CN205081115U - Novel wire jumper of diode module - Google Patents
Novel wire jumper of diode module Download PDFInfo
- Publication number
- CN205081115U CN205081115U CN201520896968.7U CN201520896968U CN205081115U CN 205081115 U CN205081115 U CN 205081115U CN 201520896968 U CN201520896968 U CN 201520896968U CN 205081115 U CN205081115 U CN 205081115U
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- CN
- China
- Prior art keywords
- wire jumper
- operate portions
- work portion
- jumper
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4846—Connecting portions with multiple bonds on the same bonding area
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- Led Device Packages (AREA)
Abstract
Novel wire jumper of diode module. The utility model relates to an improvement to the proposition of wire jumper structure. The structure is exquisite, processing is convenient and stability is good. Including work portion no. 1, work portion no. 2 and work portion no. 3, work portion no. 1 and work portion are through main jumper connection between two, work portion no. 2 and work portion pass through vice jumper connection and work portion no. 2 and work portion no. 3 and all are connected with the chip between three. The arc makes, just all is to main wire jumper with vice wire jumper by aluminium. The present case is lower to each work portion and chip surface's required precision, require to see from processing, the structural morphology of present case requires not highly to the welding precision and the welding degree of consistency. Combine above -mentioned two points, effectively solved the drawback that exists promptly among the prior art under the prerequisite of having guaranteed the electrical property. Have stability good, electric excellent performance, low in cost on the whole and process convenient characteristics.
Description
Technical field
The utility model relates to the improvement proposed jumper wire construction.
Background technology
Diode (led) module, usually encapsulated by some base plates, some chips and some wire jumpers and form, add and usually chip positive pole is directly welded on a base plate man-hour, the connection of chip negative pole and another base plate is completed again by wire jumper, for the concrete structure of wire jumper, the portion " Novel jumper wire " by name that State Bureau announced on November 13rd, 2013, application number are the Chinese utility model patent of " 201320354536.4 ", wire jumper in this case is made up of the operate portions that two are connected as a single entity, and the operate portions be wherein connected with chip has larger area.
But people find when reality uses, because operate portions one and chip surface are that face contacts; Therefore, on the one hand, require higher to the surface smoothness of operate portions one and chip; On the other hand, require higher to the uniformity coefficient of welding; Once both appearance or one do not meet the demands, bring great impact just will to the electrical property of diode (led) module entirety.
Utility model content
The utility model, for above problem, proposes a kind of delicate structure, easy to process and good stability, under the prerequisite that ensure that good electrical property, significantly reduces the wire jumper of the Novel diode module of required precision and welding difficulty.
The technical solution of the utility model is: comprise operate portions one, operate portions two and operate portions three, connected by main wire jumper between described operate portions one and operate portions two, to be connected by secondary wire jumper between described operate portions two and operate portions three and operate portions two is all connected with chip with operate portions three.
Described main wire jumper and secondary wire jumper are each made of aluminum and all curved.
Described operate portions one, main wire jumper, operate portions two, secondary wire jumper, operate portions three are connected as a single entity successively.
Described operate portions one is welded with the base plate in diode (led) module, and described operate portions two, operate portions three are all welded with the negative pole of chip.
This case is from required precision, and this case instead of of the prior art the way of contact by operate portions two and operate portions 3 two positions and contacting of chip, lower to the required precision of each operate portions and chip surface; From processing request, the structural form of this case to welding precision and welding uniformity requirements not high.In conjunction with above-mentioned 2 points, under the prerequisite that ensure that electrical property, namely efficiently solve the drawback existed in prior art.There is feature that good stability, electrical property are excellent, cheap and easy to process on the whole.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model,
Fig. 2 is the vertical view of Fig. 1;
In figure, 1 is operate portions one, and 2 is operate portions two, and 3 is operate portions three, and 4 is main wire jumpers, and 5 is secondary wire jumpers, and 6 is base plates, and 7 is chips.
Embodiment
The utility model as shown in Figure 1-2, comprise operate portions 1, operate portions 22 and operate portions 33, connected by main wire jumper 4 between described operate portions 1 and operate portions 22, to be connected by secondary wire jumper 5 between described operate portions 22 and operate portions 33 and operate portions 22 is all connected with chip 7 with operate portions 33.Like this, in this case, the structural form of " two bar line " gets final product simple, the effective contact area ensureing wire jumper and chip negative pole, and the bonding strength promoted between wire jumper and chip, thus (because temperature is lower, the electric current passed through is larger with temperature rise significantly to reduce its VF value (forward voltage); Therefore temperature rise is lower, and electrical property is better), make diode (led) module entirety have better electrical property.
Described main wire jumper 4 and secondary wire jumper 5 are each made of aluminum and all curved.In addition, for ensureing electrical property in prior art, mostly use silver as the material of wire jumper, owing to employing the structural form of above-mentioned " double jump line " in this case, therefore use aluminium to replace silver, thus under the prerequisite that ensure that electrical property, significantly reduce manufacturing cost.
Following table 1 applies for artificially proving above-mentioned theory, the data obtained when actual measurement:
Table 1
As seen from the above table, by the linear formula of the double jump of this case, even if change wire jumper material into aluminium by silver, there is not excessive change in its electrical property after machining yet.
In sum, this case is under the prerequisite ensureing electrical property, significantly reduce the object of manufacturing cost, to the precision when required precision of each operate portions and chip, welding and uniformity, there is feature that good stability, electrical property are excellent, cheap and easy to process on the whole.
Described operate portions 1, main wire jumper 4, operate portions 22, secondary wire jumper 5, operate portions 33 are connected as a single entity successively.
Described operate portions 1 is welded with the base plate 6 in diode (led) module, and described operate portions 22, operate portions 33 are all welded with the negative pole of chip 7.
Claims (4)
1. the wire jumper of Novel diode module, it is characterized in that, comprise operate portions one, operate portions two and operate portions three, connected by main wire jumper between described operate portions one and operate portions two, to be connected by secondary wire jumper between described operate portions two and operate portions three and operate portions two is all connected with chip with operate portions three.
2. the wire jumper of Novel diode module according to claim 1, is characterized in that, described main wire jumper and secondary wire jumper are each made of aluminum and all curved.
3. the wire jumper of Novel diode module according to claim 1, is characterized in that, described operate portions one, main wire jumper, operate portions two, secondary wire jumper, operate portions three are connected as a single entity successively.
4. the wire jumper of Novel diode module according to claim 1, is characterized in that, described operate portions one is welded with the base plate in diode (led) module, and described operate portions two, operate portions three are all welded with the negative pole of chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520896968.7U CN205081115U (en) | 2015-11-11 | 2015-11-11 | Novel wire jumper of diode module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520896968.7U CN205081115U (en) | 2015-11-11 | 2015-11-11 | Novel wire jumper of diode module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205081115U true CN205081115U (en) | 2016-03-09 |
Family
ID=55433499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520896968.7U Active CN205081115U (en) | 2015-11-11 | 2015-11-11 | Novel wire jumper of diode module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205081115U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105261604A (en) * | 2015-11-11 | 2016-01-20 | 扬州扬杰电子科技股份有限公司 | Jumper wire of novel diode module |
-
2015
- 2015-11-11 CN CN201520896968.7U patent/CN205081115U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105261604A (en) * | 2015-11-11 | 2016-01-20 | 扬州扬杰电子科技股份有限公司 | Jumper wire of novel diode module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |