveguide inner space power combiner - Google Patents
Ka frequency channel waveguide inner space power combiner Download PDFInfo
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- CN205303637U CN205303637U CN201521110317.7U CN201521110317U CN205303637U CN 205303637 U CN205303637 U CN 205303637U CN 201521110317 U CN201521110317 U CN 201521110317U CN 205303637 U CN205303637 U CN 205303637U
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Abstract
The utility model discloses a ka frequency channel waveguide inner space power combiner, upward piecemeal, well piecemeal and lower piecemeal form confined rectangle input waveguide, rectangle output waveguide, input/output waveguide H face power combiner behind the lock in proper order, input/output waveguide T type ties and waveguide - microstrip probe passes through, the radio frequency link is including four waveguides - microstrip transition probe and four power amplifier chip of input, output, the utility model discloses a synthetic mode of waveguide inner space power is tied the signal of importing the waveguide and is divided equally for four through cascaded waveguide H face power combiner and waveguide T type, in signal the process microstrip - waveguide transition after completion waveguide - microstrip is imported to the input of power chip, is amplified enters into the waveguide, then combine waveguide H face power combiner to carry out the synthesis of four ways power through cascaded waveguide T type once more after passing through, at last by the waveguide output.
Description
Technical field
The utility model relates to spatial power combiner in a kind of Ka frequency range waveguide in wireless communication field, is specially adapted to do the power amplifier apparatus of communication channel.
Background technology
Owing to being subject to the impact of Ka frequency range solid-state devices self Semiconductor Physics characteristic, be also difficult at present develop powerful Ka frequency range solid-state devices. In order to obtain larger power output, need to adopt the synthetic method of power that multiple power devices are concentrated in a power synthesis amplifier; In addition, adopt multiple power sources to synthesize guarantee system in the situation that of can also losing efficacy in one or several source and continue derate work.
At present, applying maximum power synthetic techniques in Ka frequency range is that in waveguide, spatial power is synthetic. The synthetic loss of Ka band circuitry is larger, and when more way synthetic, power combined coefficient is lower; And the synthetic heat radiation that can effectively solve each power monolithic of spatial power can improve the power combined coefficient of multichannel when synthetic in waveguide, be more suitable for being applied to Ka frequency range and produce larger complete machine power output.
Utility model content
The technical problems to be solved in the utility model is to provide spatial power combiner in the waveguide of a kind of Ka frequency range, has that combined coefficient is high, a bandwidth, little, the lightweight feature of volume.
For solving the problems of the technologies described above, technical solution adopted in the utility model is:
Spatial power combiner in the waveguide of a kind of Ka frequency range, comprises three upper piecemeals 1 that be arranged in parallel successively from top to bottom, middle piecemeal 2 and lower piecemeal 3; Described upper piecemeal 1 and middle piecemeal 2 fastens and between the latter two, forms complete and communicate with external environment condition and the input waveguide 30 that is connected successively, two are independently gone up radio frequency link installation cavity 21, output waveguide load 33, described middle piecemeal 2 and lower piecemeal 4 fastens and between the latter two, forms complete and communicate with external environment condition and radio frequency link installation cavity 23, output waveguide 32 are independently descended in the input waveguide load 31 that is connected successively, two
Described input waveguide 30 communicates with input waveguide load 31 and forms input waveguide H face power combiner 26 Yi Jiang mono-road signals and be assigned as multichannel, and described output waveguide 32 communicates formation output waveguide H face power combiner 27 multiple signals are combined into a road with output waveguide load 33;
Input waveguide 30 is inputted T shape knot 28 by one-to-two and independently go up the radio frequency link installation cavity 21 Yi Jiang mono-road signal that is connected and is divided into two paths of signals with two, two independently go up radio frequency link installation cavity by two-in-one output T shape tie 29 and output waveguide 32 be connected two paths of signals to be combined into a road signal;
Input waveguide load is inputted T shape knot 28 by one-to-two and independently descend the radio frequency link installation cavity 23 Yi Jiang mono-road signal that is connected to be divided into two paths of signals with two, and two are independently descended radio frequency link installation cavity 23 to tie by two-in-one output T shape and output waveguide 32 is connected two paths of signals to be combined into a road signal;
On each, in radio frequency link installation cavity 21 He in each lower radio frequency link installation cavity 23, be equipped with microstrip probe and power amplifier chips, microstrip probe connects by gold wire bonding mutually with power amplifier chips, microstrip probe be arranged on power amplifier chips both sides and respectively with extend to input, output T shape is tied phase coupling in 28,29, microstrip probe forms input waveguide microstrip transition with input T shape knot, and microstrip probe forms output waveguide microstrip transition with output T shape knot.
Further, described upper piecemeal 1, middle piecemeal 2 are located by pin with lower piecemeal 3 and are utilized together with screw fastening.
Further, the power amplifier chips of described upper radio frequency link installation cavity 21 interior settings is connected with upper piecemeal 1, and the power amplifier chips of lower radio frequency link installation cavity 23 interior settings is connected with lower piecemeal 3.
Further, on opposing two faces of described upper piecemeal 1 and lower piecemeal 3, an amplifier power supply plate 24 is respectively installed; Amplifier power supply plate on upper piecemeal 1 be connected with the power amplifier chips in upper radio frequency link installation cavity 21 by insulator, the amplifier power supply plate on lower piecemeal 3 is connected with the power amplifier chips in lower radio frequency link installation cavity 23 by insulator with lower piecemeal 3.
Further, described Waveguide-microbelt transition and micro-band waveguide transition are all made up of quartz medium substrate microstrip probe.
Further, described microstrip probe is quartz medium substrate microstrip probe.
Further, on described power amplifier chips, be also provided with multiple bypass filter capacitors that disturb for eliminating power supply.
Further, in described input waveguide 30, output waveguide 32, input waveguide load 31 and output waveguide load 33 all with being useful on the ladder boss of realizing impedance matching.
The beneficial effect that the utility model adopts technique scheme to produce is in terms of existing technologies:
Input, the output of power amplifier module all adopt the waveguide H face power combiner with isolation, make this module have good input, output port stationary wave characteristic; It is 90 ° that waveguide H face power combiner two is exported phase difference between branch road, has realized a kind of balance amplifier by symmetrical design, has further improved the port stationary wave characteristic of power amplifier module, conveniently proceeds power based on this module synthetic.
Four power amplifier chips in this power amplifier module adopt the three-dimensional mode distributing, and facilitating on the basis of four power amplifier monolithic heat radiations in module, have improved the output power density of power amplifier module.
Waveguide H face power combiner adopts rectangle ladder step to realize the mode of impedance matching, the processing of convenient input, output waveguide H face power combiner.
Waveguide-microstrip transition probe adopts quartz as medium substrate, and the process technology of based thin film has realized high-precision microstrip probe, has reduced the Insertion Loss of waveguide-microstrip transition; Quartz medium substrate is difficult for producing deformation, makes this module have high functional reliability.
This power amplifier module compact conformation, combined coefficient is high, microwave is little, be easy to the heat radiation of each monolithic.
Brief description of the drawings
Fig. 1 is the explosive view of overlooking of the present utility model;
Fig. 2 is left rotation and right rotation of the present utility model inverted explosive view;
Fig. 3 is that following waveguide is the structure chart that illustrates the upper and lower radio frequency link installation cavity of meaning;
Fig. 4 is power amplifier chips and the microstrip probe scheme of installation in lower radio frequency link installation cavity of the present utility model;
Fig. 5 is power amplifier chips and the microstrip probe scheme of installation in upper radio frequency link installation cavity of the present utility model;
Fig. 6 is the position view figure of waveguide delivery outlet of the present utility model and waveguide load input port;
Fig. 7 is the position view of waveguide output port of the present utility model and waveguide load output port;
Fig. 8 is that microwave signal of the present utility model flows to schematic diagram;
Fig. 9 is optimal alignment mounting means schematic diagram of the present utility model;
Figure 10 is equivalent circuit theory figure of the present utility model.
Description of reference numerals: upper piecemeal 1, middle piecemeal 2, lower piecemeal 3, the first incoming wave guide groove 4, the first output waveguide load groove 5, the second incoming wave guide groove 6, the second output waveguide load groove 7, the second output wave guide groove 8, the second input waveguide load groove 9, the first output wave guide groove 10, the first input waveguide load groove 11, input waveguide mouth 12, output waveguide mouth 14, waveguide load entrance 13, waveguide load outlet 15, Waveguide-microbelt transition 18, micro-band waveguide transition 19, upper radio frequency link installation cavity 21, lower radio frequency link installation cavity 23, input waveguide H face power combiner 26, output waveguide H face power combiner 27, input T shape knot 28, output T shape knot 29, input waveguide 30, output waveguide load 33, output waveguide 32, input waveguide load 31.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
As shown in Figure 1, Figure 2, shown in Fig. 8, the utility model is spatial power combiner in the waveguide of a kind of Ka frequency range, comprises three upper piecemeals 1 that be arranged in parallel successively from top to bottom, middle piecemeal 2 and lower piecemeal 3, upper piecemeal 1, middle piecemeal 2 are located by pin with lower piecemeal 3 and are utilized together with screw fastening. the lower surface of upper piecemeal 1 is provided with the first incoming wave guide groove 4, the first output waveguide load groove 5, the upper surface of lower piecemeal 3 is provided with the first output wave guide groove 10, the first input waveguide load groove 11, middle piecemeal 2 upper surfaces are provided with the second incoming wave guide groove 6, the second output waveguide load groove 7, the lower surface of middle piecemeal 2 is provided with the second output wave guide groove 8, the second input waveguide load groove 9, after fastening, the first incoming wave guide groove 4 and the second incoming wave guide groove 6 form the input waveguide 30 of sealing, after fastening, the first output waveguide load groove 5 and the second output waveguide load groove 7 form the output waveguide load 33 of sealing, after fastening, the first output wave guide groove 10 and the second output wave guide groove 8 form sealing output waveguide 32, after fastening, the first input waveguide load groove 11 and the second input waveguide load groove 9 form the input waveguide load 31 of sealing,
As shown in Figure 8, in the middle of be positioned between input waveguide 30, input waveguide load 31 piecemeal 2 on have for by the opening of signal one-to-two, this opening is positioned at the middle part of input waveguide 30 and input waveguide load 31, and input waveguide 30, input waveguide load 31 form input waveguide H face power combiner 26 by this opening; On piecemeal 2, have in the middle of be positioned between output waveguide 32 and output waveguide load 33 for by opening two-in-one signal, this opening is positioned at the middle part of output waveguide 32 and output waveguide load 33, and output waveguide 32 and output waveguide load 33 form output waveguide H face power combiner 27 by this opening.
As shown in Fig. 1,2,6,7,10, between upper piecemeal 1 and middle piecemeal 2, be provided with two and independently go up separately radio frequency link installation cavity 21, between 21 of upper radio frequency link installation cavitys and input waveguide 30 and output waveguide load 33, input waveguide 30 is exported T shape knot 28 by one-to-two and is passed to mutually Jiang Yi road signal with two upper radio frequency link installation cavitys 21 and be divided into two paths of signals, and two upper radio frequency link installation cavitys 21 are tied 29 by two-in-one input T shape and passed to mutually Jiang Er road signal with output waveguide load 33 and be combined into a road signal; Between middle piecemeal and lower piecemeal, be provided with two and independently descend separately radio frequency link installation cavity 23, lower radio frequency link installation cavity 23 is between input waveguide load 31 and output waveguide 33, input waveguide load 31 is inputted T shape knot 28 by one-to-two and is passed to mutually Jiang Yi road signal with two lower radio frequency link installation cavitys 23 and be divided into two paths of signals, two lower radio frequency link installation cavitys 23 pass to signal He Wei mono-road signal in Jiang Er road by two-in-one output T shape knot 29 mutually with output waveguide 33, described input T shape knot 28 and export T shape tie 29 symmetrical become mirror image distribution and the two structure identical.
As shown in Fig. 1,2,4,8, on two, in radio frequency link installation cavity 21 He in lower radio frequency link installation cavity 23, be equipped with a power amplifier chips, the both sides spun gold key of power amplifier chips and have a microstrip probe, microstrip probe stretches in input T shape knot 28 and output T shape knot 29 and with input T shape knot 28 and output T shape knot 29 and is coupled, microstrip probe forms input waveguide microstrip transition with input T shape knot, microstrip probe forms the micro-band waveguide transition of output with output T shape knot, and wherein Waveguide-microbelt structure 18 is all reciprocal structure mutually with micro-band waveguide transition structure 19 structures;
As shown in Figure 4, Figure 5, the power amplifier chips of described upper radio frequency link installation cavity 21 interior settings is connected with upper piecemeal 1, and the power amplifier chips of lower radio frequency link installation cavity 23 interior settings is connected with lower piecemeal 3.
As shown in Figure 9, on opposing two faces of upper piecemeal 1 and lower piecemeal 3, an amplifier power supply plate 24 is respectively installed; Amplifier power supply plate 24 is for completing the power supply of power monolithic, on opposing two faces of described upper piecemeal 1 and lower piecemeal 3, an amplifier power supply plate 24 is respectively installed; Amplifier power supply plate on upper piecemeal 1 be connected with the power amplifier chips in upper radio frequency link installation cavity 21 by insulator, the amplifier power supply plate on lower piecemeal 3 is connected with the power amplifier chips in lower radio frequency link installation cavity 23 by insulator.
For ensureing signal transmission effect, described Waveguide-microbelt transition is made up of quartz medium substrate microstrip probe.
On power amplifier chips, be also provided with multiple bypass filter capacitors that disturb for eliminating power supply.
For ensureing in described input waveguide 30, output waveguide 32, input waveguide load 31 and output waveguide load 33 all with being useful on the ladder boss of realizing impedance matching.
Amplifier power supply plate of the present utility model and power chip are distributed in different aspects, then are undertaken interconnectedly by insulator, have improved the Electro Magnetic Compatibility of power combiner, have ensured stability and the reliability of power combiner.
The concise and to the point operation principle of the utility model is as follows:
As shown in Figure 8, input signal is fed into waveguide from rectangle input waveguide mouth 12, and after waveguide H face shunt 26, power-sharing is two, then passes through the T-shaped knot shunt 28 of waveguide, and power-sharing is four parts; After four power chips amplify, export waveguide to, carry out spatial power in waveguide synthesize by output T shape knot 29, the output waveguide H face power combiner 27 of cascade, the power after synthesizing is in waveguide outlet 14 outputs; 90 ° of the phase phasic differences of branch road between waveguide H face shunt 26 and waveguide H face combiner 27, waveguide load entrance 13 and waveguide load outlet 15 connect matched waveguide load or microwave absorbing material is installed is two provide approximately-20dB of power combiner isolations, and whole like this module has just formed a balance amplifier; Stability that balance amplifier has improved amplifier work has been improved again the standing wave at power model input waveguide mouth 12, output waveguide mouth 14 places.
As shown in Figure 9, module for power supply plate 30 is connected with amplifier power supply plate 24,25, for whole module is powered; The radiating surface that a side relative with module for power supply plate 30 is module, such structure had not only been conducive to integrated but also had been conducive to the heat radiation of power amplifier module.
Claims (6)
1. a spatial power combiner in the waveguide of Ka frequency range, comprises three from top to bottom successivelyThe upper piecemeal (1) be arrangeding in parallel, middle piecemeal (2) and lower piecemeal (3); Described upper piecemeal(1) and middle piecemeal (2) fasten and between the latter two, form complete and communicate also with external environment conditionThe input waveguide (30), two that connect successively are independently gone up radio frequency link installation cavity (21), defeatedGo out waveguide load (33), described middle piecemeal (2) and lower piecemeal (3) fasten the latter two itBetween form complete and communicate with external environment condition and the input waveguide load (31) that is connected successively,Two are independently descended radio frequency link installation cavity (23), output waveguide (32), it is characterized in that:
Described input waveguide (30) the formation input waveguide that communicates with input waveguide load (31)H face power combiner (26) Yi Jiang mono-road signal is assigned as multichannel, described output waveguide (32)Communicate with output waveguide load (33) and form output waveguide H face power combiner (27) to incite somebody to actionMultiple signals are combined into a road;
Input waveguide (30) is inputted T shape knot (28) by one-to-two and is penetrated on independently with twoFrequency link installation cavity (21) the Yi Jiang mono-road signal that is connected is divided into two paths of signals, and two independentlyUpper radio frequency link installation cavity (21) is by two-in-one output T shape knot (29) and output waveguide (32)Be connected two paths of signals to be combined into a road signal;
Input waveguide load (31) by one-to-two input T shape knot (28) with two independentlyLower radio frequency link installation cavity (23) the Yi Jiang mono-road signal that is connected is divided into two paths of signals, and two solelyVertical lower radio frequency link installation cavity (23) is by two-in-one output T shape knot (29) and output waveLead (32) and be connected two paths of signals to be combined into a road signal;
Radio frequency link installation cavity (21) neutralizes each lower radio frequency link installation cavity (23) on eachIn be equipped with microstrip probe and power amplifier chips, microstrip probe and power amplifier chips are by gold wire bonding phaseConnect, microstrip probe be arranged on power amplifier chips both sides and respectively with extend to input, export TPhase coupling in shape knot (28,29), microstrip probe forms with input T shape knot that input waveguide is micro-to be withCross (18), microstrip probe forms the micro-band waveguide transition of output (19) with output T shape knot.
2. spatial power combiner in a kind of Ka frequency range according to claim 1 waveguide,It is characterized in that: described upper piecemeal (1), middle piecemeal (2) pass through pin with lower piecemeal (3)Nail is located and utilizes screw fastening together.
3. spatial power combiner in a kind of Ka frequency range according to claim 1 waveguide,It is characterized in that: the power amplifier chips arranging in described upper radio frequency link installation cavity (21) and upper pointPiece (1) is connected, the power amplifier chips and the lower piecemeal that in lower radio frequency link installation cavity (23), arrange(3) be connected.
4. spatial power combiner in a kind of Ka frequency range according to claim 1 waveguide,It is characterized in that: on opposing two faces of described upper piecemeal (1) and lower piecemeal (3), respectively installThere is an amplifier power supply plate (24); Amplifier power supply plate on upper piecemeal (1) with pass through insulatorBe connected with the power amplifier chips in upper radio frequency link installation cavity (21), on lower piecemeal (3)Amplifier power supply plate and lower piecemeal (3) are by insulator and lower radio frequency link installation cavity (23)Power amplifier chips be connected.
5. spatial power combiner in a kind of Ka frequency range according to claim 1 waveguide,It is characterized in that: described Waveguide-microbelt transition (18) and micro-band waveguide transition (19) all byQuartz medium substrate microstrip probe forms.
6. spatial power combiner in a kind of Ka frequency range according to claim 1 waveguide,It is characterized in that: described input waveguide (30), output waveguide (32), input waveguide load(31) and in output waveguide load (33) all with being useful on the ladder boss of realizing impedance matching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521110317.7U CN205303637U (en) | 2015-12-29 | 2015-12-29 | Ka frequency channel waveguide inner space power combiner |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521110317.7U CN205303637U (en) | 2015-12-29 | 2015-12-29 | Ka frequency channel waveguide inner space power combiner |
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| Publication Number | Publication Date |
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| CN205303637U true CN205303637U (en) | 2016-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201521110317.7U Withdrawn - After Issue CN205303637U (en) | 2015-12-29 | 2015-12-29 | Ka frequency channel waveguide inner space power combiner |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105552503A (en) * | 2015-12-29 | 2016-05-04 | 中国电子科技集团公司第五十四研究所 | Ka-band waveguide-based spatial power combiner |
| CN107819441A (en) * | 2017-12-08 | 2018-03-20 | 成都聚利中宇科技有限公司 | high frequency power amplifier package module |
| CN112054277A (en) * | 2020-08-19 | 2020-12-08 | 西安空间无线电技术研究所 | X-frequency-band two-path high-power waveguide synthesis network |
-
2015
- 2015-12-29 CN CN201521110317.7U patent/CN205303637U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105552503A (en) * | 2015-12-29 | 2016-05-04 | 中国电子科技集团公司第五十四研究所 | Ka-band waveguide-based spatial power combiner |
| CN105552503B (en) * | 2015-12-29 | 2018-02-06 | 中国电子科技集团公司第五十四研究所 | Spatial power combiner in a kind of Ka frequency ranges waveguide |
| CN107819441A (en) * | 2017-12-08 | 2018-03-20 | 成都聚利中宇科技有限公司 | high frequency power amplifier package module |
| CN112054277A (en) * | 2020-08-19 | 2020-12-08 | 西安空间无线电技术研究所 | X-frequency-band two-path high-power waveguide synthesis network |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160608 Effective date of abandoning: 20180206 |