GB201112598D0 - Heat sink adaptor - Google Patents

Heat sink adaptor

Info

Publication number
GB201112598D0
GB201112598D0 GBGB1112598.6A GB201112598A GB201112598D0 GB 201112598 D0 GB201112598 D0 GB 201112598D0 GB 201112598 A GB201112598 A GB 201112598A GB 201112598 D0 GB201112598 D0 GB 201112598D0
Authority
GB
United Kingdom
Prior art keywords
heat sink
adaptor
base
heat
sink adaptor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB1112598.6A
Other versions
GB2493019A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Control Techniques Ltd
Original Assignee
Control Techniques Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Control Techniques Ltd filed Critical Control Techniques Ltd
Priority to GB1112598.6A priority Critical patent/GB2493019A/en
Publication of GB201112598D0 publication Critical patent/GB201112598D0/en
Priority to CN2012102513506A priority patent/CN102889817A/en
Priority to US13/554,613 priority patent/US20130020050A1/en
Publication of GB2493019A publication Critical patent/GB2493019A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

An adaptor is provided for use with the heat sink, said heat sink comprising a base for contacting a heat source and a plurality of protrusions extending from said base. The adaptor itself comprises a base and a structure projecting therefrom. The structure is arranged to mate with one or more protrusions on the heat sink to enable heat transfer by conduction from the heat sink to the adaptor.
GB1112598.6A 2011-07-21 2011-07-21 Heat sink adaptor or cooling hat Withdrawn GB2493019A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB1112598.6A GB2493019A (en) 2011-07-21 2011-07-21 Heat sink adaptor or cooling hat
CN2012102513506A CN102889817A (en) 2011-07-21 2012-07-19 Heat sink adaptor
US13/554,613 US20130020050A1 (en) 2011-07-21 2012-07-20 Heat Sink Adaptor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1112598.6A GB2493019A (en) 2011-07-21 2011-07-21 Heat sink adaptor or cooling hat

Publications (2)

Publication Number Publication Date
GB201112598D0 true GB201112598D0 (en) 2011-09-07
GB2493019A GB2493019A (en) 2013-01-23

Family

ID=44652140

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1112598.6A Withdrawn GB2493019A (en) 2011-07-21 2011-07-21 Heat sink adaptor or cooling hat

Country Status (3)

Country Link
US (1) US20130020050A1 (en)
CN (1) CN102889817A (en)
GB (1) GB2493019A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9594222B2 (en) * 2013-02-28 2017-03-14 Mitsubishi Electric Corporation Heat dissipation structure and optical transceiver
FR3019439A1 (en) * 2014-03-26 2015-10-02 Labinal Power Systems ELECTRONIC DEVICE COMPRISING AN IMPROVED THERMAL INTERFACE
JP6378299B2 (en) 2016-12-14 2018-08-22 ファナック株式会社 heatsink

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5083373A (en) * 1986-04-25 1992-01-28 Hamburgen William R Method for providing a thermal transfer device for the removal of heat from packaged elements
US5052481A (en) * 1988-05-26 1991-10-01 International Business Machines Corporation High conduction cooling module having internal fins and compliant interfaces for vlsi chip technology
US5014117A (en) * 1990-03-30 1991-05-07 International Business Machines Corporation High conduction flexible fin cooling module
US5291371A (en) * 1990-04-27 1994-03-01 International Business Machines Corporation Thermal joint
JP2926537B2 (en) * 1994-12-15 1999-07-28 株式会社日立製作所 Multi-chip module cooling system
US6190945B1 (en) * 1998-05-21 2001-02-20 Micron Technology, Inc. Integrated heat sink
JPH11354954A (en) * 1998-06-10 1999-12-24 Fujitsu Ltd Electronic device
US6396693B1 (en) * 2000-08-24 2002-05-28 Ming Fa Shih Heat sink
US7616444B2 (en) * 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers

Also Published As

Publication number Publication date
US20130020050A1 (en) 2013-01-24
CN102889817A (en) 2013-01-23
GB2493019A (en) 2013-01-23

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)