CN105448858B - The packaging and testing apparatus and method of fingerprint detection chip - Google Patents
The packaging and testing apparatus and method of fingerprint detection chip Download PDFInfo
- Publication number
- CN105448858B CN105448858B CN201510317521.4A CN201510317521A CN105448858B CN 105448858 B CN105448858 B CN 105448858B CN 201510317521 A CN201510317521 A CN 201510317521A CN 105448858 B CN105448858 B CN 105448858B
- Authority
- CN
- China
- Prior art keywords
- detection chip
- fingerprint detection
- measured
- capacitance
- test board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The invention discloses a kind of packaging and testing apparatus and method of fingerprint detection chip, wherein, the packaging and testing device of fingerprint detection chip includes：Test board, test board is arranged on fingerprint detection chip to be measured, wherein, test board receives the pumping signal of fingerprint detection chip to be measured so that test board forms coupled capacitor with multiple detection units in fingerprint detection chip to be measured, fingerprint detection chip to be measured obtains the capacitance of multiple coupled capacitors, and is tested according to the encapsulation of the capacitances of multiple coupled capacitors to fingerprint detection chip to be measured.The packaging and testing apparatus and method of the fingerprint detection chip of the embodiment of the present invention, by setting test board on fingerprint detection chip to be measured, fingerprint detection chip to be measured obtains the capacitance of multiple coupled capacitors, and tested according to encapsulation of the capacitance to fingerprint detection chip to be measured, it is whether qualified that the encapsulation of fingerprint detection chip to be measured can fast and effeciently be tested out, improve yields.
Description
Technical field
The present invention relates to fingerprint identification technology field, more particularly to a kind of packaging and testing device of fingerprint detection chip and side
Method.
Background technology
With the continuous progress of science and technology, the application of fingerprint recognition is more and more extensive, must not as high-end smartphones
One of function that can be less.At present, mainly by setting capacitance type fingerprint detection chip to realize the detection to fingerprint in interior of mobile phone.
As shown in figure 1, fingerprint detection chip can be made up of multiple detection units.As shown in Fig. 2 plastics can be used to fingerprint detection chip
It is packaged.Because fingerprint detection belongs to Precision measurement, therefore, the table of Plastic Package very high to the technological requirement of Plastic Package
Face thickness is typically required between 100 microns to 200 microns, and the surface thickness of the Plastic Package for same type product
Degree, error requirements are within 2 microns.
At present, Plastic Package is primarily present problems with：Surface irregularity, in uneven thickness, dew crystalline substance etc..Specifically, such as
Shown in Fig. 3, Plastic Package is that injection is formed, because the temperature in injection is higher, process of the Plastic Package in cooling solidification
The middle situation that surface irregularity can be produced because of expanding with heat and contract with cold.As shown in figure 4, in injection moulding process, controlling unit can also go out
Now certain process deviation makes Plastic Package produce situation in uneven thickness.As shown in figure 5, in injection moulding process, or even meeting
The problems such as generation dew brilliant (chip part region is not packed, is directly exposed to surface), plastic seal are equipped with bubble.
Therefore, a kind of whether good method of testing of Plastic Package for judging fingerprint detection chip is needed badly.
The content of the invention
It is contemplated that at least solves above-mentioned technical problem to a certain extent.
Therefore, the present invention needs to provide a kind of packaging and testing device of fingerprint detection chip, fingerprint inspection to be measured can be detected
Whether the encapsulation for surveying chip is qualified.
In addition, the present invention it is also required to provide a kind of packaging and testing method of fingerprint detection chip.
At least one in above-mentioned technical problem to solve, embodiment proposes a kind of fingerprint according to a first aspect of the present invention
The packaging and testing device of detection chip, including：Test board, the test board are arranged on fingerprint detection chip to be measured, wherein,
The test board is conductive, wherein, the test board receives the pumping signal of the fingerprint detection chip to be measured so that the test
Plate forms coupled capacitor with multiple detection units in the fingerprint detection chip to be measured, and the fingerprint detection chip to be measured obtains
The capacitance of the multiple coupled capacitor, and according to the capacitance of the multiple coupled capacitor to the fingerprint detection chip to be measured
Encapsulation tested.
The packaging and testing device of the fingerprint detection chip of the embodiment of the present invention, by being set on fingerprint detection chip to be measured
Test board, fingerprint detection chip to be measured obtain the capacitance of the multiple coupled capacitor, and according to capacitance to the finger to be measured
The encapsulation of line detection chip is tested, and whether qualified, carry if can fast and effeciently test out the encapsulation of fingerprint detection chip to be measured
High yields.
Second aspect of the present invention embodiment provides the packaging and testing device of another fingerprint detection chip, including：Test
Plate, the test board are arranged on fingerprint detection chip to be measured, wherein, the test board is conductive, wherein, the test board connects
Ground, the fingerprint detection chip to be measured apply pumping signal so that the test board and the fingerprint to be measured to multiple detection units
Multiple detection units in detection chip form coupled capacitor, and the fingerprint detection chip to be measured obtains the multiple coupled capacitor
Capacitance, and tested according to the encapsulation of the capacitance of the multiple coupled capacitor to the fingerprint detection chip to be measured.
The packaging and testing device of the fingerprint detection chip of the embodiment of the present invention, by being set on fingerprint detection chip to be measured
Test board, and plate earthing is tested, fingerprint detection chip to be measured obtains the capacitance of the multiple coupled capacitor, and according to capacitance
Encapsulation to the fingerprint detection chip to be measured is tested, and can fast and effeciently test out the encapsulation of fingerprint detection chip to be measured
It is whether qualified, improve yields.
Third aspect present invention embodiment provides a kind of packaging and testing method of fingerprint detection chip, including：Test board
The pumping signal of fingerprint detection chip to be measured is received so that the test board and multiple inspections in the fingerprint detection chip to be measured
Survey unit and form coupled capacitor；The fingerprint detection chip to be measured obtains the capacitance of the multiple coupled capacitor, and according to institute
Encapsulation of the capacitance of multiple coupled capacitors to the fingerprint detection chip to be measured is stated to test.
The packaging and testing method of the fingerprint detection chip of the embodiment of the present invention, by being set on fingerprint detection chip to be measured
Test board, fingerprint detection chip to be measured obtain the capacitance of the multiple coupled capacitor, and according to capacitance to the finger to be measured
The encapsulation of line detection chip is tested, and whether qualified, carry if can fast and effeciently test out the encapsulation of fingerprint detection chip to be measured
High yields.
Fourth aspect present invention embodiment provides the packaging and testing method of another fingerprint detection chip, including：It is to be measured
Fingerprint detection chip applies pumping signal so that more in test board and the fingerprint detection chip to be measured to multiple detection units
Individual detection unit forms coupled capacitor；The fingerprint detection chip to be measured obtains the capacitance of the multiple coupled capacitor, and root
Tested according to encapsulation of the capacitance of the multiple coupled capacitor to the fingerprint detection chip to be measured.
The packaging and testing method of the fingerprint detection chip of the embodiment of the present invention, by being set on fingerprint detection chip to be measured
Test board, plate earthing is tested, fingerprint detection chip to be measured obtains the capacitance of the multiple coupled capacitor, and according to capacitance pair
The encapsulation of the fingerprint detection chip to be measured is tested, and can fast and effeciently be tested out the encapsulation of fingerprint detection chip to be measured and is
It is no qualified, improve yields.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Brief description of the drawings
Fig. 1 is the effect diagram that fingerprint detection chip is made up of multiple detection units.
Fig. 2 is the effect diagram detected in the prior art to fingerprint.
Fig. 3 is the effect diagram of Plastic Package surface irregularity.
Fig. 4 is Plastic Package effect diagram in uneven thickness.
Fig. 5 is that Plastic Package reveals brilliant and alveolate effect diagram.
Fig. 6 is the structural representation of the packaging and testing device of fingerprint detection chip according to an embodiment of the invention.
Fig. 7 is the structural representation of the packaging and testing device of fingerprint detection chip in accordance with another embodiment of the present invention.
Fig. 8 is the flow chart of the packaging and testing method of fingerprint detection chip according to an embodiment of the invention.
Fig. 9 is the flow chart of the packaging and testing method of fingerprint detection chip in accordance with another embodiment of the present invention.
Embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning to end
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
Below with reference to the accompanying drawings the packaging and testing apparatus and method of fingerprint detection chip according to embodiments of the present invention are described.
Fig. 6 is the structural representation according to the packaging and testing device of the fingerprint detection chip of one embodiment of the invention.
As shown in fig. 6, the packaging and testing device of the fingerprint detection chip, including：Test board 100 and fingerprint detection core to be measured
Piece 200.
In an embodiment of the present invention, test board 100 is arranged on fingerprint detection chip 200 to be measured.Wherein, test board
100 can be high rigidity conductive plate, such as the conductive plate of the soft material such as steel plate, copper coin metallic plate or conductive rubber.
Specific testing process is as follows：Test board 100 can receive the pumping signal that fingerprint detection chip 200 to be measured is sent, and swash
Encouraging signal can make test board 100 form coupled capacitor with multiple detection units in fingerprint detection chip 200 to be measured.Then, treat
The capacitance of multiple coupled capacitors can be obtained by surveying fingerprint detection chip 200, and according to the capacitances of multiple coupled capacitors to be measured
The encapsulation of fingerprint detection chip 200 is tested.Wherein, encapsulating material can be plastics.
Specifically, test board 100 can be high rigidity conductive plate, such as steel plate, copper coin metallic plate, and being sized to can be with
Cover the surface of fingerprint detection chip 200 to be measured.The area capacitance value of thinner package is big, encapsulate thickness area capacitance value it is small, with this
To judge whether the thickness of encapsulation is uniform.Specifically, if coupled capacitor capacitance it is small, the electric capacity of some coupled capacitors
Value is big, then illustrates that the package thickness is uneven or surface irregularity, then can determine that the encapsulation is unqualified.Due to the dielectric of air
Whether constant is very small, if being packaged with bubble, bubble is bigger, and electric capacity is smaller, have bubble or dew brilliant to judge to encapsulate with this.
If the capacitance of coupled capacitor be less than predetermined threshold value, illustrate that this is packaged with bubble or dew is brilliant, then can determine that the encapsulation not
It is qualified.
It should be appreciated that the present embodiment is fingerprint detection chip 200 to be measured sends pumping signal to test board 100, should
It is mutual capacitance Cleaning Principle.
The packaging and testing device of the fingerprint detection chip of the embodiment of the present invention, by being set on fingerprint detection chip to be measured
Test board, fingerprint detection chip to be measured obtain the capacitance of multiple coupled capacitors, and according to capacitance to fingerprint detection core to be measured
The encapsulation of piece is tested, and whether qualified, improve non-defective unit if can fast and effeciently test out the encapsulation of fingerprint detection chip to be measured
Rate.
Fig. 7 is the structural representation according to the packaging and testing device of the fingerprint detection chip of another embodiment of the present invention.
As shown in fig. 7, the packaging and testing device of the fingerprint detection chip, including：Test board 100 and fingerprint detection core to be measured
Piece 200.
In an embodiment of the present invention, test board 100 is arranged on fingerprint detection chip 200 to be measured.Wherein, test board
100 is conductive.
Specific testing process is as follows：Test board 100 is grounded, multiple detection lists of the fingerprint detection chip 200 to be measured to itself
Member applies pumping signal, and pumping signal can be such that test board 100 is formed with multiple detection units in fingerprint detection chip 200 to be measured
Coupled capacitor.Then, fingerprint detection chip 200 to be measured can obtain the capacitance of multiple coupled capacitors, and according to multiple coupling electricity
Encapsulation of the capacitance of appearance to fingerprint detection chip 200 to be measured is tested.Wherein, encapsulating material can be plastics.
Specifically, test board 100 can be high rigidity conductive plate, such as steel plate, copper coin metallic plate, and being sized to can be with
Cover the surface of fingerprint detection chip 200 to be measured.The area capacitance value of thinner package is big, encapsulate thickness area capacitance value it is small, with this
To judge whether the thickness of encapsulation is uniform.Specifically, if coupled capacitor capacitance it is small, the electric capacity of some coupled capacitors
Value is big, then illustrates that the package thickness is uneven or surface irregularity, then can determine that the encapsulation is unqualified.Due to the dielectric of air
Whether constant is very small, if being packaged with bubble, bubble is bigger, and electric capacity is smaller, have bubble or dew brilliant to judge to encapsulate with this.
If the capacitance of coupled capacitor be less than predetermined threshold value, illustrate that this is packaged with bubble or dew is brilliant, then can determine that the encapsulation not
It is qualified.
Swash it should be appreciated that the fingerprint detection chip 200 to be measured of the present embodiment applies to the multiple detection units of itself
Signal is encouraged, and test board 100 is grounded, application is self-capacitance Cleaning Principle.
The packaging and testing device of the fingerprint detection chip of the embodiment of the present invention, by being set on fingerprint detection chip to be measured
Test board, and plate earthing is tested, fingerprint detection chip to be measured obtains the capacitance of multiple coupled capacitors, and according to capacitance pair
The encapsulation of fingerprint detection chip to be measured is tested, and whether the encapsulation that can fast and effeciently test out fingerprint detection chip to be measured closes
Lattice, improve yields.
To achieve the above object, the present invention also proposes a kind of packaging and testing method of fingerprint detection chip.
Fig. 8 is the flow chart according to the packaging and testing method of the fingerprint detection chip of one embodiment of the invention.
As shown in figure 8, the packaging and testing method of the fingerprint detection chip, comprises the following steps：
S801, test board receives the pumping signal of fingerprint detection chip to be measured so that test board and fingerprint detection chip to be measured
In multiple detection units formed coupled capacitor.
In an embodiment of the present invention, test board is arranged on fingerprint detection chip to be measured.Wherein, test board can be
The conductive plate of the soft material such as high rigidity conductive plate, such as steel plate, copper coin metallic plate or conductive rubber.
Specifically, test board can receive the pumping signal of fingerprint detection chip to be measured, and pumping signal can make test board with treating
The multiple detection units surveyed in fingerprint detection chip form coupled capacitor.It should be appreciated that the present embodiment is examined for fingerprint to be measured
Survey chip and send pumping signal to test board, application is mutual capacitance Cleaning Principle.
S802, fingerprint detection chip to be measured obtain the capacitance of multiple coupled capacitors, and according to the electricity of multiple coupled capacitors
Encapsulation of the capacitance to fingerprint detection chip to be measured is tested.
Specifically, fingerprint detection chip to be measured can judge fingerprint inspection to be measured according to the size of the capacitance of multiple coupled capacitors
Whether uniform survey the package thickness of chip, and judge whether the encapsulation reveals crystalline substance.Wherein, encapsulating material can be plastics.
Specifically, test board can be high rigidity conductive plate, such as steel plate, copper coin metallic plate, be sized to cover
Cover the surface of fingerprint detection chip to be measured.The area capacitance value of thinner package is big, and it is small to encapsulate the area capacitance value of thickness, is judged with this
Whether the thickness of encapsulation is uniform.Specifically, if coupled capacitor capacitance it is small, the capacitance of some coupled capacitors is big,
Illustrate that the package thickness is uneven or surface irregularity, then can determine that the encapsulation is unqualified.Because the electric medium constant of air is non-
Whether often small, if being packaged with bubble, bubble is bigger, and electric capacity is smaller, have bubble or dew brilliant to judge to encapsulate with this.If
The capacitance of coupled capacitor be less than predetermined threshold value, illustrate that this is packaged with bubble or dew is brilliant, then can determine that the encapsulation is unqualified.
The packaging and testing method of the fingerprint detection chip of the embodiment of the present invention, by being set on fingerprint detection chip to be measured
Test board, fingerprint detection chip to be measured obtain the capacitance of multiple coupled capacitors, and according to capacitance to fingerprint detection core to be measured
The encapsulation of piece is tested, and whether qualified, improve non-defective unit if can fast and effeciently test out the encapsulation of fingerprint detection chip to be measured
Rate.
Fig. 9 is the flow chart according to the packaging and testing method of the fingerprint detection chip of another embodiment of the present invention.
As shown in figure 9, the packaging and testing method of the fingerprint detection chip, comprises the following steps：
S901, fingerprint detection chip to be measured apply pumping signal so that test board is examined with fingerprint to be measured to multiple detection units
The multiple detection units surveyed in chip form coupled capacitor.
In an embodiment of the present invention, test board is arranged on fingerprint detection chip to be measured.Wherein, test board is conductive.
Specifically, plate earthing is tested, fingerprint detection chip to be measured applies pumping signal, pumping signal to multiple detection units
Test board can be made to form coupled capacitor with multiple detection units in fingerprint detection chip to be measured.It should be appreciated that this implementation
The fingerprint detection chip to be measured of example applies pumping signal to the multiple detection units of itself, and tests plate earthing, and application is certainly
Capacitance detecting principle.
S902, fingerprint detection chip to be measured obtain the capacitance of multiple coupled capacitors, and according to the electricity of multiple coupled capacitors
Encapsulation of the capacitance to fingerprint detection chip to be measured is tested.
Specifically, fingerprint detection chip to be measured can judge fingerprint inspection to be measured according to the size of the capacitance of multiple coupled capacitors
Whether uniform survey the package thickness of chip, and judge whether the encapsulation reveals crystalline substance.Wherein, encapsulating material can be plastics.
Specifically, test board can be high rigidity conductive plate, such as steel plate, copper coin metallic plate, be sized to cover
Cover the surface of fingerprint detection chip to be measured.The area capacitance value of thinner package is big, and it is small to encapsulate the area capacitance value of thickness, is judged with this
Whether the thickness of encapsulation is uniform.Specifically, if coupled capacitor capacitance it is small, the capacitance of some coupled capacitors is big,
Illustrate that the package thickness is uneven or surface irregularity, then can determine that the encapsulation is unqualified.Because the electric medium constant of air is non-
Whether often small, if being packaged with bubble, bubble is bigger, and electric capacity is smaller, have bubble or dew brilliant to judge to encapsulate with this.If
The capacitance of coupled capacitor be less than predetermined threshold value, illustrate that this is packaged with bubble or dew is brilliant, then can determine that the encapsulation is unqualified.
The packaging and testing method of the fingerprint detection chip of the embodiment of the present invention, by being set on fingerprint detection chip to be measured
Test board, plate earthing is tested, fingerprint detection chip to be measured obtains the capacitance of multiple coupled capacitors, and according to capacitance to be measured
The encapsulation of fingerprint detection chip is tested, and whether can fast and effeciently test out the encapsulation of fingerprint detection chip to be measured qualified,
Improve yields.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise ", " axial direction ", " radial direction ", " circumference " be based on orientation shown in the drawings or
Position relationship, it is for only for ease of and describes the present invention and simplify description, rather than indicates or imply that signified device or element must
There must be specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include at least one this feature.In the description of the invention, " multiple " are meant that at least two, such as two, three
It is individual etc., unless otherwise specifically defined.
In the present invention, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " fixation " etc.
Term should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally；Can be that machinery connects
Connect or electrically connect；Can be joined directly together, can also be indirectly connected by intermediary, can be in two elements
The connection in portion or the interaction relationship of two elements, limited unless otherwise clear and definite.For one of ordinary skill in the art
For, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature
It is that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature are directly over second feature or oblique upper, or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward, or is merely representative of fisrt feature level height and is less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or the spy for combining the embodiment or example description
Point is contained at least one embodiment or example of the present invention.In this manual, to the schematic representation of above-mentioned term not
Identical embodiment or example must be directed to.Moreover, specific features, structure, material or the feature of description can be with office
Combined in an appropriate manner in one or more embodiments or example.In addition, in the case of not conflicting, the skill of this area
Art personnel can be tied the different embodiments or example and the feature of different embodiments or example described in this specification
Close and combine.
Although embodiments of the invention have been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, one of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changed, replacing and modification.
Claims (12)
- A kind of 1. packaging and testing device of fingerprint detection chip, it is characterised in that including：Test board, the test board are arranged on fingerprint detection chip to be measured, wherein, the test board is conductive, wherein,The test board receives the pumping signal of the fingerprint detection chip to be measured so that the test board and the fingerprint to be measured Multiple detection units in detection chip form coupled capacitor, and the fingerprint detection chip to be measured obtains the multiple coupled capacitor Capacitance, and tested according to the encapsulation of the capacitance of the multiple coupled capacitor to the fingerprint detection chip to be measured.
- 2. the packaging and testing device of fingerprint detection chip as claimed in claim 1, it is characterised in that when the multiple coupling electricity When the capacitance of appearance is inconsistent, then judge that the package thickness of the fingerprint detection chip to be measured is uneven；OrWhen the capacitance of the multiple coupled capacitor is less than predetermined threshold value, then judge that the encapsulation dew is brilliant.
- 3. the packaging and testing device of fingerprint detection chip as claimed in claim 1, it is characterised in that the test board is metal Or conductive rubber.
- 4. the packaging and testing device of fingerprint detection chip as claimed in claim 1, it is characterised in that the encapsulating material is modeling Material.
- A kind of 5. packaging and testing device of fingerprint detection chip, it is characterised in that including：Test board, the test board are arranged on fingerprint detection chip to be measured, wherein, the test board is conductive, wherein,The test plate earthing, the fingerprint detection chip to be measured apply pumping signal so that the test to multiple detection units Plate forms coupled capacitor with multiple detection units in the fingerprint detection chip to be measured, and the fingerprint detection chip to be measured obtains The capacitance of the multiple coupled capacitor, and according to the capacitance of the multiple coupled capacitor to the fingerprint detection chip to be measured Encapsulation tested.
- 6. the packaging and testing device of fingerprint detection chip as claimed in claim 5, it is characterised in thatWhen the capacitance of the multiple coupled capacitor is inconsistent, then the package thickness of the fingerprint detection chip to be measured is judged not Uniformly；OrWhen the capacitance of the multiple coupled capacitor is less than predetermined threshold value, then judge that the encapsulation dew is brilliant.
- 7. the packaging and testing device of fingerprint detection chip as claimed in claim 5, it is characterised in that the test board is metal Or conductive rubber.
- 8. the packaging and testing device of fingerprint detection chip as claimed in claim 5, it is characterised in that the encapsulating material is modeling Material.
- A kind of 9. packaging and testing method of fingerprint detection chip, it is characterised in that comprise the following steps：Test board receives the pumping signal of fingerprint detection chip to be measured so that the test board and the fingerprint detection chip to be measured In multiple detection units formed coupled capacitor；The fingerprint detection chip to be measured obtains the capacitance of the multiple coupled capacitor, and according to the multiple coupled capacitor Encapsulation of the capacitance to the fingerprint detection chip to be measured is tested.
- 10. the packaging and testing method of fingerprint detection chip as claimed in claim 9, it is characterised in that described according to described more Encapsulation of the capacitance of individual coupled capacitor to the fingerprint detection chip to be measured is tested, including：When the capacitance of the multiple coupled capacitor is inconsistent, then the package thickness of the fingerprint detection chip to be measured is judged not Uniformly；OrWhen the capacitance of the multiple coupled capacitor is less than predetermined threshold value, then judge that the encapsulation dew is brilliant.
- 11. the packaging and testing method of fingerprint detection chip as claimed in claim 9, it is characterised in that the test board is gold Category or conductive rubber.
- 12. the packaging and testing method of fingerprint detection chip as claimed in claim 9, it is characterised in that the encapsulating material is Plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510317521.4A CN105448858B (en) | 2015-06-10 | 2015-06-10 | The packaging and testing apparatus and method of fingerprint detection chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510317521.4A CN105448858B (en) | 2015-06-10 | 2015-06-10 | The packaging and testing apparatus and method of fingerprint detection chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105448858A CN105448858A (en) | 2016-03-30 |
| CN105448858B true CN105448858B (en) | 2018-03-13 |
Family
ID=55558895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510317521.4A Active CN105448858B (en) | 2015-06-10 | 2015-06-10 | The packaging and testing apparatus and method of fingerprint detection chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105448858B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017185247A1 (en) * | 2016-04-27 | 2017-11-02 | 深圳市汇顶科技股份有限公司 | Chip testing method and device |
| WO2018161210A1 (en) * | 2017-03-06 | 2018-09-13 | 深圳市汇顶科技股份有限公司 | Device and method for testing fingerprint chip |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103376970A (en) * | 2012-04-13 | 2013-10-30 | 苹果公司 | Capacitive sensing array modulation |
| CN203746088U (en) * | 2013-12-30 | 2014-07-30 | 比亚迪股份有限公司 | Fingerprint sensor |
| CN104051367A (en) * | 2014-07-01 | 2014-09-17 | 苏州晶方半导体科技股份有限公司 | Packaging structure and packaging method for fingerprint recognition chip |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI529390B (en) * | 2012-11-21 | 2016-04-11 | 茂丞科技股份有限公司 | Biometrics sensor module, assembly, manufacturing method and electronic apparatus using such biometrics sensor module |
-
2015
- 2015-06-10 CN CN201510317521.4A patent/CN105448858B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103376970A (en) * | 2012-04-13 | 2013-10-30 | 苹果公司 | Capacitive sensing array modulation |
| CN203746088U (en) * | 2013-12-30 | 2014-07-30 | 比亚迪股份有限公司 | Fingerprint sensor |
| CN104051367A (en) * | 2014-07-01 | 2014-09-17 | 苏州晶方半导体科技股份有限公司 | Packaging structure and packaging method for fingerprint recognition chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105448858A (en) | 2016-03-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105448858B (en) | The packaging and testing apparatus and method of fingerprint detection chip | |
| CN104395705B (en) | Thermal flowmeter | |
| CN101266167A (en) | Capacitance type digital material-level sensor and its measurement method | |
| CN106021811A (en) | Determination method for broadband complex magnetic conductivity of magnetic material | |
| TWM313774U (en) | Solution admeasurement sensing device | |
| CN103176058A (en) | Device for measuring transformer oil paper insulation test piece | |
| CN108716963A (en) | The performance test methods of pressure sensor | |
| CN107643466A (en) | Capacitor test system and method | |
| CN105328886B (en) | Melt state sensory perceptual system and its detection method in injection mold based on point electrode | |
| CN103884952A (en) | Analysis method of ceramic capacitor failure | |
| CN203164308U (en) | Transformer oil paper insulation test sample measuring device | |
| CN106197537A (en) | The passive wireless sensor that a kind of humiture is integrated | |
| CN103386753A (en) | Application of capacitive sensor to polymer moulding processing | |
| US7481641B2 (en) | Apparatus and method for producing an article by means of a molding technique | |
| CN107364076A (en) | A kind of sensor and its online test method for injection mold | |
| US8890549B2 (en) | Differential sand compaction sensor | |
| CN108140109A (en) | The covering layer material of fingerprint sensor compatibility | |
| García-Baños et al. | Noninvasive monitoring of polymer curing reactions by dielectrometry | |
| DE102007057903B4 (en) | Sensor module and method for producing the sensor module | |
| CN103630825B (en) | Chip test circuit and forming method thereof | |
| CN101603936A (en) | A kind of method of real-time of LCM moulding process | |
| CN111307693B (en) | Passive wireless multi-stage droplet micro-fluidic detection device | |
| CN107589300A (en) | A kind of line impedance detection method, system, device and readable storage medium storing program for executing | |
| CN102928279A (en) | Metallographical sample-filling secondary glue filling method | |
| CN208674067U (en) | Packaging body detection device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191230 Address after: 518119 1 Yanan Road, Kwai Chung street, Dapeng New District, Shenzhen, Guangdong Patentee after: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. Address before: BYD 518118 Shenzhen Road, Guangdong province Pingshan New District No. 3009 Patentee before: BYD Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: BYD Semiconductor Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |