CN205264757U - 陶瓷基板led灯丝 - Google Patents
陶瓷基板led灯丝 Download PDFInfo
- Publication number
- CN205264757U CN205264757U CN201521130496.0U CN201521130496U CN205264757U CN 205264757 U CN205264757 U CN 205264757U CN 201521130496 U CN201521130496 U CN 201521130496U CN 205264757 U CN205264757 U CN 205264757U
- Authority
- CN
- China
- Prior art keywords
- led filament
- metal layer
- crystalline ceramics
- negative pole
- transparent ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 54
- 239000000919 ceramic Substances 0.000 title claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 50
- 239000002184 metal Substances 0.000 claims abstract description 50
- 239000011222 crystalline ceramic Substances 0.000 claims description 34
- 229910002106 crystalline ceramic Inorganic materials 0.000 claims description 34
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 abstract description 4
- 229910052594 sapphire Inorganic materials 0.000 abstract description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Led Devices (AREA)
Abstract
一种陶瓷基板LED灯丝,包括透明陶瓷基板、正极金属层、负极金属层,所述正极金属层、负极金属层设于透明陶瓷基板两端,所述透明陶瓷基板表面设有晶片,所述晶片之间、晶片与金属层之间均通过金属线连接,所述透明陶瓷基板固晶的一面封装有荧光粉介质层,所述透明陶瓷基板对应正极金属层的一侧设有用于识别正极金属层的防呆部。本实用新型采用透明陶瓷基板,透明陶瓷板具有导热系数高、热膨胀系数低、耐高温、透光率高等优点,提高了LED灯丝的散热性,同时保证了LED灯丝的使用寿命;与蓝宝石相比,陶瓷基板在保证寿命的同时,大大降低了成本;本实用新型透明陶瓷基板还设有防呆部,有利于识别正、负极,防止接线时把正、负极接错。
Description
技术领域
本实用新型涉及LED领域,尤指一种陶瓷基板LED灯丝。
背景技术
传统照明灯具的灯丝一般由钨丝等可直接发光的金属丝构成,这类灯丝普遍存在着寿命短、功耗大等缺陷,且一般仅能发出黄色光,显色性较差,这些光源都是平面发光形式,光源发光角度都在120-140°之间,发光角度上无法实现大角度的发光。LED灯丝是一种用于替代传统照明灯具的灯丝(如钨丝灯),以往LED光源要达到一定的光照度和光照面积,需加装透镜之类的光学器件,影响光照效果,会降低LED应有的节能功效,LED灯丝实现360°全角度发光,大角度发光且不需加透镜,实现立体光源,带来前所未有的照明体验。而现有使用玻璃基板制作的LED灯丝产品的散热效果差,缩短使用寿命,而蓝宝石基板制作的LED灯丝产品则大大提高了LED灯丝的成本。
实用新型内容
为解决上述问题,本实用新型提供一种散热性好、成本低、性能好的陶瓷基板LED灯丝。
为实现上述目的,本实用新型采用的技术方案是:一种陶瓷基板LED灯丝,包括透明陶瓷基板、正极金属层、负极金属层,所述正极金属层、负极金属层设于透明陶瓷基板两端,所述透明陶瓷基板表面设有晶片,所述晶片之间、晶片与金属层之间均通过金属线连接,所述透明陶瓷基板固晶的一面封装有荧光粉介质层,所述透明陶瓷基板对应正极金属层的一侧设有用于识别正极金属层的防呆部。
具体地,所述正极金属层、负极金属层均为银层或银钯合金层。
具体地,所述相邻的晶片之间的连接采用串联方式或并联方式。
具体地,所述透明陶瓷基板为氧化铝99.5%以上的透明陶瓷基板。
具体地,所述正极金属层、负极金属层分别烧结于透明陶瓷基板的上表面。
本实用新型的有益效果在于:本实用新型采用透明陶瓷基板,透明陶瓷板具有导热系数高、热膨胀系数低、耐高温、透光率高等优点,提高了LED灯丝的散热性,同时保证了LED灯丝的使用寿命;与蓝宝石相比,陶瓷基板在保证寿命的同时,大大降低了成本;本实用新型透明陶瓷基板还设有防呆部,有利于识别正、负极,防止接线时把正、负极接错。
附图说明
图1是陶瓷基板LED灯丝的正面示意图。
图2是陶瓷基板LED灯丝的剖面示意图。
附图标号说明:1.透明陶瓷基板;2.正极金属层;3.负极金属层;4.晶片;5.金属线;6.防呆部。
具体实施方式
请参阅图1-2所示,本实用新型关于一种陶瓷基板LED灯丝,包括透明陶瓷基板1、正极金属层2、负极金属层3,所述正极金属层2、负极金属层3设于透明陶瓷基板1两端,所述透明陶瓷基板1表面设有晶片4,所述晶片4之间、晶片4与金属层之间均通过金属线5连接,所述透明陶瓷基板1固晶的一面封装有荧光粉介质层,所述透明陶瓷基板1对应正极金属层2的一侧设有用于识别正极金属层2的防呆部6。
与现有技术相比,本实用新型采用透明陶瓷基板1,透明陶瓷基板1具有导热系数高、热膨胀系数低、耐高温、透光率高等优点,提高了LED灯丝的散热性,同时保证了LED灯丝的使用寿命;与蓝宝石相比,使用透明陶瓷基板1在保证寿命的同时,还大大降低了成本;本实用新型透明陶瓷基板1还设有防呆部6,有利于识别正、负极,防止接线时把正、负极接错。
具体地,所述正极金属层2、负极金属层3均为银层或银钯合金层。
具体地,所述相邻的晶片4之间的连接采用串联方式或并联方式。
具体地,所述透明陶瓷基板1为氧化铝99.5%以上的透明陶瓷基板1。
具体地,所述正极金属层2、负极金属层3分别烧结于透明陶瓷基板1的上表面。
下面通过具体实施例对本实用新型作进一步的说明。
本具体实施例采用透明陶瓷基板,提高了LED灯丝的散热性,有效保证LED灯丝的使用寿命,同时有利于实现LED灯丝的360°全角度发光;正极金属层2、负极金属层3设于透明陶瓷基板1两端,其中正极金属层2一侧设有防呆部6,有利于区分正、负电极,而且该设置结构简单、不需增加额外的设计成本,能有效防止接线时接错正、负电极。而且设有晶片4的基板1表面上设有荧光粉介质层,其中荧光粉介质层由单种或两种或多种荧光粉与硅胶或其他介质混合而成,基板1单侧设有荧光粉介质层,更有利于散热。
以上实施方式仅仅是对本实用新型的优选实施方式进行描述,并非对本实用新型的范围进行限定,在不脱离本实用新型设计精神的前提下,本领域普通工程技术人员对本实用新型的技术方案作出的各种变形和改进,均应落入本实用新型的权利要求书确定的保护范围内。
Claims (5)
1.一种陶瓷基板LED灯丝,其特征在于:包括透明陶瓷基板、正极金属层、负极金属层,所述正极金属层、负极金属层设于透明陶瓷基板两端,所述透明陶瓷基板表面设有晶片,所述晶片之间、晶片与金属层之间均通过金属线连接,所述透明陶瓷基板固晶的一面封装有荧光粉介质层,所述透明陶瓷基板对应正极金属层的一侧设有用于识别正极金属层的防呆部。
2.根据权利要求1所述的一种陶瓷基板LED灯丝,其特征在于:所述正极金属层、负极金属层均为银层或银钯合金层。
3.根据权利要求1所述的一种陶瓷基板LED灯丝,其特征在于:所述相邻的晶片之间的连接采用串联方式或并联方式。
4.根据权利要求1所述的一种陶瓷基板LED灯丝,其特征在于:所述透明陶瓷基板为氧化铝99.5%以上的透明陶瓷基板。
5.根据权利要求1所述的一种陶瓷基板LED灯丝,其特征在于:所述正极金属层、负极金属层分别烧结于透明陶瓷基板的上表面。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201521130496.0U CN205264757U (zh) | 2015-12-30 | 2015-12-30 | 陶瓷基板led灯丝 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201521130496.0U CN205264757U (zh) | 2015-12-30 | 2015-12-30 | 陶瓷基板led灯丝 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205264757U true CN205264757U (zh) | 2016-05-25 |
Family
ID=56006266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201521130496.0U Expired - Fee Related CN205264757U (zh) | 2015-12-30 | 2015-12-30 | 陶瓷基板led灯丝 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN205264757U (zh) |
-
2015
- 2015-12-30 CN CN201521130496.0U patent/CN205264757U/zh not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN203907265U (zh) | 一种led球泡灯 | |
CN101566323B (zh) | 管型基元led和由管型基元led组成的照明装置 | |
CN203309554U (zh) | 一种全方位出光的led照明灯 | |
CN205264758U (zh) | 高散热性led灯丝 | |
CN105822909A (zh) | 紫外灯丝灯 | |
CN202972633U (zh) | 利用透明陶瓷cob基板实现全方位led照明的封装结构 | |
CN103867947A (zh) | 一种led球泡灯 | |
CN202048418U (zh) | Led日光灯管 | |
CN205264757U (zh) | 陶瓷基板led灯丝 | |
CN204062595U (zh) | 一种led灯具 | |
CN202056682U (zh) | 一种提高光效的led模组 | |
CN205299106U (zh) | 一种led灯 | |
CN204062597U (zh) | 一种led光源发光散热结构 | |
CN204227119U (zh) | 一种led灯丝 | |
CN203812909U (zh) | Led灯丝透明陶瓷基板 | |
CN202561515U (zh) | 一种具有360度发光效果的led灯 | |
CN203202675U (zh) | 一种led灯泡 | |
CN201973495U (zh) | 一种led光源结构 | |
CN202469579U (zh) | 双面出光平面薄片式led灯 | |
CN203215377U (zh) | 一种多发光体的led筒灯结构 | |
CN206694870U (zh) | 一种高光效的led灯丝灯 | |
CN201265813Y (zh) | 一种led照明灯 | |
CN206505946U (zh) | 一种高光效的led光源 | |
CN202901966U (zh) | 一种led灯具 | |
CN204240107U (zh) | 一种高散热性led灯丝球泡灯 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170607 Address after: Baoan District Xixiang street Shenzhen city Guangdong province 518000 Nanchang community port channel beside the oyster industry logistics park A Building 5 floor (gate 2) Patentee after: SHENZHEN LIANSHANG PHOTOELECTRIC CO.,LTD. Address before: Ssangyong Village second 417600 Lang Xinhua County of Hunan Province Town Village Group No. 008 Patentee before: Dai Peng |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160525 |