CN102889817A - Heat sink adaptor - Google Patents

Heat sink adaptor Download PDF

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Publication number
CN102889817A
CN102889817A CN2012102513506A CN201210251350A CN102889817A CN 102889817 A CN102889817 A CN 102889817A CN 2012102513506 A CN2012102513506 A CN 2012102513506A CN 201210251350 A CN201210251350 A CN 201210251350A CN 102889817 A CN102889817 A CN 102889817A
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CN
China
Prior art keywords
radiator
adapter
pedestal
protuberance
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012102513506A
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Chinese (zh)
Inventor
乔纳森·罗伯特·霍尔曼
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Nidec Control Techniques Ltd
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Nidec Control Techniques Ltd
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Filing date
Publication date
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Publication of CN102889817A publication Critical patent/CN102889817A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Abstract

An adaptor is provided for use with the heat sink, said heat sink comprising a base for contacting a heat source and a plurality of protrusions extending from said base. The adaptor itself comprises a base and a structure projecting therefrom. The structure is arranged to mate with one or more protrusions on the heat sink to enable heat transfer by conduction from the heat sink to the adaptor.

Description

The radiator adapter
Technical field
The present invention relates to the adapter for radiator.
Background technology
Radiator is the well-known equipment that cooling produces other devices of high temperature that is used in many industries.Term " radiator " is commonly used to describe the heat that will produce is delivered to fluid by convection current any parts or device in solid equipment, fluid for example is liquid or air.Radiator is used for refrigeration system and air-conditioning system, also is used for cooling to comprise many electronic devices and the photoelectric device of computer CPU (CPU ' s) and other processors.
Fig. 1 illustrates typical radiator 100.Radiator 100 comprises pedestal 102 and the fin 104 of outwards giving prominence to from pedestal 102.In the radiator 100 shown in Fig. 1, fin 104 is substantially vertically outstanding from the upper surface of pedestal 102.Each fin 104 is relatively thin, so that a plurality of fin 104 can be arranged on the upper surface of pedestal 102 in the gapped mode of tool between the adjacent fin 104.Each fin 104 comprises the large surface of the first and second substantially flats respect to one another.Large surface among Fig. 1 is rectangle substantially.
Other structures that are different from the radiator shown in Fig. 1 are well-known.For example, the fin in the radiator can be substantially vertically not outstanding from pedestal.Alternatively, fin can be outstanding with different angles, to form enlarging shape or fan-shaped fin arrangement.Alternately or additionally, a plurality of needle-like section can be used for the fin on the basic plane shown in the alternate figures 1.In a word, the purpose of fin or needle-like section is to form large as far as possible surf zone in given volume in the radiator.This surf zone is used for from the towards periphery heat transmission of fluid of radiator.
At work, the pedestal of radiator is set to contact as thermal source and produces the equipment of high temperature, heat from this equipment by diversion.Pedestal can be set to contact with the thermal source direct physical.Selectively, heat-conducting glue or thermal grease conduction can be added on the pedestal of radiator, to improve its hot property.Heat is directed leaving the fin that thermal source enters in the pedestal and passes radiator.Then, described heat energy is enough is sent to fluid on every side by convection current from radiator.The surf zone of the increase of fin promotes the towards periphery transmission of fluid of heat.In addition, by convection current towards periphery fluid the heat transmission can by around the radiator particularly the mobile of fluid in the gap between the fin at radiator be enhanced.For example can utilize fan to promote fluid between the fin of radiator.
Although existing radiator is widely used and is very useful aspect heat of cooling generation device,, existing radiator is confined to cool off by thermal convection current.The Basic Design that has radiator now is not being carried out in the situation of great change, radiator can not be with any other refrigerating mode work.The cooling system that is difficult to comprise radiator be configured in the situation that not more heat exchange radiator use with different mode of operations.Therefore, limited the many suitable application of traditional heat-dissipating device.
For example, the traditional heat-dissipating device is not suitable in the following environment, " the forcing the air cooling " that comprises particulate (wood, stone, fiber etc.) is provided providing in this environmental air, because As time goes on, these particulates may block the fan that makes air circulation and the fin of radiator, have reduced the efficient of radiator.The traditional heat-dissipating device is not suitable in the following environment usually yet, in this environment, need waterproof, the gas shield or dustproof of height, because this need to be installed in radiator in the can, this has limited the supply of the cold air that is supplied to radiator, has therefore reduced the efficient of radiator.
Summary of the invention
At this invention is described.
According to an aspect, a kind of adapter for using with radiator is provided, described radiator comprises for the pedestal of contact thermal source and a plurality of extensions that extend from described pedestal.Adapter self comprises pedestal and from the outstanding structure of pedestal, and wherein, this structure is arranged to cooperate with one or more extension on the radiator, with can be by the heat transmission of conduction realization from radiator to adapter.Preferably, at least one surface of the structure on the adapter can with radiator on the surface of extension directly contact so that can be by conducting the heat transmission of realization from radiator to adapter.This structure can comprise protuberance, fin or the needle-like section of extending from the pedestal of adapter.Alternately, this structure can for be positioned at wherein recess or the basic entity of groove, the extension on the radiator can be inserted in described recess or the groove.Adapter can be sent to another position or cooling system by many different thermaltransmission modes with its heat of collecting from radiator.
According to an aspect, provide a kind of cooling system for thermal source.This cooling system comprises radiator, and radiator comprises be used to contacting thermal source and guiding the pedestal of hot stow away from heat and a plurality of extensions that extend from the described pedestal of radiator.Cooling system also comprises adapter, adapter comprises pedestal and the structure of giving prominence to from pedestal, wherein, the structure on the adapter is arranged to cooperate with one or more extension on the radiator, realizing heat transmission from from radiator to adapter by conduction.
According to another aspect, a kind of method of the radiator of transferring is provided, described radiator comprises for the pedestal of contact thermal source and a plurality of extensions that extend from this pedestal.The method comprises adapter is assembled to radiator, and wherein, this adapter comprises pedestal and from the outstanding structure of described pedestal.When adapter was assembled on the radiator, the structure on the adapter cooperated with one or more extension on the radiator, realizing heat transmission from from radiator to adapter by conduction.Then, can utilize any suitable hot Transfer Technology to guide heat away from adapter.
According to another aspect, provide a kind of method of heat being transmitted stow away from heat.The method comprises makes radiator contact with thermal source, and described radiator comprises for the pedestal of contact thermal source and a plurality of extensions that extend from described pedestal.The method also comprises adapter is assembled to radiator, wherein, adapter comprises pedestal and the structure of giving prominence to from described pedestal, wherein, adapter is assembled to radiator comprises that the structure that makes on the adapter cooperates with one or more extension on the radiator, realizing heat transmission from from radiator to adapter by conduction.Selectively, the method can comprise that also the pedestal that makes the stow away from heat of adapter when radiator contacts with adapter contacts with external component.This external component can be cooling device.
Description of drawings
To embodiment and example be described about the following drawings now, wherein:
Fig. 1 illustrates the example of existing finned radiator;
Fig. 2 illustrates the example for the radiator adapter that is combined with Fig. 1 radiator;
Fig. 3 illustrates the adapter of the Fig. 2 that links to each other with radiator;
Fig. 4 illustrates the plane of the adapter of the Fig. 2 that links to each other with radiator.
The specific embodiment
In general introduction, be provided for the adapter that uses with radiator.Especially, adapter can use with finned radiator.Adapter cooperates with radiator, so that heat energy is enough by in conduction is from the heat sink to the adapter.Preferably, at least one surface of adapter should directly contact the surface of radiator, can realize this conduction.Increase the size that adapter directly contacts the surf zone of radiator, can increase the degree that the heat between adapter and the radiator is transmitted.Adapter has the structure that can comprise fin or other protuberances, and fin or other protuberances are inserted into such as in the gap between the extension of the fin on the radiator, are sent in the adapter from these extensions so that heat energy is enough.
The physique of adapter is mainly decided by physical size and the shape of the radiator that therewith uses.Adapter must cooperate with radiator, preferably, adapter and radiator should be locked together.Adapter has pedestal at its far-end away from the thermal source that contacts with radiator.Preferably, the outmost surface of pedestal is substantially flat.This set be so that adapter can be connected to other external components, for example other cooling devices.Adapter can also comprise built-in cooling or heat transfer component, for example the topping up pipe.
Can understand better radiator adapter disclosed herein about accompanying drawing.As above described in the background technology part, Fig. 1 illustrates typical existing finned radiator 100.Fig. 2 illustrates this radiator of aiming at the adapter 200 that uses with radiator.
Adapter 200 shown in Fig. 2 comprises pedestal 202 and a series of fin or other protuberances 204 that extend from pedestal 202.In the adapter shown in Fig. 2, protuberance 204 substantially vertically extends from the surface of pedestal 202.Each protuberance 204 is rectangle and relatively thin substantially on cross section, and protuberance 204 has two large surfaces respect to one another, to above similar about the described fin of known radiator 100 104.Because the adapter shown in Fig. 2 200 is used for using with existing finned radiator, example is finned radiator as shown in Figure 1, and the thickness of the protuberance 204 in the adapter should be set in the gap between the adjacent fin 104 that is assemblied in the radiator 100 ideally.From Fig. 3 and 4 that the adapter 200 that links to each other with radiator 100 is shown, can deepen the understanding to this.
Adapter 200 can comprise suitably sets size and isolated enough protuberances 204, be assemblied between the fin 104 in the radiator 100 in one gap, as shown in Fig. 2 to 4.The fin of this " every one " between radiator 100 and the adapter 200 is arranged so that fin 104 can move slightly when the fin 104 of radiator 100 receives the protuberance 204 that approaches from adapter.Alternately, adapter 200 can have enough protuberances 204, in order to be assemblied in each gap between the fin 104 in the radiator 100 or only be assemblied in some gaps.
Protuberance 204 in embodiment provides the frictional fit between adapter 200 and the radiator 100, to guarantee good surf zone contact.As long as between radiator 100 and adapter 200, guarantee that sufficient surf zone contacts, so that adapter 200 can conduct enough heat from radiator 100 for given situation, just can adopt any suitable configuration of protuberance 204.
Adapter 200 can be aimed at the fin of radiator 100 as illustrated in fig. 2, and is inserted into shown in Fig. 3 and 4 in the radiator 100 and is connected with formation.Radiator 100 and adapter 200 combinations are to form cooling system.
According to an embodiment, when adapter 200 cooperated with radiator, the institute that adapter 200 can not occupy between the fin of radiator was gapped, in order to some spaces are still arranged, is used for air or other flow supercooling systems.This is so that cooling system utilizes convection current to cool off at least in part, and, therefore not exclusively rely on heat from radiator 100 to adapter 200 conduction in case with thermal steering away from radiator 100.
The surface of the protuberance 204 on the adapter 200 should as far as possible closely be assemblied on the corresponding fin 104 of radiator, and heat is transmitted in the adapter 200 from radiator thus.The shape of the protuberance 204 on the adapter 200 and directed also should as far as possible closely mate with shape and the orientation of the fin 104 of radiator, so that adapter 200 can easily be assembled together with radiator, and so that large common surface zone is provided for the conduction of heat from the fin 104 of radiator to the protuberance 204 of adapter 200.
Adapter 200 should be designed to therewith the radiator that uses large as far as possible contact surface is provided, with maximization by conduction heat transmission of 200 from radiator to adapter.For example, as shown in Figure 4, the adapter 200 shown in Fig. 2 and 3 provides three contact surfaces for each fin 104 of radiator, and heat can be sent in the adapter 200 from radiator by conduction via these contact surfaces.
As shown in Figure 3, adapter 200 can pass through any suitable device, and for example bolt 206, are fixed on the radiator 100.The method that connects should be preferably interim, be reversible, rather than permanent, so that adapter 200 is being applicable to can be assembled to existing radiator when some is used, and other the time remove from radiator, and do not need arbitrary equipment is carried out any great change.According to an embodiment, screw is used for adapter 200 is fixed to radiator, and wherein, the screw thread of screw can form screw thread in the wall of the fin of radiator during inserting.
Except above-mentioned protuberance 204, the adapter 200 shown in Fig. 2 to 4 comprises pedestal 202.In the protuberance 204 each all terminates in pedestal 202 places, and the most of heat that therefore are transmitted in the adapter 200 from radiator will be directed to pedestal 202.As shown in Figure 4, ideally, pedestal 202 should have the outer surface of substantially flat, and the outer surface of substantially flat is surperficial relative with protuberance 204 extensions.The surface of described substantially flat is used as adapter 200 and for example is the flat surfaces that contacts between the external component of cooling device.Perhaps can between adapter 200 and cooling device, form the physical connection of another kind of type.For example, cooling device can be water-filled radiator, air cooling plate or " cold drawing " cooling device.As known in the art, this cooling device can not be used for directly contacting with the traditional heat-dissipating device, and example is as shown in Figure 1 only by transmitting the radiator of heat to flowing to fluid.Yet, if adapter 200, the adapter shown in Fig. 2 to 4 for example, be used for being combined with the traditional heat-dissipating device, be positioned at the centre of radiator and air-cooling system, these cooling devices (and miscellaneous part) can be successfully used to be combined with the traditional heat-dissipating device, and needn't for good and all change the design of radiator or cooling device itself.Therefore, adapter has increased the validity of radiator and the range of application that can use radiator.
Be used for deriving the heat thus except connecting external refrigeration equipment, adapter 200 can comprise the heat that build-in components is collected from radiator to process removal adapter 200.According to an embodiment, one or more conduit embeds in the adapter 200.Described conduit can comprise can flow out through conduit liquid or other fluids of adapter 200, thereby removes heat from adapter.The setting of the conduit in the adapter 200 also can be the part of gas compression system, so that the cooling owing to fluid phase change to be provided.The energy requirement of the phase transformation from liquid to gas in the conduit siphons away heat from adapter effectively.
Must be included in situation in the can for product to be cooled, the radiator adapter can provide the physics cooling " bridge " to the outside of shell, and the more supply of air, liquid or other cooling mediums can be provided in the outside of shell.
Adapter 200 can be made by any suitable material or the combination of material.Material should provide good thermal conductivity.For example, adapter can comprise aluminium, copper, other iron content or non-ferrous metal or glass.
Above-mentioned and be the cold drawing adapter at the special adapter shown in Fig. 2 to 4, it is designed to and the assembling of the finned radiator shown in Fig. 1, and this finned radiator has the fin of showing greatly the basic rectangle that extends from the pedestal of radiator at the right angle.Yet according to the same principle in conjunction with other designs of radiator, other adapters can be designed and can operate.For example, if radiator has from the outstanding enlarging shape of its pedestal or angled fin brokenly, then the size of the protuberance of adapter, shape and orientation can suitably be configured to mate enlarging shape or angled fin brokenly, so that protuberance is assemblied in the gap between the adjacent fin preferably, and has the exhibiting high surface zone that shares with fin, to be provided for heat is transmitted to from radiator the thermo-contact surface of adapter.Similarly, if radiator comprises the extension of another kind of type, for example from the needle-like section that pedestal extends, adapter can comprise that the protuberance of suitably setting size and shaping is to mate these extensions.For example, can provide cylindrical projection, the needle-like section of radiator can be inserted in the cylindrical projection, is used for heat is transmitted to adapter from radiator.Alternately, adapter can comprise be positioned at wherein ditch or the solid block of groove, the extension of radiator can be inserted in described ditch or the groove.
As mentioned above, the pedestal of adapter can be assembled to or can additionally contact external component, for example another cooling device in any suitable mode.For example, conduit or other pipelines can be used for heat is delivered to from adapter 200 air cooling radiator, water-cooling system, condensed gas system or any other suitable cooling device in other places.Therefore, traditional heat-dissipating device (when using together with adapter 200) can be more general.For example, replace utilize forced air cooling be used for the air that adopts comprise the efficient that may block fin along with the past of time and therefore reduce radiator particulate environment cooling traditional heat-dissipating device be, adapter can be engaged in the gap between the fin of radiator and be used for thermal steering away from radiator, and need to not urge the air of filling particulate around radiator.When needs are installed in radiator in the can, in needs height waterproof, gas shield or dustproof environment, limited the supply of the cold air that is supplied to radiator, therefore reduced the efficient of radiator, adapter can utilize conduction to replace convection current, heat is removed and send it to other places from radiator, and do not change existing radiator.
Therefore, can see, adapter is very useful to the existing cooling system that upgrade to rely on the traditional heat-dissipating device, and so that existing cooling system is more useful and effective, and heat exchange radiator more.Therefore, adapter is the effective solution of cost of avoiding existing system is produced physical damage.Also can make expediently adapter in conjunction with new radiator, therefore, improve the potential availability of radiator.According to special application or the environment of adapter to be used, adapter can comprise the internal cooling parts and/or can be connected to the external refrigeration parts, thus in any suitable manner with thermal steering away from radiator and associated heat source.Therefore, adapter can be used in wider environment so that comprise the existing equipment of radiator.
Although the above has provided some concrete examples of using radiator, the adapter of describing herein can be combined with radiator, is used for any suitable application that heat must be transmitted stow away from heat.Adapter can be any suitable size, shape and structure, in order to physically cooperate and satisfy the needs of thus transmission heat with radiator.Adapter can be designed, manufactured and/or supply with the radiator of cooperation, maybe can reequip existing radiator.By realizing heat from the conduction of traditional heat-dissipating device rather than rely on convection current, and do like this by the simple directly mode with the permanent change that do not need existing radiator, provide very useful and practical solution by adapter.

Claims (19)

1. one kind is used for the adapter (200) that uses with radiator, and described radiator comprises that wherein, described adapter (200) comprising for the pedestal of contact thermal source and a plurality of extensions that extend from described pedestal:
Pedestal (202); And
From the outstanding structure (204) of described pedestal (202);
Wherein, described structure (204) is arranged to cooperate with one or more extension on the radiator, realizing heat transmission from from described radiator to described adapter (200) by conduction.
2. adapter according to claim 1 (200), wherein, described structure (204) comprises a plurality of protuberances that extend from the described pedestal (202) of described adapter (200).
3. adapter according to claim 2 (200), wherein, described protuberance (204) comprises fin.
4. adapter according to claim 3 (200), wherein, the cross section of described fin (204) is basic rectangle.
5. each described adapter (200) in 4 according to claim 2, wherein, described protuberance (204) substantially vertically extends from the surface of described pedestal (202).
6. each described adapter (200) in 4 according to claim 2, wherein, described protuberance (204) is arranged from the surface of described pedestal (202) with enlarging shape and is extended.
7. each described adapter (200) in 6 according to claim 1, wherein, at least one surface of the described a plurality of extensions that extend from the described pedestal of radiator is arranged to contact at least one surface of described structure (204), can realize the heat conduction from described radiator to described adapter (200).
8. each described adapter in 7 according to claim 2, wherein, in the described protuberance (204) at least one is arranged to be assemblied in the gap between the adjacent extension on the radiator, so that the assembling that cooperates between described radiator and the described adapter (200) to be provided.
9. each described adapter (200) in 8 according to claim 1, wherein, described adapter also comprises built-in cooling-part.
10. adapter according to claim 9 (200), wherein, described built-in cooling-part comprises the pipeline of fill fluid.
11. each described adapter (200) in 10 according to claim 1, wherein, described pedestal (202) is arranged to be connected to the external refrigeration parts, is used for the heat transmission from described adapter (200) to described external refrigeration parts.
12. a cooling system that is used for thermal source, described cooling system comprises:
Radiator (100), described radiator (100) comprise for the pedestal (102) of contact thermal source and a plurality of extensions (104) that extend from described pedestal (102); And
According to claim 1, each described adapter (200) in 11, described adapter (200) cooperate with described radiator (100) and contact.
13. the method for a switching radiator (100), described radiator (100) comprises for the pedestal (102) of contact thermal source and a plurality of extensions (104) that extend from described pedestal (102), wherein, described method comprises adapter (200) is assembled on the described radiator (100), described adapter (200) comprises pedestal (202) and the structure (204) of giving prominence to from described pedestal (202), wherein, described assembling comprises that the described structure (204) that makes on the described adapter (200) cooperates with one or more extension (104) on the described radiator (100), realizing heat transmission from from described radiator (100) to described adapter (200) by conduction.
14. method according to claim 13, wherein, the described step that the described structure (204) on the described adapter (200) is cooperated with one or more extension (104) on the described radiator (100) comprises at least one Surface Contact of at least one surface of making described structure (204) and described a plurality of extensions (104).
15. according to claim 13 or 14 described methods, wherein, described structure (204) on the described adapter (200) comprises a plurality of protuberances, and the described step that described structure (204) is cooperated with one or more extension (104) on the described radiator (100) comprises in described a plurality of protuberances at least one is inserted in the gap between the adjacent extension (104) on the described radiator (100).
16. method according to claim 15, wherein, the size and dimension of described at least one protuberance (204) is set as so that when described protuberance (204) was inserted in the described gap between the adjacent extension (104) on the described radiator (100), the upper surface of described protuberance (204) contacted with the described pedestal of described radiator (100).
17. according to claim 15 or 16 described methods, wherein, the size and dimension of described at least one protuberance (204) is set as so that when described protuberance (204) is inserted in the described gap between the adjacent extension (104) on the described radiator (100), and one side surface in the described adjacent extension (104) on the side surface of described protuberance (204) and the described radiator (100) contacts.
18. each the described method in 17 also comprises described adapter (204) is connected to the external refrigeration parts according to claim 13, is used for heat is delivered to described external refrigeration parts from described adapter (200).
19. substantially as described herein or adapter as depicted in the figures, cooling system, equipment or method.
CN2012102513506A 2011-07-21 2012-07-19 Heat sink adaptor Pending CN102889817A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1112598.6A GB2493019A (en) 2011-07-21 2011-07-21 Heat sink adaptor or cooling hat
GB1112598.6 2011-07-21

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GB (1) GB2493019A (en)

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FR3019439A1 (en) * 2014-03-26 2015-10-02 Labinal Power Systems ELECTRONIC DEVICE COMPRISING AN IMPROVED THERMAL INTERFACE
JP6378299B2 (en) 2016-12-14 2018-08-22 ファナック株式会社 heatsink

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