CN205071592U - U template formula heat pipe cooling ware - Google Patents
U template formula heat pipe cooling ware Download PDFInfo
- Publication number
- CN205071592U CN205071592U CN201520845535.9U CN201520845535U CN205071592U CN 205071592 U CN205071592 U CN 205071592U CN 201520845535 U CN201520845535 U CN 201520845535U CN 205071592 U CN205071592 U CN 205071592U
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- CN
- China
- Prior art keywords
- heat
- pipe
- heat pipe
- fin
- formula heat
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- Expired - Fee Related
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Abstract
The utility model discloses a U template formula heat pipe cooling ware, this U template formula heat pipe cooling ware include heat -transfer device and fin radiating block, a serial communication port, the heat -transfer device be U template formula heat pipe, just, the bottom of U type is the evaporation zone, and the both sides limit is the condensation segment, the fin radiating block be four, wherein two centre grippings are fixed on a side of U template formula heat pipe, in addition two centre grippings are fixed on another side of U template formula heat pipe, each fin radiating block is by the bottom plate of attached condensation segment side at U template formula heat pipe and constitute from a set of parallel fin of evaporation zone with U template formula heat pipe that the bottom plate side direction is extended. U template formula heat pipe cooling ware has the advantage that processing is simple, the reliability is high.
Description
Technical field
The utility model relates to the heat pipe having intermediate heat medium in closed conduct, and this heat pipe is suitable for the cooling device making electronic device.
Background technology
Flourish along with science and technology, the design and production of electronic product is also more and more tending towards miniaturized pursuing more high performance while.Higher performance often means higher caloric value, as: the central processing unit (CPU) in computer system and image processor, they also bring higher caloric value while bringing higher operational capability; And the miniaturization of electronic product impels arranging of interiors of products components and parts to become more tight, this is unfavorable for cooling electronic component.Based on this development trend, traditional meal heat-conducting type radiator gradually cannot meet the radiating requirements of high-performance electronic components and parts.
For meeting the radiating requirements of high-performance electronic components and parts, the technical staff in industry proposes a lot of technical schemes, as electronic cooling (also known as semiconductor refrigerating), water-cooling and heat pipe heat radiation etc.Wherein, electronic cooling is that the heat produced by the cold junction absorption thermal source of semiconductor chilling plate is discharged by hot junction again, but the heat in semiconductor chilling plate hot junction still could need leave by traditional radiator fast, its refrigeration is subject to the greatly restriction of traditional heat sinks radiating effect ground.Water-cooling needs to utilize water pump, heat exchanger and conduit to build complicated water circulation system, takes up room large, and be unfavorable for electronic product ground Miniaturization Design, and water-cooling heat radiating system is complicated because pipeline connects, interface is many, has larger risk of leakage.
Publication number is that the application for a patent for invention of CN101240984A discloses one " heat-pipe radiator ", this heat-pipe radiator comprises the heat-transfer device be made up of with the U-shaped heat pipe being interposed in heat-conducting block inside heat-conducting block, described heat-conducting block is made up of at the upper cover of submounts with covering base, be provided with the conduit of evaporation section bottom sandwiched U-shaped heat pipe between base and upper cover, the condensation segment that U-shaped heat pipe both sides are vertical is arranged with one group of radiating fin.During use by the bottom surface of heat-conducting block base and the heat pipe package that exposes from bottom surface jointly to the surface being affixed on electronic devices and components, jointly absorb by heat-conducting block base and the shell to expose from bottom surface the heat that electronic devices and components produce, and transfer heat to radiating fin fast by U-shaped heat pipe and distribute.Because heat pipe has the heat conduction efficiency far above metal, so the radiating efficiency of heat-pipe radiator in the application will far above conventional metals heat-transfer radiator.
But above-mentioned heat-pipe radiator still has the following disadvantages:
1, the evaporation section bottom U-shaped heat pipe is interposed among the conduit between the base of heat-conducting block and upper cover, this needs high machining accuracy to ensure to closely cooperate between the shell of U-shaped heat pipe evaporator section and conduit, if coordinate defective tightness and leave gap the heat transfer efficiency between heat-conducting block and heat pipe will inevitably be caused to decline.
2, radiator work and idle variations in temperature are very large, and the evaporation section of U-shaped heat pipe expands with heat and contract with cold and easily causes unclamping between heat-conducting block base and upper cover under this large temperature difference, and then U-shaped heat pipe is loosened.
3, every a slice radiating fin is set on the condensation segment on U-shaped heat pipe both sides all simultaneously, when evaporation section is heated will inevitably because of expansion slight expansion, make two condensation segments mutually away from, now because the restriction of radiating fin will inevitably cause the coupling part of evaporation section and condensation segment to be out of shape, the serious connection that even can destroy radiating fin and evaporation section, thus the radiating effect reducing radiator.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of U-shaped plate-type heat-pipe radiator, and this U-shaped plate-type heat-pipe radiator has the advantage that processing is simple, reliability is high.
The technical scheme that the utility model solves the problems of the technologies described above is:
A kind of U-shaped plate-type heat-pipe radiator, this U-shaped plate-type heat-pipe radiator comprises heat-transfer device and fin radiating block, it is characterized in that,
Described heat-transfer device is U-shaped plate-type heat-pipe, and described U-shaped bottom is evaporation section, and dual-side is condensation segment;
Described fin radiating block is four pieces, and wherein two pieces are clamped on a side of U-shaped plate-type heat-pipe, and another two pieces are clamped on another side of U-shaped plate-type heat-pipe; Each fin radiating block is made up of the fin that the base plate of the condensation segment side being attached to U-shaped plate-type heat-pipe is parallel with the evaporation section of U-shaped plate-type heat-pipe with a group that extends laterally from base plate.
For strengthening the radiating effect of fin radiating block, an improvement project of the present utility model is: also comprise a radiator fan, this radiator fan is located at the side of four pieces of fin radiating blocks, and the rotation centerline of its flabellum is between middle two pieces of fin radiating blocks and the fin be parallel on fin radiating block.
The utility model has following beneficial effect compared to prior art:
1, due to directly using U-shaped plate-type heat-pipe as heat-transfer device, eliminate that to have the heat conduction that very high degree of precision requires fast, therefore the utility model has the simple advantage of processing.
2, the base described in prior art and upper cover has been abandoned, the evaporation section of U-shaped plate-type heat-pipe is directly attached on thermal source, therefore, not only increase heat exchange efficiency, and greatly reduce cause heat pipe to loosen because expanding with heat and contract with cold and there is destructive deformation between heat pipe and radiating fin may.
Accompanying drawing explanation
Fig. 1 ~ 3 are the structural representation of a specific embodiment of the present utility model, and wherein, Fig. 1 is front view (half section), and Fig. 2 is left view, and Fig. 3 is vertical view.
Fig. 4 is the perspective view of Fig. 1 ~ 3 illustrated embodiment.
Fig. 5 is the decomposing schematic representation of Fig. 1 ~ 3 illustrated embodiment.
Fig. 6 is the perspective view of U-shaped plate-type heat-pipe in the illustrated embodiment of Fig. 1 ~ 3.
Embodiment
See Fig. 1 ~ 4, the U-shaped plate-type heat-pipe radiator in this example comprises U-shaped plate-type heat-pipe 1, four pieces of fin radiating blocks 2 as heat-transfer device and radiator fan 3.
See Fig. 6 and composition graphs 1 and 5, the bottom of described U-shaped plate-type heat-pipe 1 is evaporation section 1-1, and dual-side is condensation segment 1-2.
See Fig. 1 and 4 composition graphs 5, described four pieces of fin radiating blocks 2, wherein two pieces are clamped to a side of U-shaped plate-type heat-pipe 1, another two pieces of another sides being clamped to U-shaped plate-type heat-pipe 1.Each fin radiating block 2 is made up of the fin 2-2 that the base plate 2-1 be attached on the condensation segment 1-2 sidewall of U-shaped plate-type heat-pipe 1 is parallel with described evaporation section 1-1 with a group that extends laterally from base plate 2-1; The side that the base plate 2-1 of described four pieces of fin radiating blocks 2 is attached to condensation segment 1-2 be all vertically provided with one with the groove 2-5 of corresponding condensation segment 1-2 mating shapes, each condensation segment 1-2 is all sandwiched in groove 2-5 between by two pieces of fin radiating blocks 2 of correspondence, is linked together between this two fins radiating block 2 by spot welding.The bottom laying respectively at the base plate 2-1 of two pieces of fin radiating blocks 2 outside described two condensation segment 1-2 extends a fixed head 2-3 parallel with described evaporation section 1-1 all laterally, and each fixed head 2-3 is provided with two screw hole 2-4 in order to wear screw fixed heat sink.
See Fig. 1 ~ 4 composition graphs 5, described radiator fan 3 is located at the side of four pieces of fin radiating blocks 2, and the rotation centerline of its flabellum is between middle two pieces of fin radiating blocks 2 and the fin 2-2 be parallel on fin radiating block 2.
Claims (2)
1. a U-shaped plate-type heat-pipe radiator, this U-shaped plate-type heat-pipe radiator comprises heat-transfer device and fin radiating block, it is characterized in that,
Described heat-transfer device is U-shaped plate-type heat-pipe, and described U-shaped bottom is evaporation section, and dual-side is condensation segment;
Described fin radiating block is four pieces, and wherein two pieces are clamped on a side of U-shaped plate-type heat-pipe, and another two pieces are clamped on another side of U-shaped plate-type heat-pipe; Each fin radiating block is made up of the fin that the base plate of the condensation segment side being attached to U-shaped plate-type heat-pipe is parallel with the evaporation section of U-shaped plate-type heat-pipe with a group that extends laterally from base plate.
2. the U-shaped plate-type heat-pipe radiator of one according to claim 1, it is characterized in that, also comprise a radiator fan, this radiator fan is located at the side of four pieces of fin radiating blocks, and the rotation centerline of its flabellum is between middle two pieces of fin radiating blocks and the fin be parallel on fin radiating block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520845535.9U CN205071592U (en) | 2015-10-27 | 2015-10-27 | U template formula heat pipe cooling ware |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520845535.9U CN205071592U (en) | 2015-10-27 | 2015-10-27 | U template formula heat pipe cooling ware |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205071592U true CN205071592U (en) | 2016-03-02 |
Family
ID=55398087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520845535.9U Expired - Fee Related CN205071592U (en) | 2015-10-27 | 2015-10-27 | U template formula heat pipe cooling ware |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205071592U (en) |
-
2015
- 2015-10-27 CN CN201520845535.9U patent/CN205071592U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160302 Termination date: 20211027 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |