CN203993383U - A kind of ultrasonic polishing device that utilizes the vibration of liquid transfer megahertz level - Google Patents
A kind of ultrasonic polishing device that utilizes the vibration of liquid transfer megahertz level Download PDFInfo
- Publication number
- CN203993383U CN203993383U CN201420416855.8U CN201420416855U CN203993383U CN 203993383 U CN203993383 U CN 203993383U CN 201420416855 U CN201420416855 U CN 201420416855U CN 203993383 U CN203993383 U CN 203993383U
- Authority
- CN
- China
- Prior art keywords
- vibropolish
- instrument
- vibration
- polishing
- oscillator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The ultrasonic polishing method and the burnishing device thereof that utilize the vibration of liquid transfer megahertz level, relate to a kind of finishing method and device thereof, and the method, by flexible couplant transmitting vibrations, is delivered to the high frequency ultrasound vibration of oscillator on vibropolish instrument; Realized the vibropolish instrument that does not rely on Integral modes analysis and mode design.And the method is applied in to silicon wafer polishing field, designed a set of ultrasonic polishing device that utilizes the vibration of liquid transfer megahertz level, piezoelectric ceramic piece on oscillator is applied to the excitation of the alternating voltage of suitable frequency, oscillator is by the mode low-resonance in design, the vibration of high frequency is transferred to vibropolish instrument by couplant, million acoustic vibrations transfer to polishing fluid the most at last, polishing fluid particle is effectively played a role, thereby obtain lattice surface, superelevation surface accuracy and extremely low roughness that polished silicon chip is complete.The method that this utilizes liquid transfer vibration, what make vibration additionally has a stronger flexibility, has expanded the scope that vibration utilizes.
Description
Technical field
The present invention relates to a kind of finishing method and device thereof, particularly relate to a kind of ultrasonic polishing device that utilizes the vibration of liquid transfer megahertz level.
Background technology
Ultraprecise processing is Modern high-tech industry and scientific and technical development foundation, as the Ultraprecise polished of one of ultraprecise processing key areas, is that a kind of machinery of fine abrasive particle and chemical action utilized obtains processing method smooth or super-smooth surface quality.In recent years, for the precision chemical mechnical polishing of the crisp and hard materials such as silicon chip, attached supersonic vibration assists polishing to become a hot research problem.The append mode of conventional ultrasound vibration is all the vibropolish instrument that depends on Integral modes analysis and mode design, the loading of vibration plays a role, but this append mode has significant limitation, when change of external conditions, probably can cause the change of resonant frequency, be difficult to assurance oscillator and under good resonance mode, work all the time.
Summary of the invention
The object of the present invention is to provide a kind of ultrasonic polishing device that utilizes the vibration of liquid transfer megahertz level, this device utilizes the off-resonance modal vibration of vibropolish instrument to carry out assistant chemical machine glazed finish, the high frequency ultrasound vibration of oscillator is delivered on vibropolish instrument by couplant, oscillator and vibropolish instrument are independent, thereby make the loading of vibration there is stronger flexibility, greatly expanded the scope that vibration utilizes.
The object of the invention is to be achieved through the following technical solutions:
A kind of ultrasonic polishing device that utilizes the vibration of liquid transfer megahertz level, described device is comprised of ultrasonic vibration spare system and polishing machine instrument two parts, ultrasonic vibration spare system comprises oscillator and sealing device, couplant, three assemblies of vibropolish instrument, comprises sheet under hold down gag upper slice, hold down gag, electrified wire, sealing ring, wafer presser electric tachometer indicator, horizontal boom support, couplant, vibropolish instrument, silicon chip, polishing pad, polishing disk; Oscillator is the piezoelectric patches oscillator of driving voltage frequency more than 1MHz, oscillator is corresponding is provided with sealing device, the horizontal boom that oscillator and sealing device thereof are placed in external adjustment height supports, oscillator infiltrates in couplant, silicon chip is adsorbed on vibropolish instrument, whole device is seated on the polishing disk that posts polishing pad, and vibropolish instrument is provided with notch.
Described a kind of ultrasonic polishing device that utilizes the vibration of liquid transfer megahertz level, described ultrasonic vibration chemical machinery composite polishing instrument comprises wafer presser electric tachometer indicator, Horizontal clamp, sheet, couplant, vibropolish instrument, polished object, polishing fluid, polishing pad, polishing disk under sealing ring, electrified wire, hold down gag upper slice, hold down gag; Horizontal support is a cantilever of a four-bar mechanism, and vibropolish instrument is seated on polishing disk, and locates with the triangle pawl of polishing machine.
Described a kind of ultrasonic polishing device that utilizes the vibration of liquid transfer megahertz level, is characterized in that, it is barrel-shaped that described vibropolish instrument is cylinder, vibropolish instrument be installed silicon chip, transmitting vibrations, storage couplant.
Described a kind of ultrasonic polishing device that utilizes the vibration of liquid transfer megahertz level, the described vibropolish instrument silicon chip that is installed, at the bottom of vibropolish tool barrel, be milled with groove the same with polished silicon chip shape, that the degree of depth is half silicon wafer thickness to silicon chip the contraposition silicon chip that is installed.
Described a kind of ultrasonic polishing device that utilizes the vibration of liquid transfer megahertz level, described polishing disk is seated on polishing machine, and vibropolish instrument and polishing disk have certain eccentric throw.
Advantage of the present invention and effect are:
1. the present invention is by flexible couplant transmitting vibrations, the high frequency ultrasound vibration of oscillator is delivered on vibropolish instrument, make oscillator separated with vibropolish instrument, oscillator is in resonance mode, vibropolish instrument is in forced vibration, off-resonance pattern, has broken the constraint of vibropolish instrument resonance mode, has realized the vibropolish instrument that does not rely on Integral modes analysis and mode design, thereby make the loading of vibration there is stronger flexibility, expanded the scope that vibration utilizes.
2. the present invention's million sound effects: oscillator operating frequency is more than 1MHz, and it is large that million sound have energy density, and penetration capacity is strong, and linearity is good, and the utilization rate of energy is higher, etc. advantage, also belong to high frequency ultrasound vibration simultaneously, noiselessness.
3. vibrational energy utilization rate of the present invention is high: polishing is assisted in existing ultrasonic vibration, all to transfer vibrations on polishing pad, again by vibration transmission to polishing fluid, polishing fluid particle is played a role, polishing is lined with very strong absorption of vibrations characteristic, vibrational energy loss is large, and the present invention is directly loaded into vibration on silicon chip, and the energy utilization efficiency of vibration is high.
Accompanying drawing explanation
Fig. 1 is oscillator sealing device figure of the present invention;
Fig. 2 is the ultrasonic polishing device that the present invention utilizes the vibration of liquid transfer megahertz level.
The specific embodiment
Below in conjunction with accompanying drawing illustrated embodiment, the invention will be further described.
The present invention proposes a kind of new ultrasonic vibration method in machined, by flexible couplant transmitting vibrations, the high frequency ultrasound vibration of oscillator is delivered on vibropolish instrument; Oscillator and vibropolish instrument are independent, break the constraint of existing oscillator and vibropolish instrument resonance mode, reach the independent design object of oscillator, realized the vibropolish instrument that does not rely on Integral modes analysis and mode design, make the additional of vibration there is stronger flexibility, expanded the scope that vibration utilizes.This vibration addition method is applied on silicon wafer polishing, designed a set of ultrasonic polishing device that utilizes the vibration of liquid transfer megahertz level, this device is comprised of ultrasonic vibration spare system and polishing machine system two parts, ultrasonic vibration spare system comprises oscillator and sealing device, couplant, three assemblies of vibropolish instrument, oscillator is the piezoelectric patches oscillator of driving voltage frequency more than 1MHz, because the working face of oscillator is under water, it has been designed to corresponding sealing device, the horizontal boom that oscillator and sealing device thereof are placed on external adjustment height supports on 7, regulate 7 height, can realize the distance of adjusting oscillator and vibropolish instrument.Oscillator infiltrates in couplant, the dither producing is directly transferred on vibropolish instrument 9 by couplant 8, on vibropolish instrument 9, silicon chip is adsorbed on vibropolish instrument, whole device is seated on the polishing disk that posts polishing pad, and the notch of vibropolish instrument has guaranteed silicon chip running together with vibropolish instrument, and polishing disk is around the main shaft rotation of polishing machine, the nozzle ejection polishing fluid of polishing machine, completes glossing simultaneously.The design of oscillator is without considering the impact of external environment on its intrinsic frequency, the dither that oscillator produces is delivered to vibropolish instrument by the couplant contacting with it, million acoustic vibrations transfer to polishing fluid the most at last, polishing fluid particle is effectively played a role, thereby obtain lattice surface, superelevation surface accuracy and extremely low roughness that polished silicon chip is complete.The design of oscillator and work Relative Vibration polishing tool are independently, oscillator is in resonance mode, couplant transmitting vibrations, vibropolish instrument is in forced vibration, off-resonance pattern, broken the restriction of vibropolish instrument resonance mode, realized the independent design of oscillator, after vibropolish tool wear, can independently change, oscillator is reusable edible still.
