CN105552503A - Ka-band waveguide-based spatial power combiner - Google Patents
Ka-band waveguide-based spatial power combiner Download PDFInfo
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- CN105552503A CN105552503A CN201511002839.XA CN201511002839A CN105552503A CN 105552503 A CN105552503 A CN 105552503A CN 201511002839 A CN201511002839 A CN 201511002839A CN 105552503 A CN105552503 A CN 105552503A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
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Abstract
The invention discloses a Ka-band waveguide-based spatial power combiner. An upper block, a middle block and a lower block are fastened in sequence to form a closed rectangular input waveguide, a closed rectangular output waveguide, input and output waveguide H-side power combiners, input and output waveguide T type junctions and a waveguide-microstrip probe transition; an RF link comprises four input and output waveguide-microstrip transition probes and four power amplifier chips. Based on waveguide-based spatial power combining, the Ka-band waveguide-based spatial power combiner disclosed by the invention divides a signal input in the waveguide into four equal parts through the waveguide H-side power combiners and the waveguide T type junctions which are cascaded; after waveguide-microstrip transition is finished, the signal is input to the input ends of the power amplifier chips; the amplified signal enters the waveguide through the microstrip-waveguide probe transition; then the signal is subjected to four-path power combination through the waveguide T type junctions and the waveguide H-side power combiners which are cascaded and is finally output from the waveguide.
Description
Technical field
The present invention relates to spatial power combiner in a kind of Ka frequency range waveguide in wireless communication field, be specially adapted to the power amplifier apparatus making communication channel.
Background technology
Due to the impact by Ka frequency range solid state device self Semiconductor Physics characteristic, be also difficult at present develop powerful Ka frequency range solid state device.In order to obtain larger power output, need to adopt the method for power combing to be concentrated on by multiple power device in a power synthesis amplifier; In addition, adopt multiple power source to carry out synthesis and guarantee system can also continue derate work when losing efficacy in one or several source.
At present, applying maximum power synthetic techniques in Ka frequency range is space power synthesis in waveguide.Ka band circuitry synthesis loss is comparatively large, and during the synthesis of more way, power combining efficiency is lower; And the power combining efficiency of the heat radiation that in waveguide, space power synthesis can solve each power single-chip effectively when can improve multichannel synthesis, be more suitable for being applied to Ka frequency range and produce larger complete machine power output.
Summary of the invention
The technical problem to be solved in the present invention is to provide spatial power combiner in the waveguide of a kind of Ka frequency range, has that combined coefficient is high, little, the lightweight feature of bandwidth, volume.
For solving the problems of the technologies described above, the technical solution used in the present invention is:
Spatial power combiner in the waveguide of a kind of Ka frequency range, comprises three upper piecemeals 1 be arranged in parallel successively from top to bottom, middle piecemeal 2 and lower piecemeal 3; Described upper piecemeal 1 and middle piecemeal 2 fasten and to be formed complete between the latter two and to communicate with external environment condition and the input waveguide 30, two be connected successively independently goes up radio frequency link installation cavity 21, output waveguide load 33, described middle piecemeal 2 and lower piecemeal 4 fasten and to be formed complete between the latter two and to communicate with external environment condition and radio frequency link installation cavity 23, output waveguide 32 are independently descended in the input waveguide load 31, two be connected successively
Described input waveguide 30 communicates with input waveguide load 31 and forms power combiner 26 Yi Jiang mono-road, input waveguide H face signal and be assigned as multichannel, and described output waveguide 32 communicates with output waveguide load 33 and forms output waveguide H face power combiner 27 so that multiple signals are combined into a road;
Input waveguide 30 independently go up the radio frequency link installation cavity 21 Yi Jiang mono-road signal that is connected by one-to-two input T-shaped knot 28 is divided into two paths of signals with two, two independently go up radio frequency link installation cavity by two-in-one output T-shaped tie 29 and output waveguide 32 be connected two paths of signals to be combined into a road signal;
Input waveguide load independently descend the radio frequency link installation cavity 23 Yi Jiang mono-road signal that is connected to be divided into two paths of signals by one-to-two input T-shaped knot 28 with two, and two are independently descended radio frequency link installation cavity 23 to be tied by two-in-one output T-shaped and output waveguide 32 is connected two paths of signals to be combined into a road signal;
Microstrip probe and power amplifier chips is equipped with on each in radio frequency link installation cavity 21 and in each lower radio frequency link installation cavity 23, microstrip probe and power amplifier chips are linked by gold wire bonding, microstrip probe is arranged on power amplifier chips both sides and inputs, exports T-shaped and tie phase coupling in 28,29 with extending to respectively, microstrip probe is tied with input T-shaped and is formed input waveguide microstrip transition, and microstrip probe is tied with output T-shaped and formed output waveguide microstrip transition.
Further, described upper piecemeal 1, middle block 2 and lower piecemeal 3 are located by pin and are utilized together with screw fastening.
Further, the power amplifier chips arranged in described upper radio frequency link installation cavity 21 is connected with upper piecemeal 1, and the power amplifier chips arranged in lower radio frequency link installation cavity 23 is connected with lower piecemeal 3.
Further, two faces that described upper piecemeal 1 is opposing with lower piecemeal 3 are respectively provided with an amplifier power supply plate 24; Amplifier power supply plate on upper piecemeal 1 is connected with the power amplifier chips in upper radio frequency link installation cavity 21 with by insulator, and the amplifier power supply plate on lower piecemeal 3 is connected with the power amplifier chips in lower radio frequency link installation cavity 23 by insulator with lower piecemeal 3.
Further: described Waveguide-microbelt transition and micro-band waveguide transition are all made up of quartz medium substrate microstrip probe.
Further, described microstrip probe is quartz medium substrate microstrip probe.
Further, described power amplifier chips is also provided with multiple bypass filter capacitor for eliminating power supply disturbance.
Further, all with the ladder boss for realizing impedance matching in described input waveguide 30, output waveguide 32, input waveguide load 31 and output waveguide load 33.
The present invention adopts technique scheme beneficial effect produced in terms of existing technologies to be:
Input, the output of power amplifier module all adopt the waveguide H face power combiner with isolation, make this module have good input, output port stationary wave characteristic; It is 90 ° that waveguide H face power combiner two exports phase difference between branch road, achieves a kind of balance amplifier by the design of symmetry, further improves the port stationary wave characteristic of power amplifier module, conveniently proceeds power combing based on this module.
Four power amplifier chips in this power amplifier module adopt the mode of three-dimensional distribution, on the basis facilitating four power amplifier monolithic heat radiations in module, improve the output power density of power amplifier module.
Waveguide H face power combiner adopts rectangle stair-step to realize the mode of impedance matching, the processing of convenient input, output waveguide H face power combiner.
Waveguide-microstrip transition probe adopts quartz as medium substrate, and the process technology of based thin film achieves high-precision microstrip probe, reduces the Insertion Loss of waveguide-microstrip transition; Quartz medium substrate not easily produces deformation, makes this module have high functional reliability.
This power amplifier module compact conformation, combined coefficient is high, microwave is little, be easy to the heat radiation of each monolithic.
Accompanying drawing explanation
Fig. 1 is the explosive view overlooked of the present invention;
Fig. 2 is left rotation and right rotation of the present invention and inverted explosive view;
Fig. 3 is following waveguide is the structure chart illustrating the upper and lower radio frequency link installation cavity of meaning;
Fig. 4 is power amplifier chips in lower radio frequency link installation cavity of the present invention and microstrip probe scheme of installation;
Fig. 5 is power amplifier chips in upper radio frequency link installation cavity of the present invention and microstrip probe scheme of installation;
Fig. 6 is the position view figure of wave guide outlet of the present invention and waveguide load input port;
Fig. 7 is the position view of output waveguide port of the present invention and waveguide load output port;
Fig. 8 is that microwave signal of the present invention flows to schematic diagram;
Fig. 9 is optimal alignment mounting means schematic diagram of the present invention;
Figure 10 is equivalent circuit theory figure of the present invention.
Description of reference numerals: upper piecemeal 1, middle piecemeal 2, lower piecemeal 3, first incoming wave guide groove 4, first output waveguide load groove 5, second incoming wave guide groove 6, second output waveguide load groove 7, second output wave guide groove 8, second input waveguide load groove 9, first output wave guide groove 10, first input waveguide load groove 11, input waveguide mouth 12, output waveguide mouth 14, waveguide load entrance 13, waveguide load outlet 15, Waveguide-microbelt transition 18, micro-band waveguide transition 19, upper radio frequency link installation cavity 21, lower radio frequency link installation cavity 23, input waveguide H face power combiner 26, output waveguide H face power combiner 27, input T-shaped knot 28, export T-shaped knot 29, input waveguide 30, output waveguide load 33, output waveguide 32, input waveguide load 31.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
As shown in Figure 1, Figure 2, shown in Fig. 8, the present invention is spatial power combiner in the waveguide of a kind of Ka frequency range, comprises three upper piecemeals 1 be arranged in parallel successively from top to bottom, middle piecemeal 2 and lower piecemeal 3; Upper piecemeal 1, middle block 2 and lower piecemeal 3 are located by pin and are utilized together with screw fastening.The lower surface of upper piecemeal 1 is provided with the first incoming wave guide groove 4, first output waveguide load groove 5, the upper surface of lower piecemeal 3 is provided with the first output wave guide groove 10, first input waveguide load groove 11, middle block 2 upper surface is provided with the second incoming wave guide groove 6, second output waveguide load groove 7, the lower surface of middle block 2 is provided with the second output wave guide groove 8, second input waveguide load groove 9, first incoming wave guide groove 4 and the second incoming wave guide groove 6 fasten the input waveguide 30 that rear formation is closed, first output waveguide load groove 5 and the second output waveguide load groove 7 fasten the output waveguide load 33 that rear formation is closed, first output wave guide groove 10 and the second output wave guide groove 8 fasten rear formation and close output waveguide 32, first input waveguide load groove 11 and the second input waveguide load groove 9 fasten the input waveguide load 31 that rear formation is closed,
As shown in Figure 8, be positioned between input waveguide 30, input waveguide load 31 middle block 2 on have for the opening by signal one-to-two, this opening is positioned at the middle part of input waveguide 30 and input waveguide load 31, and input waveguide 30, input waveguide load 31 form input waveguide H face power combiner 26 by this opening; Be positioned between output waveguide 32 and output waveguide load 33 and middle block 2 have for by opening two-in-one for signal, this opening is positioned at the middle part of output waveguide 32 and output waveguide load 33, and output waveguide 32 and output waveguide load 33 form output waveguide H face power combiner 27 by this opening.
As shown in Fig. 1,2,6,7,10, be provided with two between upper piecemeal 1 and middle block 2 and independently go up radio frequency link installation cavity 21 separately, upper radio frequency link installation cavity 21 and between input waveguide 30 and output waveguide load 33, input waveguide 30 exports T-shaped knot 28 by one-to-two and to pass to mutually with two upper radio frequency link installation cavitys 21 a road signal is divided into two paths of signals, and two upper radio frequency link installation cavitys 21 are tied 29 by two-in-one input T-shaped and to be passed to mutually with output waveguide load 33 two road signals are combined into a road signal; Be provided with two between middle block and lower piecemeal and independently descend radio frequency link installation cavity 23 separately, lower radio frequency link installation cavity 23 is between input waveguide load 31 and output waveguide 33, input waveguide load 31 to be passed to mutually with two lower radio frequency link installation cavitys 23 by one-to-two input T-shaped knot 28 and a road signal is divided into two paths of signals, two lower radio frequency link installation cavitys 23 pass to two signal He Wei mono-road, road signals by two-in-one output T-shaped knot 29 with output waveguide 33 mutually, described input T-shaped knot 28 and export T-shaped tie 29 symmetrical become mirror image to distribute and the two structure is identical.
As shown in Fig. 1,2,4,8, two are equipped with a power amplifier chips in radio frequency link installation cavity 21 He in lower radio frequency link installation cavity 23, the both sides spun gold key of power amplifier chips and have microstrip probe, microstrip probe stretch into input T-shaped knot 28 and to export in T-shaped knot 29 and with input T-shaped tie 28 with export T-shaped and tie 29 and be coupled, microstrip probe is tied with input T-shaped and is formed input waveguide microstrip transition, microstrip probe is tied to be formed with output T-shaped and is exported micro-band waveguide transition, and wherein Waveguide-microbelt structure 18 is all reciprocal structure mutually with micro-band waveguide transition structure 19 structure;
As shown in Figure 4, Figure 5, the power amplifier chips arranged in described upper radio frequency link installation cavity 21 is connected with upper piecemeal 1, and the power amplifier chips arranged in lower radio frequency link installation cavity 23 is connected with lower piecemeal 3.
As shown in Figure 9, opposing two faces of upper piecemeal 1 and lower piecemeal 3 are respectively provided with an amplifier power supply plate 24; Amplifier power supply plate 24, for completing the power supply of power single-chip, two faces that described upper piecemeal 1 is opposing with lower piecemeal 3 is respectively provided with an amplifier power supply plate 24; Amplifier power supply plate on upper piecemeal 1 is connected with the power amplifier chips in upper radio frequency link installation cavity 21 with by insulator, and the amplifier power supply plate on lower piecemeal 3 is connected with the power amplifier chips in lower radio frequency link installation cavity 23 by insulator.
For ensureing signal transmission effect, described Waveguide-microbelt transition is made up of quartz medium substrate microstrip probe.
Power amplifier chips is also provided with multiple bypass filter capacitor for eliminating power supply disturbance.
For ensureing in described input waveguide 30, output waveguide 32, input waveguide load 31 and output waveguide load 33 all with the ladder boss for realizing impedance matching.
Amplifier power supply plate of the present invention and power chip are distributed in different aspects, then are undertaken interconnected by insulator, improve the Electro Magnetic Compatibility of power combiner, ensure that stability and the reliability of power combiner.
The concise and to the point operation principle of the present invention is as follows:
As shown in Figure 8, input signal is fed into waveguide from rectangular input waveguides mouth 12, and after waveguide H face splitter 26, power-sharing is two, then through waveguide T junction splitter 28, power-sharing is four parts; After four power chips amplify, export waveguide to, carry out space power synthesis in waveguide by the output T-shaped knot 29 of cascade, output waveguide H face power combiner 27, the power after synthesis exports at waveguide outlet 14; The phase 90 ° of branch road between waveguide H face splitter 26 and waveguide H face mixer 27, waveguide load entrance 13 and waveguide load outlet 15 connect matched waveguide load or install microwave absorbing material provides about-20dB isolation for two power combiners, and whole like this module just constitutes a balance amplifier; The stability that namely balance amplifier improves amplifier operation which in turn improves the standing wave at power model input waveguide mouth 12, output waveguide mouth 14 place.
As shown in Figure 9, module for power supply plate 30 is connected with amplifier power supply plate 24,25, for whole module is powered; The side relative with module for power supply plate 30 is the radiating surface of module, and such structure had not only been conducive to integrated but also had been conducive to the heat radiation of power amplifier module.
Claims (6)
1. a spatial power combiner in the waveguide of Ka frequency range, comprises three the upper piecemeals (1) be arranged in parallel successively from top to bottom, middle piecemeal (2) and lower piecemeals (3); Described upper piecemeal (1) and middle piecemeal (2) fasten to be formed between the latter two complete and communicate with external environment condition and the input waveguide (30) be connected successively, two independently go up radio frequency link installation cavity (21), output waveguide load (33), described middle piecemeal (2) and lower piecemeal (3) fasten to be formed between the latter two complete and communicate with external environment condition and the input waveguide load (31) be connected successively, two independently descend radio frequency link installation cavity (23), output waveguide (32), it is characterized in that:
Described input waveguide (30) communicates with input waveguide load (31) and forms power combiner (26) Yi Jiang mono-road, input waveguide H face signal and be assigned as multichannel, and described output waveguide (32) communicates with output waveguide load (33) and forms output waveguide H face power combiner (27) so that multiple signals are combined into a road;
Input waveguide (30) independently go up radio frequency link installation cavity (21) the Yi Jiang mono-road signal that is connected by one-to-two input T-shaped knot (28) is divided into two paths of signals with two, independently goes up radio frequency link installation cavity (21) for two and ties (29) by two-in-one output T-shaped and output waveguide (32) is connected two paths of signals to be combined into a road signal;
Input waveguide load (31) independently descend radio frequency link installation cavity (23) the Yi Jiang mono-road signal that is connected to be divided into two paths of signals by one-to-two input T-shaped knot (28) and two, and two are independently descended radio frequency link installation cavity (23) to tie (29) by two-in-one output T-shaped and output waveguide (32) is connected two paths of signals to be combined into a road signal;
Radio frequency link installation cavity (21) neutralizes in each lower radio frequency link installation cavity (23) and is equipped with microstrip probe and power amplifier chips on each, microstrip probe and power amplifier chips are linked by gold wire bonding, microstrip probe is arranged on power amplifier chips both sides and input, exports T-shaped and tie (28,29) middle phase coupling with extending to respectively, microstrip probe is tied with input T-shaped and is formed input waveguide microstrip transition (18), and microstrip probe is tied to be formed with output T-shaped and exported micro-band waveguide transition (19).
2. spatial power combiner in a kind of Ka frequency range according to claim 1 waveguide, is characterized in that: described upper piecemeal (1), middle block (2) and lower piecemeal (3) are located by pin and utilized together with screw fastening.
3. spatial power combiner in a kind of Ka frequency range according to claim 1 waveguide, it is characterized in that: the power amplifier chips arranged in described upper radio frequency link installation cavity (21) is connected with upper piecemeal (1), the power amplifier chips arranged in lower radio frequency link installation cavity (23) is connected with lower piecemeal (3).
4. spatial power combiner in a kind of Ka frequency range according to claim 1 waveguide, is characterized in that: two faces that described upper piecemeal (1) is opposing with lower piecemeal (3) are respectively provided with an amplifier power supply plate (24); Amplifier power supply plate on upper piecemeal (1) is connected with the power amplifier chips in upper radio frequency link installation cavity (21) with by insulator, and the amplifier power supply plate on lower piecemeal (3) is connected with the power amplifier chips in lower radio frequency link installation cavity (23) by insulator with lower piecemeal (3).
5. spatial power combiner in a kind of Ka frequency range according to claim 1 waveguide, is characterized in that: described Waveguide-microbelt transition (18) and micro-band waveguide transition (19) are all made up of quartz medium substrate microstrip probe.
6. spatial power combiner in a kind of Ka frequency range according to claim 1 waveguide, is characterized in that: all with the ladder boss for realizing impedance matching in described input waveguide (30), output waveguide (32), input waveguide load (31) and output waveguide load (33).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201511002839.XA CN105552503B (en) | 2015-12-29 | 2015-12-29 | Spatial power combiner in a kind of Ka frequency ranges waveguide |
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| CN201511002839.XA CN105552503B (en) | 2015-12-29 | 2015-12-29 | Spatial power combiner in a kind of Ka frequency ranges waveguide |
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| CN105552503A true CN105552503A (en) | 2016-05-04 |
| CN105552503B CN105552503B (en) | 2018-02-06 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106711559A (en) * | 2016-11-18 | 2017-05-24 | 北京空间飞行器总体设计部 | Sandwich type waveguide diplexer |
| CN113098413A (en) * | 2021-03-31 | 2021-07-09 | 绵阳天赫微波科技有限公司 | Power amplifier for 6-18GHz frequency band radio frequency signals and power amplification method thereof |
| CN114976560A (en) * | 2022-06-29 | 2022-08-30 | 广东大湾区空天信息研究院 | Power amplifier for millimeter wave or terahertz |
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| US5736908A (en) * | 1996-06-19 | 1998-04-07 | The Regents Of The University Of California | Waveguide-based spatial power combining array and method for using the same |
| CN103247842A (en) * | 2013-05-20 | 2013-08-14 | 成都雷电微力科技有限公司 | Power combining module |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106711559A (en) * | 2016-11-18 | 2017-05-24 | 北京空间飞行器总体设计部 | Sandwich type waveguide diplexer |
| CN113098413A (en) * | 2021-03-31 | 2021-07-09 | 绵阳天赫微波科技有限公司 | Power amplifier for 6-18GHz frequency band radio frequency signals and power amplification method thereof |
| CN114976560A (en) * | 2022-06-29 | 2022-08-30 | 广东大湾区空天信息研究院 | Power amplifier for millimeter wave or terahertz |
| CN114976560B (en) * | 2022-06-29 | 2023-12-26 | 广东大湾区空天信息研究院 | Power amplifying device for millimeter wave or terahertz |
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