CN205074875U - Utilize compound piezoelectric vibrator high frequency ultrasonic buffing device of matching layer - Google Patents
Utilize compound piezoelectric vibrator high frequency ultrasonic buffing device of matching layer Download PDFInfo
- Publication number
- CN205074875U CN205074875U CN201520740065.XU CN201520740065U CN205074875U CN 205074875 U CN205074875 U CN 205074875U CN 201520740065 U CN201520740065 U CN 201520740065U CN 205074875 U CN205074875 U CN 205074875U
- Authority
- CN
- China
- Prior art keywords
- polishing
- matching layer
- high frequency
- piezoelectric vibrator
- piezoceramics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The utility model provides an utilize compound piezoelectric vibrator high frequency ultrasonic buffing device of matching layer, relates to the device of the compound polishing of an ultrasonic wave, the device is including piezoceramics (1), matching layer I (2), matching layer II (3), brush sliding ring (4), weight (5), polish (6), polishing pad (7), polishing work platform (8), the shaft hole of brush sliding ring (4) is passed through clearance fit and is linked together with weight (5), brush sliding ring (4) are drawn forth the well through -hole that the wire passes through weight (5) and are connected to on piezoceramics (1), paste on matching layer I (2) piezoceramics (1), II (3) water of matching layer adsorb on matching layer I (2), paste on polishing work platform (8) polishing pad (7). The device pastes the acoustic matching material at piezoelectric element radiation end, transmits the polishing interface with the ultrasonic wave efficient of high frequency, realizes the planar overall situation polishing of work piece to the acquisition is by high surface quality and the extremely low surface damage of polishing member.
Description
Technical field
The utility model relates to a kind of device of ultrasonic wave composite polishing, particularly relates to the high frequency ultrasound composite polishing device of a kind of hundreds of KHz to the matching layer structure transducer of number megahertz.
Background technology
The vibratory impulse that traditional ultrasonic assistant process technology utilizes the vibration of the supersonic frequency of kilohertz to produce, abrasive material impact and cavitation carry out removal materials processing.Ultrasonic vibration is applied to machine glazed finish or CMP process to reducing the surface roughness of polished, improving polishing efficiency and have obvious facilitation.At present, material in polishing removes unit at nanometer even Subnano-class, under this processing yardstick, the low frequency ultrasound polishing of kilohertz, due to the restriction by oscillator structure and mode of oscillation, is difficult to realize the efficiency utilization of ultrasonic vibration and the global planarizartion of workpiece.
Ultrasonic machining instrument is when amplitude is certain, frequency is higher, ultrasonication energy is larger, conventional ultrasound vibropolish instrument, depends on the Integral modes design and study of vibrating elastic body, limits by oscillator structure, when amplitude is certain, frequency not easily improves, and is generally limited in the low supersonic range of kilohertz to KHz up to a hundred, the finite energy of therefore ultrasonication.Hundreds of KHz is short to the high frequency ultrasound wave length of sound of number megahertz, is the decades of times even hundreds of times of low frequency ultrasound with the sound intensity under amplitude.
Summary of the invention
The purpose of this utility model is to provide one to utilize matching layer Combined piezoelectric vibrator high frequency ultrasound burnishing device, this device utilizes the piezoelectric element being operated in thickness vibration mode resonance state as high frequency ultrasound source, acoustical match material is pasted at piezoelectric element spoke side, the ultrasonic high-efficiency of high frequency is delivered to polishing interface, realize the overall polishing of workpiece planarization, thus obtain polished high surface quality and extremely low surface damage.
The purpose of this utility model is achieved through the following technical solutions:
One utilizes matching layer Combined piezoelectric vibrator high frequency ultrasound burnishing device, described device comprises piezoelectric ceramics, matching layer I, matching layer II, electric brush slip ring, counterweight, polishing fluid, polishing pad, polishing station, the axis hole of electric brush slip ring is linked together by matched in clearance and counterweight, electric brush slip ring is drawn wire and is connected on piezoelectric ceramics by through hole in counterweight, piezoelectric ceramics is pasted on matching layer I, matching layer II water is adsorbed on matching layer I, and polishing pad is pasted in polishing station.
Advantage of the present utility model and effect are:
The ultrasonic transducer structures of matching layer structure is simple, and the piezoelectric ceramics of humorous polarization state and polished are separated by matching layer, and serve as polishing tool head, achieve high frequency power ultrasonic simple, add flexibly.
By the Zone Full of ultrasonication irradiation to polished, the global planarizartion of polished workpiece can be realized.No matter be active or passive type, fixed eccentric or swing polished part forms of motion, all easily can add this ultrasonication, not by the restriction of Polishing Motion form.Simply can be additional on traditional polissoir, large change need not be done to polissoir.
The little amplitude ploughing effect of high frequency ultrasound millimeter wave, is applicable to rough polishing and the finishing polish process of workpiece, for the effect of being improved of the material removing rate under rough polishing and finishing polish and surface quality.
Accompanying drawing explanation
Fig. 1 is high frequency ultrasound matching layer polishing tool head schematic diagram of the present utility model;
Fig. 2 is the utility model high frequency ultrasound burnishing device overall schematic.
Detailed description of the invention
Below in conjunction with accompanying drawing illustrated embodiment, the utility model is described in further detail.
Number in the figure is: 1, piezoelectric ceramics; 2, matching layer I; 3, matching layer II; 4, electric brush slip ring; 5, counterweight; 6, polishing fluid; 7, polishing pad; 8, polishing station;
The axis hole of electric brush slip ring 4 is linked together by matched in clearance and counterweight 5, slip ring 4 is drawn wire and is connected on piezoelectric ceramic piece 1 by through hole in counterweight 5, piezoelectric ceramic piece 1 utilizes epoxide-resin glue to be pasted on matching layer I, matching layer II polished water is adsorbed on matching layer I, and polishing pad 7 is pasted in polishing station 8.
Traditional low frequency power ultrasonic vibrator complex structure, constraint by oscillator size and oscillator and vibropolish instrument resonance mode limits, frequency is difficult to the high frequency ultrasound territory bringing up to more than hundreds of KHz, the utility model proposes and utilize acoustical match design to realize the additional of high frequency ultrasound, matching layer design is carried out to polishing oscillator, reach the efficient irradiation of sound wave, to reach the effect of auxiliary polishing, the oscillator structure of matching layer piezoelectric vibrator is simple, the piezoelectric sheet of thickness resonance is adopted to add the composite transducer structure of coupling entrant sound plate, frequency can reach the high-frequency domain of hundreds of KHz to number megahertz, owing to make use of the thickness vibration mode of piezoelectric ceramics, piezoelectric constant is large, electro-acoustic conversion efficiency is high, and matching layer entrant sound plate is while being delivered to polishing interface by sound wave efficient transmission, act as again the effect of polishing tool head, clamp and carried out polishing by throwing part.This high frequency ultrasound polishing oscillator can be easy be attached in conventional chemical-mechanical glossing, high frequency electrical signal is inputted by the ultrasonic wave generating apparatus in periphery, be input to just in the polishing tool head of rotation status by electric brush slip ring 4, excitation piezoelectric ceramic piece 1, utilize the high-frequency ultrasonic that the inverse piezoelectric effect of piezoelectric ceramics produces, ultrasonic wave is through the rubbing head entrant sound plate 2 of matching layer material I, be adsorbed on rubbing head 2 by the notch water on rubbing head 2 for polished 3, polished is made to keep motion consistent with tool heads, the ultrasonic polishing action region by being delivered to containing two matching layers of polished between polishing pad 7 and polished 3.The polishing fluid 6 in high frequency components polishing action region makes polishing particles dispersion, renewal, stirring act on polishing process, while polishing station 8 does relative motion with polishing tool head, input polishing fluid 6, as the continuous supplementation of polishing fluid, realizes mechanical polishing or chemical machinery rubbing down mechanism.
The utility model, in implementation process, first utilizes supersonic generator to pass into the high-frequency ultrasonic signal of telecommunication, restarts polishing station and rotates, and polishing tool head is initiatively or do under passive situation and determine eccentric rotary relative to polishing station.
