CN205097377U - It collapses glass on limit to reduce silico briquette cutting - Google Patents

It collapses glass on limit to reduce silico briquette cutting Download PDF

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Publication number
CN205097377U
CN205097377U CN201520839376.1U CN201520839376U CN205097377U CN 205097377 U CN205097377 U CN 205097377U CN 201520839376 U CN201520839376 U CN 201520839376U CN 205097377 U CN205097377 U CN 205097377U
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CN
China
Prior art keywords
glass
silico briquette
limit
cutting
collapsed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn - After Issue
Application number
CN201520839376.1U
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Chinese (zh)
Inventor
王辉
王丙宽
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Tianjin Yingli New Energy Resource Co Ltd
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Tianjin Yingli New Energy Resource Co Ltd
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Priority to CN201520839376.1U priority Critical patent/CN205097377U/en
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Abstract

The utility model provides an it collapses glass on limit to reduce silico briquette cutting, including the glass body, its characterized in that: at least one of glass body has a plurality of recesses on the surface, the thickness D1 of glass body is 8mm -15mm, the degree of depth D2 of recess is 60um -150um, the separation W of recess is 60um -150um.

Description

A kind ofly reduce silico briquette cutting and collapse the glass on limit
Technical field
The utility model relates to silicon chip cutting field, particularly relates to a kind ofly to reduce silico briquette cutting and collapse the glass on limit.
Background technology
In current polysilicon chip cutting link, first can carry out polishing to silico briquette surface after broken ingot, increase case hardness and then cut.Steel wire is generally used to drive mortar to complete whole cutting process to silico briquette grinding in cutting process.Mortar adds cutting liquid by carborundum and forms, and wherein carborundum carries out grinding as abrasive material to silico briquette and completes cutting.Aborning generally use epoxide-resin glue silico briquette is bonding with glass, bonding complete after bondline thickness very thin, generally at about 0.2mm.Present cutting process generally uses steel wire unidirectional (from left to right or right-to-left) cutting, and the cut surface of silico briquette is generally the square of 156mm*156mm.When cutting to silico briquette bottommost, because bondline thickness is very thin, and silicon-carbide particle is near completion so the cutting power of carborundum declines obviously due to cutting process.Be equivalent to steel wire in the moment of cutting silico briquette because glue-line is thinner and directly cut silico briquette and glass, due to both hardness very close to and be plane, under the cushioning effect losing glue-line, due to unidirectional cutting, mortar containing carborundum can strengthen gradually from losing unidirectional cutting process, cause outgoing line side mortar amount few, thus cause bottom collapse limit, affect the cut quality of silicon chip.
So how providing a kind of and reduce silico briquette cutting and collapse the glass on limit, overcome many disadvantages of the prior art, is current those skilled in the art technical problems urgently to be resolved hurrily.
Utility model content
In view of this, the utility model provides and a kind ofly reduces silico briquette cutting and collapse the glass on limit, and solve problems of the prior art, concrete scheme is as follows:
A kind ofly reduce silico briquette cutting and collapse the glass on limit, comprise glass body, it is characterized in that: at least one of described glass body, there are some grooves on the surface, the thickness D1 of described glass body is 8mm-15mm, the degree of depth D2 of described groove is 60um-150um, and the separation W of described groove is 60um-150um.
Preferably, the shape of cross section of described groove is triangle.
Preferably, the shape of cross section of described groove is trapezoidal.
Preferably, the shape of cross section of described groove is U-shaped.
Preferably, the thickness D1 of described glass body is 12mm.
Preferably, the length of described glass body is 520mm, and width is 126mm.
Preferably, the size of described groove is consistent with guided wheel slot.
The glass on limit is collapsed in the minimizing silico briquette cutting that the utility model provides, there is following beneficial effect: on glass, increase groove, cutting is finished up more steady, the quantum of output of limit silicon chip is collapsed when decreasing cutting, reduce the consumption of cutting liquid to a certain extent, improve cut quality, reduce cutting cost.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to accompanying drawing required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 reduces the top view that the glass on limit is collapsed in silico briquette cutting;
Fig. 2 reduces the side view that the glass on limit is collapsed in silico briquette cutting;
Fig. 3 is groove cross section shape A partial enlarged drawing when being triangle;
Fig. 4 is groove cross section shape A partial enlarged drawing when being trapezoidal;
Fig. 5 is groove cross section shape A partial enlarged drawing when being U-shaped;
In figure: 1, glass body 2, groove
Detailed description of the invention
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
The glass on limit is collapsed in the minimizing silico briquette cutting seeing figures.1.and.2 shown, comprise glass body 1, in at least one of described glass body 1, there are some grooves 2 on the surface, the thickness D1 of described glass body 1 is 8mm-15mm, the degree of depth D2 of described groove 2 is 60um-150um, and the separation W of described groove 2 is 60um-150um.
Vitreum 1 surface is increased the groove 2 of certain depth, when steel wire to cut to bottom silico briquette with glass junction (i.e. glue-line), due to vitreum 1 surface band fluted 2, be equivalent to bondline thickness increase, because glue-line hardness is far low with silico briquette or the hardness of glass, and while there is certain elasticity, certain cushioning effect can be had, easily cut through glue-line when the steel wire with mortar cuts to glue-line.And first can cut to glue-line owing to cutting to after bottom silico briquette, decrease the contact of glass and silico briquette, thus reduce the generation of collapsing limit silicon chip.And the requirement of this cutting to mortar cutting power simultaneously also decreases, thus can reduce the use amount of mortar, reaches the object reduced costs.
See Fig. 3, preferred as the present embodiment, the shape of cross section of described groove 2 is triangle.
See Fig. 4, preferred as another of the present embodiment, the shape of cross section of described groove 2 is trapezoidal.
See Fig. 5, preferred as another of the present embodiment, the shape of cross section of described groove 2 is U-shaped.
Concrete, the thickness D1 of described glass body 1 is 12mm.
Concrete, the length of described glass body 1 is 520mm, and width is 126mm.
Concrete, unanimously, when can ensure to cut, steel wire does not offset smoothly in groove 2, ensures the vertical angle of steel wire when cutting for the size of described groove 2 and guided wheel slot (steel wire supporting body, not shown), thus the chance of limit silicon chip generation is collapsed in reduction further.

Claims (7)

1. one kind is reduced the glass that limit is collapsed in silico briquette cutting, comprise glass body, it is characterized in that: at least one of described glass body, there are some grooves on the surface, the thickness D1 of described glass body is 8mm-15mm, the degree of depth D2 of described groove is 60um-150um, and the separation W of described groove is 60um-150um.
2. the glass on limit is collapsed in minimizing silico briquette cutting according to claim 1, it is characterized in that: the shape of cross section of described groove is triangle.
3. the glass on limit is collapsed in minimizing silico briquette cutting according to claim 1, it is characterized in that: the shape of cross section of described groove is trapezoidal.
4. the glass on limit is collapsed in minimizing silico briquette cutting according to claim 1, it is characterized in that: the shape of cross section of described groove is U-shaped.
5. the glass on limit is collapsed in the minimizing silico briquette cutting according to any one of claim 1-4, it is characterized in that: the thickness D1 of described glass body is 12mm.
6. the glass on limit is collapsed in minimizing silico briquette cutting according to claim 5, it is characterized in that: the length of described glass body is 520mm, and width is 126mm.
7. the glass on limit is collapsed in minimizing silico briquette cutting according to claim 1, it is characterized in that: the size of described groove is consistent with guided wheel slot.
CN201520839376.1U 2015-10-27 2015-10-27 It collapses glass on limit to reduce silico briquette cutting Withdrawn - After Issue CN205097377U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520839376.1U CN205097377U (en) 2015-10-27 2015-10-27 It collapses glass on limit to reduce silico briquette cutting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520839376.1U CN205097377U (en) 2015-10-27 2015-10-27 It collapses glass on limit to reduce silico briquette cutting

Publications (1)

Publication Number Publication Date
CN205097377U true CN205097377U (en) 2016-03-23

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Application Number Title Priority Date Filing Date
CN201520839376.1U Withdrawn - After Issue CN205097377U (en) 2015-10-27 2015-10-27 It collapses glass on limit to reduce silico briquette cutting

Country Status (1)

Country Link
CN (1) CN205097377U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105150397A (en) * 2015-10-27 2015-12-16 天津英利新能源有限公司 Glass capable of reducing edge breakage of silicon block cutting and splicing technology

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105150397A (en) * 2015-10-27 2015-12-16 天津英利新能源有限公司 Glass capable of reducing edge breakage of silicon block cutting and splicing technology

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AV01 Patent right actively abandoned
AV01 Patent right actively abandoned

Granted publication date: 20160323

Effective date of abandoning: 20170606