CN205016385U - High reliability piece formula ceramic dielectric capacitor - Google Patents
High reliability piece formula ceramic dielectric capacitor Download PDFInfo
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- CN205016385U CN205016385U CN201520320448.1U CN201520320448U CN205016385U CN 205016385 U CN205016385 U CN 205016385U CN 201520320448 U CN201520320448 U CN 201520320448U CN 205016385 U CN205016385 U CN 205016385U
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Abstract
The utility model relates to an electronic component field discloses a high reliability piece formula ceramic dielectric capacitor, including pottery porcelain core piece, insulating material shell and with two pins of pottery porcelain core chip bonding, title page portion and overhanging portion are separated into by the insulating material shell to the pin, title page portion and overhanging portion link to each other through the linkage segment, the title page portion of pin is including the section of bending of welding the section and comprising outer book section, the section of keeping away from and infolding section, the face of weld of welding section and being laminated by the inner electrode of pottery porcelain core piece, it forms the packing space to bend between the duan yutao porcelain core piece, the overhanging portion of pin is equipped with the fluting including the oblique decurrent leg section that supports the section and go out from the bottom horizontal extension who supports the section in this leg section, can effectively avoid the not hard up circumstances of welded structure of the inside pin of condenser through above design, and it is more convenient, reliably to make electric outside the container pin weld with other component connection the time simultaneously.
Description
Technical field
The utility model relates to electronic component technology field, is specifically related to a kind of high reliability chip ceramic capacitor.
Background technology
The ceramic capacitor of current production is all the surfaces two pins being welded in ceramic chip, then at ceramic chip outer cladding one deck insulation material layer.The pin be coated in insulating material housing is directly welded on the interior electrode of ceramic chip, and the pin portions outside insulating material housing is then to the same plane bending of insulating material housing.The ceramic capacitor product of this belt length pin can not be applicable to surface and install, and meanwhile, the ceramic capacitor product strength being suitable for installing on surface is poor, easily produces the defects such as cracking or fragmentation by external force and product stress influence.
Utility model content
The utility model is for the disappearance of prior art existence, and provide a kind of internal structure to stablize, outside weldings is high reliability chip ceramic capacitor conveniently and solidly.
For reaching above-mentioned purpose, the technical solution adopted in the utility model is as follows:
A kind of high reliability chip ceramic capacitor, comprise ceramic chip, insulating material housing and two pins be welded and fixed with ceramic chip, described pin is separated into interior envelope portion and over-hang part by insulating material housing, described interior envelope portion is connected by linkage section with over-hang part, the interior envelope portion of described pin comprises welding section and by outer trisection, away from the bending section that section and interior trisection are formed, the solder side of described welding section and being fitted by interior electrode of ceramic chip, packing space is formed between described bending section and ceramic chip, the leg section that the over-hang part of described pin comprises supporting section obliquely and extends outward from the bottom transverse of supporting section.
As a kind of preferred version, the outer trisection of described pin is rolled over outside ceramic chip surface by welding section end, and trisection end laterally extends away from section outside, and interior trisection is folded to linkage section from the end away from section, and is connected with linkage section.
As a kind of preferred version, in the packing space between the bending section of described pin and ceramic chip, be filled with insulating material.
As a kind of preferred version, described leg section is provided with fluting.
As a kind of preferred version, described fluting penetrates into supporting section bottom.
As a kind of preferred version, the slab construction that described leg Duan Weiwu slots
As a kind of preferred version, described packing space is the surface of ceramic chip and away from the space between section, the surface of described ceramic chip is 0 ~ 3mm to the distance away from section.
As a kind of preferred version, described ceramic chip is 0.1 ~ 1mm to the distance away from section.
The utility model compared with prior art has obvious advantage and beneficial effect, specifically, by to envelope portion bending in pin, form welding section and bending section, have packing space between bending section and ceramic chip, when insulating material encapsulates capacitor, insulating material can enter in packing space, better positioning action can be played to the pin of capacitor internal, pin and the welded stability of ceramic chip can be improved.Its packing space height only has 0.1 ~ 1mm, highly little, and compact conformation is conducive to the overall volume reducing product.By to the bending of pin over-hang part, form supporting section and leg section, the outside bending of its leg section extends, and can be convenient to SMT attachment, and can facilitate the welding operation that capacitor is connected with other elements.Be provided with fluting in leg section, when welding, scolding tin can flow in the space of fluting, increases the contact area of scolding tin and solder side, capacitor welding is obtained more firm simultaneously.
For more clearly setting forth architectural feature of the present utility model, technological means and the specific purposes reached thereof and function, below in conjunction with accompanying drawing and specific embodiment, the utility model is described in further detail:
Accompanying drawing explanation
Fig. 1 is the cutaway view of the embodiment of the utility model;
Fig. 2 is the pin configuration enlarged drawing of the embodiment of the utility model;
Fig. 3 is the vertical view of the embodiment of the utility model;
Fig. 4 is the vertical view of another embodiment of the utility model;
Accompanying drawing identifier declaration:
10, ceramic chip, 20, insulating material housing, 30, pin,
40, linkage section, 11, by interior electrode 31, interior envelope portion,
32, over-hang part, 311, welding section, 312, outer trisection,
313, away from section, 314, interior trisection, 315, solder side,
321, supporting section, 322, leg section, 323, fluting,
50, packing space.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further illustrated:
First shown in seeing figures.1.and.2, a kind of high reliability chip ceramic capacitor, two pins 30 comprising ceramic chip 10, insulating material housing 20 and be welded and fixed with ceramic chip 10.Described pin 30 is separated into interior envelope portion 31 and over-hang part 32 by insulating material housing 20, and described interior envelope portion 31 is connected by linkage section 40 with over-hang part 32.The interior envelope portion 31 of described pin comprises welding section 311 and by outer trisection 312, the bending section that forms away from section 313 and interior trisection 314.The solder side 315 of described welding section 311 and being fitted by interior electrode 11 of ceramic chip 10, packing space 50 is formed between described bending section and ceramic chip 10, described packing space 50 be ceramic chip 10 surface and away from the space between section 313, the surface of described ceramic chip 10 is 0 ~ 3mm to the distance away from section 313, is preferably 0.1 ~ 1mm.Be filled with insulating material in described packing space 50, because insulating material can enter in packing space 50, better positioning action can be played to the pin of capacitor internal, pin 30 and the welded stability of ceramic chip 10 can be improved.And the height of its packing space 50 only has 0.1 ~ 1mm, highly little, compact conformation, is conducive to the overall volume reducing product.
Wherein, the outer trisection 312 of described pin 30 is rolled over outside ceramic chip 10 surface by welding section 311 end, and trisection 312 end laterally extends away from section 313 outside, and interior trisection 314 is folded to linkage section 40 from the end away from section 313, and is connected with linkage section 40.
The leg section 322 that the over-hang part 32 of described pin comprises supporting section 321 obliquely and extends outward from the bottom transverse of supporting section 321.The outwards bending of its leg section 322, can be convenient to SMT attachment, and can facilitate the welding operation that capacitor is connected with other elements.
As shown in Figure 3, described leg section 322 is provided with fluting 323, and described fluting 323 preferably penetrates into supporting section 321 bottom.When welding, scolding tin can flow in the space of fluting 323, increases the contact area of scolding tin and solder side, capacitor welding is obtained more firm, reliable.
Shown in Fig. 4 is another embodiment of the present utility model, and the difference of itself and previous embodiment is, described leg section 322 is the slab construction without fluting, and during welding, leg section 322 is smooth in connected element surface.
The above, it is only preferred embodiment of the present utility model, not in order to limit the utility model, thus every according to technology of the present utility model actual above embodiment is done any amendment, equivalent replacement, improvement etc., all still belong in the scope of technical solutions of the utility model.
Claims (8)
1. a high reliability chip ceramic capacitor, comprise ceramic chip, insulating material housing and two pins be welded and fixed with ceramic chip, described pin is separated into interior envelope portion and over-hang part by insulating material housing, described interior envelope portion is connected by linkage section with over-hang part, it is characterized in that: the interior envelope portion of described pin comprises welding section and by outer trisection, away from the bending section that section and interior trisection are formed, the solder side of described welding section and being fitted by interior electrode of ceramic chip, packing space is formed between described bending section and ceramic chip, the leg section that the over-hang part of described pin comprises supporting section obliquely and extends outward from the bottom transverse of supporting section.
2. high reliability chip ceramic capacitor according to claim 1, it is characterized in that: the outer trisection of described pin is rolled over outside ceramic chip surface by welding section end, trisection end laterally extends away from section outside, interior trisection is folded to linkage section from away from section end, and is connected with linkage section.
3. high reliability chip ceramic capacitor according to claim 1, is characterized in that: be filled with insulating material in the packing space between the bending section of described pin and ceramic chip.
4. high reliability chip ceramic capacitor according to claim 1, is characterized in that: described leg section is provided with fluting.
5. high reliability chip ceramic capacitor according to claim 4, is characterized in that: described fluting penetrates into supporting section bottom.
6. high reliability chip ceramic capacitor according to claim 1, is characterized in that: the slab construction that described leg Duan Weiwu slots.
7. high reliability chip ceramic capacitor according to claim 1, is characterized in that: described packing space is the surface of ceramic chip and away from the space between section, the surface of described ceramic chip is 0 ~ 3mm to the distance away from section.
8. high reliability chip ceramic capacitor according to claim 7, is characterized in that: described ceramic chip is 0.1 ~ 1mm to the distance away from section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520320448.1U CN205016385U (en) | 2015-05-18 | 2015-05-18 | High reliability piece formula ceramic dielectric capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520320448.1U CN205016385U (en) | 2015-05-18 | 2015-05-18 | High reliability piece formula ceramic dielectric capacitor |
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| Publication Number | Publication Date |
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| CN205016385U true CN205016385U (en) | 2016-02-03 |
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| CN201520320448.1U Active CN205016385U (en) | 2015-05-18 | 2015-05-18 | High reliability piece formula ceramic dielectric capacitor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106018975A (en) * | 2016-07-15 | 2016-10-12 | 吴江佳亿电子科技有限公司 | Measurement device capable of online automatically detecting capacitance of chip high-voltage ceramic dielectric capacitor |
| CN106814093A (en) * | 2016-12-21 | 2017-06-09 | 中国空间技术研究院 | A kind of aerospace nickel electrode ceramic capacitor reliability determines method |
| CN113555636A (en) * | 2020-04-02 | 2021-10-26 | 东电化电子元器件(珠海保税区)有限公司 | Assembly for protecting SMD components against environmental influences |
-
2015
- 2015-05-18 CN CN201520320448.1U patent/CN205016385U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106018975A (en) * | 2016-07-15 | 2016-10-12 | 吴江佳亿电子科技有限公司 | Measurement device capable of online automatically detecting capacitance of chip high-voltage ceramic dielectric capacitor |
| CN106018975B (en) * | 2016-07-15 | 2018-10-09 | 吴江佳亿电子科技有限公司 | A kind of measuring device of energy online automatic detection chip high voltage ceramic capacitor capacitance |
| CN106814093A (en) * | 2016-12-21 | 2017-06-09 | 中国空间技术研究院 | A kind of aerospace nickel electrode ceramic capacitor reliability determines method |
| CN106814093B (en) * | 2016-12-21 | 2019-05-24 | 中国空间技术研究院 | A kind of aerospace determines method with nickel electrode ceramic capacitor reliability |
| CN113555636A (en) * | 2020-04-02 | 2021-10-26 | 东电化电子元器件(珠海保税区)有限公司 | Assembly for protecting SMD components against environmental influences |
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