CN205112120U - Mould is cut to multi -wire saw silicon chip - Google Patents
Mould is cut to multi -wire saw silicon chip Download PDFInfo
- Publication number
- CN205112120U CN205112120U CN201520813369.4U CN201520813369U CN205112120U CN 205112120 U CN205112120 U CN 205112120U CN 201520813369 U CN201520813369 U CN 201520813369U CN 205112120 U CN205112120 U CN 205112120U
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- China
- Prior art keywords
- silicon chip
- mould
- cut
- cutting machine
- line cutting
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 65
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 65
- 239000010703 silicon Substances 0.000 title claims abstract description 65
- 238000005520 cutting process Methods 0.000 claims description 38
- 238000009413 insulation Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 230000001186 cumulative effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model provides a mould is cut to multi -wire saw silicon chip, including two blocks of parallel curb plates with set up two blocks of parallel connection boards between the board of both sides, the cuboid structure of curb plate and parallel connection hoarding one -tenth opening about in the of, the inboard evenly distributed of curb plate has a plurality of recesses, and the recess one -to -one on two blocks of parallel curb plates, the width of recess is used for fixing with to wait to cut the silicon chip width unanimous wait to cut the silicon chip. The utility model discloses an it has the direction and extends the design and can promote multi -wire saw and go into the sword precision to cut mould upper end, the precision that bonds can be guaranteed better to the resin strip space structure of lower extreme.
Description
Technical field
The utility model relates to multi-wire saw and divides section field, specifically a kind of multi-line cutting machine by cutting silicon wafer again by the Design of Dies of multiple silicon chip radially cutting method.
Background technology
Current market, super large-scale integration great majority Czochralski silicon wafer is as backing material, the ever-larger diameters of silicon chip and high surface smoothness are the Main way that it develops, and multi-wire saw technology has greater advantage in raising evenness of silicon wafer and surface geometry parameter compared with miscellaneous equipment (inside diameter slicer etc.).In multi-wire saw, cut into certain thickness silicon chip by multi-line cutting machine is disposable in the past, thus realize the batch cutting of silicon chip.And in actual applications, need a large amount of silicon chip again to cut to be divided into two, to adapt to the specific use of silicon chip, this is difficult to realize in current multi-wire saw technology.
Utility model content
In view of this, the utility model is intended to propose a kind of multi-line cutting machine silicon chip and cuts mould, to solve prior art Problems existing.
For achieving the above object, the technical solution of the utility model is achieved in that
A kind of multi-line cutting machine silicon chip cuts mould, described silicon chip is cut mould and is comprised two pieces of parallel side plates and be arranged at two pieces of parallel attachment plates between biside plate, described side plate and described parallel attachment plates surround about one rectangular structure opened, the inner side of described side plate is evenly distributed with some grooves, and the groove one_to_one corresponding on two pieces of parallel side plates, the width of described groove is consistent with silicon chip width to be cut, for fixing described silicon chip to be cut.
Further, the cross section of described connecting plate is " H " shape structure.
Further, height h=silicon chip diameter+(2-3) mm of described mould.
Further, described mould inner groovy gap width L=silicon wafer thickness+(1-2) mm.
Further, described side plate and described connecting plate are insulation board.
Relative to prior art, multi-line cutting machine silicon chip described in the utility model is cut mould and is had following advantage:
For better the front precision of silicon chip cutting is cut in location, while ensureing bonding 90 ° of silicon chip, mould adopts between silicon chip and is separated fixed form, this mode can avoid silicon chip to merge the cumulative errors produced, and simultaneously mould upper end of cutting of the present utility model has guiding extending design and can promote multi-line cutting machine and enter cutter precision; The resin streak gap structure of lower end can ensure adhesive reinforcement better.The one-piece machine member of bonding this structure of employing is fixed on multi-line cutting machine, adopt two centering modes of the gauze gap of the groove gap alignment cutting steel wire of this mould, silicon chip locating slot aligning line of cut, thin silicon wafer thickness being less than 1-2mm carries out the cutting that is divided into two, and cuts rear silicon chip TTV and thickness scattered error and a cutting silicon wafer very nearly the same.
Accompanying drawing explanation
The accompanying drawing forming a part of the present utility model is used to provide further understanding of the present utility model, and schematic description and description of the present utility model, for explaining the utility model, is not formed improper restriction of the present utility model.In the accompanying drawings:
Fig. 1 cuts the perspective view of mould for the multi-line cutting machine silicon chip described in the utility model embodiment;
Fig. 2 cuts the left view of mould for the multi-line cutting machine silicon chip described in the utility model embodiment;
Fig. 3 cuts the using state figure of mould for the multi-line cutting machine silicon chip described in the utility model embodiment;
Fig. 4 cuts the working state schematic representation of mould for the multi-line cutting machine silicon chip described in the utility model embodiment.
Detailed description of the invention
It should be noted that, when not conflicting, the embodiment in the utility model and the feature in embodiment can combine mutually.
Below with reference to the accompanying drawings and describe the utility model in detail in conjunction with the embodiments.
A kind of multi-line cutting machine silicon chip cuts mould, as illustrated in fig. 1 and 2, described silicon chip is cut mould 2 and is comprised two pieces of parallel side plates 21 and be arranged at two pieces of parallel attachment plates 22 between biside plate, described side plate 21 surrounds about one rectangular structure opened with described parallel attachment plates 22, the inner side of described side plate 21 is evenly distributed with some grooves 1, and groove 1 one_to_one corresponding on two pieces of parallel side plates, the width of described groove 1 is consistent with silicon chip 3 width to be cut, for fixing described silicon chip 3 to be cut.
Described top of cutting mould possesses the progradation of silicon chip guiding, particularly, the cross section of described connecting plate 22 is " H " shape structure, and this structure can ensure that the effect of guiding extension can be played for cutting steel wire in the upper end of mould 2, can promote multi-line cutting machine and enter cutter precision.
Meanwhile, in order to better fix silicon chip 3 to be cut, height h=silicon chip diameter+(2-3) mm of described mould 2; Described mould 2 inner groovy gap width L=silicon wafer thickness+(1-2) mm.
In order to prevent the destruction for silicon chip performance in cutting process, described side plate and described connecting plate are insulation board.
As shown in Figure 3,4, multi-line cutting machine silicon chip of the present utility model cut the duty of mould and process as follows:
To treat that silicon chip is upwards placed in this utility model mould 2 by the locating slot of the silicon chip 3 of secondary cut, and fix formation one-piece machine member with glue, then one-piece machine member is bonded on resin streak 4 and completes silicon chip integral adhesive to be cut.For better the front precision of silicon chip cutting is cut in location, while ensureing bonding 90 ° of silicon chip, mould adopts between silicon chip and is separated fixed form, this mode can avoid silicon chip to merge the cumulative errors produced, and simultaneously mould upper end of cutting of the present utility model has guiding extending design and can promote multi-line cutting machine and enter cutter precision; Resin streak 4 gap structure of lower end can ensure adhesive reinforcement better.The one-piece machine member of bonding this structure of employing is fixed on the material seat 5 of multi-line cutting machine, adopt two centering modes of the gauze gap of the groove gap alignment cutting steel wire 6 of this mould, silicon chip locating slot aligning line of cut, thin silicon wafer thickness being less than 1-2mm carries out the cutting that is divided into two, and cuts rear silicon chip TTV and thickness scattered error and a cutting silicon wafer very nearly the same.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.
Claims (5)
1. a multi-line cutting machine silicon chip cuts mould, it is characterized in that: described silicon chip is cut mould and comprised two pieces of parallel side plates and be arranged at two pieces of parallel attachment plates between biside plate, described side plate and described parallel attachment plates surround about one rectangular structure opened, the inner side of described side plate is evenly distributed with some grooves, and the groove one_to_one corresponding on two pieces of parallel side plates, the width of described groove is consistent with silicon chip width to be cut, for fixing described silicon chip to be cut.
2. multi-line cutting machine silicon chip according to claim 1 cuts mould, it is characterized in that: the cross section of described connecting plate is " H " shape structure.
3. multi-line cutting machine silicon chip according to claim 1 cuts mould, it is characterized in that: height h=silicon chip diameter+(2-3) mm of described mould.
4. the multi-line cutting machine silicon chip according to any one of claim 1-3 cuts mould, it is characterized in that: described mould inner groovy gap width L=silicon wafer thickness+(1-2) mm.
5. multi-line cutting machine silicon chip according to claim 1 cuts mould, it is characterized in that: described side plate and described connecting plate are insulation board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520813369.4U CN205112120U (en) | 2015-10-19 | 2015-10-19 | Mould is cut to multi -wire saw silicon chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520813369.4U CN205112120U (en) | 2015-10-19 | 2015-10-19 | Mould is cut to multi -wire saw silicon chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205112120U true CN205112120U (en) | 2016-03-30 |
Family
ID=55567764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520813369.4U Active CN205112120U (en) | 2015-10-19 | 2015-10-19 | Mould is cut to multi -wire saw silicon chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205112120U (en) |
-
2015
- 2015-10-19 CN CN201520813369.4U patent/CN205112120U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181029 Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Address before: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Park (outside the ring) Hai Tai Road 12 Patentee before: TIANJIN HUANOU SEMICONDUCTOR MATERIAL TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191217 Address after: 214200 Dongfen Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Co-patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Patentee after: Zhonghuan leading semiconductor materials Co.,Ltd. Address before: 300384 in Tianjin Binhai high tech Zone Huayuan Industrial Zone (outer ring) Haitai Road No. 12 Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CP03 | Change of name, title or address |
Address after: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Country or region after: China Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Address before: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. Country or region before: China Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address |