CN204836579U - 一种梳齿结构mems硅麦克风 - Google Patents
一种梳齿结构mems硅麦克风 Download PDFInfo
- Publication number
- CN204836579U CN204836579U CN201520572673.4U CN201520572673U CN204836579U CN 204836579 U CN204836579 U CN 204836579U CN 201520572673 U CN201520572673 U CN 201520572673U CN 204836579 U CN204836579 U CN 204836579U
- Authority
- CN
- China
- Prior art keywords
- comb
- vibrating diaphragm
- edge
- vibration film
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 25
- 239000010703 silicon Substances 0.000 title claims abstract description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 24
- 244000126211 Hericium coralloides Species 0.000 title abstract 2
- 239000010408 film Substances 0.000 claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000010409 thin film Substances 0.000 claims abstract description 34
- 238000006073 displacement reaction Methods 0.000 claims abstract description 8
- 230000005684 electric field Effects 0.000 claims abstract description 8
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 15
- 238000010025 steaming Methods 0.000 claims description 4
- 229910018182 Al—Cu Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 229910008045 Si-Si Inorganic materials 0.000 claims description 2
- 229910006411 Si—Si Inorganic materials 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- 230000035945 sensitivity Effects 0.000 abstract description 10
- 238000005516 engineering process Methods 0.000 abstract description 4
- 229910021419 crystalline silicon Inorganic materials 0.000 abstract 4
- 229910021426 porous silicon Inorganic materials 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 229910052814 silicon oxide Inorganic materials 0.000 description 10
- 238000009413 insulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 241000209140 Triticum Species 0.000 description 2
- 235000021307 Triticum Nutrition 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005534 acoustic noise Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Landscapes
- Micromachines (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Pressure Sensors (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520572673.4U CN204836579U (zh) | 2015-08-03 | 2015-08-03 | 一种梳齿结构mems硅麦克风 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520572673.4U CN204836579U (zh) | 2015-08-03 | 2015-08-03 | 一种梳齿结构mems硅麦克风 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204836579U true CN204836579U (zh) | 2015-12-02 |
Family
ID=54694129
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201520572673.4U Active CN204836579U (zh) | 2015-08-03 | 2015-08-03 | 一种梳齿结构mems硅麦克风 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN204836579U (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106714056A (zh) * | 2015-08-03 | 2017-05-24 | 上海微联传感科技有限公司 | 一种梳齿结构mems硅麦克风 |
CN107226450A (zh) * | 2016-03-24 | 2017-10-03 | 中芯国际集成电路制造(上海)有限公司 | 一种mems器件及其制备方法、电子装置 |
CN107360526A (zh) * | 2016-05-09 | 2017-11-17 | 上海微联传感科技有限公司 | 硅麦克风及其制造方法 |
CN107786929A (zh) * | 2016-08-26 | 2018-03-09 | 上海微联传感科技有限公司 | 硅麦克风 |
CN108260061A (zh) * | 2016-12-29 | 2018-07-06 | 通用微科技国际有限公司 | 横向模式电容式麦克风 |
CN111148000A (zh) * | 2019-12-31 | 2020-05-12 | 瑞声科技(南京)有限公司 | 一种mems麦克风及阵列结构 |
CN111885470A (zh) * | 2020-06-16 | 2020-11-03 | 歌尔微电子有限公司 | 电容型微机电系统麦克风、麦克风单体及电子设备 |
CN113543001A (zh) * | 2021-07-19 | 2021-10-22 | 歌尔微电子股份有限公司 | 电容式传感器、麦克风以及电子设备 |
-
2015
- 2015-08-03 CN CN201520572673.4U patent/CN204836579U/zh active Active
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106714056A (zh) * | 2015-08-03 | 2017-05-24 | 上海微联传感科技有限公司 | 一种梳齿结构mems硅麦克风 |
CN107226450A (zh) * | 2016-03-24 | 2017-10-03 | 中芯国际集成电路制造(上海)有限公司 | 一种mems器件及其制备方法、电子装置 |
CN107360526A (zh) * | 2016-05-09 | 2017-11-17 | 上海微联传感科技有限公司 | 硅麦克风及其制造方法 |
CN107786929A (zh) * | 2016-08-26 | 2018-03-09 | 上海微联传感科技有限公司 | 硅麦克风 |
CN107786929B (zh) * | 2016-08-26 | 2023-12-26 | 华景科技无锡有限公司 | 硅麦克风 |
CN108260061A (zh) * | 2016-12-29 | 2018-07-06 | 通用微科技国际有限公司 | 横向模式电容式麦克风 |
TWI678931B (zh) * | 2016-12-29 | 2019-12-01 | 大陸商通用微(深圳)科技有限公司 | 橫向模態之電容式麥克風 |
CN108260061B (zh) * | 2016-12-29 | 2021-02-09 | 通用微(深圳)科技有限公司 | 横向模式电容式麦克风 |
CN111148000A (zh) * | 2019-12-31 | 2020-05-12 | 瑞声科技(南京)有限公司 | 一种mems麦克风及阵列结构 |
CN111885470A (zh) * | 2020-06-16 | 2020-11-03 | 歌尔微电子有限公司 | 电容型微机电系统麦克风、麦克风单体及电子设备 |
CN111885470B (zh) * | 2020-06-16 | 2021-07-27 | 歌尔微电子有限公司 | 电容型微机电系统麦克风、麦克风单体及电子设备 |
CN113543001A (zh) * | 2021-07-19 | 2021-10-22 | 歌尔微电子股份有限公司 | 电容式传感器、麦克风以及电子设备 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN204836579U (zh) | 一种梳齿结构mems硅麦克风 | |
CN105721997B (zh) | 一种mems硅麦克风及其制备方法 | |
US9266716B2 (en) | MEMS acoustic transducer with silicon nitride backplate and silicon sacrificial layer | |
CN103139691B (zh) | 采用多孔soi硅硅键合的mems硅麦克风及其制造方法 | |
Kronast et al. | Single-chip condenser microphone using porous silicon as sacrificial layer for the air gap | |
CN105792084B (zh) | Mems麦克风及其制造方法 | |
CN104378724A (zh) | 一种无背部大声学腔体的mems硅麦克风 | |
CN109905833B (zh) | Mems麦克风制造方法 | |
CN102333254B (zh) | 一种与cmos电路纵向集成的mems硅麦克风及其制备方法 | |
WO2020133375A1 (zh) | Mems声音传感器、mems麦克风及电子设备 | |
CN103561376B (zh) | Mems麦克风及其制造方法 | |
CN101854578B (zh) | 一种基于硅硅键合工艺的微型麦克风制备方法 | |
WO2014159552A1 (en) | Mems acoustic transducer with silicon nitride backplate and silicon sacrificial layer | |
US20160142829A1 (en) | Integrated package forming wide sense gap micro electro-mechanical system microphone and methodologies for fabricating the same | |
CN103067838B (zh) | 一种高灵敏度压电式硅麦克风的制备方法 | |
WO2020140574A1 (zh) | Mems 麦克风制造方法 | |
CN109485009A (zh) | 麦克风及其制造方法 | |
JP2002027595A (ja) | 圧力センサおよびその製造方法 | |
CN203027480U (zh) | 一种高灵敏度压电式硅麦克风 | |
CN206061136U (zh) | 硅麦克风 | |
CN203104765U (zh) | 采用多孔soi硅硅键合的mems硅麦克风 | |
CN104754480B (zh) | 微型机电系统麦克风及其制造方法 | |
CN102611975B (zh) | 一种采用共晶键合与soi硅片的mems硅麦克风及其制备方法 | |
CN205584497U (zh) | 硅麦克风 | |
CN202261791U (zh) | 一种与cmos电路纵向集成的mems硅麦克风 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190125 Address after: 213135 F2 Building, 200 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Huajing Technology Wuxi Co.,Ltd. Address before: 201203 2, 3 building, 439 Chunchun Road, Pudong New Area, Shanghai. Patentee before: MICROLINK SENSTECH SHANGHAI Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20240511 Address after: 214135 China Sensor Network International Innovation Park F2, 200 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province Patentee after: SV SENSTECH (WUXI) CO.,LTD. Country or region after: China Address before: 213135 F2 Building, 200 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province Patentee before: Huajing Technology Wuxi Co.,Ltd. Country or region before: China |