Ultrasonic vibration chemical machinery composite polishing instrument, by ultrasonic vibrator, couplant, vibropolish instrument three parts, formed, its parts comprise wafer presser electric tachometer indicator, Horizontal clamp, sheet, couplant, vibropolish instrument, polished object, polishing fluid, polishing pad, polishing disk under sealing ring, electrified wire, oscillator fixture upper slice, oscillator fixture; The advantages such as vibration source is million acoustic pressure electric tachometer indicators of disc-shaped, and oscillator operating frequency is more than 1MHz, and it is large that million sound have energy density, and penetration capacity is strong, and linearity is good; Million acoustic vibrations that vibration source produces are delivered to flexible couplant, have avoided the contact wear of vibration source and vibropolish instrument, and couplant can reduce the loss of vibration on Transfer Medium interface simultaneously; A plurality of functions such as vibropolish instrument has transmitting vibrations, the silicon chip that is installed, storage couplant, vibropolish instrument is as the jig silicon chip that is installed, being about to silicon chip is adsorbed on vibropolish instrument, notch makes silicon chip rotate with vibropolish instrument, vibropolish instrument and polishing disk have certain eccentric throw, vibropolish instrument was both revolved round the sun around polishing disk axis, again around own axis rotation, and vibropolish instrument is floating type, make polishing more even, avoided the problems such as warpage of silicon chip.Million acoustic vibrations transfer to polishing fluid the most at last, and polishing fluid particle is effectively played a role, thereby obtain lattice surface, superelevation surface accuracy and extremely low roughness that polished silicon chip is complete.
The present invention is produced the ultrasonic wave of megahertz level by vibration source, be transferred on vibropolish instrument, thereby give vibropolish instrument attached supersonic vibration through selected couplant.This method utilization be vibration transmission characteristic, in order to reduce the decay of vibration in transmittance process, note 3 points: one, the requirement of vibration source, that the vibration frequency of vibration source is wanted is relatively high (frequency want 1MHz more than), this be due to, in the situation that amplitude is certain, frequency more high-energy-density is larger, vibrates additional effect better, and in same medium, the frequency of vibration is higher, and wavelength is shorter, and directionality is better; Two, the selection of couplant, vibration is by vibration source, to be delivered to vibropolish instrument by flexible couplant, just there are two interfaces, because the linear pattern of high frequency ultrasound is good, the loss that is easy to produce reflection at the interface place of two media and causes energy, this will select suitable couplant according to the specific acoustic impedance of two media, to reduce the loss of energy; Three, because the wavelength of high frequency ultrasound is very short, that in gaseous environment, decays is fast especially, so can not have gas interlayer between vibropolish instrument and workpiece to be machined, discharge air with liquid, and processed object is adsorbed on vibropolish instrument.
This ultrasonic vibration addition method and device can be applied in multiple process for machining, now the present invention have been applied in glossing, for the polishing of silicon chip, have designed a set of ultrasonic polishing device that utilizes the vibration of liquid transfer megahertz level.
Embodiment:
This utilizes the ultrasonic polishing device of liquid transfer megahertz level vibration to be comprised of ultrasonic vibration spare system and polishing machine system two parts, vibration spare system comprises oscillator and sealing device, couplant, three assemblies of vibropolish instrument, and wherein oscillator and sealing device form (see figure 1) by six parts again; Polishing machine system forms (see figure 2) by polished object (silicon chip), polishing fluid, polishing pad, polishing disk again.
In figure: 1-screw; 2-hold down gag upper slice; Sheet under 3-hold down gag; 4-electrified wire; 5-sealing ring; 6-wafer presser electric tachometer indicator; 7-horizontal boom supports; 8-couplant; 9-vibropolish instrument; 10-silicon chip; 11-polishing pad; 12-polishing fluid; 13-polishing disk.
The working face of wafer presser electric tachometer indicator of the present invention infiltrates in liquid environment, for preventing that Liquid Penetrant from causing short circuit to electrode surface, designed sealing device it carried out to encapsulation process, by bolt 1 by upper slice 2 and lower 3 fastening, make sealing ring 5 crimps, reach the effect of sealing.Piezoelectric ceramic piece is applied to the excitation (driving voltage frequency is more than 1MHz) of the alternating voltage of suitable frequency, oscillator, by the mode low-resonance in design, produces dither.Dither is delivered to the couplant of contact with it, million acoustic vibrations are just propagated before the formal row with compressional wave in couplant 7, vibration is delivered to vibropolish instrument through couplant, it is barrel-shaped that vibropolish instrument 9 is designed to cylinder, the bucket end, is milled with the same with polished silicon chip shape, the degree of depth is that the groove of half silicon wafer thickness carries out contraposition to silicon chip, there is transmitting vibrations, silicon chip is installed, store a plurality of functions such as couplant, vibropolish instrument is as the jig silicon chip that is installed, when being installed, to first be coated with one deck water, then above silicon chip being attached to, and extruding, the air of getting rid of the inside, silicon chip is adsorbed on vibropolish instrument, notch makes silicon chip rotate with vibropolish instrument.For avoiding the direct contact between oscillator and vibropolish instrument, reduce wearing and tearing unnecessary, the external horizontal boom that is seated oscillator and sealing device supports on 7, horizontal support 7 is a cantilever of a four-bar mechanism, the logical height that regulates horizontal boom to support, reaches the object that regulates the distance between oscillator and vibropolish instrument; Vibropolish tool card is seated on polishing disk, and locate with the triangle pawl of polishing machine, polishing disk is seated on polishing machine, around the main shaft rotation of polishing machine, vibropolish instrument and polishing disk have certain eccentric throw, and vibropolish instrument was both revolved round the sun around polishing disk axis, again around own axis rotation, and vibropolish instrument is floating type, make polishing more even, avoided the problems such as warpage of silicon chip.Vibration is via vibropolish instrument, silicon chip, and million acoustic vibrations transfer to polishing fluid the most at last, and polishing fluid particle is effectively played a role, thereby obtains lattice surface, superelevation surface accuracy and extremely low roughness that polished silicon chip is complete.
Claims (5)
1. a ultrasonic polishing device that utilizes liquid transfer megahertz level vibration, it is characterized in that, described device is comprised of ultrasonic vibration spare system and polishing machine instrument two parts, ultrasonic vibration spare system comprises oscillator and sealing device, couplant, three assemblies of vibropolish instrument, comprises sheet under hold down gag upper slice, hold down gag, electrified wire, sealing ring, wafer presser electric tachometer indicator, horizontal boom support, couplant, vibropolish instrument, silicon chip, polishing pad, polishing disk; Oscillator is made as the piezoelectric patches oscillator of driving voltage frequency more than 1MHz, oscillator is corresponding is provided with sealing device, the horizontal boom that oscillator and sealing device thereof are placed in external adjustment height supports on (7), oscillator infiltrates in couplant, silicon chip is adsorbed on vibropolish instrument, whole device is seated on the polishing disk that posts polishing pad, and vibropolish instrument is provided with notch.
2. a kind of ultrasonic polishing device that utilizes liquid transfer megahertz level vibration according to claim 1, it is characterized in that, described ultrasonic vibration chemical machinery composite polishing instrument comprises wafer presser electric tachometer indicator, Horizontal clamp, sheet, couplant, vibropolish instrument, polished object, polishing fluid, polishing pad, polishing disk under sealing ring, electrified wire, hold down gag upper slice, hold down gag; Horizontal boom is supported for a cantilever of a four-bar mechanism, and vibropolish tool card is seated on polishing disk, and locates with the triangle pawl of polishing machine.
3. a kind of ultrasonic polishing device that utilizes the vibration of liquid transfer megahertz level according to claim 1, is characterized in that, it is barrel-shaped that described vibropolish instrument is cylinder, and vibropolish instrument clamps silicon chip.
4. a kind of ultrasonic polishing device that utilizes liquid transfer megahertz level vibration according to claim 3, it is characterized in that, described vibropolish instrument clamps silicon chip, is milled with groove the same with polished silicon chip shape, that the degree of depth is half silicon wafer thickness to silicon chip mount silicon chip at the bottom of vibropolish tool barrel.
5. a kind of ultrasonic polishing device that utilizes the vibration of liquid transfer megahertz level according to claim 1, is characterized in that, described polishing disk is seated on polishing machine, and vibropolish instrument and polishing disk have certain eccentric throw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420416855.8U CN203993383U (en) | 2014-07-28 | 2014-07-28 | A kind of ultrasonic polishing device that utilizes the vibration of liquid transfer megahertz level |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420416855.8U CN203993383U (en) | 2014-07-28 | 2014-07-28 | A kind of ultrasonic polishing device that utilizes the vibration of liquid transfer megahertz level |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203993383U true CN203993383U (en) | 2014-12-10 |
Family
ID=52033446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420416855.8U Expired - Fee Related CN203993383U (en) | 2014-07-28 | 2014-07-28 | A kind of ultrasonic polishing device that utilizes the vibration of liquid transfer megahertz level |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203993383U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104117878A (en) * | 2014-07-28 | 2014-10-29 | 辽宁工业大学 | Ultrasonic polishing method and device for transmitting megahertz-level vibration through liquid |
-
2014
- 2014-07-28 CN CN201420416855.8U patent/CN203993383U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104117878A (en) * | 2014-07-28 | 2014-10-29 | 辽宁工业大学 | Ultrasonic polishing method and device for transmitting megahertz-level vibration through liquid |
| CN104117878B (en) * | 2014-07-28 | 2017-01-18 | 辽宁工业大学 | Ultrasonic polishing method and device for transmitting megahertz-level vibration through liquid |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104117878A (en) | Ultrasonic polishing method and device for transmitting megahertz-level vibration through liquid | |
| US20100087125A1 (en) | Polishing tool and polishing device | |
| KR102070465B1 (en) | Device for detecting cracking and thickness | |
| CN206344030U (en) | A kind of radial ultrasonic vibration auxiliary cup emery wheel | |
| JP2014147978A (en) | Processing device of columnar member | |
| CN105058254B (en) | Large-size radial ultrasonic auxiliary end face grinding abrasive disk | |
| CN203993383U (en) | A kind of ultrasonic polishing device that utilizes the vibration of liquid transfer megahertz level | |
| JP2875513B2 (en) | Semiconductor material processing method and apparatus | |
| JP2011245574A (en) | Two-dimensional (oval) ultrasonic-assisted chemical mechanical composite machining method and device | |
| JP2011183510A (en) | Ultrasonic-vibration-assisted grinding method and device therefor | |
| CN106493648A (en) | A kind of radial ultrasonic vibration auxiliary cup emery wheel and its using method | |
| JP2015174180A (en) | ultrasonic chamfering machine | |
| CN106493647A (en) | A kind of axial ultrasonic vibration auxiliary cup emery wheel and its using method | |
| CN106891205B (en) | The fine aperture apparatus of air-flow auxiliary drive ultrasonic grinding | |
| JPS63185556A (en) | Polishing device | |
| CN105150034B (en) | Grinding head capable of achieving end face ultrasound-assisted grinding and polishing | |
| CN112188938B (en) | Ultrasonic vibration applying tool, traveling wave generating device, and ultrasonic machining device | |
| CN105215796A (en) | One utilizes matching layer Combined piezoelectric vibrator high frequency ultrasound burnishing device and method | |
| CN108818163A (en) | Multifrequency vibration micro-structure surface processing unit (plant) | |
| Wu et al. | Surface formation characteristics in elliptical ultrasonic assisted grinding of monocrystal silicon | |
| JPH11123365A (en) | Ultrasonic vibrating combined processing tool | |
| CN205765279U (en) | A kind of T-shaped sample sonic oscillation burnishing device | |
| Wiercigroch et al. | Dynamics of ultrasonic drilling of hard materials | |
| JP2000317782A (en) | Piezoelectric element and its machining method | |
| JPS59118369A (en) | Manufacture of diaphragm |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141210 Termination date: 20170728 |