CN204989258U - PCB test faller subassembly - Google Patents
PCB test faller subassembly Download PDFInfo
- Publication number
- CN204989258U CN204989258U CN201520582269.5U CN201520582269U CN204989258U CN 204989258 U CN204989258 U CN 204989258U CN 201520582269 U CN201520582269 U CN 201520582269U CN 204989258 U CN204989258 U CN 204989258U
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- CN
- China
- Prior art keywords
- needle plate
- pogopin
- faller
- card extender
- register pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a PCB test faller subassembly aims at providing the PCB test faller subassembly that can realize the multiple test probes while to the test point hypodermic needle test of multiple different size of a dimensions. The utility model discloses a pogopin faller (1) back of the body connects pogopin keysets (2) and imbeds fixed arriving on last faller (3) respectively, pogopin faller (1) and between last faller (3) pogopin faller (1) and between pogopin keysets (2), other layer of faller with go up between faller (3), go up faller keysets (5) with install pogopin faller locating pin (6), pogopin keysets locating pin (7) between other layer of faller respectively, go up faller locating pin (8) and last faller keysets locating pin. The utility model discloses be applied to the technical field of PCB test faller.
Description
Technical field
The utility model relates to a kind of test needle plate, particularly a kind of PCB test needle plate assembly.
Background technology
Traditional PCB needle-bar testing apparatus, employing be generally that the mode of pin test under single Pogopin probe or single common test probe carries out pressing test to product.The mode of pin test under single test probe, be generally only applicable to that test point type is single, product test spot size is more or less the same, distribute spacing is reasonable, the simple electronic product of surface encapsulation, its scope of application is relatively narrow.More for product test point kind, the electronic product that size difference is larger, only obviously cannot realize by pin test under single test probe, the particularly electronic product of surface encapsulation micro connector, because the pin test point of connector is little much compared with other testing weld pad, under using test probe of the same race, pin test cannot realize at all, needs to use Pogopin probe.And along with the development of hyundai electronics surface mounting technology, the encapsulation of electronic product surface element device becomes increasingly complex, the kind of pilot to be measured is more and more various, the size difference that result in pilot to be measured is also increasing, therefore, under existing single testing needle, pin measuring technology cannot meet the development trend of existing electronic technology already.
Utility model content
Technical problem to be solved in the utility model overcomes the deficiencies in the prior art, provides a kind of and can realize multiple test probe simultaneously to the PCB test needle plate assembly of pin test under the test point of multiple different size size.
The technical scheme that the utility model adopts is: the utility model comprises Pogopin needle plate, Pogopin card extender, upper needle plate, other layer of needle plate, upper needle plate card extender, Pogopin needle plate register pin, Pogopin card extender register pin, upper needle plate register pin and upper needle plate card extender register pin, the described Pogopin needle plate back of the body connects described Pogopin card extender and embeds respectively, be fixed on described upper needle plate, described Pogopin needle plate register pin is installed between described Pogopin needle plate and described upper needle plate, described Pogopin card extender register pin is installed between described Pogopin needle plate and described Pogopin card extender, interfix between described other layer of needle plate and described upper needle plate and described upper needle plate register pin is installed, interfix between described upper needle plate card extender and described other layer of needle plate and described upper needle plate card extender register pin is installed.
Described other layer of needle plate comprises and superposes fixing middle spacer, needle plate back up pad and pin block tailpin plate from top to bottom successively.
Described upper needle plate is provided with needle plate guide finger, described needle plate guide finger and support plate guide pin bushing suitable.
Described PCB test needle plate assembly adopts contour screw with extraneous securing member, and described contour screw is provided with buffer spring.
The beneficial effects of the utility model are: because the utility model comprises Pogopin needle plate, Pogopin card extender, upper needle plate, other layer of needle plate, upper needle plate card extender, Pogopin needle plate register pin, Pogopin card extender register pin, upper needle plate register pin and upper needle plate card extender register pin, the described Pogopin needle plate back of the body connects described Pogopin card extender and embeds respectively, be fixed on described upper needle plate, described Pogopin needle plate register pin is installed between described Pogopin needle plate and described upper needle plate, described Pogopin card extender register pin is installed between described Pogopin needle plate and described Pogopin card extender, interfix between described other layer of needle plate and described upper needle plate and described upper needle plate register pin is installed, interfix between described upper needle plate card extender and described other layer of needle plate and described upper needle plate card extender register pin is installed.So think ratio with prior art, this application technology has adapted to the development trend of existing electronic product, adopt the mode that the multiple common test probe on the Pogopin probe on described Pogopin needle plate and described upper needle plate combines, no matter how complicated product components and parts type has, difference between test point has much, multiple test probe can both be realized simultaneously to the function of pin test under the test point of multiple different size size under same PCB test needle plate assembly, adapt to the nowadays electronic product industry of high speed development.
Accompanying drawing explanation
Fig. 1 is vertical view of the present utility model;
Fig. 2 is the A-A sectional view of Fig. 1 of the present utility model;
Fig. 3 of the present utility modelly faces explosive view;
Fig. 4 is spatial structure explosive view of the present utility model.
Embodiment
As Fig. 1, Fig. 2, shown in Fig. 3 and Fig. 4, in the present embodiment, described PCB test needle plate assembly comprises Pogopin needle plate 1, Pogopin card extender 2, upper needle plate 3, other layer of needle plate 4, upper needle plate card extender 5, Pogopin needle plate register pin 6, Pogopin card extender register pin 7, upper needle plate register pin 8 and upper needle plate card extender register pin 9, described Pogopin needle plate 1 back of the body connects described Pogopin card extender 2 and embeds respectively, be fixed on described upper needle plate 3, described Pogopin needle plate register pin 6 is installed between described Pogopin needle plate 1 and described upper needle plate 3, described Pogopin card extender register pin 7 is installed between described Pogopin needle plate 1 and described Pogopin card extender 2, interfix between described other layer of needle plate 4 and described upper needle plate 3 and described upper needle plate register pin 8 is installed, interfix between described upper needle plate card extender 5 and described other layer of needle plate 4 and described upper needle plate card extender register pin 9 is installed.Wherein said Pogopin needle plate 1 back of the body connects described Pogopin card extender 2 and embeds respectively, is fixed on described upper needle plate 3, achieve Pogopin probe 11 on described Pogopin needle plate 1 with on described upper needle plate 3 the effect that tentatively combines of common test probe 31.Described Pogopin needle plate register pin 6 is installed between described Pogopin needle plate 1 and described upper needle plate 3, ensure that the accurate location between described Pogopin needle plate 1 and described upper needle plate 3.Described Pogopin card extender register pin 7 is installed between described Pogopin needle plate 1 and described Pogopin card extender 2, ensure that the accurate location between described Pogopin needle plate 1 and described Pogopin card extender 2.Interfix between described other layer of needle plate 4 and described upper needle plate 3 and described upper needle plate register pin 8 is installed, described other layer of needle plate 4 comprises in the present embodiment and superposes fixing middle spacer 41, needle plate back up pad 42 and pin block tailpin plate 43 from top to bottom successively, described needle plate back up pad 42 plays the effect of the common test probe supporting described upper needle plate 3, described middle spacer plays the effect of the height regulating described PCB test needle plate assembly, and described pin block tailpin plate 43 is the effect described common test probe 31 being played to guiding.Certainly different needle plates can also be increased as required to regulate the effect of the height of described PCB test needle plate assembly or support, guiding, the multiple common test probe of increase.Interfix between described other layer of needle plate 4 and described upper needle plate 3 and described upper needle plate register pin 8 is installed, ensure that described accurate location between other layer of needle plate 4 and described upper needle plate 3.Interfix between described upper needle plate card extender 5 and described other layer of needle plate 4 and described upper needle plate card extender register pin 9 is installed, ensureing described accurate location between other layer of needle plate 4 and described upper needle plate card extender 5.Utilize the accurate location of these register pins just, whole described PCB test needle plate assembly could be connected into the entirety of an accurate positioning, achieve multiple test probe simultaneously to the function of pin test under the test point of multiple different size size.The fixing bolt that all adopts in the present embodiment is as securing member.
In the present embodiment, described upper needle plate 3 is provided with needle plate guide finger 10, described needle plate guide finger 10 is suitable with support plate guide pin bushing.Described support plate guide pin bushing is arranged on the support plate of PCB proving installation, described PCB test needle plate assembly is accurately located with coordinating between support plate guide pin bushing by described needle plate guide finger 10 with the support plate of described test product, thus the probe on described PCB test needle plate assembly is accurately tested pin under each test point of test product.
In the present embodiment, described PCB test needle plate assembly adopts contour screw 12 with extraneous securing member, and described contour screw is provided with buffer spring 13.Being to reduce the impact of extraneous vibration on test process by arranging buffer spring 13 on contour screw 12, the described degree of freedom of PCB test needle plate assembly and the size of equilibrant can also be improved in addition.
The utility model is applied to the technical field of PCB test needle plate.
Although embodiment of the present utility model describes with practical solution, but the restriction do not formed the utility model implication, for those skilled in the art, according to this instructions to the amendment of its embodiment and and the combination of other schemes be all apparent.
Claims (4)
1. a PCB test needle plate assembly, it is characterized in that: it comprises Pogopin needle plate (1), Pogopin card extender (2), upper needle plate (3), other layer of needle plate (4), upper needle plate card extender (5), Pogopin needle plate register pin (6), Pogopin card extender register pin (7), upper needle plate register pin (8) and upper needle plate card extender register pin (9), described Pogopin needle plate (1) back of the body connects described Pogopin card extender (2) and embeds respectively, be fixed on described upper needle plate (3), between described Pogopin needle plate (1) and described upper needle plate (3), described Pogopin needle plate register pin (6) is installed, between described Pogopin needle plate (1) and described Pogopin card extender (2), described Pogopin card extender register pin (7) is installed, interfix between described other layer of needle plate (4) and described upper needle plate (3) and described upper needle plate register pin (8) is installed, interfix between described upper needle plate card extender (5) and described other layer of needle plate (4) and described upper needle plate card extender register pin (9) is installed.
2. PCB test needle plate assembly according to claim 1, is characterized in that: described other layer of needle plate (4) comprises and superpose fixing middle spacer (41), needle plate back up pad (42) and pin block tailpin plate (43) from top to bottom successively.
3. PCB test needle plate assembly according to claim 1 and 2, is characterized in that: described upper needle plate (3) is provided with needle plate guide finger (10), and described needle plate guide finger (10) is suitable with support plate guide pin bushing.
4. PCB test needle plate assembly according to claim 1 and 2, is characterized in that: described PCB test needle plate assembly adopts contour screw (12) with extraneous securing member, described contour screw is provided with buffer spring (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520582269.5U CN204989258U (en) | 2015-08-05 | 2015-08-05 | PCB test faller subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520582269.5U CN204989258U (en) | 2015-08-05 | 2015-08-05 | PCB test faller subassembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204989258U true CN204989258U (en) | 2016-01-20 |
Family
ID=55123615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520582269.5U Expired - Fee Related CN204989258U (en) | 2015-08-05 | 2015-08-05 | PCB test faller subassembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204989258U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106493516A (en) * | 2016-10-17 | 2017-03-15 | 苏州润弘安创自动化科技有限公司 | A kind of pogopin probes needle mould, its processing technique and probe assembly technology |
| CN108008161A (en) * | 2017-10-26 | 2018-05-08 | 惠州市金百泽电路科技有限公司 | The quick determination method of metallized semi-pore photovoltaic electrical property |
-
2015
- 2015-08-05 CN CN201520582269.5U patent/CN204989258U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106493516A (en) * | 2016-10-17 | 2017-03-15 | 苏州润弘安创自动化科技有限公司 | A kind of pogopin probes needle mould, its processing technique and probe assembly technology |
| CN108008161A (en) * | 2017-10-26 | 2018-05-08 | 惠州市金百泽电路科技有限公司 | The quick determination method of metallized semi-pore photovoltaic electrical property |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160120 |