Claims (1)
1. one kind utilizes matching layer Combined piezoelectric vibrator high frequency ultrasound burnishing device, it is characterized in that, described device comprises piezoelectric ceramics (1), matching layer I (2), matching layer II (3), electric brush slip ring (4), counterweight (5), polishing fluid (6), polishing pad (7), polishing station (8), the axis hole of electric brush slip ring (4) is linked together by matched in clearance and counterweight (5), electric brush slip ring (4) is drawn wire and is connected on piezoelectric ceramics (1) by the middle through hole of counterweight (5), piezoelectric ceramics (1) is pasted on matching layer I (2), matching layer II (3) water is adsorbed on matching layer I (2), polishing pad (7) is pasted in polishing station (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520740065.XU CN205074875U (en) | 2015-09-23 | 2015-09-23 | Utilize compound piezoelectric vibrator high frequency ultrasonic buffing device of matching layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520740065.XU CN205074875U (en) | 2015-09-23 | 2015-09-23 | Utilize compound piezoelectric vibrator high frequency ultrasonic buffing device of matching layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205074875U true CN205074875U (en) | 2016-03-09 |
Family
ID=55427313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520740065.XU Expired - Fee Related CN205074875U (en) | 2015-09-23 | 2015-09-23 | Utilize compound piezoelectric vibrator high frequency ultrasonic buffing device of matching layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205074875U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112775767A (en) * | 2021-01-29 | 2021-05-11 | 上海理工大学 | Ultrasonic vibration assisted magnetic composite fluid polishing device |
-
2015
- 2015-09-23 CN CN201520740065.XU patent/CN205074875U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112775767A (en) * | 2021-01-29 | 2021-05-11 | 上海理工大学 | Ultrasonic vibration assisted magnetic composite fluid polishing device |
| CN112775767B (en) * | 2021-01-29 | 2022-09-23 | 上海理工大学 | Ultrasonic vibration assisted magnetic composite fluid polishing device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108136441B (en) | Vibration exciting method for langevin type ultrasonic transducer, ultrasonic processing method, and ultrasonic transmission method | |
| CN203380706U (en) | Hard and brittle material grinding device under ultrasound effect | |
| CN205074875U (en) | Utilize compound piezoelectric vibrator high frequency ultrasonic buffing device of matching layer | |
| CN105215796B (en) | One kind utilizes matching layer Combined piezoelectric vibrator high frequency ultrasound burnishing device and method | |
| JP2011183510A (en) | Ultrasonic-vibration-assisted grinding method and device therefor | |
| JP6716082B2 (en) | Excitation method of longitudinal and torsional vibration of Langevin type ultrasonic transducer | |
| CN106493648A (en) | A kind of radial ultrasonic vibration auxiliary cup emery wheel and its using method | |
| KR100647199B1 (en) | Ultrasonic cutter and its cutting method | |
| CN206344031U (en) | A kind of axial ultrasonic vibration auxiliary cup emery wheel | |
| CN105397640B (en) | A kind of combined type hard grinding wheel trimmer | |
| CN104117878A (en) | Ultrasonic polishing method and device for transmitting megahertz-level vibration through liquid | |
| EP2389273B1 (en) | Ultrasonic treatment device | |
| JP2005001096A (en) | Ultrasonic vibrating table | |
| JPWO2019230883A1 (en) | Ultrasonic vibration imparting tool, traveling wave generator and ultrasonic processing device | |
| CN101758426A (en) | Small-bore polishing machine based on ultrasonic vibration | |
| Wu et al. | A new centerless grinding technique without employing a regulating wheel | |
| CN203061410U (en) | Double-bending traveling wave ultrasonic polishing oscillator | |
| JP2011110693A (en) | Grinding tool | |
| TWM400382U (en) | Ultrasonic chemical mechanical polishing mechanism | |
| CN108818163A (en) | Multifrequency vibration micro-structure surface processing unit (plant) | |
| RU152124U1 (en) | ULTRASONIC HEAD OF A DIAMOND ROTATING CUTTING TOOL | |
| CN202034919U (en) | Toroidal ultrasonic polishing vibrator | |
| CN215510529U (en) | Ultrasonic vibration grinder | |
| JP6682252B2 (en) | Abrasive tools and equipment | |
| CN203993383U (en) | A kind of ultrasonic polishing device that utilizes the vibration of liquid transfer megahertz level |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160309 Termination date: 20170923 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |