CN204809211U - Sensor - Google Patents
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- CN204809211U CN204809211U CN201520320449.6U CN201520320449U CN204809211U CN 204809211 U CN204809211 U CN 204809211U CN 201520320449 U CN201520320449 U CN 201520320449U CN 204809211 U CN204809211 U CN 204809211U
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- panel
- pad
- hole
- sensing chip
- transducer
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Abstract
The utility model discloses a sensor, this sensor includes: the through -hole is seted up to panel, pad, illusory pad, sensing chip, sensing chip structure part on the panel, fill conducting material in the through -hole, and the sensing chip sets up in the panel, and sensing chip structure part sets up in the panel, and the pad sets up in the through -hole to be connected through wire and sensing chip, illusory pad sets up in another through -hole. Because the pad setting is in the through -hole of having filled conducting material, conducting material through filling in the through -hole can draw forth the pad from the panel, can avoid like this laying wire at the upper surface of panel, but lay wire in the interior formation of panel, the lower surface of panel is drawn forth on with the sensing chip through the conducting material in the through -hole, thereby avoid carrying out the wiring of signal line at the upper surface of panel, operations such as sculpture step have been avoided carrying on to sensor itself, just so can guarantee sensor's reliability and yield.
Description
Technical field
The application relates to electronic technology field, particularly relates to a kind of transducer.
Background technology
Along with the intelligence degree of end product improves constantly, various sensor chip emerges in an endless stream, sensing chip extends the application of the products such as communication, such as, fingerprint recognition chip application, to fields such as smart mobile phone, punched-card machine, door locks, so just proposes huge requirement to the reliability of sensing chip.
Very large for chip area, the chip that pad is too concentrated, its maximum feature is the cabling of chip signal line, and how to reduce the impact between holding wire.In chip package process, the etching of sensing chip itself forms the processing eases such as step, thinning, metal line, punching affects chip precision, or produce micro-crack, the chip defect such as uneven after unbalance stress of expanding with heat and contract with cold after being heated and make the reliability decrease of product, reduce the yield of chip.
Utility model content
The utility model embodiment provides a kind of transducer, the problem that the reliability in order to solve the detection of prior art sensing chip is lower.
Its concrete technical scheme is as follows:
A kind of transducer, described transducer comprises: panel, pad, dummy pad, sensing chip, sensing chip structure division, wherein,
Through hole offered by described panel, filled conductive material in described through hole;
Described sensing chip arranges in described panel, and described sensing chip is used for collection signal;
Described sensing chip structure division is arranged in described panel, and is positioned at the top of described sensing chip;
Described pad is arranged in described through hole, and is connected with described sensing chip by wire, and described pad is used for signal transmission;
Described dummy pad is arranged in another through hole.
Optionally, described panel is resin material or plastics or silicon chip.
Optionally, the diameter of described through hole is the arbitrary diameter between 5um-100um.
Optionally, described electric conducting material is copper or aluminium or nickel or alloy or other electric conducting materials.
Optionally, the consistent size of described pad and described dummy pad, and described pad is arranged on one end of described panel, and described dummy pad is arranged on the other end of described panel.
Optionally, described pad and described dummy pad are copper or aluminium or nickel or other electric conducting materials.
Optionally, described transducer also comprises:
Soldered ball, is attached at the back side of described panel, and described soldered ball is connected with the conductive material contacts in described through hole.
A kind of transducer is provided at the utility model, this transducer comprises: panel, pad, dummy pad, sensing chip, sensing chip structure division, through hole offered by panel, filled conductive material in through hole, sensing chip is arranged in panel, sensing chip is used for collection signal, sensing chip structure division is arranged in panel, and is positioned at the top of sensing chip, and pad is arranged in through hole, and be connected with sensing chip by wire, dummy pad is arranged in another through hole.Be filled with in the through hole of electric conducting material because pad is arranged on, pad can be drawn from panel by the electric conducting material of filling in through hole, can avoid like this connecting up at the upper surface of panel, but wiring is formed in panel, sensing chip will be drawn out to the lower surface of panel by the electric conducting material in through hole, thus avoid the wiring carrying out holding wire at the upper surface of panel, avoid and the operations such as etching step are carried out to transducer itself, so just can ensure reliability and the yield of transducer.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of transducer in the utility model embodiment;
Fig. 2 is the another kind of structural representation of a kind of transducer in the utility model embodiment;
Fig. 3 is the flow chart of the preparation method of a kind of transducer in the utility model embodiment.
Embodiment
In order to solve sensing chip in prior art in transducer and pad is positioned at same surface, according to bonding wire mode, chip bonding pad is drawn, the distance in bonding wire height inevitably lifting induction region and the packaging body external world, thus the problem that the reliability causing sensing chip to detect is lower, the utility model embodiment provides a kind of transducer, this transducer comprises panel, pad, dummy pad, sensing chip, sensing chip structure division, through hole offered by panel, electric conducting material is filled with in this through hole, sensing chip is arranged in panel, sensing chip is used for collection signal, sensing chip structure division is arranged in panel, and be positioned at the top of sensing chip, pad is arranged in through hole, the wire that through hole is arranged in panel is connected with sensing chip, dummy pad is arranged in another through hole, that is, the mode using bonding wire mode to be drawn by chip bonding pad is effectively avoided in the utility model embodiment, thus reduce the distance in induction region and the packaging body external world, and then the detecting reliability of sensing chip is got a promotion.
Below by accompanying drawing and specific embodiment, technical solutions of the utility model are described in detail, be to be understood that the explanation of concrete technical characteristic just to technical solutions of the utility model in the utility model embodiment and embodiment, instead of limit, when not conflicting, the concrete technical characteristic in the utility model embodiment and embodiment can combine mutually.
Be illustrated in figure 1 the structural representation of a kind of transducer in the utility model embodiment, this transducer comprises: panel 101, sensing chip 102, sensing chip structure division 103, pad 104, dummy pad 105, wherein,
Panel 101 is offered through hole 101a, filled conductive material in through hole 101a.Wherein, panel can be the polymeric material such as epoxide resin material, polyimides, also can be other dielectric materials, does not limit the material that panel 101 specifically uses here.In addition, the electric conducting material of filling in through hole 101a can be copper, iron, aluminium, alloy or macromolecule conducting material etc.;
Sensing chip 102 is arranged in panel 101, and sensing chip 102 is for collection signal, and as can be seen from Fig. 1, sensing chip 102 is the centers being arranged on whole panel 101, thus ensures fail safe and the stability of sensing chip 102.
Sensing chip structure division 103 is arranged in panel 101; and be positioned at the top of sensing chip 102; this structure can play a protective role to sensing chip 102, and this sensing chip structure division 103 can make sensing chip 102 outer signals can be detected more accurately.
Pad 104 is arranged in through hole 101a, this pad 104 is connected with the contact point of sensing chip 102 by the wire arranged in panel 101, thus make the Signal transmissions that sensing chip 102 generates on pad 104, or the signal on pad 104 can be transferred on sensing chip 102.
Dummy pad 105 is arranged in another through hole 101b of panel 101.
Specifically, in the utility model embodiment, pad 104 is arranged on and is filled with in the through hole 101a of electric conducting material, pad 104 can be drawn from panel 101 by the electric conducting material of filling in through hole 101a, can avoid like this connecting up at the upper surface of panel 101, but wiring is formed in panel 101, sensing chip 102 will be drawn out to the lower surface of panel 101 by the electric conducting material in through hole 101a, thus avoid the wiring carrying out holding wire at the upper surface of panel 101, avoid and the operations such as etching step are carried out to transducer itself, so just can ensure reliability and the yield of transducer.
Further, applicability and counter plate 101 in order to ensure through hole 101a in the utility model embodiment affect, the diameter of this through hole 101a can be set between 5um-100um, certainly, this diameter range is a citing, be not illustrate that this diameter can only be limited within the scope of this, in the production of reality, the size of through-hole diameter can be determined according to the demand of product.
Further, in the utility model embodiment, pad 104 is the pads for Signal transmissions, and dummy pad 105 is not the transmission for signal.Pad 104 and dummy pad 105 are all copper or aluminium or nickel or other electric conducting materials, and the size of the size of pad 104 and dummy pad 105 and through hole 101a is basically identical, ensure that pad 104 and dummy pad 105 can be placed in through hole like this.
Further, in the utility model embodiment, the through hole that panel 101 is offered can be the through hole of manhole or square through hole or other shapes, in the utility model embodiment, do not limit the concrete shape of this through hole, the shape of through hole can be set according to demand in the production of reality.
Further, in the utility model embodiment, this transducer can also comprise soldered ball 201 (as shown in Figure 2), in fig. 2, this soldered ball 201 is attached at the back side of panel 101, and soldered ball 201 is connected with the conductive material contacts of through hole 101a and through hole 101b.That is this soldered ball 201 is for being drawn by the electric conducting material in through hole 101a, thus makes external circuitry or equipment can this transducer of easier connection.In fig. 2, this soldered ball 201 is metal soldered ball, such as the metals such as copper, iron, alloy.
In addition, additionally provide a kind of preparation method of transducer in the utility model embodiment, be illustrated in figure 3 the flow chart of the preparation method of a kind of transducer in the utility model embodiment, the method comprises:
S301, at carrying silicon wafer surface rubberizing film or coated polymer binding material;
S302, adopts the mode faced down to be positioned on glued membrane the sensing chip of pad, dummy pad and senser element structure division;
S303, dielectric overlay on sensing chip, and flattens medium;
S304, peels off the medium covering sensing chip from carrying silicon wafer, removes glued membrane;
S305, connect pad, and through hole is offered in the position residing for described pad in sensing chip side by the wire in medium;
S306, filled conductive material in the through hole of medium, forms conductive electric wire road;
S307, at the back side of medium, the end of the through hole of filled conductive material makes soldered ball.
Further, in the utility model embodiment, this carrying silicon wafer is silicon or the material such as glass or stainless steel.
Further, when through hole is offered in the position residing for pad, need the size of reference pad to offer, such as through hole can be offered according to the shape of pad and size, ensure like this pad can with the sufficient structure of electric conducting material of filling in through hole.Through hole can certainly be offered not in accordance with the shape of pad and size.Concrete implementation is not limited, as long as ensure that the electric conducting material in through hole can contact the requirement just meeting technical solutions of the utility model preferably with pad in the utility model embodiment.
Further, in the utility model embodiment, electric conducting material is copper or aluminium or nickel or other electric conducting materials, ensure that signal can be delivered to pad like this, or the signal on pad can be transferred out by electric conducting material.
Certainly, soldered ball also can be copper or nickel or other electric conducting materials.
By above-mentioned method, in the utility model embodiment, pad is arranged on and is filled with in the through hole of electric conducting material, pad can be drawn from panel by the electric conducting material of filling in through hole, can avoid like this connecting up at the upper surface of panel, but wiring is formed in panel, sensing chip will be drawn out to the lower surface of panel by the electric conducting material in through hole, thus avoid the wiring carrying out holding wire at the upper surface of panel, avoid and the operations such as etching step are carried out to transducer itself, so just can ensure reliability and the yield of transducer.
Although described the preferred embodiment of the application, one of ordinary skilled in the art once obtain the basic creative concept of cicada, then can make other change and amendment to these embodiments.So claims are intended to be interpreted as comprising preferred embodiment and falling into all changes and the amendment of the application's scope.
Obviously, those skilled in the art can carry out various change and modification to the application and not depart from the spirit and scope of the application.Like this, if these amendments of the application and modification belong within the scope of the application's claim and equivalent technologies thereof, then the application is also intended to comprise these change and modification.
Claims (7)
1. a transducer, is characterized in that, described transducer comprises: panel, pad, dummy pad, sensing chip, sensing chip structure division, wherein,
Through hole offered by described panel, filled conductive material in described through hole;
Described sensing chip arranges in described panel, and described sensing chip is used for collection signal;
Described sensing chip structure division is arranged in described panel, and is positioned at the top of described sensing chip;
Described pad is arranged in described through hole, and is connected with described sensing chip by wire, and described pad is used for signal transmission;
Described dummy pad is arranged in another through hole.
2. transducer as claimed in claim 1, is characterized in that, described panel is resin material or plastics or silicon chip.
3. transducer as claimed in claim 1, it is characterized in that, the diameter of described through hole is the arbitrary diameter between 5um-100um.
4. transducer as claimed in claim 1, is characterized in that, described electric conducting material is copper or aluminium or nickel or alloy or other electric conducting materials.
5. transducer as claimed in claim 1, it is characterized in that, the consistent size of described pad and described dummy pad, and described pad is arranged on one end of described panel, described dummy pad is arranged on the other end of described panel.
6. transducer as claimed in claim 1, is characterized in that, described pad and described dummy pad are copper or aluminium or nickel or other electric conducting materials.
7. transducer as claimed in claim 1, is characterized in that, also comprise:
Soldered ball, is attached at the back side of described panel, and described soldered ball is connected with the conductive material contacts in described through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520320449.6U CN204809211U (en) | 2015-05-18 | 2015-05-18 | Sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520320449.6U CN204809211U (en) | 2015-05-18 | 2015-05-18 | Sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204809211U true CN204809211U (en) | 2015-11-25 |
Family
ID=54593987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520320449.6U Active CN204809211U (en) | 2015-05-18 | 2015-05-18 | Sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204809211U (en) |
-
2015
- 2015-05-18 CN CN201520320449.6U patent/CN204809211U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PP01 | Preservation of patent right | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20211029 Granted publication date: 20151125 |