CN105215796A - One utilizes matching layer Combined piezoelectric vibrator high frequency ultrasound burnishing device and method - Google Patents
One utilizes matching layer Combined piezoelectric vibrator high frequency ultrasound burnishing device and method Download PDFInfo
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- CN105215796A CN105215796A CN201510610047.4A CN201510610047A CN105215796A CN 105215796 A CN105215796 A CN 105215796A CN 201510610047 A CN201510610047 A CN 201510610047A CN 105215796 A CN105215796 A CN 105215796A
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- matching layer
- polishing
- high frequency
- frequency ultrasound
- ultrasonic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
One utilizes matching layer Combined piezoelectric vibrator high frequency ultrasound burnishing device and method, relates to a kind of device and method of ultrasonic wave composite polishing, and device is made up of ultrasonic vibration spare system and conventional chemical-mechanical polishing system two parts; Ultrasonic spare system comprise piezoelectric ceramics, matching layer I, polished, and corresponding electric input equipment; The high frequency ultrasound that the method is produced by piezoelectric vibrator must through be applied to polishing interface at interior double-deck matching layer containing polished, is pasted onto the material of the matching layer I on piezoelectric ceramics and thickness and carries out adjustment according to the material of polished and varied in thickness and select; High frequency ultrasound frequency of sound wave is in the high frequency ultrasound territory of hundreds of KHz to number megahertz; The high-power radial pattern of piezoelectric ceramic thin sheet, and the thickness resonance vibration mode being operated in self.The present invention can realize the process of ultrasonic assistant chemical machinery finishing polish to different materials, zones of different or rough polishing.
Description
Technical field
The present invention relates to a kind of device and method of ultrasonic wave composite polishing, particularly relate to a kind of hundreds of KHz to the high frequency ultrasound composite polishing device of matching layer structure transducer of number megahertz and method.
Background technology
The vibratory impulse that traditional ultrasonic assistant process technology utilizes the vibration of the supersonic frequency of kilohertz to produce, abrasive material impact and cavitation carry out removal materials processing.Ultrasonic vibration is applied to machine glazed finish or CMP process to reducing the surface roughness of polished, improving polishing efficiency and have obvious facilitation.At present, material in polishing removes unit at nanometer even Subnano-class, under this processing yardstick, the low frequency ultrasound polishing of kilohertz, due to the restriction by oscillator structure and mode of oscillation, is difficult to realize the efficiency utilization of ultrasonic vibration and the global planarizartion of workpiece.
Ultrasonic machining instrument is when amplitude is certain, frequency is higher, ultrasonication energy is larger, conventional ultrasound vibropolish instrument, depends on the Integral modes design and study of vibrating elastic body, limits by oscillator structure, when amplitude is certain, frequency not easily improves, and is generally limited in the low supersonic range of kilohertz to KHz up to a hundred, the finite energy of therefore ultrasonication.Hundreds of KHz is short to the high frequency ultrasound wave length of sound of number megahertz, is the decades of times even hundreds of times of low frequency ultrasound with the sound intensity under amplitude.
Summary of the invention
One is the object of the present invention is to provide to utilize matching layer Combined piezoelectric vibrator high frequency ultrasound burnishing device and method, the method utilizes the piezoelectric element being operated in thickness vibration mode resonance state as high frequency ultrasound source, acoustical match material is pasted at piezoelectric element spoke side, the ultrasonic high-efficiency of high frequency is delivered to polishing interface, realize the overall polishing of workpiece planarization, thus obtain polished high surface quality and extremely low surface damage.
The object of the invention is to be achieved through the following technical solutions:
One utilizes matching layer Combined piezoelectric vibrator high frequency ultrasound burnishing device, and described device is made up of ultrasonic vibration spare system and conventional chemical-mechanical polishing system two parts; Ultrasonic spare system comprise piezoelectric ceramics, matching layer I, polished, and corresponding electric input equipment; Chemical-mechanical polishing system is built on conventional chemical-mechanical polishing machine, polishing part is summarised as, polishing station on polishing machine, the input equipment of polishing fluid and polishing fluid, the polishing pad pasted in polishing station, and ultrasonic spare system, meet the optional equipment electric brush slip ring of ultrasonic spare system and polishing system relative motion in addition, counterweight.
One utilizes matching layer Combined piezoelectric vibrator high frequency ultrasound finishing method, described method is the high frequency ultrasound finishing method of matching layer structure, comprise the high frequency ultrasound that produced by piezoelectric vibrator and must be applied to polishing interface through the double-deck matching layer containing polished, be pasted onto the material of the matching layer I on piezoelectric ceramics and thickness and carry out adjustment according to the material of polished and varied in thickness and select; High frequency ultrasound frequency of sound wave is in the high frequency ultrasound territory of hundreds of KHz to number megahertz; The high-power radial pattern of piezoelectric ceramic thin sheet, and the thickness resonance vibration mode being operated in self; According to different ultrasonication requirement of strength, adjustment matching layer material and thickness, makes it be operated in the most loud efficiency of transmission or transmission case more in a low voice.
Described one utilizes matching layer Combined piezoelectric vibrator high frequency ultrasound finishing method, and bonding glue-line selects acoustic impedance parameter close to the epoxy glue layer of matching layer, and glue-line should be thin and even, should reach the effect can ignored it and affect sound transmission.
Advantage of the present invention and effect are:
The ultrasonic transducer structures of matching layer structure is simple, and the piezoelectric ceramics of humorous polarization state and polished are separated by matching layer, and serve as polishing tool head, achieve high frequency power ultrasonic simple, add flexibly.
By the Zone Full of ultrasonication irradiation to polished, the global planarizartion of polished workpiece can be realized.No matter be active or passive type, fixed eccentric or swing polished part forms of motion, all easily can add this ultrasonication, not by the restriction of Polishing Motion form.Simply can be additional on traditional polissoir, large change need not be done to polissoir.
The little amplitude ploughing effect of high frequency ultrasound millimeter wave, is applicable to rough polishing and the finishing polish process of workpiece, for the effect of being improved of the material removing rate under rough polishing and finishing polish and surface quality.
Accompanying drawing explanation
Fig. 1 is high frequency ultrasound matching layer polishing tool head schematic diagram of the present invention;
Fig. 2 is high frequency ultrasound burnishing device overall schematic of the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing illustrated embodiment, the invention will be further described.
Number in the figure is: 1, piezoelectric ceramics; 2, matching layer I; 3, matching layer II (polished); 4, electric brush slip ring; 5, counterweight; 6, polishing fluid; 7, polishing pad; 8, polishing station;
The axis hole of electric brush slip ring 4 is linked together by matched in clearance and counterweight 5, slip ring 4 is drawn wire and is connected on piezoelectric ceramic piece 1 by through hole in counterweight 5, piezoelectric ceramic piece 1 utilizes epoxide-resin glue to be pasted on matching layer I, matching layer II polished water is adsorbed on matching layer I, and polishing pad 7 is pasted in polishing station 8.
Traditional low frequency power ultrasonic vibrator complex structure, constraint by oscillator size and oscillator and vibropolish instrument resonance mode limits, frequency is difficult to the high frequency ultrasound territory bringing up to more than hundreds of KHz, the present invention proposes to utilize acoustical match design to realize the additional of high frequency ultrasound, matching layer design is carried out to polishing oscillator, reach the efficient irradiation of sound wave, to reach the effect of auxiliary polishing, the oscillator structure of matching layer piezoelectric vibrator is simple, the piezoelectric sheet of thickness resonance is adopted to add the composite transducer structure of coupling entrant sound plate, frequency can reach the high-frequency domain of hundreds of KHz to number megahertz, owing to make use of the thickness vibration mode of piezoelectric ceramics, piezoelectric constant is large, electro-acoustic conversion efficiency is high, and matching layer entrant sound plate is while being delivered to polishing interface by sound wave efficient transmission, act as again the effect of polishing tool head, clamp and carried out polishing by throwing part.This high frequency ultrasound polishing oscillator can be easy be attached in conventional chemical-mechanical glossing, high frequency electrical signal is inputted by the ultrasonic wave generating apparatus in periphery, be input to just in the polishing tool head of rotation status by electric brush slip ring 4, excitation piezoelectric ceramic piece 1, utilize the high-frequency ultrasonic that the inverse piezoelectric effect of piezoelectric ceramics produces, ultrasonic wave is through the rubbing head entrant sound plate 2 of matching layer material I, be adsorbed on rubbing head 2 by the notch water on rubbing head 2 for polished 3, polished is made to keep motion consistent with tool heads, the ultrasonic polishing action region by being delivered to containing two matching layers of polished between polishing pad 7 and polished 3.The polishing fluid 6 in high frequency components polishing action region makes polishing particles dispersion, renewal, stirring act on polishing process, while polishing station 8 does relative motion with polishing tool head, input polishing fluid 6, as the continuous supplementation of polishing fluid, realizes mechanical polishing or chemical machinery rubbing down mechanism.
The present invention, in implementation process, first utilizes supersonic generator to pass into the high-frequency ultrasonic signal of telecommunication, restarts polishing station and rotates, and polishing tool head is initiatively or do under passive situation and determine eccentric rotary relative to polishing station.
Claims (3)
1. utilize a matching layer Combined piezoelectric vibrator high frequency ultrasound burnishing device, it is characterized in that, described device is made up of ultrasonic vibration spare system and conventional chemical-mechanical polishing system two parts; Ultrasonic spare system comprise piezoelectric ceramics, matching layer I, polished, and corresponding electric input equipment; Chemical-mechanical polishing system is built on conventional chemical-mechanical polishing machine, polishing part is summarised as, polishing station on polishing machine, the input equipment of polishing fluid and polishing fluid, the polishing pad pasted in polishing station, and ultrasonic spare system, meet the optional equipment electric brush slip ring of ultrasonic spare system and polishing system relative motion in addition, counterweight.
2. one kind utilizes matching layer Combined piezoelectric vibrator high frequency ultrasound finishing method, it is characterized in that, described method is the high frequency ultrasound finishing method of matching layer structure, comprise the high frequency ultrasound that produced by piezoelectric vibrator and must be applied to polishing interface through the double-deck matching layer containing polished, be pasted onto the material of the matching layer I on piezoelectric ceramics and thickness and carry out adjustment according to the material of polished and varied in thickness and select; High frequency ultrasound frequency of sound wave is in the high frequency ultrasound territory of hundreds of KHz to number megahertz; The high-power radial pattern of piezoelectric ceramic thin sheet, and the thickness resonance vibration mode being operated in self; According to different ultrasonication requirement of strength, adjustment matching layer material and thickness, makes it be operated in the most loud efficiency of transmission or transmission case more in a low voice.
3. one according to claim 2 utilizes matching layer Combined piezoelectric vibrator high frequency ultrasound finishing method, it is characterized in that, bonding glue-line selects acoustic impedance parameter close to the epoxy glue layer of matching layer, and glue-line should be thin and even, should reach the effect can ignored it and affect sound transmission.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510610047.4A CN105215796B (en) | 2015-09-23 | 2015-09-23 | One kind utilizes matching layer Combined piezoelectric vibrator high frequency ultrasound burnishing device and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510610047.4A CN105215796B (en) | 2015-09-23 | 2015-09-23 | One kind utilizes matching layer Combined piezoelectric vibrator high frequency ultrasound burnishing device and method |
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| Publication Number | Publication Date |
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| CN105215796A true CN105215796A (en) | 2016-01-06 |
| CN105215796B CN105215796B (en) | 2017-11-21 |
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| CN201510610047.4A Expired - Fee Related CN105215796B (en) | 2015-09-23 | 2015-09-23 | One kind utilizes matching layer Combined piezoelectric vibrator high frequency ultrasound burnishing device and method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108818162A (en) * | 2018-06-28 | 2018-11-16 | 杭州电子科技大学 | Novel vibrating motivates grinding and polishing tool head device |
| CN112621538A (en) * | 2020-12-15 | 2021-04-09 | 中国建筑材料科学研究总院有限公司 | Polishing method for harmonic oscillator shell end face |
Citations (5)
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|---|---|---|---|---|
| JPH06226612A (en) * | 1993-01-28 | 1994-08-16 | Toshiba Corp | Polishing tool |
| CN101716745A (en) * | 2009-11-09 | 2010-06-02 | 清华大学 | Device and method for polishing sapphire substrate material by ultrasound assisted chemical machinery |
| CN104054355A (en) * | 2012-11-16 | 2014-09-17 | 阿西斯特医疗系统有限公司 | Ultrasound Transducer And Processing Methods Thereof |
| CN104117878A (en) * | 2014-07-28 | 2014-10-29 | 辽宁工业大学 | Ultrasonic polishing method and device for transmitting megahertz-level vibration through liquid |
| CN104741979A (en) * | 2015-03-30 | 2015-07-01 | 浙江工业大学 | Ultrasonic grinding tiny female die machining equipment based on dielectrophoresis effect |
-
2015
- 2015-09-23 CN CN201510610047.4A patent/CN105215796B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06226612A (en) * | 1993-01-28 | 1994-08-16 | Toshiba Corp | Polishing tool |
| CN101716745A (en) * | 2009-11-09 | 2010-06-02 | 清华大学 | Device and method for polishing sapphire substrate material by ultrasound assisted chemical machinery |
| CN104054355A (en) * | 2012-11-16 | 2014-09-17 | 阿西斯特医疗系统有限公司 | Ultrasound Transducer And Processing Methods Thereof |
| CN104117878A (en) * | 2014-07-28 | 2014-10-29 | 辽宁工业大学 | Ultrasonic polishing method and device for transmitting megahertz-level vibration through liquid |
| CN104741979A (en) * | 2015-03-30 | 2015-07-01 | 浙江工业大学 | Ultrasonic grinding tiny female die machining equipment based on dielectrophoresis effect |
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| Title |
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| 林书玉: "功率超声振动系统的研究进展", 《应用声学》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108818162A (en) * | 2018-06-28 | 2018-11-16 | 杭州电子科技大学 | Novel vibrating motivates grinding and polishing tool head device |
| CN112621538A (en) * | 2020-12-15 | 2021-04-09 | 中国建筑材料科学研究总院有限公司 | Polishing method for harmonic oscillator shell end face |
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| Publication number | Publication date |
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| CN105215796B (en) | 2017-11-21 |
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Granted publication date: 20171121 Termination date: 20200923 |